Fourier modal method (FMM) is known as a powerful tool in simulations of periodic micro-structures, e.g., gratings. For an arbitrary plane wave incidence, the Rayleigh coefficients for both reflected and transmitted field can be calculated with the FMM efficiently. When dealing with a general beam incidence, FMM together with plane wave decomposition can still provide solutions. However the needed computational resources increase with the number of plane wave components in the angular spectrum domain. To solve this problem, we put forward an efficient approach which integrates interpolation technique into the method above. For most diffractive thin elements, the complex Rayleigh coefficients distribution is smooth. In this case several well-selected plane wave components are enough to characterize the diffraction property. In our method, only these selected plane wave components are analyzed with FMM while the results of other components are obtained by interpolation technique. Besides that, an efficient approach for especially divergent incident beam is also presented in this article. It enable a parallel FMM analysis which calculates a set of plane wave components in one computational loop.
{"title":"Efficient grating simulation for general incident beam","authors":"Site Zhang, F. Wyrowski, J. Tervo","doi":"10.1117/12.2039961","DOIUrl":"https://doi.org/10.1117/12.2039961","url":null,"abstract":"Fourier modal method (FMM) is known as a powerful tool in simulations of periodic micro-structures, e.g., gratings. For an arbitrary plane wave incidence, the Rayleigh coefficients for both reflected and transmitted field can be calculated with the FMM efficiently. When dealing with a general beam incidence, FMM together with plane wave decomposition can still provide solutions. However the needed computational resources increase with the number of plane wave components in the angular spectrum domain. To solve this problem, we put forward an efficient approach which integrates interpolation technique into the method above. For most diffractive thin elements, the complex Rayleigh coefficients distribution is smooth. In this case several well-selected plane wave components are enough to characterize the diffraction property. In our method, only these selected plane wave components are analyzed with FMM while the results of other components are obtained by interpolation technique. Besides that, an efficient approach for especially divergent incident beam is also presented in this article. It enable a parallel FMM analysis which calculates a set of plane wave components in one computational loop.","PeriodicalId":395835,"journal":{"name":"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129560483","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
We present a quantitative comparison of a fixed-pattern structured light system and a multi-pattern structured light system under varying capture environments. Several factors affect the performance of these systems, which makes the task of a fair comparison a very challenging aspect of this study. We conducted our experiments under controlled environment to enable us to control various system parameters for a fair comparison of these two techniques. We describe our methodology in choosing the system parameters for our study. For this analysis, we used two ground truth models with various depth and spatial variations as well as some smooth regions. These models are representative of two extremes of depth measurement scenarios. We show that multi-pattern approaches can be very accurate in controlled environment in stationary scenes due to high SNR, whereas fixed pattern methods are robust to ambient lighting changes but they have lesser accuracy. Further, in practical applications, we show that the multi-pattern approach has higher spatial and depth resolution when compared to a fixed pattern system.
{"title":"Comparison of fixed-pattern and multiple-pattern structured light imaging systems","authors":"Vikram V. Appia, P. Gelabert","doi":"10.1117/12.2037906","DOIUrl":"https://doi.org/10.1117/12.2037906","url":null,"abstract":"We present a quantitative comparison of a fixed-pattern structured light system and a multi-pattern structured light system under varying capture environments. Several factors affect the performance of these systems, which makes the task of a fair comparison a very challenging aspect of this study. We conducted our experiments under controlled environment to enable us to control various system parameters for a fair comparison of these two techniques. We describe our methodology in choosing the system parameters for our study. For this analysis, we used two ground truth models with various depth and spatial variations as well as some smooth regions. These models are representative of two extremes of depth measurement scenarios. We show that multi-pattern approaches can be very accurate in controlled environment in stationary scenes due to high SNR, whereas fixed pattern methods are robust to ambient lighting changes but they have lesser accuracy. Further, in practical applications, we show that the multi-pattern approach has higher spatial and depth resolution when compared to a fixed pattern system.","PeriodicalId":395835,"journal":{"name":"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122355373","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Reliable microelectromechanical systems (MEMS) switches are critical for developing high performance radio frequency circuits like phase shifters. Engineers have attempted to improve reliability and lifecycle performance using novel contact metals, unique mechanical designs and packaging. Various test fixtures including: MEMS devices, atomic force microscopes (AFM) and nanoindentors have been used to collect resistance and contact force data. AFM and nanoindentor test fixtures allow direct contact force measurements but are severely limited by low resonance sensors, and therefore low data collection rates. This paper reports the contact resistance evolution results and fabrication of thin film, sputtered and evaporated gold, micro-contacts dynamically tested up to 3kHz. The upper contact support structure consists of a gold surface micromachined, fix-fix beam designed with sufficient restoring force to overcome adhesion. The hemisphere-upper and planar-lower contacts are mated with a calibrated, external load resulting in approximately 100μN of contact force and are cycled in excess of 106 times or until failure. Contact resistance is measured, in-situ, using a cross-bar configuration and the entire apparatus is isolated from external vibration and housed in an enclosure to minimize contamination due to ambient environment. Additionally, contact cycling and data collection are automated using a computer and LabVIEW. Results include contact resistance measurements of 6 and 8 μm radius contact bumps and lifetime testing up to 323.6 million cycles.
{"title":"Contact resistance evolution of highly cycled, lightly loaded micro-contacts","authors":"C. Stilson, R. Coutu","doi":"10.1117/12.2037355","DOIUrl":"https://doi.org/10.1117/12.2037355","url":null,"abstract":"Reliable microelectromechanical systems (MEMS) switches are critical for developing high performance radio frequency circuits like phase shifters. Engineers have attempted to improve reliability and lifecycle performance using novel contact metals, unique mechanical designs and packaging. Various test fixtures including: MEMS devices, atomic force microscopes (AFM) and nanoindentors have been used to collect resistance and contact force data. AFM and nanoindentor test fixtures allow direct contact force measurements but are severely limited by low resonance sensors, and therefore low data collection rates. This paper reports the contact resistance evolution results and fabrication of thin film, sputtered and evaporated gold, micro-contacts dynamically tested up to 3kHz. The upper contact support structure consists of a gold surface micromachined, fix-fix beam designed with sufficient restoring force to overcome adhesion. The hemisphere-upper and planar-lower contacts are mated with a calibrated, external load resulting in approximately 100μN of contact force and are cycled in excess of 106 times or until failure. Contact resistance is measured, in-situ, using a cross-bar configuration and the entire apparatus is isolated from external vibration and housed in an enclosure to minimize contamination due to ambient environment. Additionally, contact cycling and data collection are automated using a computer and LabVIEW. Results include contact resistance measurements of 6 and 8 μm radius contact bumps and lifetime testing up to 323.6 million cycles.","PeriodicalId":395835,"journal":{"name":"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130606591","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Jeffrey Lutkenhaus, D. George, B. Arigong, Hualiang Zhang, U. Philipose, Yuankun Lin
In this work, we present a method of holographically fabricating photonic structures in photosensitive polymer using a phase pattern displayed on a spatial light modulator (SLM) as a digitally programmable phase mask. The phase pattern can be programmed in hexagonal and square symmetries. By changing the gray level of the pixelated units in the displayed phase pattern, we can achieve a digital control of the phases of one or more of the interfering beams, thus changing the interference pattern. By using the phase pattern on the SLM as a tunable phase mask, different photonic crystal templates can be fabricated.
{"title":"Holographic fabrication of photonic crystal templates using spatial-light-modulator-based phase mask method","authors":"Jeffrey Lutkenhaus, D. George, B. Arigong, Hualiang Zhang, U. Philipose, Yuankun Lin","doi":"10.1117/12.2038781","DOIUrl":"https://doi.org/10.1117/12.2038781","url":null,"abstract":"In this work, we present a method of holographically fabricating photonic structures in photosensitive polymer using a phase pattern displayed on a spatial light modulator (SLM) as a digitally programmable phase mask. The phase pattern can be programmed in hexagonal and square symmetries. By changing the gray level of the pixelated units in the displayed phase pattern, we can achieve a digital control of the phases of one or more of the interfering beams, thus changing the interference pattern. By using the phase pattern on the SLM as a tunable phase mask, different photonic crystal templates can be fabricated.","PeriodicalId":395835,"journal":{"name":"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116838107","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
R. Westerman, L. Martinez, D. Pays-Volard, K. Mackenzie, T. Lazerand
Deep Reactive Ion Etching (DRIE) has revolutionized a wide variety of MEMS applications since its inception nearly two decades ago. The DRIE technology has been largely responsible for allowing lab scale technology demonstrations to become manufacturable and profitable consumer products. As applications which utilize DRIE technologies continue to expand and evolve, they continue to spawn a range of new requirements and open up exciting opportunities for advancement of DRIE. This paper will examine a number of current and emerging DRIE applications including nanotechnology, and DRIE related packaging technologies such as Through Silicon Via (TSV) and plasma dicing. The paper will discuss a number of technical challenges and solutions associated with these applications including: feature profile control at high aspect ratios, causes and elimination of feature tilt/skew, process options for fragile device structures, and problems associated with through substrate etching. The paper will close with a short discussion around the challenges of implementing DRIE in production environments as well as looking at potentially disruptive enhancements / substitutions for DRIE.
深度反应离子蚀刻(Deep Reactive Ion Etching, DRIE)自近20年前问世以来，已经彻底改变了各种MEMS应用。DRIE技术在很大程度上负责允许实验室规模的技术演示成为可制造和有利可图的消费产品。随着使用DRIE技术的应用程序不断扩展和发展，它们继续产生一系列新的要求，并为DRIE的发展开辟了令人兴奋的机会。本文将研究一些当前和新兴的DRIE应用，包括纳米技术，以及与DRIE相关的封装技术，如硅通孔(TSV)和等离子切割。本文将讨论与这些应用相关的一些技术挑战和解决方案，包括:高纵横比下的特征轮廓控制，特征倾斜/倾斜的原因和消除，易碎器件结构的工艺选择，以及与基板蚀刻相关的问题。本文将以简短的讨论结束，讨论在生产环境中实现DRIE所面临的挑战，以及对DRIE潜在的破坏性增强/替代。
{"title":"Deep silicon etching: current capabilities and future directions","authors":"R. Westerman, L. Martinez, D. Pays-Volard, K. Mackenzie, T. Lazerand","doi":"10.1117/12.2046694","DOIUrl":"https://doi.org/10.1117/12.2046694","url":null,"abstract":"Deep Reactive Ion Etching (DRIE) has revolutionized a wide variety of MEMS applications since its inception nearly two decades ago. The DRIE technology has been largely responsible for allowing lab scale technology demonstrations to become manufacturable and profitable consumer products. As applications which utilize DRIE technologies continue to expand and evolve, they continue to spawn a range of new requirements and open up exciting opportunities for advancement of DRIE. This paper will examine a number of current and emerging DRIE applications including nanotechnology, and DRIE related packaging technologies such as Through Silicon Via (TSV) and plasma dicing. The paper will discuss a number of technical challenges and solutions associated with these applications including: feature profile control at high aspect ratios, causes and elimination of feature tilt/skew, process options for fragile device structures, and problems associated with through substrate etching. The paper will close with a short discussion around the challenges of implementing DRIE in production environments as well as looking at potentially disruptive enhancements / substitutions for DRIE.","PeriodicalId":395835,"journal":{"name":"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128468438","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Frequency references are used in almost every modern electronic device including mobile phones, personal computers, and scientific and medical instrumentation. With modern consumer mobile devices imposing stringent requirements of low cost, low complexity, compact system integration and low power consumption, there has been significant interest to develop batch-manufactured MEMS resonators. An important challenge for MEMS resonators is to match the frequency and temperature stability of quartz resonators. We present 1MHz and 20MHz temperature compensated Free-Free beam MEMS resonators developed using PolyMUMPS, which is a commercial multi-user process available from MEMSCAP. We introduce a novel temperature compensation technique that enables high frequency stability over a wide temperature range. We used three strategies: passive compensation by using a structural gold (Au) layer on the resonator, active compensation through using a heater element, and a Free-Free beam design that minimizes the effects of thermal mismatch between the vibrating structure and the substrate. Detailed electro-mechanical simulations were performed to evaluate the frequency response and Quality Factor (Q). Specifically, for the 20MHz device, a Q of 10,000 was obtained for the passive compensated design. Finite Element Modeling (FEM) simulations were used to evaluate the Temperature Coefficient of frequency (TCf) of the resonators between -50°C and 125°C which yielded +0.638 ppm/°C for the active compensated, compared to -1.66 ppm/°C for the passively compensated design and -8.48 ppm/°C for uncompensated design for the 20MHz device. Electro-thermo-mechanical simulations showed that the heater element was capable of increasing the temperature of the resonators by approximately 53°C with an applied voltage of 10V and power consumption of 8.42 mW.
{"title":"Design of active temperature compensated composite free-free beam MEMS resonators in a standard process","authors":"G. Xereas, V. Chodavarapu","doi":"10.1117/12.2036239","DOIUrl":"https://doi.org/10.1117/12.2036239","url":null,"abstract":"Frequency references are used in almost every modern electronic device including mobile phones, personal computers, and scientific and medical instrumentation. With modern consumer mobile devices imposing stringent requirements of low cost, low complexity, compact system integration and low power consumption, there has been significant interest to develop batch-manufactured MEMS resonators. An important challenge for MEMS resonators is to match the frequency and temperature stability of quartz resonators. We present 1MHz and 20MHz temperature compensated Free-Free beam MEMS resonators developed using PolyMUMPS, which is a commercial multi-user process available from MEMSCAP. We introduce a novel temperature compensation technique that enables high frequency stability over a wide temperature range. We used three strategies: passive compensation by using a structural gold (Au) layer on the resonator, active compensation through using a heater element, and a Free-Free beam design that minimizes the effects of thermal mismatch between the vibrating structure and the substrate. Detailed electro-mechanical simulations were performed to evaluate the frequency response and Quality Factor (Q). Specifically, for the 20MHz device, a Q of 10,000 was obtained for the passive compensated design. Finite Element Modeling (FEM) simulations were used to evaluate the Temperature Coefficient of frequency (TCf) of the resonators between -50°C and 125°C which yielded +0.638 ppm/°C for the active compensated, compared to -1.66 ppm/°C for the passively compensated design and -8.48 ppm/°C for uncompensated design for the 20MHz device. Electro-thermo-mechanical simulations showed that the heater element was capable of increasing the temperature of the resonators by approximately 53°C with an applied voltage of 10V and power consumption of 8.42 mW.","PeriodicalId":395835,"journal":{"name":"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components","volume":"920 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123051341","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
We report on the development of a highly scalable head-tracking system capable of tracking many users. Throughout the operating area, a series of high-speed (4 kHz) near-infrared LED-based Digital Light Processor (DLP) picoprojectors provide overlapping illumination of the volume. Each projector outputs a sequence of binary images which encode the position of each pixel within the projected image as well as an identifier sequence for the projector. Overlapping projectors use differing temporal multiplexing to allow sensor discrimination and background rejection. Pixel positions from multiple projectors received by each sensor are triangulated to obtain position and orientation.
{"title":"High-speed active head tracking system","authors":"V. Markov, S. Kupiec, A. Hastings, T. Hester","doi":"10.1117/12.2040852","DOIUrl":"https://doi.org/10.1117/12.2040852","url":null,"abstract":"We report on the development of a highly scalable head-tracking system capable of tracking many users. Throughout the operating area, a series of high-speed (4 kHz) near-infrared LED-based Digital Light Processor (DLP) picoprojectors provide overlapping illumination of the volume. Each projector outputs a sequence of binary images which encode the position of each pixel within the projected image as well as an identifier sequence for the projector. Overlapping projectors use differing temporal multiplexing to allow sensor discrimination and background rejection. Pixel positions from multiple projectors received by each sensor are triangulated to obtain position and orientation.","PeriodicalId":395835,"journal":{"name":"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123977752","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Ultrashort pulsed lasers are used to fabricate 3D structures in single crystal CVD diamond. The interaction of the laser with diamond lattice leads to a permanent structural modification, which is highly localized at the focus. Severe spherical aberrations compromise fabrication precision below the diamond surface. We implement adaptive aberration compensation to ensure optimum fabrication performance. The nature of the structural modification is analysed for both surface and subsurface laser fabrications.
{"title":"Ultrafast laser processing of diamond","authors":"P. Salter, M. Booth","doi":"10.1117/12.2040384","DOIUrl":"https://doi.org/10.1117/12.2040384","url":null,"abstract":"Ultrashort pulsed lasers are used to fabricate 3D structures in single crystal CVD diamond. The interaction of the laser with diamond lattice leads to a permanent structural modification, which is highly localized at the focus. Severe spherical aberrations compromise fabrication precision below the diamond surface. We implement adaptive aberration compensation to ensure optimum fabrication performance. The nature of the structural modification is analysed for both surface and subsurface laser fabrications.","PeriodicalId":395835,"journal":{"name":"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121285641","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Mäkynen, M. Tuohiniemi, A. Näsilä, R. Mannila, J. Antila
VTT Technical research centre of Finland has developed a MEMS Fabry-Perot interferometer (FPI) for the wavelength range from 7.5 μm to 9.5 μm. The device consists of two Distributed Bragg Reflectors (DBR) manufactured with MEMS processing techniques. The full width half maximum of the transmission peak is 150nm. This transmission peak can be tuned from 7.5 μm to 9.5 μm by applying a control voltage from 0 V to 30 V. A laboratory demonstrator has been put together to show the use of this module as a part of a spectral measurement setup. Several gas samples have been measured with the setup and compared against measurement results found in literature.
{"title":"MEMS Fabry-Perot interferometer-based spectrometer demonstrator for 7.5 μm to 9.5 μm wavelength range","authors":"J. Mäkynen, M. Tuohiniemi, A. Näsilä, R. Mannila, J. Antila","doi":"10.1117/12.2036272","DOIUrl":"https://doi.org/10.1117/12.2036272","url":null,"abstract":"VTT Technical research centre of Finland has developed a MEMS Fabry-Perot interferometer (FPI) for the wavelength range from 7.5 μm to 9.5 μm. The device consists of two Distributed Bragg Reflectors (DBR) manufactured with MEMS processing techniques. The full width half maximum of the transmission peak is 150nm. This transmission peak can be tuned from 7.5 μm to 9.5 μm by applying a control voltage from 0 V to 30 V. A laboratory demonstrator has been put together to show the use of this module as a part of a spectral measurement setup. Several gas samples have been measured with the setup and compared against measurement results found in literature.","PeriodicalId":395835,"journal":{"name":"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components","volume":"136 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116324125","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The holographic lithography - ion beam etching is adopted to fabricate the nanoimprint template with periodic structures. The accurate control of the high aspect ratio of the profile is achieved by the optimization of the holographic lithography and the choice of the appropriate parameters of ion beam etching. There are two major challenging steps of this method: 1) the holographic exposure and development in the fabrication of the photoresist mask and 2) the ion beam etching to transfer the photoresist mask to the fused silica. The experiment indicates that titled rotation of the ion beam etching combined with reactive ion beam etching can achieve the accurate control of the high aspect ratio structure. Two types of nanoimprint template have been fabricated: the period of 250nm and the groove depth of 380nm; the period of 600nm and groove depth of 1400nm, respectively.
{"title":"Fabrication of the nanoimprint template with periodic structures","authors":"Quan Liu, Jianhong Wu, Yu Cheng","doi":"10.1117/12.2039584","DOIUrl":"https://doi.org/10.1117/12.2039584","url":null,"abstract":"The holographic lithography - ion beam etching is adopted to fabricate the nanoimprint template with periodic structures. The accurate control of the high aspect ratio of the profile is achieved by the optimization of the holographic lithography and the choice of the appropriate parameters of ion beam etching. There are two major challenging steps of this method: 1) the holographic exposure and development in the fabrication of the photoresist mask and 2) the ion beam etching to transfer the photoresist mask to the fused silica. The experiment indicates that titled rotation of the ion beam etching combined with reactive ion beam etching can achieve the accurate control of the high aspect ratio structure. Two types of nanoimprint template have been fabricated: the period of 250nm and the groove depth of 380nm; the period of 600nm and groove depth of 1400nm, respectively.","PeriodicalId":395835,"journal":{"name":"Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115752309","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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