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Elastocaloric effect and cooling performance of NiTi sheets in a continuous rotating bending elastocaloric cooler 连续旋转弯曲弹性冷却器中镍钛板的弹性热效应和冷却性能
IF 6.1 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2024-08-15 DOI: 10.1063/5.0217563
Siyuan Cheng, Wanju Sun, Xueshi Li, Jiongjiong Zhang
Elastocaloric cooling technology has the prospect of becoming a commercialized green alternative to current vapor-compression technology, and the systematic characterization of the elastocaloric effect and microstructure has become increasingly significant for the optimization of elastocaloric coolers and heat pumps. In this work, a comprehensive elastocaloric effect characterization for a dog-bone shaped NiTi sheet with a thickness of 0.5 mm was performed for the application in a compact continuous rotating bending elastocaloric cooler. The elastocaloric effect was found to be nearly identical under Brayton-like and sinusoidal force-controlled cyclic tensile loadings. The maximum adiabatic temperature change values of 31 and 23 K were recorded in Brayton-like cyclic loadings under maximum applied stress of 600 and 400 MPa, respectively, with an applied strain rate of 0.1 s−1. During fatigue tests, large applied stress (>600 MPa) and high applied strain rates (>0.1 s−1) tended to result in premature failure of the NiTi sheet samples. In the continuous rotating bending elastocaloric cooler, the sheets generated a temperature span of 6 K between the copper heat sink and heat source. The results of this work provide a set of thermophysical property data for the elastocaloric solid refrigerant and insights for the optimization of structural and operational parameters in elastocaloric coolers and heat pumps.
弹性冷却技术有望成为当前蒸汽压缩技术的商业化绿色替代技术,而弹性效应和微观结构的系统表征对于优化弹性冷却器和热泵越来越重要。本研究对厚度为 0.5 毫米的狗骨形镍钛片进行了全面的弹性热效应表征,以应用于紧凑型连续旋转弯曲弹性热冷却器。研究发现,在布雷顿式和正弦力控制的循环拉伸负荷下,弹性热效应几乎相同。在最大外加应力为 600 兆帕和 400 兆帕,外加应变速率为 0.1 秒-1 的情况下,记录到的最大绝热温度变化值分别为 31 千帕和 23 千帕。在疲劳试验中,大的外加应力(>600 兆帕)和高的外加应变率(>0.1 s-1)往往会导致镍钛板样品过早失效。在连续旋转弯曲弹性冷却器中,板材在铜散热器和热源之间产生了 6 K 的温度跨度。这项工作的结果为弹性固体制冷剂提供了一组热物理性质数据,并为优化弹性冷却器和热泵的结构和运行参数提供了启示。
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引用次数: 0
Advances in InGaN-based RGB micro-light-emitting diodes for AR applications: Status and perspective 用于 AR 应用的基于 InGaN 的 RGB 微型发光二极管的进展:现状与展望
IF 6.1 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2024-08-14 DOI: 10.1063/5.0222618
Panpan Li, Jacob Ewing, Matthew S. Wong, Yifan Yao, Hongjian Li, Srinivas Gandrothula, Jordan M. Smith, Mike Iza, Shuji Nakamura, Steven P. DenBaars
Micro-light-emitting diodes (µLEDs) are gathering significant interest as a technology for emerging micro-displays. However, µLEDs encounter numerous obstacles, including size-dependent efficiency loss, poor efficiency of red µLEDs, and challenges associated with the mass transfer and integration of full-color µLEDs. These issues become more acute in ultra-small µLEDs (<5 µm), which were required by the augmented reality (AR) displays. Here, we discuss the principal challenges faced by µLEDs and explore the possible solutions. We highlight recent advances in InGaN-based RGB µLEDs tailored for AR displays. In particular, we discuss the advancements in ultra-small InGaN µLEDs scaled down to 1 µm, the developments in InGaN red µLEDs, and the implementation of tunnel junction-based cascaded InGaN µLEDs for monolithic integration.
微型发光二极管(µLEDs)作为一种新兴的微型显示器技术,正在引起人们的极大兴趣。然而,µLED 遇到了许多障碍,包括与尺寸有关的效率损失、红色 µLED 的低效率,以及与传质和全彩 µLED 集成有关的挑战。这些问题在超小型 µLED(<5 µm)中变得更加尖锐,而这正是增强现实(AR)显示器所需要的。在此,我们将讨论 µLED 所面临的主要挑战,并探讨可能的解决方案。我们重点介绍了为 AR 显示器量身定制的基于 InGaN 的 RGB µLED 的最新进展。特别是,我们讨论了超小型 InGaN µLED 的进步、InGaN 红光 µLED 的发展以及基于隧道结的级联 InGaN µLED 的单片集成实现。
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引用次数: 0
Enhanced electrical performance in graphene field-effect transistors through post-annealing of high-k HfLaO gate dielectrics 通过对高 K HfLaO 栅极电介质进行后退火处理提高石墨烯场效应晶体管的电气性能
IF 6.1 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2024-08-14 DOI: 10.1063/5.0207559
Chunlin Liu, Xuesong Li, Ling-Xuan Qian, Jing Tian, Xiping Zhang
High-k gate dielectrics have attracted a great deal of attention in the investigation of transistors due to their unique properties such as superior gate controllability. However, their integration into graphene field-effect transistors (GFETs) remains problematic and the physical mechanisms governing the performance of these devices are still not fully understood. In this study, the effects of post-annealing on GFETs utilizing the high-k HfLaO ternary oxide as the gate dielectric were comprehensively investigated. The HfLaO film was deposited on top of graphene by magnetron sputtering, and the device performance with various post-annealing temperatures was conducted. It was found that post-annealing temperature can effectively increase the dielectric constant through balancing the oxygen-vacancy defects and moisture absorption. Both the surface morphology of HfLaO and performance of GFETs were investigated, and the fabricated GFETs exhibit notable electrical performance enhancements. Specifically, GFETs with a 200 °C post-annealed HfLaO gate dielectric demonstrate the optimal device performance, featuring a minimal Dirac point voltage (VDirac) of 1.1 V and a minimal hysteresis (ΔVDirac) of 0.5 V. The extracted hole and electron mobilities are 4012 and 1366 cm2/V · s, respectively, nearly one order of magnitude higher than that of GFETs with as-deposited HfLaO. This work outperforms other existing GFETs utilizing high-k gate dielectric and chemical vapor deposition grown graphene in terms of both carrier mobility and on–off ratio. It is also noted that the excessive post-annealing temperature can negatively impact the GFET performance through introducing oxygen vacancies, increasing the surface roughness, lowering the breakdown voltage, and inducing recrystallization.
高 k 栅极电介质因其独特的性能(如出色的栅极可控性)而在晶体管研究中备受关注。然而,将它们集成到石墨烯场效应晶体管(GFET)中仍存在问题,而且人们对这些器件性能的物理机制仍不完全了解。本研究全面考察了退火后对使用高k HfLaO三元氧化物作为栅电介质的石墨烯场效应晶体管的影响。通过磁控溅射将 HfLaO 薄膜沉积在石墨烯上,并在不同的后退火温度下对器件性能进行了测试。研究发现,后退火温度可以通过平衡氧空位缺陷和吸湿性来有效提高介电常数。对 HfLaO 的表面形貌和 GFET 的性能都进行了研究,制备出的 GFET 具有显著的电性能提升。具体来说,采用 200 °C 后退火 HfLaO 栅极电介质的 GFET 具有最佳的器件性能,其最小狄拉克点电压 (VDirac) 为 1.1 V,最小滞后 (ΔVDirac) 为 0.5 V。提取的空穴和电子迁移率分别为 4012 cm2/V - s 和 1366 cm2/V - s,比采用原沉积 HfLaO 的 GFET 高出近一个数量级。就载流子迁移率和通断比而言,这项研究成果优于其他使用高 K 栅极电介质和化学气相沉积生长石墨烯的现有 GFET。研究还指出,过高的退火后温度会引入氧空位、增加表面粗糙度、降低击穿电压并诱发再结晶,从而对 GFET 的性能产生负面影响。
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引用次数: 0
Polymer assisted deposition of YIG thin films with thickness control for spintronics applications 聚合物辅助沉积用于自旋电子学应用的具有厚度控制功能的 YIG 薄膜
IF 6.1 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2024-08-14 DOI: 10.1063/5.0223260
Rubén Corcuera, Pilar Jiménez-Cavero, Rafael Pérez del Real, Francisco Rivadulla, Rafael Ramos, José Ignacio Morales-Aragonés, Soraya Sangiao, César Magén, Luis Morellón, Irene Lucas
The use of magnetic garnets in new technologies such as spintronic devices requires fine-structured thin films. Classical fabrication techniques for these materials, typically physical vapor deposition methods, lead to excellent magnetic behavior. However, availability and scalability for potential applications are well restricted. In this study, we propose an innovative approach to fabricating Yttrium Iron Garnet thin films with precise thickness control achieved through iterative layer deposition via a chemical synthesis route. Remarkably, the iterative deposition process results in films exhibiting exceptional crystallinity. Magnetic characterization provides saturation magnetization and coercivity values on par with those reported in literature, summed to narrow ferromagnetic resonance lines. Therefore, in this work we demonstrate the viability of polymer assisted deposition as a promising alternative thinking about scalability to conventional deposition techniques for this material. Notably, our findings reveal energy conversion efficiencies comparable to those achieved with materials synthesized via physical vapor deposition methods.
在自旋电子器件等新技术中使用磁性石榴石需要结构精细的薄膜。这些材料的经典制造技术,通常是物理气相沉积法,可产生极佳的磁性。然而,潜在应用的可用性和可扩展性受到很大限制。在本研究中,我们提出了一种创新的方法,通过化学合成路线的迭代层沉积来制造具有精确厚度控制的钇铁石榴石薄膜。值得注意的是,迭层沉积工艺可使薄膜显示出卓越的结晶度。磁性表征提供的饱和磁化和矫顽力值与文献报道的值相当,总和为窄铁磁共振线。因此,在这项工作中,我们证明了聚合物辅助沉积技术的可行性,认为它是一种很有前途的替代技术,可以扩展到这种材料的传统沉积技术。值得注意的是,我们的研究结果表明,能量转换效率可与通过物理气相沉积方法合成的材料相媲美。
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引用次数: 0
Thermal contribution to current-driven antiferromagnetic-order switching 热对电流驱动反铁磁阶切换的贡献
IF 6.1 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2024-08-14 DOI: 10.1063/5.0219729
Myoung-Woo Yoo, Virginia O. Lorenz, Axel Hoffmann, David G. Cahill
In information technology devices, current-driven state switching is crucial in various disciplines including spintronics, where the contribution of heating to the switching mechanism plays an inevitable role. Recently, current-driven antiferromagnetic order switching has attracted considerable attention due to its implications for next-generation spintronic devices. Although the switching mechanisms can be explained by spin dynamics induced by spin torques, some reports have claimed that demagnetization above the Néel temperature due to Joule heating is critical for switching. Here, we present a systematic method and an analytical model to quantify the thermal contribution due to Joule heating in micro-electronic devices, focusing on current-driven octupole switching in the non-collinear antiferromagnet, Mn3Sn. The results consistently show that the critical temperature for switching remains relatively constant above the Néel temperature, while the threshold current density depends on the choice of substrate and the base temperature. In addition, we provide an analytical model to calculate the Joule-heating temperature, which quantitatively explains our experimental results. From numerical calculations, we illustrate the reconfiguration of magnetic order during cooling from a demagnetized state of polycrystalline Mn3Sn. This work provides not only deeper insights into magnetization switching in antiferromagnets, but also a general guideline for evaluating the Joule-heating temperature excursions in micro-electronic devices.
在信息技术设备中,电流驱动的状态切换在包括自旋电子学在内的各个学科中都至关重要,而加热对切换机制的贡献在其中起着不可避免的作用。最近,电流驱动的反铁磁阶次切换因其对下一代自旋电子器件的影响而备受关注。虽然开关机制可以用自旋力矩诱导的自旋动力学来解释,但一些报道称焦耳加热导致的奈尔温度以上的退磁是开关的关键。在此,我们提出了一种系统方法和一个分析模型,用于量化微电子器件中焦耳加热引起的热贡献,重点研究非共轭反铁磁体 Mn3Sn 中电流驱动的八极开关。结果一致表明,开关的临界温度在奈尔温度之上保持相对恒定,而阈值电流密度则取决于基底和基底温度的选择。此外,我们还提供了一个计算焦耳热温度的分析模型,该模型可以定量解释我们的实验结果。通过数值计算,我们说明了多晶 Mn3Sn 从退磁状态冷却过程中磁序的重新配置。这项工作不仅加深了我们对反铁磁体磁化切换的理解,还为评估微电子器件的焦耳热温度偏移提供了一般指导。
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引用次数: 0
Thermal conductivity of double polymorph Ga2O3 structures 双多晶体 Ga2O3 结构的导热性
IF 6.1 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2024-08-14 DOI: 10.1063/5.0213985
Azat Abdullaev, Kairolla Sekerbayev, Alexander Azarov, Vishnukanthan Venkatachalapathy, Vinay S. Chauhan, Zhandos Utegulov, Andrej Kuznetsov
Recently discovered double gamma/beta (γ/β) polymorph Ga2O3 structures constitute a class of novel materials providing an option to modulate functional properties across interfaces without changing the chemical compositions of materials, in contrast to that in conventional heterostructures. In this work, for the first time, we investigate thermal transport in such homo-interface structures as an example of their physical properties. In particular, the cross-plane thermal conductivity (k) was measured by femtosecond laser-based time-domain thermoreflectance with MHz modulation rates, effectively obtaining depth profiles of the thermal conductivity across the γ-/β-Ga2O3 structures. In this way, the thermal conductivity of γ-Ga2O3 ranging from 1.84 to 2.11 W m−1 K−1 was found to be independent of the initial β-substrates orientations, in accordance with the cubic spinel structure of the γ-phase and consistently with the molecular dynamics simulation data. In turn, the thermal conductivity of monoclinic β-Ga2O3 showed a distinct anisotropy, with values ranging from 10 W m−1 K−1 for [−201] to 20 Wm−1 K−1 for [010] orientations. Thus, for double γ-/β-Ga2O3 polymorph structures formed on [010] β-substrates, there is an order of magnitude difference in thermal conductivity across the γ/β interface, which can potentially be exploited in thermal energy conversion applications.
最近发现的双γ/β(γ/β)多晶Ga2O3结构是一类新型材料,与传统的异质结构相比,它提供了一种在不改变材料化学成分的情况下调节跨界面功能特性的选择。在这项研究中,我们首次研究了这类同界面结构中的热传输,作为其物理性质的一个实例。特别是,我们采用基于飞秒激光的时域热反射法测量了跨面热导率(k),其调制速率为 MHz,从而有效地获得了整个 γ-/β-Ga2O3 结构的热导率深度剖面图。这样,γ-Ga2O3 的热导率从 1.84 W m-1 K-1 到 2.11 W m-1 K-1 不等,这与γ-相的立方尖晶石结构相符,也与分子动力学模拟数据一致。反过来,单斜β-Ga2O3 的热导率表现出明显的各向异性,其值从 [-201] 取向的 10 W m-1 K-1 到 [010] 取向的 20 Wm-1 K-1。因此,对于在[010] β基底上形成的双γ-/β-Ga2O3多晶体结构,在γ/β界面上的热导率存在数量级的差异,这有可能在热能转换应用中得到利用。
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引用次数: 0
Spin magnetotransport in rare-earth iron garnet (REIG)/Pt: Effects of modulated bulk and REIG/Pt interfaces 稀土铁榴石(REIG)/铂中的自旋磁传输:调制体和 REIG/Pt 界面的影响
IF 6.1 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2024-08-14 DOI: 10.1063/5.0215071
Pei Gen Li, Sheung Mei Ng, Xin Yuan, Fu Xiang Zhang, Hon Fai Wong, Zhi Qin Chu, Peng Cao, Chi Wah Leung
The intrinsic magnetization compensation behaviors of rare-earth iron garnets (REIGs) make the material promising for applications in ultrafast spin storage devices. REIG/heavy metal heterostructures such as TbIG/Pt often display two sign crossovers of anomalous Hall effect resistance with varying temperatures. One of these crossovers is attributed to the magnetization compensation of REIG, and the other to the competition between the magnetic proximity effect and the spin Hall effect. Here, we design trilayer REIG heterostructures based on two rare-earth species (Tb and Eu). We modulate the layer stacking of the TbIG/EuIG/TbIG sandwich with a fixed total thickness and explore the contributions of REIG bulk and REIG/Pt interfaces on these two crossover points. As TbIG gradually moves away from Pt, the compensation temperature shows some fluctuations. However, when TbIG is entirely out of contact with Pt, the second crossover point undergoes a change that shows REIG/Pt interface dependency. The results highlight the dominance of REIG bulk on the compensation behavior and the interface sensitivity of the second crossover point. This study provides a reference for designing controllable spintronics devices, such as magnon valve applications.
稀土铁榴石(REIGs)的内在磁化补偿行为使这种材料有望应用于超快自旋存储设备。稀土铁榴石/重金属异质结构(如 TbIG/Pt)通常会随着温度的变化而出现霍尔效应电阻的两种符号交叉。其中一个交叉点归因于 REIG 的磁化补偿,另一个交叉点归因于磁接近效应和自旋霍尔效应之间的竞争。在这里,我们设计了基于两种稀土(铽和铕)的三层 REIG 异质结构。我们以固定的总厚度调节 TbIG/EuIG/TbIG 夹层的层堆叠,并探索 REIG 体和 REIG/Pt 界面对这两个交叉点的贡献。随着 TbIG 逐渐远离铂,补偿温度出现了一些波动。然而,当 TbIG 与铂完全不接触时,第二个交叉点发生了变化,显示出 REIG/Pt 界面的依赖性。结果凸显了 REIG 体块对补偿行为的主导作用以及第二个交叉点的界面敏感性。这项研究为设计可控自旋电子器件(如磁子阀应用)提供了参考。
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引用次数: 0
A photo rechargeable capacitor based on the p–n heterojunction of ZnO/ZIF-67 showing enhanced photovoltage 一种基于氧化锌/ZIF-67 p-n 异质结的光充电电容器,显示出更强的光电压
IF 6.1 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2024-08-14 DOI: 10.1063/5.0219883
Yanlong Lv, Xin Sun, Changhua Mi, Jianan Gu, Yanhong Wang, Meicheng Li
The photo rechargeable device (PRD) has been continuously drawing attention because it combines energy conversion and storage in one device. As for the photoelectrode of PRD, the construction of heterojunction is of crucial importance to enhance the photo performance. In this work, a two-electrode photo rechargeable capacitor based on the p–n heterojunction of ZnO/ZIF-67 is fabricated. ZIF-67 not only serves as the energy storage material but also forms the p–n heterojunction together with ZnO. A fast volatilization method was adopted for the in situ growth of ZIF-67 on ZnO nanorods to ensure sufficient mass loading and fewer interface defects. The results show a photovoltage of 0.36 V (0.2 V higher than single ZnO), a specific capacitance of 759.0 mF/g, and an overall energy conversion efficiency of 0.49%. The enhanced photovoltage is attributed to the p–n heterojunction. Moreover, a practical button cell was also fabricated, with 91% Coulombic efficiency remaining after 3000 cycles in the dark.
光充电器件(PRD)集能量转换和储存于一体,因此一直备受关注。对于光充电器件的光电极来说,异质结的构造对于提高光电性能至关重要。本研究基于 ZnO/ZIF-67 的 p-n 异质结制作了一种双电极光充电电容器。ZIF-67 不仅是储能材料,还与 ZnO 一起形成了 p-n 异质结。在 ZnO 纳米棒上原位生长 ZIF-67 时采用了快速挥发法,以确保足够的质量负载和较少的界面缺陷。结果显示,ZIF-67 的光电压为 0.36 V(比单一氧化锌高 0.2 V),比电容为 759.0 mF/g,整体能量转换效率为 0.49%。光电压的增强归功于 p-n 异质结。此外,还制作出了一种实用的纽扣电池,在黑暗中循环 3000 次后,库仑效率仍高达 91%。
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引用次数: 0
Ellingham diagrams of binary oxides 二元氧化物的埃林厄姆图
IF 6.1 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2024-08-14 DOI: 10.1063/5.0216426
Shun-Li Shang, Shuang Lin, Michael C. Gao, Darrell G. Schlom, Zi-Kui Liu
Controlling the oxidation state of constituents by tuning the oxidizing environment and materials chemistry is vital to the successful synthesis of targeted binary or multicomponent oxides. We have conducted a comprehensive thermodynamic analysis of 137 binary oxides to calculate their Ellingham diagrams. It is found that the “reactive” elements that oxidize easily are the f-block elements (lanthanides and actinides), elements in groups II, III, and IV (alkaline earth, Sc, Y, Ti, Zr, and Hf), and Al and Li. In contrast, the “noble” elements are easily reduced. These are coinage metals (Cu, Ag, and especially Au), Pt-group elements, and Hg and Se. Machine learning-based sequential feature selection indicates that the ease of oxidation can be represented by the electronic structures of pure elements, for example, their d- and s-valence electrons, Mendeleev numbers, and groups, making the Periodic Table a useful tool for qualitatively assessing the ease of oxidation. The other elemental features that weakly correlate with the ease of oxidation are thermochemical properties such as melting points and the standard entropy at 298 K of pure elements. Applying Ellingham diagrams enables the oxidation of multicomponent materials to be predicted, such as the Fe–20Cr–20Ni alloy (in wt. %) and the equimolar high entropy alloy of AlCoCrFeNi. These Ellingham diagram-based predictions are in accordance with thermodynamic calculations using the CALPHAD approach and experimental observations in the literature.
通过调整氧化环境和材料化学来控制成分的氧化态,对于成功合成目标二元或多组分氧化物至关重要。我们对 137 种二元氧化物进行了全面的热力学分析,以计算它们的埃林厄姆图。结果发现,容易氧化的 "活性 "元素是 f 族元素(镧系元素和锕系元素)、第二、第三和第四族元素(碱土、Sc、Y、Ti、Zr 和 Hf)以及 Al 和 Li。相比之下,"惰性 "元素很容易被还原。它们是贵金属(铜、银,尤其是金)、铂族元素以及汞和硒。基于机器学习的序列特征选择表明,氧化的难易程度可以用纯元素的电子结构来表示,例如它们的 d 和 s 价电子、门捷列夫数和基团,这使得元素周期表成为定性评估氧化难易程度的有用工具。与氧化难易程度相关性较弱的其他元素特征是热化学性质,如纯元素的熔点和 298 K 时的标准熵。应用埃林厄姆图可以预测多组分材料的氧化情况,例如铁-20Cr-20Ni 合金(以重量百分比计)和 AlCoCrFeNi 等摩尔高熵合金。这些基于埃林厄姆图的预测与使用 CALPHAD 方法进行的热力学计算和文献中的实验观察结果一致。
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引用次数: 0
A low-cost and convenient route of fabricating GaN films with P-type mixed microcrystalline and amorphous structure deposited via Ga target of magnetron sputtering 通过磁控溅射镓靶沉积具有 P 型微晶和非晶混合结构的氮化镓薄膜的低成本便捷制备路线
IF 6.1 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2024-08-14 DOI: 10.1063/5.0217625
Xueqing Chen, Nan Li, Zerong Xing, Jiasheng Zu, Xianwei Meng, Zhuquan Zhou, Qian Li, Lifeng Tian, Yuntao Cui, Jing Liu
GaN, a third-generation semiconductor, has gained widespread attention owing to its high temperature resistance, wide bandgap, and high critical breakdown electric fields. Magnetron sputtering has a broad potential in the field of low-cost growth of GaN on account of high efficiency, superior quality, and convenient operation. However, challenges caused from the pure Ga targets with a huge refrigeration system need to be resolved for wide practices. Here, a new and cost-effective Ga target for magnetron sputtering was fabricated by utilizing the wetting properties of CuGa2 and Ga. Mixed microcrystalline and amorphous GaN films were obtained via reactive magnetron sputtering employing the Ga target. The average deposition rate is about 1.68 nm/min, and the average roughness is ∼7.45 ± 0.26 nm under 100 W of sputtering power. In addition, the sputtered GaN films were found to be wide-bandgap and p-type semiconductors with high transmittance, as revealed by x-ray photoelectron spectroscopy and absorption spectra. The GaN films display a bandgap of ∼3.60 eV and a transmittance exceeding 88.5% in the visible range. Furthermore, field-effect transistors and metal–semiconductor–metal photodetectors have been fabricated using the obtained GaN films, demonstrating favorable response characteristics. The prospects of microcrystalline/amorphous GaN films in sensing, power devices, and flexible electronics were forecasted. Overall, a low-cost and pervasive route of target fabrication process expands the possibilities of using low melting point metals in magnetron sputtering.
氮化镓是第三代半导体,因其耐高温、宽带隙和高临界击穿电场而受到广泛关注。磁控溅射具有效率高、质量好、操作方便等优点,在低成本生长氮化镓领域具有广阔的发展前景。然而,为了广泛应用,需要解决纯镓靶材与庞大的制冷系统所带来的挑战。在此,我们利用 CuGa2 和 Ga 的润湿特性,制造了一种新型且经济高效的磁控溅射 Ga 靶件。利用这种镓靶,通过反应磁控溅射获得了微晶和非晶氮化镓混合薄膜。在 100 W 溅射功率下,平均沉积速率约为 1.68 nm/min,平均粗糙度为 ∼7.45 ± 0.26 nm。此外,X 射线光电子能谱和吸收光谱显示,溅射出的氮化镓薄膜是具有高透过率的宽带隙 p 型半导体。氮化镓薄膜的带隙为∼3.60 eV,在可见光范围内的透过率超过 88.5%。此外,利用所获得的氮化镓薄膜制作的场效应晶体管和金属-半导体-金属光电探测器也显示出良好的响应特性。研究人员还预测了微晶/非晶氮化镓薄膜在传感、功率器件和柔性电子器件中的应用前景。总之,低成本和普遍的靶材制造工艺路线拓展了在磁控溅射中使用低熔点金属的可能性。
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引用次数: 0
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