首页 > 最新文献

IEEE Design & Test最新文献

英文 中文
Blank Page 空白页
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-04-23 DOI: 10.1109/mdat.2024.3372177
{"title":"Blank Page","authors":"","doi":"10.1109/mdat.2024.3372177","DOIUrl":"https://doi.org/10.1109/mdat.2024.3372177","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"19 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140800790","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Recap of the 29th Edition of the Asia and South Pacific Design Automation Conference (ASPDAC 2024) 第 29 届亚洲及南太平洋设计自动化大会(ASPDAC 2024)回顾
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-04-23 DOI: 10.1109/mdat.2024.3371368
Taewhan Kim
This Year, the 29th Asia and South Pacific Design Automation Conference (ASP-DAC 2024) was fully in-person after the COVID-19 pandemic. The conference was held from Monday, 22 January 2024 to Thursday, 25 January 2024, at Songdo Convention Center, Incheon, South Korea.
今年,第 29 届亚洲及南太平洋设计自动化大会(ASP-DAC 2024)在 COVID-19 大流行后全面采用现场会议的形式。会议于 2024 年 1 月 22 日(星期一)至 25 日(星期四)在韩国仁川松岛会议中心举行。
{"title":"Recap of the 29th Edition of the Asia and South Pacific Design Automation Conference (ASPDAC 2024)","authors":"Taewhan Kim","doi":"10.1109/mdat.2024.3371368","DOIUrl":"https://doi.org/10.1109/mdat.2024.3371368","url":null,"abstract":"This Year, the 29th Asia and South Pacific Design Automation Conference (ASP-DAC 2024) was fully in-person after the COVID-19 pandemic. The conference was held from Monday, 22 January 2024 to Thursday, 25 January 2024, at Songdo Convention Center, Incheon, South Korea.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"12 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140800794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fuzzing for Automated SoC Security Verification: Challenges and Solution 用于自动 SoC 安全验证的模糊测试:挑战与解决方案
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-03-18 DOI: 10.1109/mdat.2024.3377164
Muhammad Monir Hossain, Kimia Zamiri Azar, Fahim Rahman, Farimah Farahmandi, Mark Tehranipoor
{"title":"Fuzzing for Automated SoC Security Verification: Challenges and Solution","authors":"Muhammad Monir Hossain, Kimia Zamiri Azar, Fahim Rahman, Farimah Farahmandi, Mark Tehranipoor","doi":"10.1109/mdat.2024.3377164","DOIUrl":"https://doi.org/10.1109/mdat.2024.3377164","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"3 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140172711","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Conventional Tests for Approximate Scan Logic 近似扫描逻辑的常规测试
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-02-26 DOI: 10.1109/mdat.2024.3370824
Irith Pomeranz
{"title":"Conventional Tests for Approximate Scan Logic","authors":"Irith Pomeranz","doi":"10.1109/mdat.2024.3370824","DOIUrl":"https://doi.org/10.1109/mdat.2024.3370824","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"295 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-02-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139977787","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Issue on the 2021 Workshop on Top Picks in Hardware and Embedded Security 2021 年硬件和嵌入式安全精选研讨会特刊
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-02-21 DOI: 10.1109/mdat.2023.3349082
Gang Qu
The globalization of IC design is forcing IC and IP core designers and users to reconsider the security and trust of hardware as the semiconductor industry is losing multiple billions of dollars annually due to IP infringement. An attacker can reverse engineer the functionality of an IC/IP, steal and claim ownership of the IP, inject malicious circuitry into the IC, introduce counterfeits into the supply chain, or overbuild ICs/IPs and sell them illegally.
集成电路设计的全球化迫使集成电路和 IP 核心设计人员和用户重新考虑硬件的安全性和可信度,因为知识产权侵权每年给半导体行业造成数十亿美元的损失。攻击者可以对集成电路/IP 的功能进行反向工程,窃取并声称拥有知识产权,在集成电路中注入恶意电路,在供应链中引入假冒产品,或过度制造集成电路/IP 并非法销售。
{"title":"Special Issue on the 2021 Workshop on Top Picks in Hardware and Embedded Security","authors":"Gang Qu","doi":"10.1109/mdat.2023.3349082","DOIUrl":"https://doi.org/10.1109/mdat.2023.3349082","url":null,"abstract":"The globalization of IC design is forcing IC and IP core designers and users to reconsider the security and trust of hardware as the semiconductor industry is losing multiple billions of dollars annually due to IP infringement. An attacker can reverse engineer the functionality of an IC/IP, steal and claim ownership of the IP, inject malicious circuitry into the IC, introduce counterfeits into the supply chain, or overbuild ICs/IPs and sell them illegally.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"48 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139951368","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Blank Page 空白页
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-02-21 DOI: 10.1109/mdat.2024.3363359
{"title":"Blank Page","authors":"","doi":"10.1109/mdat.2024.3363359","DOIUrl":"https://doi.org/10.1109/mdat.2024.3363359","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"5 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139951019","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Report on the 2023 Embedded Systems Week (ESWEEK) 2023 年嵌入式系统周(ESWEEK)报告
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-02-21 DOI: 10.1109/mdat.2023.3333795
Xiaobo Sharon Hu, Alain Girault, Heiko Falk
{"title":"Report on the 2023 Embedded Systems Week (ESWEEK)","authors":"Xiaobo Sharon Hu, Alain Girault, Heiko Falk","doi":"10.1109/mdat.2023.3333795","DOIUrl":"https://doi.org/10.1109/mdat.2023.3333795","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"2016 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139951026","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Recap of the 42nd Edition of the International Conference on Computer- Aided Design (ICCAD 2023) 第 42 届国际计算机辅助设计大会(ICCAD 2023)回顾
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-02-21 DOI: 10.1109/mdat.2024.3351568
Evangeline Young
This Year Marks our return to a fully in-person International Conference on Computer-Aided Design (ICCAD) after the COVID-19 pandemic. We are thrilled to resume an event with personal interactions and extensive networking while retaining some good practices adopted during the pandemic of having a virtual platform where participants and authors can connect remotely.
在 COVID-19 大流行之后,今年标志着我们重返完全面对面的计算机辅助设计国际会议 (ICCAD)。我们很高兴能重新举办一次具有个人互动和广泛网络的活动,同时保留了大流行病期间采用的一些良好做法,即通过虚拟平台让与会者和作者进行远程联系。
{"title":"Recap of the 42nd Edition of the International Conference on Computer- Aided Design (ICCAD 2023)","authors":"Evangeline Young","doi":"10.1109/mdat.2024.3351568","DOIUrl":"https://doi.org/10.1109/mdat.2024.3351568","url":null,"abstract":"This Year Marks our return to a fully in-person International Conference on Computer-Aided Design (ICCAD) after the COVID-19 pandemic. We are thrilled to resume an event with personal interactions and extensive networking while retaining some good practices adopted during the pandemic of having a virtual platform where participants and authors can connect remotely.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"142 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139951086","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Predictions 预测
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-02-21 DOI: 10.1109/mdat.2024.3357778
Scott Davidson
We engineers do a lot of predicting. When we design something, we predict how it will perform when implemented. We use tools like simulators and timing analyzers to help us refine these predictions, but getting silicon that runs as fast as you had hoped it would run is always a pleasant surprise.
我们工程师经常进行预测。在设计时,我们会预测它在实现时的性能。我们使用仿真器和时序分析仪等工具来帮助我们完善这些预测,但如果硅片的运行速度能达到你的预期,那总是令人惊喜的。
{"title":"Predictions","authors":"Scott Davidson","doi":"10.1109/mdat.2024.3357778","DOIUrl":"https://doi.org/10.1109/mdat.2024.3357778","url":null,"abstract":"We engineers do a lot of predicting. When we design something, we predict how it will perform when implemented. We use tools like simulators and timing analyzers to help us refine these predictions, but getting silicon that runs as fast as you had hoped it would run is always a pleasant surprise.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"2016 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139951023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Issue on the 2021 Workshop on Top Picks in Hardware and Embedded Security 2021 年硬件和嵌入式安全精选研讨会特刊
IF 2 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-02-21 DOI: 10.1109/mdat.2024.3358221
Partha Pratim Pande
The articles in this issue are divided into three groups: 1) the first group are articles in the Special Issue on the 2021 Workshop on Top Picks in Hardware and Embedded Security; 2) the second group comprises general interest articles; and 3) additionally, we have two conference reports.
本期文章分为三组:1)第一组是 2021 年硬件和嵌入式安全精选研讨会特刊中的文章;2)第二组是一般兴趣文章;3)此外,我们还有两篇会议报告。
{"title":"Special Issue on the 2021 Workshop on Top Picks in Hardware and Embedded Security","authors":"Partha Pratim Pande","doi":"10.1109/mdat.2024.3358221","DOIUrl":"https://doi.org/10.1109/mdat.2024.3358221","url":null,"abstract":"<fig orientation=\"portrait\" position=\"float\" xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\"> <graphic orientation=\"portrait\" position=\"float\" xlink:href=\"pande-3358221.tif\"/> </fig> The articles in this issue are divided into three groups: 1) the first group are articles in the Special Issue on the 2021 Workshop on Top Picks in Hardware and Embedded Security; 2) the second group comprises general interest articles; and 3) additionally, we have two conference reports.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"152 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2024-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139951015","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
IEEE Design & Test
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1