Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626050
J. Somech
This paper presents a comprehensive approach to Electromagnetic Compatibility (EMC) at the system level when it is required to demonstrate MIL-E-60S1 safety margins, briefly and are then used to derive the requirements for all subsystems down to each unit. The discussion is broken into two parts: intersystem and intrasystem compatibility. In both cases an apportionment method that ensures adequate system level margin is developed. A design example is worked out at the end to give a feel for the approach that is presented. System EMC requirements are discussed Introduction Electromagnetic Compatibility (EMC) of a complex system is extremely important and is a key ingredient to the success of a large Military or Aerospace program which is required to procure equipment that meet MIL-E-6051 specification. This specification states that all units in a system are required to demonstrate a 6 dB margin and all ordance a 20 dB margin. These are the margins that have to be designed and tested into a system in order to assure electromagnetic compatibility at the system level. The standard approach in most cases is to procure equipment that are certified to MIL-STD-461/462 and perform a limited EMC test while integrating them together. This unfotunately does not guarantee a 6 dB safety margin nor does it guarantee overall compatibility between the different subsystems, for the simple reason that the total number of boxes and their layout is not taken into account. It is also difficult to perform a system EMC test due to all the complex interactions between different subsystems and their interconnecting cables. The approach discussed below is a general one and applies to all programs, large or small, military or not. Before beginning the discussion, few definitions are given. unit: a stand alone component assembly: a collection of units that opperate together subsystem? several assemblies and units mounted system: a complete, self powered (in this case) entity: unit, assembly, subsystem or system together functionally independent equipment CH3169-0/92/0000-0012 $3.00 01992 IEEE 66 starting point of the EMC System Design is the system definition phase, during which the Electromagnetic Environment (EME) in which the system is intended to operate is characterized. The EME is defined based on the proximity of local transmitters, the presence of sensitive receivers, national or international frequency band constraints. This defines then the Intersystem Requirements which are to be met contractualy. Following the system definition phase, the system partitioning phase starts. It is during this phase that the system is divided into several subsystems that will perform the different functions. Intrasystem Compatibility, then, must be achieved in order that all subsystems will function harmoniously together. Figure 1 below shows a block diagram of the System Design Concept. Definition MIL-E-6051
当需要演示MIL-E-60S1安全裕度时，本文提出了系统级电磁兼容性(EMC)的综合方法，然后用于推导所有子系统的要求，直至每个单元。讨论分为两部分:系统间兼容性和系统内兼容性。在这两种情况下，一种分配方法，确保充分的系统级余量被开发。最后给出了一个设计实例，让人们对所提出的方法有一个感觉。介绍复杂系统的电磁兼容性(EMC)是极其重要的，是大型军事或航空航天项目成功的关键因素，这需要采购符合MIL-E-6051规范的设备。该规范规定，系统中的所有单元都必须具有6db余量，所有单元都必须具有20db余量。为了确保系统级的电磁兼容性，必须在系统中设计和测试这些余量。在大多数情况下，标准方法是采购通过MIL-STD-461/462认证的设备，并在将它们集成在一起时执行有限的EMC测试。不幸的是，这并不能保证6 dB的安全裕度，也不能保证不同子系统之间的整体兼容性，原因很简单，因为没有考虑到机箱的总数和它们的布局。由于不同子系统之间及其互连电缆之间存在复杂的相互作用，因此对系统进行EMC测试也很困难。下面讨论的方法是一种通用方法，适用于所有项目，无论大小，军事与否。在开始讨论之前，给出了一些定义。单元:一个独立的组件组装;一个一起操作的子系统的单元集合?几个组件和单元安装系统:一个完整的，自供电(在这种情况下)的实体:单元，组件，子系统或系统一起功能独立的设备IEEE 66 EMC系统设计的起点是系统定义阶段，在此期间，系统打算运行的电磁环境(EME)是有特征的。环境电磁是根据本地发射器的距离、敏感接收器的存在、国家或国际频段限制来定义的。这就定义了要在合同中满足的系统间需求。在系统定义阶段之后，开始系统分区阶段。在这个阶段，系统被分成几个子系统来执行不同的功能。因此，必须实现系统内部兼容性，以便所有子系统能够和谐地协同工作。图1显示了系统设计概念的框图。定义mil - e - 6051
{"title":"An EMC System Design Approach That Ensures MIL-E-6051 Safety Margins Are Incorporated","authors":"J. Somech","doi":"10.1109/ISEMC.1992.626050","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626050","url":null,"abstract":"This paper presents a comprehensive approach to Electromagnetic Compatibility (EMC) at the system level when it is required to demonstrate MIL-E-60S1 safety margins, briefly and are then used to derive the requirements for all subsystems down to each unit. The discussion is broken into two parts: intersystem and intrasystem compatibility. In both cases an apportionment method that ensures adequate system level margin is developed. A design example is worked out at the end to give a feel for the approach that is presented. System EMC requirements are discussed Introduction Electromagnetic Compatibility (EMC) of a complex system is extremely important and is a key ingredient to the success of a large Military or Aerospace program which is required to procure equipment that meet MIL-E-6051 specification. This specification states that all units in a system are required to demonstrate a 6 dB margin and all ordance a 20 dB margin. These are the margins that have to be designed and tested into a system in order to assure electromagnetic compatibility at the system level. The standard approach in most cases is to procure equipment that are certified to MIL-STD-461/462 and perform a limited EMC test while integrating them together. This unfotunately does not guarantee a 6 dB safety margin nor does it guarantee overall compatibility between the different subsystems, for the simple reason that the total number of boxes and their layout is not taken into account. It is also difficult to perform a system EMC test due to all the complex interactions between different subsystems and their interconnecting cables. The approach discussed below is a general one and applies to all programs, large or small, military or not. Before beginning the discussion, few definitions are given. unit: a stand alone component assembly: a collection of units that opperate together subsystem? several assemblies and units mounted system: a complete, self powered (in this case) entity: unit, assembly, subsystem or system together functionally independent equipment CH3169-0/92/0000-0012 $3.00 01992 IEEE 66 starting point of the EMC System Design is the system definition phase, during which the Electromagnetic Environment (EME) in which the system is intended to operate is characterized. The EME is defined based on the proximity of local transmitters, the presence of sensitive receivers, national or international frequency band constraints. This defines then the Intersystem Requirements which are to be met contractualy. Following the system definition phase, the system partitioning phase starts. It is during this phase that the system is divided into several subsystems that will perform the different functions. Intrasystem Compatibility, then, must be achieved in order that all subsystems will function harmoniously together. Figure 1 below shows a block diagram of the System Design Concept. Definition MIL-E-6051","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"62 1","pages":"68-71"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74221028","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626069
R. Nelson
Efforts are being made at North Dakota State University (NDSU) to help students understand the importance of considering EMC in the design of electronic circuits and systems. These efforts include trying to introduce EMC concepts in “standard” undergraduate and graduate courses, as well as developing a dedicated EMC course entitled “Designing for Electromagnetic Compatibility”. The new course was first offered during the 1991 spring quarter and has both a lecture and measurements component. Unique aspects of the course have been made possible by regional industries. This paper describes the new course as well as other efforts being made to enhance EMC education at NDSU.
{"title":"EMC Education At North Dakota State University","authors":"R. Nelson","doi":"10.1109/ISEMC.1992.626069","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626069","url":null,"abstract":"Efforts are being made at North Dakota State University (NDSU) to help students understand the importance of considering EMC in the design of electronic circuits and systems. These efforts include trying to introduce EMC concepts in “standard” undergraduate and graduate courses, as well as developing a dedicated EMC course entitled “Designing for Electromagnetic Compatibility”. The new course was first offered during the 1991 spring quarter and has both a lecture and measurements component. Unique aspects of the course have been made possible by regional industries. This paper describes the new course as well as other efforts being made to enhance EMC education at NDSU.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"61 1","pages":"164-167"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86869265","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626044
S. Daijavad, W. Pence, B. Rubin, H. Heeb, S. Ponnapalli, A. Ruehli
Most companies oflering products that mus t pass FCC or’ other regulatory agency specifications have compiled EMI design guidelines which are practiced b y their engineers. I n this paper, we take one such practical E M I design guideline and, through extensive use of a state-of-the-art electromagnetic analysis code, investigate its range of applicability, and show its lamitations. The emphasis is placed on the methodology, rather than the guideline itself, so that a framework is established under which other EMI design guidelines can be similarly “revisited”.
{"title":"Methodology for evaluating practical EMI design guidelines using EM analysis programs","authors":"S. Daijavad, W. Pence, B. Rubin, H. Heeb, S. Ponnapalli, A. Ruehli","doi":"10.1109/ISEMC.1992.626044","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626044","url":null,"abstract":"Most companies oflering products that mus t pass FCC or’ other regulatory agency specifications have compiled EMI design guidelines which are practiced b y their engineers. I n this paper, we take one such practical E M I design guideline and, through extensive use of a state-of-the-art electromagnetic analysis code, investigate its range of applicability, and show its lamitations. The emphasis is placed on the methodology, rather than the guideline itself, so that a framework is established under which other EMI design guidelines can be similarly “revisited”.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"83 1","pages":"30-34"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91130306","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626059
D. N. Ladd, G. Costache
The finite element method is applied to study the electromagnetic radiation from a VLSI package heatsink. A heatsink fastened to the IC package can be effective in eliminating performance degrading thermal effects, however its presence will also alter the pattern of the electromagnetic radiation. This paper does not deal with any thermal considerations, but looks only at the influence of various heatsink configurations on the radiated electromagnetic field. The finite element algorithm solves the magnetic field distribution about an axisymmetric model of an integrated circuit mounted onto a heatsink. The configurations are simplified and an equivalent induced noise voltage source is used to excite the antenna consisting of the chip and the heatsink. A radiation boundary condition allows the mesh to be truncated close to the heatsink. Results presented show how the configurations can either reduce or increase the radiated emissions.
{"title":"Finite Element Analysis Of The Electromagnetic Radiation From A VLSI Package Heatsink","authors":"D. N. Ladd, G. Costache","doi":"10.1109/ISEMC.1992.626059","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626059","url":null,"abstract":"The finite element method is applied to study the electromagnetic radiation from a VLSI package heatsink. A heatsink fastened to the IC package can be effective in eliminating performance degrading thermal effects, however its presence will also alter the pattern of the electromagnetic radiation. This paper does not deal with any thermal considerations, but looks only at the influence of various heatsink configurations on the radiated electromagnetic field. The finite element algorithm solves the magnetic field distribution about an axisymmetric model of an integrated circuit mounted onto a heatsink. The configurations are simplified and an equivalent induced noise voltage source is used to excite the antenna consisting of the chip and the heatsink. A radiation boundary condition allows the mesh to be truncated close to the heatsink. Results presented show how the configurations can either reduce or increase the radiated emissions.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"5 1","pages":"120-123"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90321294","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626098
B. Szentkuti
In wide frequency ran es the electromagnetic coupling through a cable shieldmay be well simulated with a longitudinal1 homo eneous set-up (transfined: (surface) transfer impedance Z, b / m ) and capacitive coupling impedance Z, (Q/m). They are not dependent on the test set-up, in contrary to the "shielding attenuation". The coupling transfer function (T) throu h the shield nuation into ZT and ZF, at any frequency where ZT and Z, may be defined. The shielding quality (and intrinsic shield parameters) may be tested also with "field methods", some of them not having a basic upper frequency limit of application. The concepts used for coaxial cables may be a p p lied to multi-wire cables and to connectors and cable asmission line). The intrinsic CO L 9 le shie d ammeters are dei s given. It allows to convert the test data or s f ielding atteGlossary of Important Terms 1 and 2 = outer and inner circuit, see fig. 2 n and f = near and far end (seen from generator) Subscripts only used if distinction i s necessary (surface) transfer impedance (of a cable ihield) ' transfer impedance [of a connector) capacitive coupling impedance (of a cable shield) capacitive coupling impedance (of a connector] through capacitance (of a cable shield) i d T 1 3 characteristic impedances of the transmission lines formed by circuits (1 ) and (2) , see fig. 2 max IZ,+ZTl length of cable section under test shield diameter coupling (transfer) function shielding attenuation As = 20 log IT I summing function, argument I-f 4 7 7 2
在宽频率范围内，通过电缆屏蔽的电磁耦合可以用纵向同质设置(转换为:(表面)传输阻抗Z, b /m)和电容耦合阻抗Z， (Q/m)很好地模拟。它们不依赖于测试设置，与“屏蔽衰减”相反。耦合传递函数(T)通过屏蔽器衰减为ZT和ZF，在任意频率下，ZT和Z都可以定义。屏蔽质量(和固有屏蔽参数)也可以用“现场方法”进行测试，其中一些方法没有应用的基本频率上限。用于同轴电缆的概念可能是(适用于多线电缆和连接器和电缆许可线)。给出了本征CO - l9电流计的计算公式。重要术语1和2 =外部和内部电路，见图2 n和f =近端和远端(从发电机上看)下标仅在需要区分时使用(表面)传输阻抗(电缆屏蔽)传输阻抗(连接器的)电容耦合阻抗(电缆屏蔽的)连接器的电容耦合阻抗(电缆屏蔽的)通过电容(电缆屏蔽的)i d T 1 3电路(1)和(2)形成的传输线的特性阻抗，见图2 max IZ，+ZTl测试屏蔽下电缆截面长度直径耦合(传输)函数屏蔽衰减As = 20 log IT i求和函数，参数i -f 4 7 7 2
{"title":"Shielding Quality Of Cables And Connectors: Some Basics For Beller Understanding Of Test Methods","authors":"B. Szentkuti","doi":"10.1109/ISEMC.1992.626098","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626098","url":null,"abstract":"In wide frequency ran es the electromagnetic coupling through a cable shieldmay be well simulated with a longitudinal1 homo eneous set-up (transfined: (surface) transfer impedance Z, b / m ) and capacitive coupling impedance Z, (Q/m). They are not dependent on the test set-up, in contrary to the \"shielding attenuation\". The coupling transfer function (T) throu h the shield nuation into ZT and ZF, at any frequency where ZT and Z, may be defined. The shielding quality (and intrinsic shield parameters) may be tested also with \"field methods\", some of them not having a basic upper frequency limit of application. The concepts used for coaxial cables may be a p p lied to multi-wire cables and to connectors and cable asmission line). The intrinsic CO L 9 le shie d ammeters are dei s given. It allows to convert the test data or s f ielding atteGlossary of Important Terms 1 and 2 = outer and inner circuit, see fig. 2 n and f = near and far end (seen from generator) Subscripts only used if distinction i s necessary (surface) transfer impedance (of a cable ihield) ' transfer impedance [of a connector) capacitive coupling impedance (of a cable shield) capacitive coupling impedance (of a connector] through capacitance (of a cable shield) i d T 1 3 characteristic impedances of the transmission lines formed by circuits (1 ) and (2) , see fig. 2 max IZ,+ZTl length of cable section under test shield diameter coupling (transfer) function shielding attenuation As = 20 log IT I summing function, argument I-f 4 7 7 2","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"191 1","pages":"294-301"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88473453","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626094
Han Fang
In this paper, theoretical analyses and exper. imental results are carried out on the electromagnetic leak. age from shielded cables caused by pigtail effect. Calcula. tions of the leakage are presented on the basis of transmis. sion line theory and antenna theory, and are in excellent agreement with the experiment. Finally, certain protective methods and techniques are introduced, which exhibit at least 30 dB suppressions against the pigtail effect.
{"title":"Electromagnetic Leakage From Shielded Cables By Pigtail Effect","authors":"Han Fang","doi":"10.1109/ISEMC.1992.626094","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626094","url":null,"abstract":"In this paper, theoretical analyses and exper. imental results are carried out on the electromagnetic leak. age from shielded cables caused by pigtail effect. Calcula. tions of the leakage are presented on the basis of transmis. sion line theory and antenna theory, and are in excellent agreement with the experiment. Finally, certain protective methods and techniques are introduced, which exhibit at least 30 dB suppressions against the pigtail effect.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"1 1","pages":"278-282"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76583502","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626106
L.K.C. Wong
Effective use of connector technology is a critical component in the design approach to electromagnetic interference control. “Pin-and-box” type of connectors used on backplanes are significant radiators of RF energy at system clock speeds of over 100 MHz. Experimental data obtained from a high bandwidth TEM cell and from the anechoic chamber measurement are used to show the effectiveness of different ground pin shielding patterns. Shielding effectiveness of an experimental backplane connector shield is also presented.
{"title":"Backplane Connector Radiated Emission And Shielding Effectiveness","authors":"L.K.C. Wong","doi":"10.1109/ISEMC.1992.626106","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626106","url":null,"abstract":"Effective use of connector technology is a critical component in the design approach to electromagnetic interference control. “Pin-and-box” type of connectors used on backplanes are significant radiators of RF energy at system clock speeds of over 100 MHz. Experimental data obtained from a high bandwidth TEM cell and from the anechoic chamber measurement are used to show the effectiveness of different ground pin shielding patterns. Shielding effectiveness of an experimental backplane connector shield is also presented.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"100 1","pages":"346-351"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74258840","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626155
E. Marx
Causality is addressed in the context of the principles of electromagnetism for nonsinusoidal fields. Topics include Maxwell's equations, integral equations for scattering, stepping-in-time algorithms, dispersive media, and Green's functions.
{"title":"Causality and Maxwell's equations","authors":"E. Marx","doi":"10.1109/ISEMC.1992.626155","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626155","url":null,"abstract":"Causality is addressed in the context of the principles of electromagnetism for nonsinusoidal fields. Topics include Maxwell's equations, integral equations for scattering, stepping-in-time algorithms, dispersive media, and Green's functions.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"59 1","pages":"503-507"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89425111","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626066
M. Kunkel, G. Kunkel
Transfer impedance and shielding effectiveness testing was performed on a set of joint surfaces over the frequency range of 10 MHz to 1 GlrIz. The joint surfaces consisted of a set of plates and were: (1) a 6% inch outside diameter ring with a 4!/4 inch inside diameter; and (2) a 51/2 inch diameter disk. The plates were manufactured from !44 inch thick 6061-T6 aluminum and tin plated. The electromagnetic bonding was obtained using .040 inch thick zinc plated steel washers sandwiched between the plates and held in place with 6-32 screws on a 51/4 inch diameter ring. The number of screws and washers used were 2, 4 and 8 where the screws and washers were evenly spaced during each test.
{"title":"Comparison between transfer impedance and shielding effectiveness testing","authors":"M. Kunkel, G. Kunkel","doi":"10.1109/ISEMC.1992.626066","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626066","url":null,"abstract":"Transfer impedance and shielding effectiveness testing was performed on a set of joint surfaces over the frequency range of 10 MHz to 1 GlrIz. The joint surfaces consisted of a set of plates and were: (1) a 6% inch outside diameter ring with a 4!/4 inch inside diameter; and (2) a 51/2 inch diameter disk. The plates were manufactured from !44 inch thick 6061-T6 aluminum and tin plated. The electromagnetic bonding was obtained using .040 inch thick zinc plated steel washers sandwiched between the plates and held in place with 6-32 screws on a 51/4 inch diameter ring. The number of screws and washers used were 2, 4 and 8 where the screws and washers were evenly spaced during each test.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"38 1","pages":"149-153"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80655810","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626091
L. Hoeft
A model has been developed for explaining the possible effects of electromagnetic fields on the occurrence of cancer.' This model postulates that electromagnetic fields increase the cell division rate and therefore the occurrence of natural or spontaneous cancers, e.g. those produced by radiation or chemicals. The increased cell division rate may occur because the biological system is able to perceive the presence of the electromagnetic field but is probably not able to identify it, at least not at low field strengths. The unidentified stimulus produces a physiological stress that increases the cell division rate. This model is consistent with most observations and can be used to make predictions.
{"title":"A model for possible effects of electromagnetic fields on the occurrence of cancer","authors":"L. Hoeft","doi":"10.1109/ISEMC.1992.626091","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626091","url":null,"abstract":"A model has been developed for explaining the possible effects of electromagnetic fields on the occurrence of cancer.' This model postulates that electromagnetic fields increase the cell division rate and therefore the occurrence of natural or spontaneous cancers, e.g. those produced by radiation or chemicals. The increased cell division rate may occur because the biological system is able to perceive the presence of the electromagnetic field but is probably not able to identify it, at least not at low field strengths. The unidentified stimulus produces a physiological stress that increases the cell division rate. This model is consistent with most observations and can be used to make predictions.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"20 1","pages":"266-268"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85386861","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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