Pub Date : 2022-08-04DOI: 10.33180/infmidem2022.206
{"title":"Analysis of effects of dangling-bond defects in doped a-Si:H layers in heterojunction silicon solar cells with different electron affinities of ITO contacts","authors":"","doi":"10.33180/infmidem2022.206","DOIUrl":"https://doi.org/10.33180/infmidem2022.206","url":null,"abstract":"","PeriodicalId":56293,"journal":{"name":"Informacije Midem-Journal of Microelectronics Electronic Components and Materials","volume":"57 1","pages":""},"PeriodicalIF":1.2,"publicationDate":"2022-08-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84876960","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-04DOI: 10.33180/infmidem2022.203
{"title":"Programmable implementation of time-area-efficient Elliptic Curve Cryptography for entity authentication","authors":"","doi":"10.33180/infmidem2022.203","DOIUrl":"https://doi.org/10.33180/infmidem2022.203","url":null,"abstract":"","PeriodicalId":56293,"journal":{"name":"Informacije Midem-Journal of Microelectronics Electronic Components and Materials","volume":"83 1","pages":""},"PeriodicalIF":1.2,"publicationDate":"2022-08-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76248782","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-04DOI: 10.33180/infmidem2022.202
{"title":"Design, Fabrication and Measurement of LDNMOSSCR Devices with Appropriate ESD Protection Window for 18V HV CDMOS Process","authors":"","doi":"10.33180/infmidem2022.202","DOIUrl":"https://doi.org/10.33180/infmidem2022.202","url":null,"abstract":"","PeriodicalId":56293,"journal":{"name":"Informacije Midem-Journal of Microelectronics Electronic Components and Materials","volume":"6 1","pages":""},"PeriodicalIF":1.2,"publicationDate":"2022-08-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84716360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-04DOI: 10.33180/infmidem2022.201
{"title":"Five-Level Transformerless Common Ground Type Inverter with Reduced Device Count","authors":"","doi":"10.33180/infmidem2022.201","DOIUrl":"https://doi.org/10.33180/infmidem2022.201","url":null,"abstract":"","PeriodicalId":56293,"journal":{"name":"Informacije Midem-Journal of Microelectronics Electronic Components and Materials","volume":"140 1","pages":""},"PeriodicalIF":1.2,"publicationDate":"2022-08-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85368050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-04-11DOI: 10.33180/infmidem2022.104
{"title":"Operation of Permanent Magnet Synchronous Motor after Open-circuit Battery Supply Fault","authors":"","doi":"10.33180/infmidem2022.104","DOIUrl":"https://doi.org/10.33180/infmidem2022.104","url":null,"abstract":"","PeriodicalId":56293,"journal":{"name":"Informacije Midem-Journal of Microelectronics Electronic Components and Materials","volume":"24 1","pages":""},"PeriodicalIF":1.2,"publicationDate":"2022-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73725624","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-04-11DOI: 10.33180/infmidem2022.105
{"title":"Charge Pump Using Gain-Boosting and Positive Feedback Techniques in 180-nm Digital CMOS Process","authors":"","doi":"10.33180/infmidem2022.105","DOIUrl":"https://doi.org/10.33180/infmidem2022.105","url":null,"abstract":"","PeriodicalId":56293,"journal":{"name":"Informacije Midem-Journal of Microelectronics Electronic Components and Materials","volume":"1053 1","pages":""},"PeriodicalIF":1.2,"publicationDate":"2022-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77646508","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}