Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896929
Bharath Ramakrishnan, S. Alkharabsheh, Yaser Hadad, B. Sammakia, P. Chiarot, M. Seymour, Russell Tipton
Recent advancements in microelectronics packaging and fabrication have resulted in high heat flux densities in data center server components. Liquid cooling is increasingly replacing air cooling in data centers because of its high heat carrying capacity. It also provides an energy efficient way to transport heat from processor as compared to air cooling using Computer Room Air Conditioning (CRAC). This study presents the results of a bench level experiment to characterize a commercially available cold plate. The cold plate under consideration is used in Direct Liquid Cooling (DLC) application in data center cooling. Thermal characterization of cold-plate is necessary in order to develop a fundamental understanding of its energy transport which would enable researchers to improve the overall energy-efficiency; reliability and usability of warm water cooling in data centers. The temperature rise (ΔT) across the cold plate and the cold plate surface temperature are measured for various coolant flow rate and chip power. The results are presented in the form of thermal resistance curve. A close estimation of heat transfer coefficient values is then obtained from the resistance values using well-established relations.
{"title":"Experimental characterization of a cold plate used in warm water cooling of data centers","authors":"Bharath Ramakrishnan, S. Alkharabsheh, Yaser Hadad, B. Sammakia, P. Chiarot, M. Seymour, Russell Tipton","doi":"10.1109/SEMI-THERM.2017.7896929","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896929","url":null,"abstract":"Recent advancements in microelectronics packaging and fabrication have resulted in high heat flux densities in data center server components. Liquid cooling is increasingly replacing air cooling in data centers because of its high heat carrying capacity. It also provides an energy efficient way to transport heat from processor as compared to air cooling using Computer Room Air Conditioning (CRAC). This study presents the results of a bench level experiment to characterize a commercially available cold plate. The cold plate under consideration is used in Direct Liquid Cooling (DLC) application in data center cooling. Thermal characterization of cold-plate is necessary in order to develop a fundamental understanding of its energy transport which would enable researchers to improve the overall energy-efficiency; reliability and usability of warm water cooling in data centers. The temperature rise (ΔT) across the cold plate and the cold plate surface temperature are measured for various coolant flow rate and chip power. The results are presented in the form of thermal resistance curve. A close estimation of heat transfer coefficient values is then obtained from the resistance values using well-established relations.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126595424","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896909
K. Srinivasan, S. Pan, Zhigang Feng, N. Chang, T. Pawlak
Power Management devices are becoming ubiquitous in every electronic system for achieving energy efficiency with constrained power/thermal budget. Multi-Function and Multi-Channel PMICs are becoming common design trend to support diverse voltage/power requirements of complex SoCs. In this paper, we present an approach to perform a full chip level thermal analysis with the capability to perform a detailed sub-modeling for electro-thermal analysis with Finite Element method and perform thermal-aware EM and stress analysis. The approach in transient thermal, thermal-aware EM and stress analyses includes the generation of thermal-aware chip power maps, conversion of converged thermal profiles in Power Devices to thermal loadings and detailed sub-modeling of on-chip structures for transient thermal, thermal-aware EM and thermal-induced stress analyses.
{"title":"An efficient transient thermal simulation methodology for Power Management IC designs","authors":"K. Srinivasan, S. Pan, Zhigang Feng, N. Chang, T. Pawlak","doi":"10.1109/SEMI-THERM.2017.7896909","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896909","url":null,"abstract":"Power Management devices are becoming ubiquitous in every electronic system for achieving energy efficiency with constrained power/thermal budget. Multi-Function and Multi-Channel PMICs are becoming common design trend to support diverse voltage/power requirements of complex SoCs. In this paper, we present an approach to perform a full chip level thermal analysis with the capability to perform a detailed sub-modeling for electro-thermal analysis with Finite Element method and perform thermal-aware EM and stress analysis. The approach in transient thermal, thermal-aware EM and stress analyses includes the generation of thermal-aware chip power maps, conversion of converged thermal profiles in Power Devices to thermal loadings and detailed sub-modeling of on-chip structures for transient thermal, thermal-aware EM and thermal-induced stress analyses.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130359483","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896908
R. Murugan, Nathan Ai, C. Kao
A coupled-electro-thermal RDS(ON) (drain to source ON resistance) co-analysis methodology for Power MOSFET is proposed. The methodology contains two functional modules: 1) physical field solvers and 2) equivalent circuit/network solver. The field solver resolves the electrical and thermal field variables by the conventional 3D finite-element method, while the network solver can achieve accurate and efficient results by connecting the equivalent electrical, thermal and flow circuits that are extracted from the system through advanced numerical computational schemes. The integrated equivalent network can then be solved by a generic circuit solver for steady state and transient responses. The methodology is demonstrated, via simulation and measurement, on a 2.5MHz DCDC buck-boost converter. Good correlation between co-analysis methodology and laboratory measurements is achieved.
{"title":"System-level electro-thermal analysis of RDS(ON) for power MOSFET","authors":"R. Murugan, Nathan Ai, C. Kao","doi":"10.1109/SEMI-THERM.2017.7896908","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896908","url":null,"abstract":"A coupled-electro-thermal RDS(ON) (drain to source ON resistance) co-analysis methodology for Power MOSFET is proposed. The methodology contains two functional modules: 1) physical field solvers and 2) equivalent circuit/network solver. The field solver resolves the electrical and thermal field variables by the conventional 3D finite-element method, while the network solver can achieve accurate and efficient results by connecting the equivalent electrical, thermal and flow circuits that are extracted from the system through advanced numerical computational schemes. The integrated equivalent network can then be solved by a generic circuit solver for steady state and transient responses. The methodology is demonstrated, via simulation and measurement, on a 2.5MHz DCDC buck-boost converter. Good correlation between co-analysis methodology and laboratory measurements is achieved.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126346073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896902
T. Torzewicz, A. Samson, T. Raszkowski, A. Sobczak, M. Janicki, M. Zubert, A. Napieralski
This paper, based on the practical example of a hybrid test circuit, illustrates the importance of proper modeling of the heat transfer coefficient dependence on surface temperature rise and fluid velocity in air cooled electronic systems. The presented experiments show that for the considered circuit the value of the heat transfer coefficient strongly depends on both these factors, thus its changes have to be taken into account in thermal simulations. A simple empirical relation proposed here by the authors allows accurate assessment of local heat transfer coefficient values in different cooling conditions and significant increase of thermal simulation accuracy.
{"title":"Thermal analysis of hybrid circuits with variable heat transfer coefficient","authors":"T. Torzewicz, A. Samson, T. Raszkowski, A. Sobczak, M. Janicki, M. Zubert, A. Napieralski","doi":"10.1109/SEMI-THERM.2017.7896902","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896902","url":null,"abstract":"This paper, based on the practical example of a hybrid test circuit, illustrates the importance of proper modeling of the heat transfer coefficient dependence on surface temperature rise and fluid velocity in air cooled electronic systems. The presented experiments show that for the considered circuit the value of the heat transfer coefficient strongly depends on both these factors, thus its changes have to be taken into account in thermal simulations. A simple empirical relation proposed here by the authors allows accurate assessment of local heat transfer coefficient values in different cooling conditions and significant increase of thermal simulation accuracy.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131999725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896905
Aaron Rips, K. Shoele, A. Glezer, R. Mittal
A novel method that exploits flow-induced vibration for enhancing heat transfer in electronic cooling applications is explored using coupled flow-structural-thermal modeling. The idea is inspired from wind-instruments where the flow-induced vibration of a “reed” generates sound. In the current approach, a reed installed in a channel with heated walls is shown to generate vortex structures that enhance thermal convection with low pressure loss. Simulations employ a multiphysics approach to model the dynamics of this coupled flow, structure and thermal problem. Through flow visualizations and analyses, the dominant heat transfer enhancement mechanism is identified. Vortical structures shed from the self-actuated fluttering reed cause jetting of cold fluid from the core of the flow towards the heated top and bottom walls of the channel, causing sharper temperature gradients and thus higher heat flux. This mechanism led to 30% higher heat transfer for a fixed flow rate, and an 11% improvement in the thermal enhancement factor.
{"title":"Efficient electronic cooling via flow-induced vibrations","authors":"Aaron Rips, K. Shoele, A. Glezer, R. Mittal","doi":"10.1109/SEMI-THERM.2017.7896905","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896905","url":null,"abstract":"A novel method that exploits flow-induced vibration for enhancing heat transfer in electronic cooling applications is explored using coupled flow-structural-thermal modeling. The idea is inspired from wind-instruments where the flow-induced vibration of a “reed” generates sound. In the current approach, a reed installed in a channel with heated walls is shown to generate vortex structures that enhance thermal convection with low pressure loss. Simulations employ a multiphysics approach to model the dynamics of this coupled flow, structure and thermal problem. Through flow visualizations and analyses, the dominant heat transfer enhancement mechanism is identified. Vortical structures shed from the self-actuated fluttering reed cause jetting of cold fluid from the core of the flow towards the heated top and bottom walls of the channel, causing sharper temperature gradients and thus higher heat flux. This mechanism led to 30% higher heat transfer for a fixed flow rate, and an 11% improvement in the thermal enhancement factor.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132981833","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896906
Maxim Serebreni, R. Wilcoxon, D. Hillman, N. Blattau, C. Hillman
Electronic components, such as ball grid array (BGA), chip scale packages (CSP) and bottom terminated components (BTC) used in harsh use environments often require the use of conformal coatings to meet reliability requirements. In certain coating application methods, the conformal coating materials can flow underneath the component and cause solder joint failure during thermal expansion and contraction of the electronic assembly. In this study, BGA components were coated with an acrylic conformal coating material using two application methods and subjected to two different thermal cycling profiles to assess the integrity of SnPb and Pb-free BGA components. To better understand the observed failure modes, Finite Element Analysis (FEA) was performed on the conformally coated BGA packages. Material characterization was performed using Dynamic Mechanical Analysis (DMA) and Thermal Mechanical Analysis (TMA) to capture the temperature dependent properties of the conformal coating to better correlate simulation and experimental results. Failure modes were found to greatly depend on the conformal coating material properties around the glass transition temperature (Tg) rather than temperature cycle range. Significant differences in the failure mode were found between the Pb-free and SnPb BGA components with acrylic conformal coating materials and temperatures profiles.
{"title":"The effect of improper conformal coating on SnPb and Pb-free BGA solder joints during thermal cycling: Experiments and modeling","authors":"Maxim Serebreni, R. Wilcoxon, D. Hillman, N. Blattau, C. Hillman","doi":"10.1109/SEMI-THERM.2017.7896906","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896906","url":null,"abstract":"Electronic components, such as ball grid array (BGA), chip scale packages (CSP) and bottom terminated components (BTC) used in harsh use environments often require the use of conformal coatings to meet reliability requirements. In certain coating application methods, the conformal coating materials can flow underneath the component and cause solder joint failure during thermal expansion and contraction of the electronic assembly. In this study, BGA components were coated with an acrylic conformal coating material using two application methods and subjected to two different thermal cycling profiles to assess the integrity of SnPb and Pb-free BGA components. To better understand the observed failure modes, Finite Element Analysis (FEA) was performed on the conformally coated BGA packages. Material characterization was performed using Dynamic Mechanical Analysis (DMA) and Thermal Mechanical Analysis (TMA) to capture the temperature dependent properties of the conformal coating to better correlate simulation and experimental results. Failure modes were found to greatly depend on the conformal coating material properties around the glass transition temperature (Tg) rather than temperature cycle range. Significant differences in the failure mode were found between the Pb-free and SnPb BGA components with acrylic conformal coating materials and temperatures profiles.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"144 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132962827","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896901
M. Čermák, M. Ahmadi, M. Bahrami, Kevin Lau
This paper documents the development of a passively cooled outdoor electronics enclosure consisting of six 1.2kW AC/DC rectifiers (7.2kW total output power). Commercially available fan cooled rectifiers were used as a starting point and modified to be passively cooled using heat pipes and naturally-cooled heat sinks without changing the layout of the original circuit board. Several designs were considered, tested and modified to develop a fully passive thermal solution. The prototype was tested at ambient air temperatures of 26°C, 36°C and 46°C and it delivered 98.8%, 85.7% and 80.7% of its nominal output power at each of these temperatures, respectively.
{"title":"Development of a passively cooled outdoor telecom power enclosure","authors":"M. Čermák, M. Ahmadi, M. Bahrami, Kevin Lau","doi":"10.1109/SEMI-THERM.2017.7896901","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896901","url":null,"abstract":"This paper documents the development of a passively cooled outdoor electronics enclosure consisting of six 1.2kW AC/DC rectifiers (7.2kW total output power). Commercially available fan cooled rectifiers were used as a starting point and modified to be passively cooled using heat pipes and naturally-cooled heat sinks without changing the layout of the original circuit board. Several designs were considered, tested and modified to develop a fully passive thermal solution. The prototype was tested at ambient air temperatures of 26°C, 36°C and 46°C and it delivered 98.8%, 85.7% and 80.7% of its nominal output power at each of these temperatures, respectively.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125798885","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896942
A. Alexeev, G. Martin, V. Hildenbrand
In modern phosphor-converted white LEDs, electrical, optical, and thermal performances are inter-twined. It creates challenges for thermal measurements, analysis and thermal compact model development. For example, on one hand, phosphor particles encapsulated in the dome material generate significant amount of heat during blue to white light conversion, and on the other hand, increase dome thermal conductivity. These phenomena limit applicability of single heat flow path and single heat source compact models. The paper presents a comparison of two compact model types for different configurations of a particular mid-power LED. The comparison was done by relating the results of thermal transient analysis of a verified full FEM model with the compact models. The effect of an additional heat flow path corresponding to heat propagation into the LED dome was investigated. Drawbacks and applicability limits of the standard one-dimensional heat flow path interpretation of thermal transient measurements results were shown. A measurement based compact model generation procedure is demonstrated.
{"title":"Structure function analysis and thermal compact model development of a mid-power LED","authors":"A. Alexeev, G. Martin, V. Hildenbrand","doi":"10.1109/SEMI-THERM.2017.7896942","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896942","url":null,"abstract":"In modern phosphor-converted white LEDs, electrical, optical, and thermal performances are inter-twined. It creates challenges for thermal measurements, analysis and thermal compact model development. For example, on one hand, phosphor particles encapsulated in the dome material generate significant amount of heat during blue to white light conversion, and on the other hand, increase dome thermal conductivity. These phenomena limit applicability of single heat flow path and single heat source compact models. The paper presents a comparison of two compact model types for different configurations of a particular mid-power LED. The comparison was done by relating the results of thermal transient analysis of a verified full FEM model with the compact models. The effect of an additional heat flow path corresponding to heat propagation into the LED dome was investigated. Drawbacks and applicability limits of the standard one-dimensional heat flow path interpretation of thermal transient measurements results were shown. A measurement based compact model generation procedure is demonstrated.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128545907","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896927
A. Robinson, W. Tan, R. Kempers, J. Colenbrander, N. Bushnell, R. Chen
This work describes the design of a high-performance water cooled micro heat sink for thermal management of high heat flux microelectronics. The design process leverages advances in additive manufacturing to produce flow channels and composite material structures that are not possible with traditional machining processes. The micro heat sink was designed with microchannels and an array of fins with integrated microjets (FINJET™ architecture). Simulation Driven Design (SDD), using ANSYS Fluent CFD software, was used to design the micro heat exchanger with overall outer dimensions of 4.1mm (length) × 3.2mm (width) × 1mm (thickness). Based on the SDD results, a prototype was fabricated and tested with heat fluxes up to and exceeding 1000 W/cm2. The results show that the numerical and experimental results are in reasonable agreement considering the complexity of the flow and associated conjugate heat transfer within the device. Importantly, experimental performance achieved an estimated overall thermal conductance of ∼300 kW/m2K with an associated pressure drop of 160 kPa (23 psi) for a flow rate of 0.5 L/min. For 20°C water at the inlet, this corresponded to a measured base temperature of 54°C for an applied heat flux of 1000 W/cm2.
{"title":"A new hybrid heat sink with impinging micro-jet arrays and microchannels fabricated using high volume additive manufacturing","authors":"A. Robinson, W. Tan, R. Kempers, J. Colenbrander, N. Bushnell, R. Chen","doi":"10.1109/SEMI-THERM.2017.7896927","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896927","url":null,"abstract":"This work describes the design of a high-performance water cooled micro heat sink for thermal management of high heat flux microelectronics. The design process leverages advances in additive manufacturing to produce flow channels and composite material structures that are not possible with traditional machining processes. The micro heat sink was designed with microchannels and an array of fins with integrated microjets (FINJET™ architecture). Simulation Driven Design (SDD), using ANSYS Fluent CFD software, was used to design the micro heat exchanger with overall outer dimensions of 4.1mm (length) × 3.2mm (width) × 1mm (thickness). Based on the SDD results, a prototype was fabricated and tested with heat fluxes up to and exceeding 1000 W/cm2. The results show that the numerical and experimental results are in reasonable agreement considering the complexity of the flow and associated conjugate heat transfer within the device. Importantly, experimental performance achieved an estimated overall thermal conductance of ∼300 kW/m2K with an associated pressure drop of 160 kPa (23 psi) for a flow rate of 0.5 L/min. For 20°C water at the inlet, this corresponded to a measured base temperature of 54°C for an applied heat flux of 1000 W/cm2.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"8 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113946477","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896907
T. Raszkowski, A. Samson, M. Zubert, M. Janicki, A. Napieralski
This paper introduces a methodology to generate Compact Thermal Models (CTMs) of electronic systems based on the knowledge of structure eigenvalues in 3D distributed thermal models. Initially, the influence of various model parameters on its eigenvalues is demonstrated using the Green's function solution of the model. Next, CTMs in the form of RC ladders are generated for a real test hybrid circuit with different values of dissipated power and in various cooling conditions. Then, the simulation results produced by these models are compared with the ones obtained using the distributed model and the measured values.
{"title":"Structure-aware Thermal Model reduction","authors":"T. Raszkowski, A. Samson, M. Zubert, M. Janicki, A. Napieralski","doi":"10.1109/SEMI-THERM.2017.7896907","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896907","url":null,"abstract":"This paper introduces a methodology to generate Compact Thermal Models (CTMs) of electronic systems based on the knowledge of structure eigenvalues in 3D distributed thermal models. Initially, the influence of various model parameters on its eigenvalues is demonstrated using the Green's function solution of the model. Next, CTMs in the form of RC ladders are generated for a real test hybrid circuit with different values of dissipated power and in various cooling conditions. Then, the simulation results produced by these models are compared with the ones obtained using the distributed model and the measured values.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124135481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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