Pub Date : 2024-09-09DOI: 10.3103/s1068375524700078
V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov
Abstract
The operation of mounting chips into packages is the most critical in the technological assembly of electronic products, pivotal for ensuring precise chip positioning, robust mechanical connection, reliable electrical contact, and efficient heat dissipation. Whether accomplished through soldering with eutectic alloys or low-melting-point solders, or via bonding onto a conductive composition, chip mounting must adhere to stringent criteria: high joint strength under thermal cycling and mechanical loads, low electrical and thermal resistance, minimal mechanical stress on the chip, and the absence of contaminants. To elucidate the thermal dynamics and mechanical stress involved, a thermal model of a power transistor with a soldered chip on a chip holder is explored. This model facilitates the determination of thermal resistance and maximum mechanical stress in the chip post-cooling. Automated technological equipment for chip mounting by vibration and ultrasonic soldering is presented, as well as the peculiarities of mounting transistor chips in D-Pak and Super-D2Pak casings, and in power electronics modules. Transitioning towards mounting with rigidly organized leads necessitates the operation of forming a matrix structure of solder leads. This operation is executed through various methods, including induction heating, laser irradiation, and others, to ensure optimal performance and reliability.
{"title":"Chapter 7. Technology for the Assembly and Mounting of Micromodules","authors":"V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov","doi":"10.3103/s1068375524700078","DOIUrl":"https://doi.org/10.3103/s1068375524700078","url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">Abstract</h3><p>The operation of mounting chips into packages is the most critical in the technological assembly of electronic products, pivotal for ensuring precise chip positioning, robust mechanical connection, reliable electrical contact, and efficient heat dissipation. Whether accomplished through soldering with eutectic alloys or low-melting-point solders, or via bonding onto a conductive composition, chip mounting must adhere to stringent criteria: high joint strength under thermal cycling and mechanical loads, low electrical and thermal resistance, minimal mechanical stress on the chip, and the absence of contaminants. To elucidate the thermal dynamics and mechanical stress involved, a thermal model of a power transistor with a soldered chip on a chip holder is explored. This model facilitates the determination of thermal resistance and maximum mechanical stress in the chip post-cooling. Automated technological equipment for chip mounting by vibration and ultrasonic soldering is presented, as well as the peculiarities of mounting transistor chips in D-Pak and Super-D2Pak casings, and in power electronics modules. Transitioning towards mounting with rigidly organized leads necessitates the operation of forming a matrix structure of solder leads. This operation is executed through various methods, including induction heating, laser irradiation, and others, to ensure optimal performance and reliability.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":null,"pages":null},"PeriodicalIF":0.9,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142205102","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-09DOI: 10.3103/s1068375524700108
V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov
Abstract
The issues of selecting the frequency and power of high-frequency heating in soldering electronic modules and device enclosures are thoroughly examined. High-frequency electromagnetic energy is explored for its efficient non-contact heating capabilities, enabling rapid heating to soldering temperatures through the induction of eddy currents in the metal components and solder. Compared to convective heat sources, high-frequency heating can achieve heating rates up to 10 times faster, with the heating zone precisely localized within the area defined by the inductor design. Methods and device schematics for high-frequency soldering processes are provided, alongside descriptions of the technological equipment and fixtures utilized in these processes. Transistor generators operating at medium (66 kHz) and high frequencies (440 and 1760 kHz) have gained widespread adoption for high-frequency heating applications. To enhance the quality of solder joints and increase product yield, computer-controlled thermal profiles are essential for high-frequency soldering processes. The advantages of high-frequency heating, including locality, simplicity of design, high environmental cleanliness, and the ability to leverage electromagnetic forces for improving solder flow, make it an optimal choice for surface mounting of electronic modules. Induction devices constructed on magnetic cores are also viable for soldering power contacts, connectors, and wires to printed circuit boards, coaxial cables, and sealing metal-glass housings of integrated circuits. These applications highlight the versatility and efficacy of high-frequency heating techniques in modern electronic assembly processes.
{"title":"Chapter 10. High-Frequency Soldering Technology in Electronics","authors":"V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov","doi":"10.3103/s1068375524700108","DOIUrl":"https://doi.org/10.3103/s1068375524700108","url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">Abstract</h3><p>The issues of selecting the frequency and power of high-frequency heating in soldering electronic modules and device enclosures are thoroughly examined. High-frequency electromagnetic energy is explored for its efficient non-contact heating capabilities, enabling rapid heating to soldering temperatures through the induction of eddy currents in the metal components and solder. Compared to convective heat sources, high-frequency heating can achieve heating rates up to 10 times faster, with the heating zone precisely localized within the area defined by the inductor design. Methods and device schematics for high-frequency soldering processes are provided, alongside descriptions of the technological equipment and fixtures utilized in these processes. Transistor generators operating at medium (66 kHz) and high frequencies (440 and 1760 kHz) have gained widespread adoption for high-frequency heating applications. To enhance the quality of solder joints and increase product yield, computer-controlled thermal profiles are essential for high-frequency soldering processes. The advantages of high-frequency heating, including locality, simplicity of design, high environmental cleanliness, and the ability to leverage electromagnetic forces for improving solder flow, make it an optimal choice for surface mounting of electronic modules. Induction devices constructed on magnetic cores are also viable for soldering power contacts, connectors, and wires to printed circuit boards, coaxial cables, and sealing metal-glass housings of integrated circuits. These applications highlight the versatility and efficacy of high-frequency heating techniques in modern electronic assembly processes.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":null,"pages":null},"PeriodicalIF":0.9,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142205104","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-09DOI: 10.3103/s1068375524700029
V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov
Abstract
In this chapter, we comprehensively discuss the primary varieties of solders and fluxes utilized in the fabrication of electrical connections within electronic modules. Particular emphasis is placed on the challenges associated with the use of lead-free soldering materials. A potential resolution to these challenges involves the modification of solder compositions, potentially transitioning towards nanoscale architectures. A promising avenue of exploration lies in the utilization of water-based fluxes and flux gels. Water-based fluxes containing surfactant additives offer notable advantages, particularly in their application via spray mechanisms. They exhibit robust stability and mitigate thermal shock occurrences during soldering operations. Furthermore, we delve into the characteristics of solder pastes employed in the surface mounting of electronic modules, elucidating their application methodologies, operational considerations, and optimal storage practices. Additionally, we provide a comprehensive overview of conductive adhesives utilized in the formation of contact connections. The chapter also examines the primary types of mounting microwires employed in ultrasonic and thermosonic microwelding processes, alongside outlining the role of protective liquids in the cleaning of connections.
{"title":"Chapter 2. Materials for Building Electrical Connections","authors":"V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov","doi":"10.3103/s1068375524700029","DOIUrl":"https://doi.org/10.3103/s1068375524700029","url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">Abstract</h3><p>In this chapter, we comprehensively discuss the primary varieties of solders and fluxes utilized in the fabrication of electrical connections within electronic modules. Particular emphasis is placed on the challenges associated with the use of lead-free soldering materials. A potential resolution to these challenges involves the modification of solder compositions, potentially transitioning towards nanoscale architectures. A promising avenue of exploration lies in the utilization of water-based fluxes and flux gels. Water-based fluxes containing surfactant additives offer notable advantages, particularly in their application via spray mechanisms. They exhibit robust stability and mitigate thermal shock occurrences during soldering operations. Furthermore, we delve into the characteristics of solder pastes employed in the surface mounting of electronic modules, elucidating their application methodologies, operational considerations, and optimal storage practices. Additionally, we provide a comprehensive overview of conductive adhesives utilized in the formation of contact connections. The chapter also examines the primary types of mounting microwires employed in ultrasonic and thermosonic microwelding processes, alongside outlining the role of protective liquids in the cleaning of connections.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":null,"pages":null},"PeriodicalIF":0.9,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142205075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-09DOI: 10.3103/s1068375524700054
V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov
Abstract
Automation and mechanization of assembly and mounting of electronic modules yield the greatest efficiency gains in reducing the manufacturing complexity of products. Key pathways to enhance efficiency include the use of automated equipment and batch processing of new component bases, including surface-mount components. The preparation of electronic components for assembly entails several essential operations, including unpacking, incoming inspection, solderability testing, straightening, and lead forming. To ensure the solderability of printed circuit boards, immersion coatings have become widely adopted, achieved through a chemical displacement reaction in solution, providing sufficiently thin and uniform coatings on areas with exposed copper. Notably, immersion silver application involves the inclusion of organic compound additives to mitigate silver migration. Assembly operations require careful coordination of tolerances on lead and hole diameters, selection of an acceptable method for component fixation, and determination of the optimal arrangement of components on the board. The characteristics of universal machines capable of performing these operations are detailed. Furthermore, methods for fluxing, wave soldering of printed circuit boards, soldering with soldering irons, and employing soldering stations are thoroughly discussed. Special considerations regarding the cleaning of assembly joints and boards after soldering are also highlighted.
{"title":"Chapter 5. Assembly and Mounting of Electronic Modules on Printed Circuit Boards","authors":"V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov","doi":"10.3103/s1068375524700054","DOIUrl":"https://doi.org/10.3103/s1068375524700054","url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">Abstract</h3><p>Automation and mechanization of assembly and mounting of electronic modules yield the greatest efficiency gains in reducing the manufacturing complexity of products. Key pathways to enhance efficiency include the use of automated equipment and batch processing of new component bases, including surface-mount components. The preparation of electronic components for assembly entails several essential operations, including unpacking, incoming inspection, solderability testing, straightening, and lead forming. To ensure the solderability of printed circuit boards, immersion coatings have become widely adopted, achieved through a chemical displacement reaction in solution, providing sufficiently thin and uniform coatings on areas with exposed copper. Notably, immersion silver application involves the inclusion of organic compound additives to mitigate silver migration. Assembly operations require careful coordination of tolerances on lead and hole diameters, selection of an acceptable method for component fixation, and determination of the optimal arrangement of components on the board. The characteristics of universal machines capable of performing these operations are detailed. Furthermore, methods for fluxing, wave soldering of printed circuit boards, soldering with soldering irons, and employing soldering stations are thoroughly discussed. Special considerations regarding the cleaning of assembly joints and boards after soldering are also highlighted.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":null,"pages":null},"PeriodicalIF":0.9,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142205100","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-09DOI: 10.3103/s106837552470011x
V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov
Abstract
The primary types of lasers and laser diode systems used for assembly soldering are examined in detail. The technological features of laser soldering are presented for various types of contact connections in electronic modules, including bulk conductors, planar lead elements, chips, and device packages. By modeling the parameters of laser soldering, the optimal technological regimes for these processes have been determined. Laser radiation offers several advantages over infrared methods, including high localization of power in the heating zone, noninertial impact allowing for heating with short-duration pulses, precise dosing of emitted energy, and a minimal thermal effect zone. Soldered joints created through laser soldering exhibit a glossy surface, well-formed fillets, and enhanced strength properties. The ability to regulate flexibly and dose precisely the supplied energy enables the adjustment of temperature and soldering time over a wide range, enhancing the control and quality of the soldering process.
{"title":"Chapter 11. Laser Soldering of Electronic Modules","authors":"V. L. Lanin, V. A. Emel’yanov, I. B. Petuhov","doi":"10.3103/s106837552470011x","DOIUrl":"https://doi.org/10.3103/s106837552470011x","url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">Abstract</h3><p>The primary types of lasers and laser diode systems used for assembly soldering are examined in detail. The technological features of laser soldering are presented for various types of contact connections in electronic modules, including bulk conductors, planar lead elements, chips, and device packages. By modeling the parameters of laser soldering, the optimal technological regimes for these processes have been determined. Laser radiation offers several advantages over infrared methods, including high localization of power in the heating zone, noninertial impact allowing for heating with short-duration pulses, precise dosing of emitted energy, and a minimal thermal effect zone. Soldered joints created through laser soldering exhibit a glossy surface, well-formed fillets, and enhanced strength properties. The ability to regulate flexibly and dose precisely the supplied energy enables the adjustment of temperature and soldering time over a wide range, enhancing the control and quality of the soldering process.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":null,"pages":null},"PeriodicalIF":0.9,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142205105","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-04-26DOI: 10.3103/s1068375524020066
V. M. Kosenkov, L. P. Kolomiytseva
Abstract
Using the example of stamping a box-shaped part from high-strength sheet steel by a pulsed electro-hydraulic method, the limiting possibilities of its shaping, taking into account the springing of the material, are studied. The influence of the radius of the curvature and the shape of the surface of the corners of the part on the change in the structure of high-strength steel DP780 and the appearance of defects in it is determined. Relations between the radius of the curvature of the surface of the part and the thickness of the workpiece at which there are no defects in the structure of DP780 steel and the limiting possibilities of its deformation are achieved with minimal springing of the material are obtained.
{"title":"The Influence of Springing of High-Strength Steel DP780 on the Ultimate Possibilities of Its Formation during Electro-Hydraulic Stamping","authors":"V. M. Kosenkov, L. P. Kolomiytseva","doi":"10.3103/s1068375524020066","DOIUrl":"https://doi.org/10.3103/s1068375524020066","url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">Abstract</h3><p>Using the example of stamping a box-shaped part from high-strength sheet steel by a pulsed electro-hydraulic method, the limiting possibilities of its shaping, taking into account the springing of the material, are studied. The influence of the radius of the curvature and the shape of the surface of the corners of the part on the change in the structure of high-strength steel DP780 and the appearance of defects in it is determined. Relations between the radius of the curvature of the surface of the part and the thickness of the workpiece at which there are no defects in the structure of DP780 steel and the limiting possibilities of its deformation are achieved with minimal springing of the material are obtained.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":null,"pages":null},"PeriodicalIF":0.9,"publicationDate":"2024-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140804729","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-04-26DOI: 10.3103/s1068375524020145
E. V. Yurchenko, G. V. Ghilețchii, S. A. Vatavu, V. I. Petrenko, D. Harea, C. Bubulinca, A. I. Dikusar
Abstract—
A combination of X-ray diffraction and X-ray fluorescence analysis has shown that the strengthened layer formed during electric spark alloying of 65G steel with a processing electrode made of the T15K6 hard alloy is a nanocrystalline material, the ratio of the crystalline and amorphous phases in which is achieved by changing the discharge energy. Since an increase in discharge energy leads to an increase in surface roughness and its amorphization, there is an optimal value of discharge energy at which maximum wear resistance of the resulting nanocomposites is achieved. At E = 0.2 J, the wear resistance of the hardened layer is 7–10 times higher than the wear resistance of the untreated surface.
摘要 结合 X 射线衍射和 X 射线荧光分析表明，用 T15K6 硬质合金制成的加工电极对 65G 钢进行电火花合金化时形成的强化层是一种纳米结晶材料，其中结晶相和非晶相的比例可通过改变放电能量来实现。由于放电能量的增加会导致表面粗糙度的增加及其非晶化，因此存在一个最佳放电能量值，在该值下所产生的纳米复合材料可达到最大耐磨性。在 E = 0.2 J 时，硬化层的耐磨性是未处理表面耐磨性的 7-10 倍。
{"title":"Composition, Structure, and Wear Resistance of Surface Nanostructures Obtained by Electric Spark Alloying of 65G Steel","authors":"E. V. Yurchenko, G. V. Ghilețchii, S. A. Vatavu, V. I. Petrenko, D. Harea, C. Bubulinca, A. I. Dikusar","doi":"10.3103/s1068375524020145","DOIUrl":"https://doi.org/10.3103/s1068375524020145","url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">Abstract—</h3><p>A combination of X-ray diffraction and X-ray fluorescence analysis has shown that the strengthened layer formed during electric spark alloying of 65G steel with a processing electrode made of the T15K6 hard alloy is a nanocrystalline material, the ratio of the crystalline and amorphous phases in which is achieved by changing the discharge energy. Since an increase in discharge energy leads to an increase in surface roughness and its amorphization, there is an optimal value of discharge energy at which maximum wear resistance of the resulting nanocomposites is achieved. At <i>E</i> = 0.2 J, the wear resistance of the hardened layer is 7–10 times higher than the wear resistance of the untreated surface.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":null,"pages":null},"PeriodicalIF":0.9,"publicationDate":"2024-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140804699","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-04-26DOI: 10.3103/s1068375524020078
Muhammad Natsir, Muhammad Nurdin, Zainal Rahmad Syah, Suryani Dyah Astuti, Thamrin Azis, La Ode Muhammad Zuhdi Mulkiyan, La Ode Agus Salim, Faizal Mustapa, Ahmad Zulfan, Maulidiyah Maulidiyah
Abstract
This research explores the heightened sensitivity of the electrochemical formaldehyde detection achieved by incorporating a modified graphene paste electrode with a titanium dioxide-silver (TiO2/Ag) composite (GTA). The G-TiO2 matrix was augmented with varying masses of silver modifiers, namely, 0.2, 0.4, 0.6, and 0.8 g, aiming to establish the most effective composition for formaldehyde detection. Characterization through scanning electron microscopy and energy-dispersive X-ray spectroscopy confirmed the material’s composition, revealing GTA electrode nanocomposites consisting of carbon, oxygen, titanium, and silver with the compositions of 77.05, 19.46, 2.39, and 1.11%, respectively. An electrochemical analysis was conducted to assess the efficacy of the developed electrode in a 1 M K3[Fe(CN)6] solution. Furthermore, a real sample testing was performed to evaluate the practical utility of the electrode gauging its efficiency through the calculation of percentage recovery before and after treatment. The GTA electrode with a 0.4 g Ag modifier exhibited the optimal performance, as evidenced by a Horwitz Ratio stability test result of 1.38% and a limit of detection of 0.0168 µg/L. This research highlights the promising potential of the GTA electrode for the precise and sensitive formaldehyde detection, particularly in processed food products.
摘要 本研究探讨了通过在改性石墨烯浆电极中加入二氧化钛-银（TiO2/Ag）复合材料（GTA）来提高电化学甲醛检测灵敏度的问题。在 G-TiO2 基质中添加了不同质量的银改性剂，分别为 0.2、0.4、0.6 和 0.8 克，目的是确定最有效的甲醛检测成分。通过扫描电子显微镜和能量色散 X 射线光谱分析确认了材料的成分，发现 GTA 电极纳米复合材料由碳、氧、钛和银组成，含量分别为 77.05%、19.46%、2.39% 和 1.11%。在 1 M K3[Fe(CN)6] 溶液中进行了电化学分析，以评估所开发电极的功效。此外，还进行了实际样品测试，通过计算处理前后的回收百分比来评估电极的实际效用。使用 0.4 g Ag 改性剂的 GTA 电极表现出最佳性能，其 Horwitz 比率稳定性测试结果为 1.38%，检测限为 0.0168 µg/L。这项研究凸显了 GTA 电极在精确灵敏地检测甲醛方面的巨大潜力，尤其是在加工食品中。
{"title":"Design and Fabrication of a High-Performance Sensor for Formaldehyde Detection Based on Graphene-TiO2/Ag Electrode","authors":"Muhammad Natsir, Muhammad Nurdin, Zainal Rahmad Syah, Suryani Dyah Astuti, Thamrin Azis, La Ode Muhammad Zuhdi Mulkiyan, La Ode Agus Salim, Faizal Mustapa, Ahmad Zulfan, Maulidiyah Maulidiyah","doi":"10.3103/s1068375524020078","DOIUrl":"https://doi.org/10.3103/s1068375524020078","url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">Abstract</h3><p>This research explores the heightened sensitivity of the electrochemical formaldehyde detection achieved by incorporating a modified graphene paste electrode with a titanium dioxide-silver (TiO<sub>2</sub>/Ag) composite (GTA). The G-TiO<sub>2</sub> matrix was augmented with varying masses of silver modifiers, namely, 0.2, 0.4, 0.6, and 0.8 g, aiming to establish the most effective composition for formaldehyde detection. Characterization through scanning electron microscopy and energy-dispersive X-ray spectroscopy confirmed the material’s composition, revealing GTA electrode nanocomposites consisting of carbon, oxygen, titanium, and silver with the compositions of 77.05, 19.46, 2.39, and 1.11%, respectively. An electrochemical analysis was conducted to assess the efficacy of the developed electrode in a 1 M K<sub>3</sub>[Fe(CN)<sub>6</sub>] solution. Furthermore, a real sample testing was performed to evaluate the practical utility of the electrode gauging its efficiency through the calculation of percentage recovery before and after treatment. The GTA electrode with a 0.4 g Ag modifier exhibited the optimal performance, as evidenced by a Horwitz Ratio stability test result of 1.38% and a limit of detection of 0.0168 µg/L. This research highlights the promising potential of the GTA electrode for the precise and sensitive formaldehyde detection, particularly in processed food products.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":null,"pages":null},"PeriodicalIF":0.9,"publicationDate":"2024-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140804706","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-04-26DOI: 10.3103/s1068375524020029
M. I. Baranov
Abstract
A special case of equality of the conduction current density and the displacement current density in a homogeneous nonmagnetic conducting medium was used to consider the results of approximate calculation estimation of the relative permittivity εr of nonmagnetic conducting materials (metals and alloys), which are extensively used in electrical power engineering, electric power industry, and high-voltage pulse technology under the influence of variable (pulsed) electric currents and electromagnetic fields (EMF) with various amplitude–time parameters. It was demonstrated that, in the investigated case, at low frequencies f0 of conduction current and EMF (at a frequency on the order of 102 Hz) in the range of extremely low-frequency electromagnetic waves (EMW), the materials under consideration exhibit extremely high values of the electrophysical parameter εr (on the order of 1015). For extremely high frequencies f0 of current and EMF (at a frequency on the order of 5 × 1013 Hz) in the infrared range of EMW, these conducting materials are characterized by εr values on the order of 102–104, and in terms of the electrophysical parameter εr, they approach solid dielectrics and ferroelectrics.
{"title":"Calculation Estimation of the Relative Permittivity of Nonmagnetic Conducting Materials under the Action of Variable Conduction Current","authors":"M. I. Baranov","doi":"10.3103/s1068375524020029","DOIUrl":"https://doi.org/10.3103/s1068375524020029","url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">Abstract</h3><p>A special case of equality of the conduction current density and the displacement current density in a homogeneous nonmagnetic conducting medium was used to consider the results of approximate calculation estimation of the relative permittivity ε<sub><i>r</i></sub> of nonmagnetic conducting materials (metals and alloys), which are extensively used in electrical power engineering, electric power industry, and high-voltage pulse technology under the influence of variable (pulsed) electric currents and electromagnetic fields (EMF) with various amplitude–time parameters. It was demonstrated that, in the investigated case, at low frequencies <i>f</i><sub>0</sub> of conduction current and EMF (at a frequency on the order of 10<sup>2</sup> Hz) in the range of extremely low-frequency electromagnetic waves (EMW), the materials under consideration exhibit extremely high values of the electrophysical parameter ε<sub><i>r</i></sub> (on the order of 10<sup>15</sup>). For extremely high frequencies <i>f</i><sub>0</sub> of current and EMF (at a frequency on the order of 5 × 10<sup>13</sup> Hz) in the infrared range of EMW, these conducting materials are characterized by ε<sub><i>r</i></sub> values on the order of 10<sup>2</sup>–10<sup>4</sup>, and in terms of the electrophysical parameter ε<sub><i>r</i></sub>, they approach solid dielectrics and ferroelectrics.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":null,"pages":null},"PeriodicalIF":0.9,"publicationDate":"2024-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140806716","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-04-26DOI: 10.3103/s1068375524020030
A. A. Burkov, A. Yu. Bytsura
Abstract
Deposition of protective coatings improves the corrosion resistance and tribological behavior of the surfaces of metallic components. However, surface preparation prior to coating application increases the cost per unit area of the coating. Substrates made of St3 steel with surface roughness Ra ranging from 0.01 to 0.597 μm were prepared, including those with a layer of rust, and were subjected to electro-spark deposition of Cr–Fe–Cu coatings. The performed studies led to the conclusion that the initial surface roughness of St3 steel does not affect the nature of material deposition during the electro-spark alloying (ESA) and the structure of the deposited coatings. This is unequivocally confirmed by the data on heat resistance and tribological properties of the coatings. Electro-spark treatment can promote self-cleaning of the rust layer; however, complete elimination is not achieved, and large pores are formed in the coating. This significantly reduces the heat resistance and wear resistance of the coating.
{"title":"Influence of Substrate Surface Quality on Electro-Spark Alloying","authors":"A. A. Burkov, A. Yu. Bytsura","doi":"10.3103/s1068375524020030","DOIUrl":"https://doi.org/10.3103/s1068375524020030","url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">Abstract</h3><p>Deposition of protective coatings improves the corrosion resistance and tribological behavior of the surfaces of metallic components. However, surface preparation prior to coating application increases the cost per unit area of the coating. Substrates made of St3 steel with surface roughness <i>R</i><sub><i>a</i></sub> ranging from 0.01 to 0.597 μm were prepared, including those with a layer of rust, and were subjected to electro-spark deposition of Cr–Fe–Cu coatings. The performed studies led to the conclusion that the initial surface roughness of St3 steel does not affect the nature of material deposition during the electro-spark alloying (ESA) and the structure of the deposited coatings. This is unequivocally confirmed by the data on heat resistance and tribological properties of the coatings. Electro-spark treatment can promote self-cleaning of the rust layer; however, complete elimination is not achieved, and large pores are formed in the coating. This significantly reduces the heat resistance and wear resistance of the coating.</p>","PeriodicalId":782,"journal":{"name":"Surface Engineering and Applied Electrochemistry","volume":null,"pages":null},"PeriodicalIF":0.9,"publicationDate":"2024-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140806663","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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