This study used the TA1 interface prefabricated corrugated hot-rolling combined with differential temperature rolling (PCHR + DTR) process to fabricate Ti/Cu composite plates with high interfacial strength while maintaining a flat plate shape. The influence of reduction rates on the mechanical properties, microstructure, interfacial bonding, and elemental diffusion of the Ti/Cu composite plates prepared by the PCHR+DTR process was systematically investigated through mechanics performance tests and microstructural characterization. A rolling molecular dynamics model of the Ti/Cu composite plate was established to elucidate the effect of the reduction rates on diffusion behavior and formation of compound mechanisms.The results indicate that the shear strength of the composite plates prepared by this process is higher at the troughs than at the peaks and exceeds the shear performance of composite plates fabricated using the hot flat rolling + DTR process.With increasing reduction rate, the shear strength initially increased and then decreased. At an reduction rate of 50 %, the shear strength at the peak and trough reached 122.25 MPa and 166.54 MPa, respectively. Meanwhile, both tensile strength and yield strength increased with raising reduction rates, while elongation decreased due to pronounced work hardening. At an reduction rate of 60 %, the tensile strength and yield strength reached their maximum values, which were 265.45 MPa and 452.16 MPa, respectively, with a corresponding elongation minimum of 16 %. Moreover, microscopic results illustrate that grain refinement and elongation occur on both the titanium and copper sides, with more intense grain deformation observed near the interface. This is due to the rupture of the hard and brittle layers on both sides under pressure and friction, allowing fresh copper metal to infiltrate the small cracks on the titanium side, which is benefit for bonding of heterogeneous materials and grains deformation. Meanwhile,the materials on both sides of the interface are in direct contact. Compared with the substrate, the grains are subjected to greater normal stress and shear stress.At the reduction rate of 50 %, the bonding performance of the composite plate is the best, and the copper metal residue most on the titanium side at the shear fracture.
Under the influences of the rolling force and the corrugated structure, R-Cube and Copper textures are found on the copper side both at the peaks and troughs, while basal tilting textures are observed on the titanium side. At the reduction rate of 55 %, the atomic diffusion is the greatest, and the slope of the mean square displacement curve is the largest. Furthermore, atomic potential energy distribution results show no significant compound layer formation at the interface.’
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