Pub Date : 2015-10-01DOI: 10.1109/TEST.2015.7342374
Karim Arabi
As mobile computing becomes increasingly pervasive, so do our expectations of the devices we use and interact with in our everyday lives. We want these devices to be smarter, anticipate our needs, and share our perception of the world so we can interact with them more naturally. The computational complexity of achieving these goals using traditional computing architectures is quite challenging, particularly in a power- or thermal-constrained environment. This talk will review the rise of machine learning and brain-inspired computing and how it is impacting next generation SoC architectures and its technology drivers.
{"title":"Brain-inspired computing","authors":"Karim Arabi","doi":"10.1109/TEST.2015.7342374","DOIUrl":"https://doi.org/10.1109/TEST.2015.7342374","url":null,"abstract":"As mobile computing becomes increasingly pervasive, so do our expectations of the devices we use and interact with in our everyday lives. We want these devices to be smarter, anticipate our needs, and share our perception of the world so we can interact with them more naturally. The computational complexity of achieving these goals using traditional computing architectures is quite challenging, particularly in a power- or thermal-constrained environment. This talk will review the rise of machine learning and brain-inspired computing and how it is impacting next generation SoC architectures and its technology drivers.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":"166 1","pages":"7"},"PeriodicalIF":0.0,"publicationDate":"2015-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73658457","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-10-01DOI: 10.1109/TEST.2015.7342375
A. Kahng
Which semiconductor products will drive manufacturing and test technology over the next 10 to 15 years? In the past, Moore's Law has been used to predict the continuing evolution of semiconductors. Now, however, we are seeing an explosion of new device, memory and heterogeneous integration technologies aimed at achieving "More than Moore" scaling of product value. By looking at the applications that drive this explosion of new technologies, we can begin to model what the future might look like, and how the industry can deploy cost-effective manufacture and test strategies in the coming years. Three applications in particular — Smart Phone, Datacenter and IoT — will continue to have great influence on both semiconductors and systems. The ITRS "2.0" semiconductor roadmap projects these applications into the future to model potential benefits of future technologies. What will semiconductors look like in the next 10 to 15 years? Let's find out!
{"title":"Modeling the future of semiconductors (and test!)","authors":"A. Kahng","doi":"10.1109/TEST.2015.7342375","DOIUrl":"https://doi.org/10.1109/TEST.2015.7342375","url":null,"abstract":"Which semiconductor products will drive manufacturing and test technology over the next 10 to 15 years? In the past, Moore's Law has been used to predict the continuing evolution of semiconductors. Now, however, we are seeing an explosion of new device, memory and heterogeneous integration technologies aimed at achieving \"More than Moore\" scaling of product value. By looking at the applications that drive this explosion of new technologies, we can begin to model what the future might look like, and how the industry can deploy cost-effective manufacture and test strategies in the coming years. Three applications in particular — Smart Phone, Datacenter and IoT — will continue to have great influence on both semiconductors and systems. The ITRS \"2.0\" semiconductor roadmap projects these applications into the future to model potential benefits of future technologies. What will semiconductors look like in the next 10 to 15 years? Let's find out!","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":"14 1","pages":"8"},"PeriodicalIF":0.0,"publicationDate":"2015-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79627623","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-10-01DOI: 10.1109/TEST.2014.7035302
B. Floyd
The millimeter-wave spectrum from 30 to 300 GHz features large available bandwidth and small wavelengths which can be leveraged for high-throughput wireless communications and high-resolution radar sensors. Key mass-market millimeter-wave applications include local-area networks at 60 GHz which can support multiple gigabit-per-second transfer rates, vehicular radars at 76–81 GHz for collision avoidance or adaptive cruise-control, and fifth-generation cellular networks at 28 GHz which can support higher data rates. Silicon technology has advanced to the point that it is now possible to realize high-performance and low-cost solutions for each of these applications. This talk will review application requirements and opportunities for these markets and then highlight the challenges associated with both antenna and package integration and manufacturing test for multi-antenna transceivers operating at millimeter-wave frequencies. Finally, a recently-developed 76–81-GHz radar transceiver chipset with built-in-test will be highlighted to illustrate an approach to simplify the manufacturing test of a millimeter-wave radar system.
{"title":"Market opportunities and testing challenges for millimeter-wave radios and radars","authors":"B. Floyd","doi":"10.1109/TEST.2014.7035302","DOIUrl":"https://doi.org/10.1109/TEST.2014.7035302","url":null,"abstract":"The millimeter-wave spectrum from 30 to 300 GHz features large available bandwidth and small wavelengths which can be leveraged for high-throughput wireless communications and high-resolution radar sensors. Key mass-market millimeter-wave applications include local-area networks at 60 GHz which can support multiple gigabit-per-second transfer rates, vehicular radars at 76–81 GHz for collision avoidance or adaptive cruise-control, and fifth-generation cellular networks at 28 GHz which can support higher data rates. Silicon technology has advanced to the point that it is now possible to realize high-performance and low-cost solutions for each of these applications. This talk will review application requirements and opportunities for these markets and then highlight the challenges associated with both antenna and package integration and manufacturing test for multi-antenna transceivers operating at millimeter-wave frequencies. Finally, a recently-developed 76–81-GHz radar transceiver chipset with built-in-test will be highlighted to illustrate an approach to simplify the manufacturing test of a millimeter-wave radar system.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":"12 1","pages":"1"},"PeriodicalIF":0.0,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75534236","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-10-01DOI: 10.1109/TEST.2014.7035306
B. Murmann
In the past, CMOS feature size scaling has played a big role in overcoming the perceived barriers, routinely enabling cheaper, faster and lower power devices with every new technology node. However, as the benefits of conventional feature size scaling are diminishing, what can we do to meet the needs of next-generation systems? The precise answer to this question is unclear, but most researchers will agree that some of the progress will have to come from innovative re-architecting and looking for better ways to employ the amazing nano-CMOS fabric that we already have. In this talk, I will review opportunities for system-driven architectural innovation and new application areas in mixed-signal IC design. We will discuss a number of examples related to the idea of “fooling Nyquist” and extracting desired analog-domain information using low-rate and low-bandwidth observations. In addition, we will investigate the potential for mixed-signal co-processors in machine learning algorithms, as well as trends in sensor systems. Along with these examples, we will discuss potential challenges and future needs in mixed-signal testing.
{"title":"Teaching an old dog new tricks: Views on the future of mixed-signal IC design","authors":"B. Murmann","doi":"10.1109/TEST.2014.7035306","DOIUrl":"https://doi.org/10.1109/TEST.2014.7035306","url":null,"abstract":"In the past, CMOS feature size scaling has played a big role in overcoming the perceived barriers, routinely enabling cheaper, faster and lower power devices with every new technology node. However, as the benefits of conventional feature size scaling are diminishing, what can we do to meet the needs of next-generation systems? The precise answer to this question is unclear, but most researchers will agree that some of the progress will have to come from innovative re-architecting and looking for better ways to employ the amazing nano-CMOS fabric that we already have. In this talk, I will review opportunities for system-driven architectural innovation and new application areas in mixed-signal IC design. We will discuss a number of examples related to the idea of “fooling Nyquist” and extracting desired analog-domain information using low-rate and low-bandwidth observations. In addition, we will investigate the potential for mixed-signal co-processors in machine learning algorithms, as well as trends in sensor systems. Along with these examples, we will discuss potential challenges and future needs in mixed-signal testing.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":"61 1","pages":"1"},"PeriodicalIF":0.0,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83808795","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-10-01DOI: 10.1109/TEST.2014.7035338
Kenneth Larsen
As electronic chip designs are predominately System-On-Chip (SoC), hardware emulation has become a crucial tool for pre-silicon hardware and software validation. Pre-silicon emulation models are often available many quarters before tapeout and are used in many areas such as OS boot, software driver development, and system stress and performance testing. Increasingly hardware emulation is used in the development of test contents and to verify the quality of tools and processes used in post-silicon testing. This presentation will cover how hardware emulation aids pre- and post-silicon testing and debugging of SoC infrastructure functions for testability, reliability, and repairability.
{"title":"Emulation and its connection to test","authors":"Kenneth Larsen","doi":"10.1109/TEST.2014.7035338","DOIUrl":"https://doi.org/10.1109/TEST.2014.7035338","url":null,"abstract":"As electronic chip designs are predominately System-On-Chip (SoC), hardware emulation has become a crucial tool for pre-silicon hardware and software validation. Pre-silicon emulation models are often available many quarters before tapeout and are used in many areas such as OS boot, software driver development, and system stress and performance testing. Increasingly hardware emulation is used in the development of test contents and to verify the quality of tools and processes used in post-silicon testing. This presentation will cover how hardware emulation aids pre- and post-silicon testing and debugging of SoC infrastructure functions for testability, reliability, and repairability.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":"55 2 1","pages":"1"},"PeriodicalIF":0.0,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90950502","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-10-01DOI: 10.1109/TEST.2014.7035286
K. Schneider
Severe weather events, and the associated customer outages, have shown that the nations electrical infrastructure is vulnerable to large scale natural events. Because of the regulated environment that utilities must operate in it is not feasible for utilities to build adequate traditional infrastructure to address these events; i.e. more transmission lines and more large central generators. Microgrid technologies have the potential to address some of the challenges associated with improving the resiliency of the nations electrical infrastructure. Microgrids are not a new concept but advances in device capabilities, computing capabilities, and communications are making them a more attractive option. This panel discussion will cover the concept of using microgrids as a resiliency resource and examine work that is being done by the United States Department of Energy.
{"title":"Microgrids as a resiliency resource","authors":"K. Schneider","doi":"10.1109/TEST.2014.7035286","DOIUrl":"https://doi.org/10.1109/TEST.2014.7035286","url":null,"abstract":"Severe weather events, and the associated customer outages, have shown that the nations electrical infrastructure is vulnerable to large scale natural events. Because of the regulated environment that utilities must operate in it is not feasible for utilities to build adequate traditional infrastructure to address these events; i.e. more transmission lines and more large central generators. Microgrid technologies have the potential to address some of the challenges associated with improving the resiliency of the nations electrical infrastructure. Microgrids are not a new concept but advances in device capabilities, computing capabilities, and communications are making them a more attractive option. This panel discussion will cover the concept of using microgrids as a resiliency resource and examine work that is being done by the United States Department of Energy.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":"35 1","pages":"1"},"PeriodicalIF":0.0,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77946305","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-10-01DOI: 10.1109/TEST.2014.7035290
Wesley Smith
The implementation of widespread Adaptive testing requires a degree of collaboration between parties that haven't yet decided that it's in their best interest to do so. The technology exists, but the drive to make it happen as yet, does not.
{"title":"Collaboration and teamwork obstacles","authors":"Wesley Smith","doi":"10.1109/TEST.2014.7035290","DOIUrl":"https://doi.org/10.1109/TEST.2014.7035290","url":null,"abstract":"The implementation of widespread Adaptive testing requires a degree of collaboration between parties that haven't yet decided that it's in their best interest to do so. The technology exists, but the drive to make it happen as yet, does not.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":"81 1","pages":"1"},"PeriodicalIF":0.0,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83203428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-10-01DOI: 10.1109/TEST.2014.7035307
P. Murthy
Security and privacy issues are magnified by the velocity, volume, and variety of Big Data, such as large-scale cloud infrastructures, diversity of data sources and formats, streaming nature of data acquisition and high volume inter-cloud migration. Therefore, traditional security mechanisms, which are tailored to securing small-scale, static (as opposed to streaming) data, are inadequate. In this talk we highlight the top ten Big Data security and privacy challenges. Highlighting the challenges will motivate increased focus on fortifying Big Data infrastructures.
{"title":"Top ten challenges in Big Data security and privacy","authors":"P. Murthy","doi":"10.1109/TEST.2014.7035307","DOIUrl":"https://doi.org/10.1109/TEST.2014.7035307","url":null,"abstract":"Security and privacy issues are magnified by the velocity, volume, and variety of Big Data, such as large-scale cloud infrastructures, diversity of data sources and formats, streaming nature of data acquisition and high volume inter-cloud migration. Therefore, traditional security mechanisms, which are tailored to securing small-scale, static (as opposed to streaming) data, are inadequate. In this talk we highlight the top ten Big Data security and privacy challenges. Highlighting the challenges will motivate increased focus on fortifying Big Data infrastructures.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":"55 1","pages":"1"},"PeriodicalIF":0.0,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88691900","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-10-01DOI: 10.1109/TEST.2014.7035287
A. V. Meier
Technologies for distributed energy resources including renewable generation, advanced inverters, electric storage, vehicle charging and load controls are rapidly maturing. To date, increasing penetration levels especially of solar DG and electric vehicles are primarily seen as a challenge to the legacy distribution infrastructure. In the long run, of course, distributed resources should serve as an asset to the grid: not only to optimize environmental and economic performance under expected operating conditions, but perhaps even more importantly to support a resilient grid, or islanded portions thereof, in the face of extreme events and emergencies. This panel presentation argues that a crucial step toward this goal is to improve the visibility and transparency of distribution systems. Smart operational decisions, whether reconfiguring network topology or dispatching diverse micro-resources, hinge on situational awareness, or an accurate reading of network conditions. This presentation will discuss physical monitoring and data analysis, including the use of high-precision synchrophasors (PMUs), to help expand the range of options for operating flexible and resourceful distribution systems under uncertain and changing conditions.
{"title":"Recruiting distributed resources for grid resilience: The need for transparency","authors":"A. V. Meier","doi":"10.1109/TEST.2014.7035287","DOIUrl":"https://doi.org/10.1109/TEST.2014.7035287","url":null,"abstract":"Technologies for distributed energy resources including renewable generation, advanced inverters, electric storage, vehicle charging and load controls are rapidly maturing. To date, increasing penetration levels especially of solar DG and electric vehicles are primarily seen as a challenge to the legacy distribution infrastructure. In the long run, of course, distributed resources should serve as an asset to the grid: not only to optimize environmental and economic performance under expected operating conditions, but perhaps even more importantly to support a resilient grid, or islanded portions thereof, in the face of extreme events and emergencies. This panel presentation argues that a crucial step toward this goal is to improve the visibility and transparency of distribution systems. Smart operational decisions, whether reconfiguring network topology or dispatching diverse micro-resources, hinge on situational awareness, or an accurate reading of network conditions. This presentation will discuss physical monitoring and data analysis, including the use of high-precision synchrophasors (PMUs), to help expand the range of options for operating flexible and resourceful distribution systems under uncertain and changing conditions.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":"23 1","pages":"1"},"PeriodicalIF":0.0,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81219683","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-10-01DOI: 10.1109/TEST.2014.7035310
G. Yeric
Looking forward along the technology roadmap, we see a complex, shifting landscape in which to attempt to ramp yield. Optical lithography is not providing any direct scaling benefit, and the available workarounds such as multiple patterning and mix-and-match lithography techniques greatly complicate design-technology co-optimization (DTCO) and yield/cost understanding. The silicon FinFET will give way to nanowires and/or new channel materials, and eventually force the examination of entirely new transistor topologies. Interconnect R's and C's will upset the FET/wire balance and with it some of our accumulated design/yield understanding, and reliability will play an increasing role in the determination of final cost. This talk will examine these technology roadmap topics with a view toward technology bring-up.
{"title":"Design, technology and yield in the post-moore era","authors":"G. Yeric","doi":"10.1109/TEST.2014.7035310","DOIUrl":"https://doi.org/10.1109/TEST.2014.7035310","url":null,"abstract":"Looking forward along the technology roadmap, we see a complex, shifting landscape in which to attempt to ramp yield. Optical lithography is not providing any direct scaling benefit, and the available workarounds such as multiple patterning and mix-and-match lithography techniques greatly complicate design-technology co-optimization (DTCO) and yield/cost understanding. The silicon FinFET will give way to nanowires and/or new channel materials, and eventually force the examination of entirely new transistor topologies. Interconnect R's and C's will upset the FET/wire balance and with it some of our accumulated design/yield understanding, and reliability will play an increasing role in the determination of final cost. This talk will examine these technology roadmap topics with a view toward technology bring-up.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":"81 1","pages":"1"},"PeriodicalIF":0.0,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86835821","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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