首页 > 最新文献

IEEE Journal on Exploratory Solid-State Computational Devices and Circuits最新文献

英文 中文
The Impact of Analog-to-Digital Converter Architecture and Variability on Analog Neural Network Accuracy 模数转换器结构和可变性对模拟神经网络精度的影响
IF 2.4 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-09-13 DOI: 10.1109/JXCDC.2023.3315134
Matthew Spear;Joshua E. Kim;Christopher H. Bennett;Sapan Agarwal;Matthew J. Marinella;T. Patrick Xiao
The analog-to-digital converter (ADC) is not only a key component in analog in-memory computing (IMC) accelerators but also a bottleneck for the efficiency and accuracy of these systems. While the tradeoffs between power consumption, latency, and area in ADC design are well studied, it is relatively unknown which ADC implementations are optimal for algorithmic accuracy, particularly for neural network inference. We explore the design space of the ADC with a focus on accuracy, investigating the sensitivity of neural network outputs to component variability inside the ADC and how this sensitivity depends on the ADC architecture. The compact models of the pipeline, cyclic, successive-approximation-register (SAR) and ramp ADCs are developed, and these models are used in a system-level accuracy simulation of analog neural network inference. Our results show how the accuracy on a complex image recognition benchmark (ResNet50 on ImageNet) depends on the capacitance mismatch, comparator offset, and effective number of bits (ENOB) for each of the four ADC architectures. We find that robustness to component variations depends strongly on the ADC design and that inference accuracy is particularly sensitive to the value-dependent error characteristics of the ADC, which cannot be captured by the conventional ENOB precision metric.
模数转换器(ADC)不仅是模拟内存计算(IMC)加速器的关键组件,也是这些系统效率和精度的瓶颈。虽然 ADC 设计中功耗、延迟和面积之间的权衡已得到深入研究,但哪些 ADC 实现是算法精度(尤其是神经网络推理)的最佳选择却相对未知。我们以精度为重点探索 ADC 的设计空间,研究神经网络输出对 ADC 内部元件变化的敏感性,以及这种敏感性如何取决于 ADC 架构。我们开发了流水线、循环、逐次逼近寄存器 (SAR) 和斜坡 ADC 的紧凑模型,并将这些模型用于模拟神经网络推理的系统级精度仿真。我们的结果显示了复杂图像识别基准(ImageNet 上的 ResNet50)的准确性如何取决于四种 ADC 架构中每种架构的电容失配、比较器偏移和有效位数 (ENOB)。我们发现,对元件变化的鲁棒性在很大程度上取决于 ADC 的设计,而推理准确度对 ADC 的误差特性值特别敏感,传统的 ENOB 精度指标无法捕捉到这种误差特性。
{"title":"The Impact of Analog-to-Digital Converter Architecture and Variability on Analog Neural Network Accuracy","authors":"Matthew Spear;Joshua E. Kim;Christopher H. Bennett;Sapan Agarwal;Matthew J. Marinella;T. Patrick Xiao","doi":"10.1109/JXCDC.2023.3315134","DOIUrl":"10.1109/JXCDC.2023.3315134","url":null,"abstract":"The analog-to-digital converter (ADC) is not only a key component in analog in-memory computing (IMC) accelerators but also a bottleneck for the efficiency and accuracy of these systems. While the tradeoffs between power consumption, latency, and area in ADC design are well studied, it is relatively unknown which ADC implementations are optimal for algorithmic accuracy, particularly for neural network inference. We explore the design space of the ADC with a focus on accuracy, investigating the sensitivity of neural network outputs to component variability inside the ADC and how this sensitivity depends on the ADC architecture. The compact models of the pipeline, cyclic, successive-approximation-register (SAR) and ramp ADCs are developed, and these models are used in a system-level accuracy simulation of analog neural network inference. Our results show how the accuracy on a complex image recognition benchmark (ResNet50 on ImageNet) depends on the capacitance mismatch, comparator offset, and effective number of bits (ENOB) for each of the four ADC architectures. We find that robustness to component variations depends strongly on the ADC design and that inference accuracy is particularly sensitive to the value-dependent error characteristics of the ADC, which cannot be captured by the conventional ENOB precision metric.","PeriodicalId":54149,"journal":{"name":"IEEE Journal on Exploratory Solid-State Computational Devices and Circuits","volume":"9 2","pages":"176-184"},"PeriodicalIF":2.4,"publicationDate":"2023-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10250846","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135402296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Stuck-at Faults Tolerance and Recovery in MLP Neural Networks Using Imperfect Emerging CNFET Technology 使用不完美新兴 CNFET 技术的 MLP 神经网络的卡滞故障容限与恢复
IF 2.4 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-09-11 DOI: 10.1109/JXCDC.2023.3313127
An Qi Zhang;Amr M. S. Tosson;Dylan Ma;Ryan Fang;Lan Wei
Devices using emerging technologies and materials with the potential to outperform their silicon counterpart are actively explored in search of ways to extend Moore’s law. Among these technologies, low dimensional channel materials (LDMs) devices, such as carbon nanotube field-effect transistors (CNFETs), are promising to eventually outperform silicon CMOS. As these technologies are in their early development stages, their devices still suffer from high levels of defects and variations, thus unsuitable for nowadays general-purpose applications. On the other hand, applications with inherent error resilience and high-performance demands would suppress the impact of process imperfection and benefit from the performance boost. These applications, including image processing and machine learning through neural networks, would be the ideal targets for adopting these new emerging technologies even in their early stage of technology and process development. In this article, the effects of stuck-at faults in CNFET static random access memory (SRAM)-based multilayer perceptron (MLP) neural network are investigated. The impacts of various fault patterns are analyzed. Several fault recovery techniques are introduced, and their effectiveness is analyzed under different scenarios. With the proposed recovery techniques, the system can recover and tolerate a high level of stuck-at faults up to 40%, paving the path to adopt the early-stage and faulty emerging devices technologies in such high-demand applications.
人们正在积极探索使用新兴技术和材料的器件,这些器件的性能有可能超过硅器件,以寻求延长摩尔定律的方法。在这些技术中,碳纳米管场效应晶体管(CNFET)等低维沟道材料(LDMs)器件有望最终超越硅 CMOS。由于这些技术还处于早期开发阶段,其器件仍存在大量缺陷和变异,因此不适合现在的通用应用。另一方面,具有内在抗错能力和高性能要求的应用将抑制工艺缺陷的影响,并从性能提升中获益。包括图像处理和通过神经网络进行机器学习在内的这些应用将是采用这些新兴技术的理想目标,即使它们还处于技术和工艺开发的早期阶段。本文研究了基于 CNFET 静态随机存取存储器 (SRAM) 的多层感知器 (MLP) 神经网络中卡滞故障的影响。分析了各种故障模式的影响。引入了几种故障恢复技术,并分析了它们在不同情况下的有效性。利用所提出的恢复技术,系统可以恢复和容忍高达 40% 的卡滞故障,为在此类高需求应用中采用早期和故障新兴设备技术铺平了道路。
{"title":"Stuck-at Faults Tolerance and Recovery in MLP Neural Networks Using Imperfect Emerging CNFET Technology","authors":"An Qi Zhang;Amr M. S. Tosson;Dylan Ma;Ryan Fang;Lan Wei","doi":"10.1109/JXCDC.2023.3313127","DOIUrl":"10.1109/JXCDC.2023.3313127","url":null,"abstract":"Devices using emerging technologies and materials with the potential to outperform their silicon counterpart are actively explored in search of ways to extend Moore’s law. Among these technologies, low dimensional channel materials (LDMs) devices, such as carbon nanotube field-effect transistors (CNFETs), are promising to eventually outperform silicon CMOS. As these technologies are in their early development stages, their devices still suffer from high levels of defects and variations, thus unsuitable for nowadays general-purpose applications. On the other hand, applications with inherent error resilience and high-performance demands would suppress the impact of process imperfection and benefit from the performance boost. These applications, including image processing and machine learning through neural networks, would be the ideal targets for adopting these new emerging technologies even in their early stage of technology and process development. In this article, the effects of stuck-at faults in CNFET static random access memory (SRAM)-based multilayer perceptron (MLP) neural network are investigated. The impacts of various fault patterns are analyzed. Several fault recovery techniques are introduced, and their effectiveness is analyzed under different scenarios. With the proposed recovery techniques, the system can recover and tolerate a high level of stuck-at faults up to 40%, paving the path to adopt the early-stage and faulty emerging devices technologies in such high-demand applications.","PeriodicalId":54149,"journal":{"name":"IEEE Journal on Exploratory Solid-State Computational Devices and Circuits","volume":"9 2","pages":"168-175"},"PeriodicalIF":2.4,"publicationDate":"2023-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10246789","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135361608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modeling of Bilayer Modulated RRAM and Its Array Performance for Compute-in-Memory Applications 存储器中计算应用的双层调制RRAM建模及其阵列性能
IF 2.4 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-09-04 DOI: 10.1109/JXCDC.2023.3311899
Jia-Wei Lee;Tzu-Chin Chou;Po-An Chen;Meng-Hsueh Chiang
This article presents a modified compact model of resistive random access memory (RRAM) with a tunneling barrier. The bilayer modulated RRAM can be integrated into a higher density array, reducing leakage current in standby mode. The model demonstrates current transition behavior from low- to high-bias regions by considering both bulk-limited and electrode-limited transport mechanisms. This model can evaluate RRAM array performance under various pulsing conditions and device parameter variations with calibrated model cards. The compute-in-memory application requires precise current sum results hindered by the wire resistance loading effect. This study also evaluates various sizes of arrays suitable for performance improvement.
本文提出了一种改进的带隧道阻挡层的电阻随机存取存储器(RRAM)的紧凑模型。双层调制RRAM可以集成到更高密度的阵列中,减少待机模式下的泄漏电流。该模型通过考虑体积限制和电极限制输运机制,展示了电流从低偏置到高偏置区域的转变行为。该模型可以通过校准的模型卡来评估不同脉冲条件下RRAM阵列的性能和器件参数的变化。内存计算应用需要精确的电流和结果,这受到导线电阻负载效应的阻碍。本研究亦评估了不同大小的阵列,以提高效能。
{"title":"Modeling of Bilayer Modulated RRAM and Its Array Performance for Compute-in-Memory Applications","authors":"Jia-Wei Lee;Tzu-Chin Chou;Po-An Chen;Meng-Hsueh Chiang","doi":"10.1109/JXCDC.2023.3311899","DOIUrl":"10.1109/JXCDC.2023.3311899","url":null,"abstract":"This article presents a modified compact model of resistive random access memory (RRAM) with a tunneling barrier. The bilayer modulated RRAM can be integrated into a higher density array, reducing leakage current in standby mode. The model demonstrates current transition behavior from low- to high-bias regions by considering both bulk-limited and electrode-limited transport mechanisms. This model can evaluate RRAM array performance under various pulsing conditions and device parameter variations with calibrated model cards. The compute-in-memory application requires precise current sum results hindered by the wire resistance loading effect. This study also evaluates various sizes of arrays suitable for performance improvement.","PeriodicalId":54149,"journal":{"name":"IEEE Journal on Exploratory Solid-State Computational Devices and Circuits","volume":"9 2","pages":"151-158"},"PeriodicalIF":2.4,"publicationDate":"2023-09-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10239165","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62236596","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Boosting RRAM-Based Mixed-Signal Accelerators in FD-SOI Technology for ML Applications 在FD-SOI技术中增强基于ram的混合信号加速器用于ML应用
IF 2.4 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-08-29 DOI: 10.1109/JXCDC.2023.3309713
Andrea Boni;Francesco Malena;Francesco Saccani;Michele Amoretti;Michele Caselli
This article presents the flipped (F)-2T2R resistive random access memory (RRAM) compute cell enhancing the performance of RRAM-based mixed-signal accelerators for deep neural networks (DNNs) in machine-learning (ML) applications. The F-2T2R cell is designed to exploit the features of the FD-SOI technology and it achieves a large increase in cell output impedance, compared to the standard 1-transistor 1-resistor (1T1R) cell. The article also describes the modeling of an F-2T2R-based accelerator and its transistor-level implementation in a 22-nm FD-SOI technology. The modeling results and the accelerator performance are validated by simulation. The proposed design can achieve an energy efficiency of up to 1260 1 bit-TOPS/W, with a memory array of 256 rows and columns. From the results of our analytical framework, a ResNet18, mapped on the accelerator, can obtain an accuracy reduction below 2%, with respect to the floating-point baseline, on the CIFAR-10 dataset.
本文介绍了翻转(F)-2T2R电阻随机存取存储器(RRAM)计算单元,增强了机器学习(ML)应用中深度神经网络(dnn)中基于RRAM的混合信号加速器的性能。F-2T2R电池设计利用FD-SOI技术的特点,与标准的1晶体管1电阻(1T1R)电池相比,它实现了电池输出阻抗的大幅增加。本文还介绍了基于f - 22rr的加速器的建模及其在22纳米FD-SOI技术中的晶体管级实现。仿真结果验证了建模结果和加速器的性能。该设计可实现高达1260 bit-TOPS/W的能量效率,存储阵列为256行和256列。从我们的分析框架的结果来看,在加速器上映射的ResNet18,相对于CIFAR-10数据集上的浮点基线,可以获得低于2%的精度降低。
{"title":"Boosting RRAM-Based Mixed-Signal Accelerators in FD-SOI Technology for ML Applications","authors":"Andrea Boni;Francesco Malena;Francesco Saccani;Michele Amoretti;Michele Caselli","doi":"10.1109/JXCDC.2023.3309713","DOIUrl":"10.1109/JXCDC.2023.3309713","url":null,"abstract":"This article presents the flipped (F)-2T2R resistive random access memory (RRAM) compute cell enhancing the performance of RRAM-based mixed-signal accelerators for deep neural networks (DNNs) in machine-learning (ML) applications. The F-2T2R cell is designed to exploit the features of the FD-SOI technology and it achieves a large increase in cell output impedance, compared to the standard 1-transistor 1-resistor (1T1R) cell. The article also describes the modeling of an F-2T2R-based accelerator and its transistor-level implementation in a 22-nm FD-SOI technology. The modeling results and the accelerator performance are validated by simulation. The proposed design can achieve an energy efficiency of up to 1260 1 bit-TOPS/W, with a memory array of 256 rows and columns. From the results of our analytical framework, a ResNet18, mapped on the accelerator, can obtain an accuracy reduction below 2%, with respect to the floating-point baseline, on the CIFAR-10 dataset.","PeriodicalId":54149,"journal":{"name":"IEEE Journal on Exploratory Solid-State Computational Devices and Circuits","volume":"9 2","pages":"159-167"},"PeriodicalIF":2.4,"publicationDate":"2023-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10233848","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62236587","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
3-D Logic Circuit Design-Oriented Electrothermal Modeling of Vertical Junctionless Nanowire FETs 面向三维逻辑电路设计的垂直无结纳米线场效应管电热建模
IF 2.4 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-08-28 DOI: 10.1109/JXCDC.2023.3309502
Sara Mannaa;Arnaud Poittevin;Cédric Marchand;Damien Deleruyelle;Bastien Deveautour;Alberto Bosio;Ian O’Connor;Chhandak Mukherjee;Yifan Wang;Houssem Rezgui;Marina Deng;Cristell Maneux;Jonas Müller;Sylvain Pelloquin;Konstantinos Moustakas;Guilhem Larrieu
This work presents new insights into 3-D logic circuit design with vertical junctionless nanowire FETs (VNWFET) accounting for underlying electrothermal phenomena. Aided by the understanding of the nanoscale heat transport in VNWFETs through multiphysics simulations, the SPICE-compatible compact model captures temperature and trapping effects principally through a shift of the device threshold voltage. Circuit-level simulations indicate a strong impact of temperature variation on functionality and figures of merits, such as energy-delay products. Subsequent guidelines for design considerations are discussed that are intended to provide feedback for technology improvements.
这项工作为三维逻辑电路设计提供了新的见解,垂直无结纳米线场效应管(VNWFET)考虑了潜在的电热现象。通过多物理场模拟了解了vnwfet中的纳米级热传输,spice兼容的紧凑模型主要通过器件阈值电压的移动来捕获温度和捕获效应。电路级仿真表明,温度变化对功能和性能指标(如能量延迟产品)的影响很大。随后讨论了设计考虑的指导方针,旨在为技术改进提供反馈。
{"title":"3-D Logic Circuit Design-Oriented Electrothermal Modeling of Vertical Junctionless Nanowire FETs","authors":"Sara Mannaa;Arnaud Poittevin;Cédric Marchand;Damien Deleruyelle;Bastien Deveautour;Alberto Bosio;Ian O’Connor;Chhandak Mukherjee;Yifan Wang;Houssem Rezgui;Marina Deng;Cristell Maneux;Jonas Müller;Sylvain Pelloquin;Konstantinos Moustakas;Guilhem Larrieu","doi":"10.1109/JXCDC.2023.3309502","DOIUrl":"10.1109/JXCDC.2023.3309502","url":null,"abstract":"This work presents new insights into 3-D logic circuit design with vertical junctionless nanowire FETs (VNWFET) accounting for underlying electrothermal phenomena. Aided by the understanding of the nanoscale heat transport in VNWFETs through multiphysics simulations, the SPICE-compatible compact model captures temperature and trapping effects principally through a shift of the device threshold voltage. Circuit-level simulations indicate a strong impact of temperature variation on functionality and figures of merits, such as energy-delay products. Subsequent guidelines for design considerations are discussed that are intended to provide feedback for technology improvements.","PeriodicalId":54149,"journal":{"name":"IEEE Journal on Exploratory Solid-State Computational Devices and Circuits","volume":"9 2","pages":"116-123"},"PeriodicalIF":2.4,"publicationDate":"2023-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10232986","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62236510","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
INFORMATION FOR AUTHORS 作者信息
IF 2.4 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-06-29 DOI: 10.1109/JXCDC.2023.3277781
{"title":"INFORMATION FOR AUTHORS","authors":"","doi":"10.1109/JXCDC.2023.3277781","DOIUrl":"https://doi.org/10.1109/JXCDC.2023.3277781","url":null,"abstract":"","PeriodicalId":54149,"journal":{"name":"IEEE Journal on Exploratory Solid-State Computational Devices and Circuits","volume":"9 1","pages":"C3-C3"},"PeriodicalIF":2.4,"publicationDate":"2023-06-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/6570653/10138050/10168535.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49946610","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Topic on Nontraditional Devices, Circuits, and Architectures for Energy-Efficient Computing 节能计算的非传统器件、电路和体系结构专题
IF 2.4 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-06-26 DOI: 10.1109/JXCDC.2023.3280846
Sourav Dutta;Punyashloka Debashis;Amir Khosrowshahi
Recently, novel applications in the space of artificial intelligence (AI) such as solving constraint optimization problems, probabilistic inferencing, contextual adaptation, and continual learning from noisy data are gaining momentum to address relevant real-world problems. A majority of these tasks are compute and/or memory intensive. While traditional deep learning has been fueled by the utilization of graphic processing units (GPUs) to accelerate algorithms primarily in the cloud, today we see a surge in the development of application/domain-specific integrated circuits and systems that aim at providing an order of magnitude improvement over traditional GPU-based approaches in terms of energy efficiency and latency. This growing branch of research taps into the realms of neuronal dynamics, collective computing using dynamical systems, harnessing stochasticity to enable probabilistic computing, and even draws inspiration from quantum computing. We envision such specialized application/domain-specific systems to perform complex tasks such as solving NP-hard optimization problems, performing reasoning and cognition in the presence of uncertainty with superior energy-efficiency (and/or area and latency improvements) compared to conventional GPU-based approaches and von Neumann computing using traditional silicon-based devices, circuits, and architectures. Of special interest is to utilize such nontraditional computing approaches to reduce the time to obtain solutions for computationally challenging problems that otherwise tend to grow exponentially with problem size. To support this vision, there needs to be fundamental advances in both nontraditional devices and circuits/architectures. Recent works have shown that novel circuit topologies and architectures involving non-Boolean, oscillatory, spiking, probabilistic, or quantum-inspired computing are more suited toward tackling applications such as solving constraint optimization problems, performing energy-based learning, performing Bayesian learning and inference, lifelong continual learning, and solving quantum-inspired applications such as Quantum Monte Carlo. A flurry of current research highlights that compared to traditional silicon-based devices, emerging nanodevices utilizing novel quantum materials such as complex oxides, ferroelectric materials, and spintronic materials can allow the realization of these novel circuits and architectures with lower foot-print area, higher energy efficiency, and lower latency.
最近,人工智能(AI)领域的新应用,如解决约束优化问题、概率推理、上下文适应和从噪声数据中持续学习,正在获得解决相关现实问题的动力。这些任务中的大多数都是计算和/或内存密集型的。虽然传统的深度学习是由图形处理单元(gpu)的使用推动的,主要是在云端加速算法,但今天我们看到应用程序/特定领域集成电路和系统的开发激增,旨在提供比传统的基于gpu的方法在能效和延迟方面的数量级改进。这一不断发展的研究分支涉及神经动力学领域,使用动力系统进行集体计算,利用随机性实现概率计算,甚至从量子计算中汲取灵感。我们设想,与传统的基于gpu的方法和使用传统硅基器件、电路和架构的冯·诺伊曼计算相比,这种专门的应用/领域特定系统可以执行复杂的任务,如解决NP-hard优化问题,在存在不确定性的情况下进行推理和认知,并具有卓越的能效(和/或面积和延迟改进)。特别感兴趣的是利用这种非传统的计算方法来减少获得具有计算挑战性问题的解决方案的时间,否则这些问题往往会随着问题规模呈指数级增长。为了支持这一愿景,需要在非传统设备和电路/架构方面取得根本性的进步。最近的研究表明,涉及非布尔、振荡、尖峰、概率或量子启发计算的新颖电路拓扑和架构更适合于解决约束优化问题、执行基于能量的学习、执行贝叶斯学习和推理、终身持续学习以及解决量子启发应用(如量子蒙特卡罗)等应用。当前的一系列研究强调,与传统的硅基器件相比,新兴的纳米器件利用新型量子材料,如复合氧化物、铁电材料和自旋电子材料,可以实现这些新颖的电路和架构,具有更小的占地面积、更高的能量效率和更低的延迟。
{"title":"Special Topic on Nontraditional Devices, Circuits, and Architectures for Energy-Efficient Computing","authors":"Sourav Dutta;Punyashloka Debashis;Amir Khosrowshahi","doi":"10.1109/JXCDC.2023.3280846","DOIUrl":"10.1109/JXCDC.2023.3280846","url":null,"abstract":"Recently, novel applications in the space of artificial intelligence (AI) such as solving constraint optimization problems, probabilistic inferencing, contextual adaptation, and continual learning from noisy data are gaining momentum to address relevant real-world problems. A majority of these tasks are compute and/or memory intensive. While traditional deep learning has been fueled by the utilization of graphic processing units (GPUs) to accelerate algorithms primarily in the cloud, today we see a surge in the development of application/domain-specific integrated circuits and systems that aim at providing an order of magnitude improvement over traditional GPU-based approaches in terms of energy efficiency and latency. This growing branch of research taps into the realms of neuronal dynamics, collective computing using dynamical systems, harnessing stochasticity to enable probabilistic computing, and even draws inspiration from quantum computing. We envision such specialized application/domain-specific systems to perform complex tasks such as solving NP-hard optimization problems, performing reasoning and cognition in the presence of uncertainty with superior energy-efficiency (and/or area and latency improvements) compared to conventional GPU-based approaches and von Neumann computing using traditional silicon-based devices, circuits, and architectures. Of special interest is to utilize such nontraditional computing approaches to reduce the time to obtain solutions for computationally challenging problems that otherwise tend to grow exponentially with problem size. To support this vision, there needs to be fundamental advances in both nontraditional devices and circuits/architectures. Recent works have shown that novel circuit topologies and architectures involving non-Boolean, oscillatory, spiking, probabilistic, or quantum-inspired computing are more suited toward tackling applications such as solving constraint optimization problems, performing energy-based learning, performing Bayesian learning and inference, lifelong continual learning, and solving quantum-inspired applications such as Quantum Monte Carlo. A flurry of current research highlights that compared to traditional silicon-based devices, emerging nanodevices utilizing novel quantum materials such as complex oxides, ferroelectric materials, and spintronic materials can allow the realization of these novel circuits and architectures with lower foot-print area, higher energy efficiency, and lower latency.","PeriodicalId":54149,"journal":{"name":"IEEE Journal on Exploratory Solid-State Computational Devices and Circuits","volume":"9 1","pages":"iii-v"},"PeriodicalIF":2.4,"publicationDate":"2023-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/6570653/10138050/10163725.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"48736919","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits publication information 探索性固态计算器件和电路IEEE杂志出版信息
IF 2.4 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-06-01 DOI: 10.1109/JXCDC.2023.3277777
{"title":"IEEE Journal on Exploratory Solid-State Computational Devices and Circuits publication information","authors":"","doi":"10.1109/JXCDC.2023.3277777","DOIUrl":"10.1109/JXCDC.2023.3277777","url":null,"abstract":"","PeriodicalId":54149,"journal":{"name":"IEEE Journal on Exploratory Solid-State Computational Devices and Circuits","volume":"9 1","pages":"C2-C2"},"PeriodicalIF":2.4,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/6570653/10138050/10171850.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47878758","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Nontraditional Design of Dynamic Logics Using FDSOI for Ultra-Efficient Computing 利用FDSOI实现超高效计算的非传统动态逻辑设计
IF 2.4 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-04-21 DOI: 10.1109/JXCDC.2023.3269141
Shubham Kumar;Swetaki Chatterjee;Chetan Kumar Dabhi;Yogesh Singh Chauhan;Hussam Amrouch
In this article, we propose a nontraditional design of dynamic logic circuits using fully-depleted silicon-on-insulator (FDSOI) FETs. FDSOI FET allows the threshold voltage ( $V_{text {t}}$ ) to be adjustable (i.e., low- $V_{text {t}}$ and high- $V_{text {t}}$ states) by using the back gate (BG) bias. Our design utilizes the front gate (FG) and BG of an FDSOI FET as the input terminals and proposes the dynamic logic gates (like NAND, NOR, AND, OR, XOR, and XNOR) and circuits (like a half-adder and full-adder). It requires fewer transistors to build dynamic logic gates and achieves high performance with low power dissipation compared to conventional dynamic logic designs. The compact industrial model of FDSOI FET (BSIM-IMG) has been used to simulate dynamic logic gates and is fully calibrated to reproduce the 14 nm FDSOI FET technology node data. Calibration is performed for both electrical characteristics and process variations. The simulation results show an average improvement in transistor count, propagation delay, power, and power-delay product (PDP) of 23.43%, 57.16%, 47.05%, and 77.29%, respectively, compared to the conventional designs. Further, our design reduces the charge-sharing effect, which affects the drivability of the dynamic logic gates. In addition, we have analyzed the impact of the process, supply voltage, and load capacitance variations on the propagation delay of the dynamic logic family in detail. The results show that these variations have a minor impact on the propagation delay of the proposed FDSOI-based dynamic logic gates compared to the conventional dynamic logic gates.
在本文中,我们提出了一种使用完全耗尽绝缘体上硅(FDSOI)FET的动态逻辑电路的非传统设计。FDSOI FET允许通过使用背栅(BG)偏置来调整阈值电压($V_{text{t}}$)(即,低-$V_{text{t}}$和高-$V_{text{t}}$状态)。我们的设计利用FDSOI FET的前栅极(FG)和BG作为输入端,并提出了动态逻辑门(如NAND、NOR、and、OR、XOR和XNOR)和电路(如半加法器和全加法器)。与传统的动态逻辑设计相比,它需要更少的晶体管来构建动态逻辑门,并以低功耗实现高性能。FDSOI FET的紧凑型工业模型(BSIM-IMG)已被用于模拟动态逻辑门,并被完全校准以再现14nm FDSOI场效应管技术节点数据。对电气特性和工艺变化进行校准。仿真结果显示,与传统设计相比,晶体管计数、传播延迟、功率和功率延迟乘积(PDP)的平均改善分别为23.43%、57.16%、47.05%和77.29%。此外,我们的设计减少了电荷共享效应,这影响了动态逻辑门的可驱动性。此外,我们还详细分析了工艺、电源电压和负载电容变化对动态逻辑族传播延迟的影响。结果表明,与传统动态逻辑门相比,这些变化对所提出的基于FDSOI的动态逻辑门的传播延迟影响较小。
{"title":"Nontraditional Design of Dynamic Logics Using FDSOI for Ultra-Efficient Computing","authors":"Shubham Kumar;Swetaki Chatterjee;Chetan Kumar Dabhi;Yogesh Singh Chauhan;Hussam Amrouch","doi":"10.1109/JXCDC.2023.3269141","DOIUrl":"10.1109/JXCDC.2023.3269141","url":null,"abstract":"In this article, we propose a nontraditional design of dynamic logic circuits using fully-depleted silicon-on-insulator (FDSOI) FETs. FDSOI FET allows the threshold voltage (\u0000<inline-formula> <tex-math>$V_{text {t}}$ </tex-math></inline-formula>\u0000) to be adjustable (i.e., low-\u0000<inline-formula> <tex-math>$V_{text {t}}$ </tex-math></inline-formula>\u0000 and high-\u0000<inline-formula> <tex-math>$V_{text {t}}$ </tex-math></inline-formula>\u0000 states) by using the back gate (BG) bias. Our design utilizes the front gate (FG) and BG of an FDSOI FET as the input terminals and proposes the dynamic logic gates (like NAND, NOR, AND, OR, XOR, and XNOR) and circuits (like a half-adder and full-adder). It requires fewer transistors to build dynamic logic gates and achieves high performance with low power dissipation compared to conventional dynamic logic designs. The compact industrial model of FDSOI FET (BSIM-IMG) has been used to simulate dynamic logic gates and is fully calibrated to reproduce the 14 nm FDSOI FET technology node data. Calibration is performed for both electrical characteristics and process variations. The simulation results show an average improvement in transistor count, propagation delay, power, and power-delay product (PDP) of 23.43%, 57.16%, 47.05%, and 77.29%, respectively, compared to the conventional designs. Further, our design reduces the charge-sharing effect, which affects the drivability of the dynamic logic gates. In addition, we have analyzed the impact of the process, supply voltage, and load capacitance variations on the propagation delay of the dynamic logic family in detail. The results show that these variations have a minor impact on the propagation delay of the proposed FDSOI-based dynamic logic gates compared to the conventional dynamic logic gates.","PeriodicalId":54149,"journal":{"name":"IEEE Journal on Exploratory Solid-State Computational Devices and Circuits","volume":"9 1","pages":"74-82"},"PeriodicalIF":2.4,"publicationDate":"2023-04-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/6570653/10138050/10106142.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43854132","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Parallel Matrix Multiplication Using Voltage-Controlled Magnetic Anisotropy Domain Wall Logic 利用压控磁各向异性畴壁逻辑的并行矩阵乘法
IF 2.4 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-04-20 DOI: 10.1109/JXCDC.2023.3266441
Nicholas Zogbi;Samuel Liu;Christopher H. Bennett;Sapan Agarwal;Matthew J. Marinella;Jean Anne C. Incorvia;T. Patrick Xiao
The domain wall-magnetic tunnel junction (DW-MTJ) is a versatile device that can simultaneously store data and perform computations. These three-terminal devices are promising for digital logic due to their nonvolatility, low-energy operation, and radiation hardness. Here, we augment the DW-MTJ logic gate with voltage-controlled magnetic anisotropy (VCMA) to improve the reliability of logical concatenation in the presence of realistic process variations. VCMA creates potential wells that allow for reliable and repeatable localization of domain walls (DWs). The DW-MTJ logic gate supports different fanouts, allowing for multiple inputs and outputs for a single device without affecting the area. We simulate a systolic array of DW-MTJ multiply-accumulate (MAC) units with 4-bit and 8-bit precision, which uses the nonvolatility of DW-MTJ logic gates to enable fine-grained pipelining and high parallelism. The DW-MTJ systolic array provides comparable throughput and efficiency to state-of-the-art CMOS systolic arrays while being radiation-hard. These results improve the feasibility of using DW-based processors, especially for extreme-environment applications such as space.
畴壁磁隧道结(DW-MTJ)是一种多功能设备,可以同时存储数据和执行计算。这三种终端设备由于其非易失性、低能耗操作和辐射硬度而有望用于数字逻辑。在这里,我们用压控磁各向异性(VCMA)增强DW-MTJ逻辑门,以在存在实际工艺变化的情况下提高逻辑级联的可靠性。VCMA创造了潜在的阱,允许域壁(DW)的可靠和可重复的定位。DW-MTJ逻辑门支持不同的扇出,允许在不影响区域的情况下为单个设备提供多个输入和输出。我们模拟了一个具有4位和8位精度的DW-MTJ乘累加(MAC)单元的收缩阵列,该阵列使用DW-MaTJ逻辑门的非易失性来实现细粒度流水线和高并行性。DW-MTJ收缩阵列在抗辐射的同时,提供了与最先进的CMOS收缩阵列相当的吞吐量和效率。这些结果提高了使用基于DW的处理器的可行性,尤其是在太空等极端环境应用中。
{"title":"Parallel Matrix Multiplication Using Voltage-Controlled Magnetic Anisotropy Domain Wall Logic","authors":"Nicholas Zogbi;Samuel Liu;Christopher H. Bennett;Sapan Agarwal;Matthew J. Marinella;Jean Anne C. Incorvia;T. Patrick Xiao","doi":"10.1109/JXCDC.2023.3266441","DOIUrl":"10.1109/JXCDC.2023.3266441","url":null,"abstract":"The domain wall-magnetic tunnel junction (DW-MTJ) is a versatile device that can simultaneously store data and perform computations. These three-terminal devices are promising for digital logic due to their nonvolatility, low-energy operation, and radiation hardness. Here, we augment the DW-MTJ logic gate with voltage-controlled magnetic anisotropy (VCMA) to improve the reliability of logical concatenation in the presence of realistic process variations. VCMA creates potential wells that allow for reliable and repeatable localization of domain walls (DWs). The DW-MTJ logic gate supports different fanouts, allowing for multiple inputs and outputs for a single device without affecting the area. We simulate a systolic array of DW-MTJ multiply-accumulate (MAC) units with 4-bit and 8-bit precision, which uses the nonvolatility of DW-MTJ logic gates to enable fine-grained pipelining and high parallelism. The DW-MTJ systolic array provides comparable throughput and efficiency to state-of-the-art CMOS systolic arrays while being radiation-hard. These results improve the feasibility of using DW-based processors, especially for extreme-environment applications such as space.","PeriodicalId":54149,"journal":{"name":"IEEE Journal on Exploratory Solid-State Computational Devices and Circuits","volume":"9 1","pages":"65-73"},"PeriodicalIF":2.4,"publicationDate":"2023-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/6570653/10138050/10106129.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"43778223","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
期刊
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1