Pub Date : 2024-03-01DOI: 10.1109/MTS.2024.3363787
Luis Kun
In April 2022, I was invited to lecture at Villanova University, Villanova, PA, USA, and I met Dr. Pritpal Singh. Later, in June of that year during the IEEE TAB Series, I met the then President of the Humanitarian Activities Committee (HAC), Dr. Sampathkumar Veeraraghavan. Later, in July during the IEEE Latin American Electron Devices Conference (LAEDC) sponsored by the IEEE Electron Devices Society (EDS), I was invited to give a keynote talk and to be part of a panel. Mario Aleman conducted this panel session on Humanitarian Technology 2022, which also included both above-mentioned individuals. I also had the opportunity to meet the fourth panelist, Dr. Morgan Kiani (see Figure 1 ).
{"title":"Connecting in Person and Networking","authors":"Luis Kun","doi":"10.1109/MTS.2024.3363787","DOIUrl":"https://doi.org/10.1109/MTS.2024.3363787","url":null,"abstract":"In April 2022, I was invited to lecture at Villanova University, Villanova, PA, USA, and I met Dr. Pritpal Singh. Later, in June of that year during the IEEE TAB Series, I met the then President of the Humanitarian Activities Committee (HAC), Dr. Sampathkumar Veeraraghavan. Later, in July during the IEEE Latin American Electron Devices Conference (LAEDC) sponsored by the IEEE Electron Devices Society (EDS), I was invited to give a keynote talk and to be part of a panel. Mario Aleman conducted this panel session on Humanitarian Technology 2022, which also included both above-mentioned individuals. I also had the opportunity to meet the fourth panelist, Dr. Morgan Kiani (see \u0000<xref>Figure 1</xref>\u0000).","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 1","pages":"4-5"},"PeriodicalIF":2.2,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10496889","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140546392","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-03-01DOI: 10.1109/MTS.2024.3365574
Alex Roig Albelda
Spain’s Comunitat Valenciana (Valencian Community) ( Figure 1 ) has a rich agricultural history, with long traditions of resilience and innovation. This tradition, along with the community’s deep ethic of respect for the land, remains at the core of the region’s approach to climate change and sustainability.
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Pub Date : 2024-03-01DOI: 10.1109/MTS.2024.3375177
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Publications are only as strong as the people who make them work. As part of this new chapter in IEEE Technology and Society Magazine (TSM), this is the first in a series of pieces to introduce the new associate editors who represent a powerhouse of knowledge on the social implications of technology and are leaders from across the many varied disciplines that the IEEE Society for the Social Implications of Technology (IEEE SSIT) encompasses. We hope the answers below highlight the ways in which the associate editors are both scholars and engaged citizens whose work aims to make positive change as it addresses (or transforms) harms related to social–technical relationships. Reading through the answers from the associate editors’ work and interests, what becomes clear is that seriously engaging with technology and society concepts leads to richer research projects and more meaningful ways in which to address technological and social problems.
{"title":"Introducing the Editorial Board—Part I","authors":"Ketra Schmitt;Heather Love;Michael Guckert;Elisabeth Gilmore;Royce Francis;Neha Chugh;Antonio Bucchiarone","doi":"10.1109/MTS.2024.3375996","DOIUrl":"https://doi.org/10.1109/MTS.2024.3375996","url":null,"abstract":"Publications are only as strong as the people who make them work. As part of this new chapter in IEEE Technology and Society Magazine (TSM), this is the first in a series of pieces to introduce the new associate editors who represent a powerhouse of knowledge on the social implications of technology and are leaders from across the many varied disciplines that the IEEE Society for the Social Implications of Technology (IEEE SSIT) encompasses. We hope the answers below highlight the ways in which the associate editors are both scholars and engaged citizens whose work aims to make positive change as it addresses (or transforms) harms related to social–technical relationships. Reading through the answers from the associate editors’ work and interests, what becomes clear is that seriously engaging with technology and society concepts leads to richer research projects and more meaningful ways in which to address technological and social problems.","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 1","pages":"9-12"},"PeriodicalIF":2.2,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10496880","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140546391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-03-01DOI: 10.1109/MTS.2024.3375179
{"title":"Understanding the Role of Technology in Society","authors":"","doi":"10.1109/MTS.2024.3375179","DOIUrl":"https://doi.org/10.1109/MTS.2024.3375179","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 1","pages":"C4-C4"},"PeriodicalIF":2.2,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10496900","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140546579","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-03-01DOI: 10.1109/MTS.2024.3381389
{"title":"Call for Papers: ISTAS24","authors":"","doi":"10.1109/MTS.2024.3381389","DOIUrl":"https://doi.org/10.1109/MTS.2024.3381389","url":null,"abstract":"","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 1","pages":"C2-C2"},"PeriodicalIF":2.2,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10496879","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140546580","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-03-01DOI: 10.1109/MTS.2024.3367387
A. David Wunsch
Stories of technological hubris and its dire consequences have an unfailing attraction. The Greek myth of Dedalus and Icarus is a paradigm for historians of technology as powerful as that of Oedipus is for Freudian psychoanalysis. Father and son, Dedalus and Icarus, are held prisoners in a labyrinth on the Island of Crete. Determined to escape, they choose a route through the air and so create wings made of willow branches, connecting them together and to themselves with wax. The father warns his son not to fly too close to the sun. The youth ignores the warning, his wax melts, and he drowns in the ocean.
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Pub Date : 2024-03-01DOI: 10.1109/MTS.2024.3375324
Ketra Schmitt
Wow. Here I am, writing my first editorial as Editor-in-Chief (EIC). If you know me, you know I always have something to say. And yet, faced with my first editorial, I am overcome with gratitude and humility. I have been a long-time reader of IEEE Technology and Society Magazine (IEEE TSM) because it is a rare place where social and technological concerns come together in a way that respects both the technological details as well as the critical, social areas that influence technological invention and adoption.
{"title":"A Social Technical Journey to SSIT","authors":"Ketra Schmitt","doi":"10.1109/MTS.2024.3375324","DOIUrl":"https://doi.org/10.1109/MTS.2024.3375324","url":null,"abstract":"Wow. Here I am, writing my first editorial as Editor-in-Chief (EIC). If you know me, you know I always have something to say. And yet, faced with my first editorial, I am overcome with gratitude and humility. I have been a long-time reader of IEEE Technology and Society Magazine (IEEE TSM) because it is a rare place where social and technological concerns come together in a way that respects both the technological details as well as the critical, social areas that influence technological invention and adoption.","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 1","pages":"6-8"},"PeriodicalIF":2.2,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10496883","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140546560","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-03-01DOI: 10.1109/MTS.2024.3374970
Juste Rajaonson;Ketra Schmitt
Welcome to this March 2024 Special Issue on Advancing Sustainable Development Goals with AI This issue features research on how AI and data technologies can be used to advance the United Nations (UN) sustainable development goals (SDGs) [1] .
{"title":"AI and Data Technologies in Advancing Sustainable Development Goals","authors":"Juste Rajaonson;Ketra Schmitt","doi":"10.1109/MTS.2024.3374970","DOIUrl":"https://doi.org/10.1109/MTS.2024.3374970","url":null,"abstract":"Welcome to this March 2024 Special Issue on Advancing Sustainable Development Goals with AI This issue features research on how AI and data technologies can be used to advance the United Nations (UN) sustainable development goals (SDGs) \u0000<xref>[1]</xref>\u0000.","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 1","pages":"33-38"},"PeriodicalIF":2.2,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10496901","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140546423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-03-01DOI: 10.1109/MTS.2024.3375999
Elisabeth Gilmore
At the recent international negotiations on climate change in Dubai in 2023, the potential for artificial intelligence (AI) to play a critical role in addressing climate challenges was recognized through the initiative “AI for Climate Action (#AI4ClimateAction).” Launched by the Technology Mechanism—established under the United Nations Framework Convention on Climate Change (UNFCCC)—this initiative is focused on accelerating the implementation of the Paris Agreement with the focus on ensuring that the use is responsible, and benefits are shared equitably. While exploring promising applications like integrating AI to improve early warning systems and enhancing agricultural yields, there is also a need to minimize the carbon footprint of AI applications. More information can be found at: https://unfccc.int/ttclear/artificial_intelligence
{"title":"AI and Climate Change","authors":"Elisabeth Gilmore","doi":"10.1109/MTS.2024.3375999","DOIUrl":"https://doi.org/10.1109/MTS.2024.3375999","url":null,"abstract":"At the recent international negotiations on climate change in Dubai in 2023, the potential for artificial intelligence (AI) to play a critical role in addressing climate challenges was recognized through the initiative “AI for Climate Action (#AI4ClimateAction).” Launched by the Technology Mechanism—established under the United Nations Framework Convention on Climate Change (UNFCCC)—this initiative is focused on accelerating the implementation of the Paris Agreement with the focus on ensuring that the use is responsible, and benefits are shared equitably. While exploring promising applications like integrating AI to improve early warning systems and enhancing agricultural yields, there is also a need to minimize the carbon footprint of AI applications. More information can be found at: \u0000<uri>https://unfccc.int/ttclear/artificial_intelligence</uri>","PeriodicalId":55016,"journal":{"name":"IEEE Technology and Society Magazine","volume":"43 1","pages":"13-13"},"PeriodicalIF":2.2,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10496881","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140546354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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