Pub Date : 1900-01-01DOI: 10.1109/SEMI-THERM.2017.7896916
Mohammad I. Tradat, H. Alissa, K. Nemati, Sadegh Khalili, B. Sammakia, M. Seymour, Russell Tipton
Today's data centers increasingly rely on environmental data collection and analysis to operate the cooling infrastructure as efficiently as possible and to maintain the reliability of IT equipment. This in turn emphasizes the importance of the quality of data collected and its relevance to the overall operation of the data center. This study presents an experiment based analysis and comparison of environmental and power data collection using two different approaches; one uses a discrete sensor network and smart PDUs, and another uses available data from the installed IT equipment (IPMI data). The comparison looks deeply into the effect of both approaches that are adopted to control data center cooling. In addition, the effect that the Supply Air Temperature (SAT) from the Computer Room Air Handler (CRAH) unit had on the IT equipment was investigated in fully sealed Cold Aisle Containment (CAC) with 100% CPU utilization. It can be observed that the difference between the discrete and IPMI inlet temperature of the IT equipment increased as SAT increased due to the IT fans increasing speed in an attempt to get more cooling and the resulting in negative pressure differential build up inside the containment. Furthermore, the authors identified a value of the supply air temperature at which IT equipment started to ramp up for both approaches of data center cooling and control. The novelty of this study may aid data center operators when making the decision of what monitoring or control scheme to use.
{"title":"Impact of elevated temperature on data center operation based on internal and external IT instrumentation","authors":"Mohammad I. Tradat, H. Alissa, K. Nemati, Sadegh Khalili, B. Sammakia, M. Seymour, Russell Tipton","doi":"10.1109/SEMI-THERM.2017.7896916","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896916","url":null,"abstract":"Today's data centers increasingly rely on environmental data collection and analysis to operate the cooling infrastructure as efficiently as possible and to maintain the reliability of IT equipment. This in turn emphasizes the importance of the quality of data collected and its relevance to the overall operation of the data center. This study presents an experiment based analysis and comparison of environmental and power data collection using two different approaches; one uses a discrete sensor network and smart PDUs, and another uses available data from the installed IT equipment (IPMI data). The comparison looks deeply into the effect of both approaches that are adopted to control data center cooling. In addition, the effect that the Supply Air Temperature (SAT) from the Computer Room Air Handler (CRAH) unit had on the IT equipment was investigated in fully sealed Cold Aisle Containment (CAC) with 100% CPU utilization. It can be observed that the difference between the discrete and IPMI inlet temperature of the IT equipment increased as SAT increased due to the IT fans increasing speed in an attempt to get more cooling and the resulting in negative pressure differential build up inside the containment. Furthermore, the authors identified a value of the supply air temperature at which IT equipment started to ramp up for both approaches of data center cooling and control. The novelty of this study may aid data center operators when making the decision of what monitoring or control scheme to use.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"33 8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123250614","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/SEMI-THERM.2017.7896943
J. Ellis, Gethn Pickard
A method for determining the thermal resistance of high power LEDs is described. Unlike more complicated systems, this method simply uses a fast pulse to determine the junction temperature under actual operating currents, combined with a conventional thermocouple to measure the mounting face temperature. The literature can be somewhat confusing in describing the thermal resistance of an LED. Often an “apparent” thermal resistance is determined from the input power alone, ignoring the optical power output. This can provide a correct junction temperature as a guideline under a given condition. However, the real thermal resistance, which may be about twice as high as the apparent thermal resistance, is of little use unless the exact output power of the LED is known, so that the real heat dissipated can be determined. This is dependent on the operating current, temperature, and where the LED is on its longevity curve, and can also be affected by the light fitting as well. Therefore, it is necessary to model these LED effects which correctly describes the light output under real conditions.
{"title":"A method of characterising the thermal resistance of high power LEDs","authors":"J. Ellis, Gethn Pickard","doi":"10.1109/SEMI-THERM.2017.7896943","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896943","url":null,"abstract":"A method for determining the thermal resistance of high power LEDs is described. Unlike more complicated systems, this method simply uses a fast pulse to determine the junction temperature under actual operating currents, combined with a conventional thermocouple to measure the mounting face temperature. The literature can be somewhat confusing in describing the thermal resistance of an LED. Often an “apparent” thermal resistance is determined from the input power alone, ignoring the optical power output. This can provide a correct junction temperature as a guideline under a given condition. However, the real thermal resistance, which may be about twice as high as the apparent thermal resistance, is of little use unless the exact output power of the LED is known, so that the real heat dissipated can be determined. This is dependent on the operating current, temperature, and where the LED is on its longevity curve, and can also be affected by the light fitting as well. Therefore, it is necessary to model these LED effects which correctly describes the light output under real conditions.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128363402","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/SEMI-THERM.2017.7896910
Narayanan Terizhandur Varadharajan, M. Ozen, Kazunari Koga, H. Mandavia
Smaller footprints along with higher bandwidth needs and tightening power performance requirements are forcing the move towards 3D-IC package architectures. This is compounded by the fast pace of development in the mobile, automotive and internet-of-things (IoT) market segments. During the design process, engineers have to access many design and analysis tools, but most of the design flow is often unconnected and design data is exchanged manually. To meet aggressive schedule and market requirements, we aim to showcase a flow to tackle the problem with a native 3D hierarchical design approach incorporating IC-package co-design. Finally, we illustrate the benefits of using such an approach for solving the all-critical thermal “hotspot” issue in a 3D stacked IC design, as seen in the image below, facilitating a quick turnaround for design/performance decisions.
{"title":"Enabling faster design/performance decisions for 3D-IC package architectures","authors":"Narayanan Terizhandur Varadharajan, M. Ozen, Kazunari Koga, H. Mandavia","doi":"10.1109/SEMI-THERM.2017.7896910","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896910","url":null,"abstract":"Smaller footprints along with higher bandwidth needs and tightening power performance requirements are forcing the move towards 3D-IC package architectures. This is compounded by the fast pace of development in the mobile, automotive and internet-of-things (IoT) market segments. During the design process, engineers have to access many design and analysis tools, but most of the design flow is often unconnected and design data is exchanged manually. To meet aggressive schedule and market requirements, we aim to showcase a flow to tackle the problem with a native 3D hierarchical design approach incorporating IC-package co-design. Finally, we illustrate the benefits of using such an approach for solving the all-critical thermal “hotspot” issue in a 3D stacked IC design, as seen in the image below, facilitating a quick turnaround for design/performance decisions.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"161 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115899005","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/SEMI-THERM.2017.7896900
H. K. Ma, C. Hsieh, S. Liao
In recent years, piezoelectric fans and their feasibility of cooling electronic devices have been widely studied. Nonetheless, there is few study about using piezoelectric fans to generate radial air flow. In this study, a radial multiple fan system (RMFS) was developed for the thermal management of high power LEDs. This system used one piezoelectric actuator and the magnetic repulsive force to activate up to 20 passive fans, which featured low power consumption and a large cooling area. The RMFS was embedded in a circular heat sink in order to evaluate its thermal performance. To find the optimal design of the RMFS, some geometry parameters were investigated. Besides, the performance of different designs was compared with commercially available axial fan. The results showed that design E had the better thermal performance because of its relatively large frequency and amplitude. The thermal resistance and the percentage improvement under 15 W heat flux were 0.84 K/W and 41.9 %, respectively. Moreover, a dimensionless number for the RMFS (MRMFS) was defined to assess the enhancement of the convective heat transfer coefficient. In design E, MRMFS was 2.1 when the power consumption of the RMFS was only 0.2 W.
{"title":"Study of an innovative multiple fan system with one piezoelectric actuator embedded in a circular heat sink","authors":"H. K. Ma, C. Hsieh, S. Liao","doi":"10.1109/SEMI-THERM.2017.7896900","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896900","url":null,"abstract":"In recent years, piezoelectric fans and their feasibility of cooling electronic devices have been widely studied. Nonetheless, there is few study about using piezoelectric fans to generate radial air flow. In this study, a radial multiple fan system (RMFS) was developed for the thermal management of high power LEDs. This system used one piezoelectric actuator and the magnetic repulsive force to activate up to 20 passive fans, which featured low power consumption and a large cooling area. The RMFS was embedded in a circular heat sink in order to evaluate its thermal performance. To find the optimal design of the RMFS, some geometry parameters were investigated. Besides, the performance of different designs was compared with commercially available axial fan. The results showed that design E had the better thermal performance because of its relatively large frequency and amplitude. The thermal resistance and the percentage improvement under 15 W heat flux were 0.84 K/W and 41.9 %, respectively. Moreover, a dimensionless number for the RMFS (MRMFS) was defined to assess the enhancement of the convective heat transfer coefficient. In design E, MRMFS was 2.1 when the power consumption of the RMFS was only 0.2 W.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127507178","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/SEMI-THERM.2017.7896938
Richard Kenney, Vaidehi Oruganti, A. Ortega, Don Nguyen, Michael Brooks
Experiments have been performed to characterize the thermal resistance of thermal interface materials that deform under mechanical loading. TIMs in this category include elastomeric silicon rubber based TIM gap pads and pourable paste-like composite materials that set when cured. This paper reports on extensive experiments performed to characterize the overall thermal resistance of TIM pads composed of a silicon rubber base material enhanced with metallic filler particles. It is found that TIM pad thermal resistance decreases with applied load, reaching an asymptotic minimum thermal resistance which is dependent on initial thickness and material formulation. The critical pressure required to achieve minimum resistance is identified for all tested samples and is strongly dependent on material formulation. It is shown that the minimum thermal TIM resistance is not dependent on the size of the TIM sample under test when it is represented as the unit thermal resistance. Careful examination of the data shows that the apparent density of these TIM materials increases with load. Surprisingly the effective thermal conductivity initially increases with load but then maximizes and decreases as the load and the material strain surpass some critical value.
{"title":"Experiments on the thermal resistance of deformable thermal interface materials under mechanical loading","authors":"Richard Kenney, Vaidehi Oruganti, A. Ortega, Don Nguyen, Michael Brooks","doi":"10.1109/SEMI-THERM.2017.7896938","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896938","url":null,"abstract":"Experiments have been performed to characterize the thermal resistance of thermal interface materials that deform under mechanical loading. TIMs in this category include elastomeric silicon rubber based TIM gap pads and pourable paste-like composite materials that set when cured. This paper reports on extensive experiments performed to characterize the overall thermal resistance of TIM pads composed of a silicon rubber base material enhanced with metallic filler particles. It is found that TIM pad thermal resistance decreases with applied load, reaching an asymptotic minimum thermal resistance which is dependent on initial thickness and material formulation. The critical pressure required to achieve minimum resistance is identified for all tested samples and is strongly dependent on material formulation. It is shown that the minimum thermal TIM resistance is not dependent on the size of the TIM sample under test when it is represented as the unit thermal resistance. Careful examination of the data shows that the apparent density of these TIM materials increases with load. Surprisingly the effective thermal conductivity initially increases with load but then maximizes and decreases as the load and the material strain surpass some critical value.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127337745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/SEMI-THERM.2017.7896922
H. K. Ma, S. Liao, Y. S. Lee
In this study, a multiple fans system with a piezoelectric actuator (MFPA) was integrated with a vapor chamber. The integrated system was embedded in a micro-computer for its thermal management. The MFPA utilized magnetic repulsive force to transfer power from the piezoelectric actuator to the adjacent passive fans. Models with different fan length, fan pitch and the number of the fans were developed. The thermal performance, vibrational amplitude, and power consumption of different models were investigated. The experiment results showed that the thermal resistance of all the models decreased when the input power increased. Besides, the model with shorter carbon fiber plate length, larger fan pitch and larger fan number had the lower thermal resistance. The model with five fans, 11 mm fan pitch, 40 mm carbon fiber plate and 10 mm Mylar plate had the lowest thermal resistance at 3.14 °C/W under the 12 W input power, while the thermal resistance of natural convection was 4.88 °C/W. The power consumption of the model was merely 0.05 W.
在本研究中，将一个带有压电致动器(MFPA)的多风扇系统与一个蒸汽室集成在一起。该集成系统被嵌入到微机中进行热管理。MFPA利用磁斥力将压电致动器的功率传递给相邻的无源风扇。开发了不同风扇长度、风扇间距和风扇数量的型号。研究了不同型号的热工性能、振动幅值和功耗。实验结果表明，各模型的热阻随输入功率的增大而减小。碳纤维板长度越短、风机节距越大、风机数量越多，其热阻越小。在12 W输入功率下，5个风扇、11 mm风扇间距、40 mm碳纤维板和10 mm Mylar板的模型的热阻最低，为3.14°C/W，而自然对流的热阻为4.88°C/W。该模型的功耗仅为0.05 W。
{"title":"Integration of a multiple piezoelectric fans system with a vapor chamber","authors":"H. K. Ma, S. Liao, Y. S. Lee","doi":"10.1109/SEMI-THERM.2017.7896922","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896922","url":null,"abstract":"In this study, a multiple fans system with a piezoelectric actuator (MFPA) was integrated with a vapor chamber. The integrated system was embedded in a micro-computer for its thermal management. The MFPA utilized magnetic repulsive force to transfer power from the piezoelectric actuator to the adjacent passive fans. Models with different fan length, fan pitch and the number of the fans were developed. The thermal performance, vibrational amplitude, and power consumption of different models were investigated. The experiment results showed that the thermal resistance of all the models decreased when the input power increased. Besides, the model with shorter carbon fiber plate length, larger fan pitch and larger fan number had the lower thermal resistance. The model with five fans, 11 mm fan pitch, 40 mm carbon fiber plate and 10 mm Mylar plate had the lowest thermal resistance at 3.14 °C/W under the 12 W input power, while the thermal resistance of natural convection was 4.88 °C/W. The power consumption of the model was merely 0.05 W.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121609031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/SEMI-THERM.2017.7896920
P. Parida, A. Sridhar, M. Schultz, Fanghao Yang, M. Gaynes, E. Colgan, B. Dang, Gerard McVicker, T. Brunschwiler, J. Knickerbocker, T. Chainer
Interlayer cooling utilizing pumped two-phase flow of a chip-to-chip interconnect-compatible dielectric fluid is an enabling technology for future high power 3D (three-dimensional) chip stacks. Development of this approach requires high fidelity and computationally manageable conjugate thermal models. In this paper, a conjugate heat transfer model developed for simulating two-phase flow boiling through chip embedded micron-scale channels is described. This model uses a novel hybrid approach where governing equations for flow-field and convection in the single-phase flow regions (e.g. inlet plenum) as well as that for heat conduction in solids is solved in detail (i.e., full-physics) while in the two-phase flow regions (e.g. micro-channels), a reduced-physics approach is used. Extensive model validation using data from several experiments was performed to quantify the accuracy of this model under different operating conditions.
{"title":"Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices","authors":"P. Parida, A. Sridhar, M. Schultz, Fanghao Yang, M. Gaynes, E. Colgan, B. Dang, Gerard McVicker, T. Brunschwiler, J. Knickerbocker, T. Chainer","doi":"10.1109/SEMI-THERM.2017.7896920","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896920","url":null,"abstract":"Interlayer cooling utilizing pumped two-phase flow of a chip-to-chip interconnect-compatible dielectric fluid is an enabling technology for future high power 3D (three-dimensional) chip stacks. Development of this approach requires high fidelity and computationally manageable conjugate thermal models. In this paper, a conjugate heat transfer model developed for simulating two-phase flow boiling through chip embedded micron-scale channels is described. This model uses a novel hybrid approach where governing equations for flow-field and convection in the single-phase flow regions (e.g. inlet plenum) as well as that for heat conduction in solids is solved in detail (i.e., full-physics) while in the two-phase flow regions (e.g. micro-channels), a reduced-physics approach is used. Extensive model validation using data from several experiments was performed to quantify the accuracy of this model under different operating conditions.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133839887","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/SEMI-THERM.2017.7896948
Yaser Hadad, Bharath Ramakrishnan, S. Alkharabsheh, P. Chiarot, B. Sammakia
In electronics cooling, water is increasingly replacing air for applications requiring high heat flux. Water is the ideal substitute due to its high specific heat capacity and density. Indeed, high values of heat capacity (high density and specific heat capacity) enable water to receive, store and carry higher amounts of energy compared to air. Water's incompressibility and very low specific volume also requires smaller amounts of mechanical work for fluid circulation. Using warm water instead of chilled water makes the cooling process more economical, but requires more efficiently designed cold-plates. Our current work focuses on modeling and optimization of a V-groove mini-channel cold-plate using warm water as the coolant. Our results show that the performance of an impinging channel heat sink is significantly different compared to parallel channel designs. Dividing the flow into two branches cuts the fluid velocity and flow path in half for the impinging design. This reduction in the fluid velocity and flow length affects the developing thermal boundary layer and is an important consideration for a shorter length heat exchanger (where the channel length is comparable to the thermal entrance length). Distributing the coolant uniformly to every channel is a challenge for impinging cold-plates where there are strict limitations on size.
{"title":"Numerical modeling and optimization of a V-groove warm water cold-plate","authors":"Yaser Hadad, Bharath Ramakrishnan, S. Alkharabsheh, P. Chiarot, B. Sammakia","doi":"10.1109/SEMI-THERM.2017.7896948","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896948","url":null,"abstract":"In electronics cooling, water is increasingly replacing air for applications requiring high heat flux. Water is the ideal substitute due to its high specific heat capacity and density. Indeed, high values of heat capacity (high density and specific heat capacity) enable water to receive, store and carry higher amounts of energy compared to air. Water's incompressibility and very low specific volume also requires smaller amounts of mechanical work for fluid circulation. Using warm water instead of chilled water makes the cooling process more economical, but requires more efficiently designed cold-plates. Our current work focuses on modeling and optimization of a V-groove mini-channel cold-plate using warm water as the coolant. Our results show that the performance of an impinging channel heat sink is significantly different compared to parallel channel designs. Dividing the flow into two branches cuts the fluid velocity and flow path in half for the impinging design. This reduction in the fluid velocity and flow length affects the developing thermal boundary layer and is an important consideration for a shorter length heat exchanger (where the channel length is comparable to the thermal entrance length). Distributing the coolant uniformly to every channel is a challenge for impinging cold-plates where there are strict limitations on size.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116085867","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/SEMI-THERM.2017.7896899
A. Gurevich, Isaac Steiner, Enhui Huang
Relatively low efficiency of thermoelectric systems is a main limiting factor for extension of the Thermoelectric technology application fields. A prospective way of efficiency improvement based on combination of Thermoelectric and Vapor Chamber thermal technologies is shown and analyzed in the paper. Aluminum Vapor Chamber technology has been chosen for evaluations because of its important advantages: high thermal conductivity, light weight, wide working temperature range. A series of experiments and computer simulations has been performed to define effective thermal conductivity of Aluminum Vapor Chamber in conjunction with thermoelectric modules. It was found that Aluminum Vapor Chamber performs thermally like isotropic material with effective thermal conductivity of 8363 W/m/K. Performance of the thermoelectric air conditioners containing Vapor Chamber have been estimated. It was shown that use of combination of Thermoelectric and Vapor Chamber Technologies (TVC systems) provides significant improvement of cooling capacity at the same working conditions.
{"title":"Design of thermal systems based on combination of Thermoelectric and Vapor Chamber technologies","authors":"A. Gurevich, Isaac Steiner, Enhui Huang","doi":"10.1109/SEMI-THERM.2017.7896899","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896899","url":null,"abstract":"Relatively low efficiency of thermoelectric systems is a main limiting factor for extension of the Thermoelectric technology application fields. A prospective way of efficiency improvement based on combination of Thermoelectric and Vapor Chamber thermal technologies is shown and analyzed in the paper. Aluminum Vapor Chamber technology has been chosen for evaluations because of its important advantages: high thermal conductivity, light weight, wide working temperature range. A series of experiments and computer simulations has been performed to define effective thermal conductivity of Aluminum Vapor Chamber in conjunction with thermoelectric modules. It was found that Aluminum Vapor Chamber performs thermally like isotropic material with effective thermal conductivity of 8363 W/m/K. Performance of the thermoelectric air conditioners containing Vapor Chamber have been estimated. It was shown that use of combination of Thermoelectric and Vapor Chamber Technologies (TVC systems) provides significant improvement of cooling capacity at the same working conditions.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127739013","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/SEMI-THERM.2017.7896935
K. Petrosyants, Sergey V. Lebedev, L. Sambursky, V. G. Stakhin, I. Kharitonov, M. Ismail-Zade, P. Ignatov
SOI CMOS technology was developed for extended high temperature (HT) range applications (to 300 °C). MOSFETs come in two options: for digital applications with minimum gate length 0.18 µm and 1.8 V supply voltage and for analog applications with minimum gate length 0.5 µm and 5 V supply. Results of electrical characteristics measurement are demonstrated, analyzed, and compared for SOI MOSFETs of both options. A modified SOI MOSFET compact model is developed for extended temperature range up to 300°C to provide the possibility of HT SOI CMOS circuit simulation with SPICE.
SOI CMOS技术是为扩展高温(HT)范围应用(至300°C)而开发的。mosfet有两种选择:用于最小栅极长度0.18µm和1.8 V供电电压的数字应用，以及最小栅极长度0.5µm和5 V供电的模拟应用。对两种选择的SOI mosfet的电特性测量结果进行了演示、分析和比较。开发了一种改进的SOI MOSFET紧凑型模型，可扩展温度范围至300°C，以提供使用SPICE进行HT SOI CMOS电路模拟的可能性。
{"title":"High temperature submicron SOI CMOS technology characterization for analog and digital applications up to 300°C","authors":"K. Petrosyants, Sergey V. Lebedev, L. Sambursky, V. G. Stakhin, I. Kharitonov, M. Ismail-Zade, P. Ignatov","doi":"10.1109/SEMI-THERM.2017.7896935","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896935","url":null,"abstract":"SOI CMOS technology was developed for extended high temperature (HT) range applications (to 300 °C). MOSFETs come in two options: for digital applications with minimum gate length 0.18 µm and 1.8 V supply voltage and for analog applications with minimum gate length 0.5 µm and 5 V supply. Results of electrical characteristics measurement are demonstrated, analyzed, and compared for SOI MOSFETs of both options. A modified SOI MOSFET compact model is developed for extended temperature range up to 300°C to provide the possibility of HT SOI CMOS circuit simulation with SPICE.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117023031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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