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A Method To Improve EMI Shielding Predictions 一种改进电磁干扰屏蔽预测的方法
C. Brench
Colin E. Brench Digital Equipment Corporation 146 Main Street, Maynard, MA 01754 Overall perfonnance of a shield with one or more apertures depends upon a number of factors, including, the type and location of the source, the presence of adjacent conductors and the geometry of the shield. Both analytic and numerical techniques were employed in this work to analyze four separate indicators to shielding perfonnance. The four indicators used were shielding effectiveness, electric field suppression, magnetic field suppression and surface impedance.
具有一个或多个孔的屏蔽的整体性能取决于许多因素,包括源的类型和位置,相邻导体的存在以及屏蔽的几何形状。本文采用解析和数值方法对屏蔽性能的四个独立指标进行了分析。使用的四个指标是屏蔽效能、电场抑制、磁场抑制和表面阻抗。
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引用次数: 1
Circuit theory approach to shielding 电路理论的屏蔽方法
G. Kunkel
There are two approved methods for approximating the shielding effectiveness of shielding m,aterials used in the design of shielded enclosures and boxes. Both of the approved methods use wave theory and quasi-stationary assumptions. One of the methods uses Maxwell¿s equations to estimate the shielding, and the other uses the correlation between transmissiain lines and radiated waves. A third method consisiting of circuit theory (or Kirkoff's Law) is proposed herein as an applicable method of approximation worthy of consideration.
有两种被批准的方法来近似屏蔽m的屏蔽效果,屏蔽m是屏蔽外壳和屏蔽盒设计中使用的材料。这两种方法都使用波动理论和准平稳假设。一种方法使用麦克斯韦方程组来估计屏蔽,另一种方法使用传输线和辐射波之间的相关性。本文提出了由电路理论(或Kirkoff定律)组成的第三种方法,作为值得考虑的适用近似方法。
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引用次数: 0
Derivation Of The Normalized Site Attenuation Mutual Coupling Correction Factor And An Improved Method Of Antenna Factor Determination 归一化站点衰减互耦校正因子的推导及天线因子确定的改进方法
R. McConnell
The mutual coupling correction factor is used in ANSI C63.4-1991 site attenuation procedures to correct the antenna factors of resonant dipoles at a distance of three meters and arrive at values of measured normalized site attenuation. The correction factor accounts for nonlinearities of attenuation versus distance for resonant dipoles in close proximity. A derivation of the correction factor is given here in which it is shown that the factor is composed of effects due to mutual impedance, changes in aperture, and changes in effective height. The insights gained from this derivation lead to improved methods of deterniining resonant dipole antenna factors through the elimination of two approximations which are used in the present ANSI C63.5-1988 procedures.
ANSI C63.4-1991站点衰减程序中使用互耦校正因子对三米距离上的谐振偶极子天线因子进行校正,得到归一化站点衰减的测量值。校正因子解释了近距离共振偶极子衰减随距离的非线性。本文给出了修正系数的推导,其中表明修正系数由相互阻抗、孔径变化和有效高度变化的影响组成。从这个推导中获得的见解导致通过消除目前ANSI C63.5-1988程序中使用的两个近似来确定谐振偶极子天线因子的改进方法。
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引用次数: 3
The Measurement Of Radiated Emissions From Integrated Circuits 集成电路辐射发射的测量
R. R. Goulette
Newer, larger integrated circuits are becoming significant sources of EMI, due to their higher clock speeds, greater dynamic current consumption, and increased size and complexity. This paper presents an approach for the measurement of radiated emissions potential at the component level, with the objective of quantitatively specifying the level of device emissions that will ensure compliance at the equipment level. Since many integrated circuit radiated emission effects depend upon near-field coupling, the problem is first examined in the light of magnetic and electric field measurements made in the immediate vicinity of the device. The prospect of using far-field measurement methods is also considered, and the relative merits of using both techniques are weighed. R = Radiated I. INTRODUCI~ON C = Conducted Fig. 1. Electromagnetic emission from integrated circuits. The design of telecommunications equipment for EMI compliance is currently hampered by a lack of relevant data on the emissions potential of commercial and custom electronic components. Newer, more complex devices such as 32-bit microprocessors, digital signal processors, and a variety of ASICs (application-specific integrated circuits) have appeared on the scene and represent an increasingly important source of electromagnetic energy. This is due to their higher clock speeds, greater dynamic current consumption, and increased size and complexity. Although these components will not normally fail the radiated emissions limits by themselves, the energy that they generate may excite resonant structures within electronic equipment, causing an EM1 problem. Figure 1 depicts the flow of both conducted and radiated energy from the integrated circuit (IC) into printed circuit board (PCB) and backplane structures, into enclosure cavities and onto connectors and cables. Each one of these elements contributes to the total energy radiated from the equipment. It is evident from this view that limiting the emissions from the device will control the emissions from the equipment. The problem that remains is to quantitatively specify the level of device emissions that will ensure emission compliance at the product level. The purpose of this paper is to propose that devices be characterized in terms of their equivalent magnetic and electric dipole moments, which will provide a measure of the potential for radiated emissions coupling. This is accomplished by representing an IC by a small loop antenna (magnetic dipole) and by a small dipole antenna (electric dipole). The magnetic dipole moment is simply the product of loop area and loop current, and the electric dipoie moment is the product of dipole length and current [I]. Measurement techniques to determine these parameters will be presented in the following sections. II. REASONS FOR REDUCING INTEGRATED ClRCUIT EMISSIONS Direct device radiated emissions are becoming more important in modem high-density high-speed circuitry since the use of ground planes a
由于更高的时钟速度、更大的动态电流消耗以及尺寸和复杂性的增加,更新、更大的集成电路正成为EMI的重要来源。本文提出了一种在组件水平上测量辐射发射电位的方法,目的是定量地指定设备发射水平,以确保在设备水平上符合要求。由于许多集成电路的辐射发射效应依赖于近场耦合,因此首先根据在器件附近进行的磁场和电场测量来检查这个问题。对远场测量方法的应用前景进行了展望,并对两种方法的优缺点进行了比较。R =辐射I. intri ~ON C =传导集成电路的电磁发射。目前,由于缺乏关于商业和定制电子元件的潜在排放的有关数据,使电信设备的设计不符合电磁干扰标准。更新,更复杂的设备,如32位微处理器,数字信号处理器和各种专用集成电路(asic)已经出现在现场,代表着越来越重要的电磁能量来源。这是由于它们更高的时钟速度,更大的动态电流消耗,以及增加的尺寸和复杂性。虽然这些组件本身通常不会超过辐射发射限制,但它们产生的能量可能会激发电子设备内的谐振结构,导致EM1问题。图1描述了从集成电路(IC)进入印刷电路板(PCB)和背板结构,进入外壳腔和连接器和电缆的传导和辐射能量的流动。这些元素中的每一个都对设备辐射的总能量有贡献。很明显,从这个观点来看,限制设备的排放将控制设备的排放。剩下的问题是定量地指定设备排放水平,以确保在产品水平上符合排放要求。本文的目的是提出用等效磁偶极矩和电偶极矩来表征器件,这将为辐射发射耦合的潜力提供一种度量。这是通过一个小的环形天线(磁偶极子)和一个小的偶极子天线(电偶极子)来表示一个集成电路来实现的。磁偶极矩是回路面积与回路电流的乘积,电偶极矩是偶极子长度与电流的乘积[I]。确定这些参数的测量技术将在以下章节中介绍。2直接器件辐射在现代高密度高速电路中变得越来越重要,因为地平面和带状线的使用最大限度地减少了痕量辐射,使大型IC器件内的高架(典型2.5毫米)布线成为主要的辐射体。控制IC辐射发射的额外好处是,实现这一目标所需的器件布局和电路措施也倾向于降低封装电感、地反弹和传导噪声。由此可见,辐射发射的测量也提供了与设备传导噪声有关的一些主要因素的指示,可能通过对电场和磁场的单一测量来实现。这与一些较新的asic需要对数百个引脚进行传导噪声测量形成鲜明对比,CH3169-0/92/0000-0067 $3.00 / 1992 IEEE 340表明,确定这种相关性的努力是值得的。本文没有提出直接测量传导噪声的限制和技术的主题,因为它已经在文献[2],[3]中得到了广泛的处理,并且因为这项工作的主要目的是控制IC的辐射发射贡献,而这些贡献不能在电路组级别有效地减轻。DI。磁偶极矩和电偶极矩的需求如果要避免沿着图1中明显的路径发生明显的系统耦合,EMC工程师需要了解IC的近场耦合电位。近场是指距离小于六分之一波长的近距离耦合。例如,如果集成电路安装在金属外壳内的PCB上,则需要知道电偶极矩和磁偶极矩,以便估计腔谐振效应。新的高速asic可以发射高达或超过1 GHz的显著场,因此这甚至可以应用于小型外壳和结构,例如安装在地平面上的散热器组件。
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引用次数: 19
Radiated Emissions Of Interconnect Cables 互连电缆的辐射发射
S.K. Das, W.T. Smith, C. Paul
Short ribbon cables are often used to connect components inside a computer or other electronic device. Crosstalk between the closely spaced wires of a multiconductor ribbon cable is often a problem. Interspersing ground wires and signal-carrying wires is a common and effective method for reduction of crosstalk on these types of cables [ll. In this study, the radiated emissions of a ribbon cable are analyzed. The goal is to determine how different signal wire/ground wire configurations affect the radiated fields of a ribbon cable. A five wire model of a 10 cm ribbon cable is used. Lumped circuit analysis and the method of moments are used to predict the currents and radiated fields.
短带状电缆通常用于连接计算机或其他电子设备内部的组件。多导体带状电缆中间隔很近的导线之间的串扰经常是一个问题。在这些类型的电缆上散布地线和信号传输线是减少串扰的一种常见而有效的方法[11]。本文对带状电缆的辐射发射进行了分析。目的是确定不同的信号线/地线配置如何影响带状电缆的辐射场。使用五线模型的10cm带状电缆。采用集总电路分析和矩量法对电流和辐射场进行了预测。
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引用次数: 5
Broadband Quarter Wave Absorbers And Site Attenuation New Developments 宽带四分之一波吸收器和站点衰减新进展
F. Mayer, J. Chaumat, M. Kirschvink
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引用次数: 2
Far-field Techniques For Predicting Aircraft Antenna Coupling 预测飞机天线耦合的远场技术
J.M. Harris, R. Levin
The analytical prediction of coupling between antennas is frequently time consuming and costly. The predictions are most challenging when the antennas operate at frequencies below 1 GHz and are located on surfaces that offer only limited ground plane area. This paper explores the limitations of using simple far-field, free-space transmission equations to predict the coupling between two helicopter-mounted antennas operating in the UHF band. Onaircraft antenna coupling measurements are compared to coupling measurements performed in an anechoic chamber and to antenna coupling values calculated using the simple far-field, free-space transmission equations.
天线间耦合的分析预测往往是费时且昂贵的。当天线工作在低于1ghz的频率上,并且位于仅提供有限地平面面积的表面时,预测是最具挑战性的。本文探讨了使用简单的远场自由空间传输方程来预测在UHF频段工作的两个直升机天线之间耦合的局限性。将飞机上的天线耦合测量值与在消声室中进行的耦合测量值以及使用简单的远场自由空间传输方程计算的天线耦合值进行了比较。
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引用次数: 2
Shielding Enhancement Of The Torpedo Mk 50 鱼雷Mk 50的防护增强
L. Lacoursiere
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引用次数: 1
Electromagnetic Shielding Degradation Of Composite And Metal Mil-c-38999 Connectors Due To Environmental Exposure 环境暴露对复合材料和金属Mil-c-38999连接器电磁屏蔽性能的影响
D. Kempf
Three types of MIL-C-38999 connectors were measured for shielding effectiveness both before and after exposure to a controlled simulated Navy fleet environment using a salt fog chamber. Two connectors types were made of compositematerial. The third type was a standard aluminumconnector. Shielding effectivenesswas measured over the frequency range of 1 to 10 GHz using m ode-stirred chamber techniques. This paper compares the degradation of shielding effectiveness of the three connector types resulting from the salt fog exposure.
三种类型的MIL-C-38999连接器在暴露于受控的模拟海军舰队环境之前和之后使用盐雾室测量了屏蔽效能。两种类型的连接器由复合材料制成。第三种是标准的铝连接器。在1至10 GHz的频率范围内,使用模态搅拌室技术测量了屏蔽效果。本文比较了盐雾暴露对三种连接器屏蔽性能的影响。
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引用次数: 0
New broadband gigahertz field simulator 新型宽带千兆赫场模拟器
A. Podgorski, G. Gibson
A new electromagnetic field simulator for the measurement of radiated susceptibility and emission is presented. The design of the new simulator permits its easy incorporation into existing EMC and EMP facilities and provides for facilities testing capability expansion into the gigahertz region.
提出了一种用于测量辐射磁化率和发射的新型电磁场模拟器。新模拟器的设计使其易于并入现有的EMC和EMP设施,并提供设施测试能力扩展到千兆赫兹区域。
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引用次数: 6
期刊
IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility
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