Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626067
John W. Adams
{"title":"Electromagnetic Shielding Of RF Gaskets Measured By Two Methods","authors":"John W. Adams","doi":"10.1109/ISEMC.1992.626067","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626067","url":null,"abstract":"","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"28 1","pages":"154-157"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87402193","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626128
J. Daher, G. Champion
This paper describes the test methodology and the test results of Radio Frequency (RF) and microwave susceptibility measurements performed on charge-coupled devices (CCD's). Conducted susceptibility measurements were performed on a CCD image sensor chip and radiated susceptibility measurements were performed on a camera system which uses the same CCD chip as the image sensor. The measurement results indicate that imaging systems which employ CCD sensors are susceptible to modest electromagnetic (EM) environments. Thus, when operated in severe EM environments, CCD-based imaging systems will require significant hardening to operate without upset. The work described in this paper was sponsored by Rome Laboratory under Contract No. F30602-89-C-0165.
本文介绍了在电荷耦合器件(CCD)上进行射频(RF)和微波磁化率测量的测试方法和测试结果。在CCD图像传感器芯片上进行了传导磁化率测量，在与图像传感器使用相同CCD芯片的相机系统上进行了辐射磁化率测量。测量结果表明，采用CCD传感器的成像系统易受中等电磁环境的影响。因此，当在恶劣的EM环境中运行时，基于ccd的成像系统需要进行大量硬化才能正常运行。本文所描述的工作由罗马实验室根据合同编号。f30602 - 89 - c - 0165。
{"title":"Susceptibility Of Charge-coupled Devices To RF And Microwave Radiation","authors":"J. Daher, G. Champion","doi":"10.1109/ISEMC.1992.626128","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626128","url":null,"abstract":"This paper describes the test methodology and the test results of Radio Frequency (RF) and microwave susceptibility measurements performed on charge-coupled devices (CCD's). Conducted susceptibility measurements were performed on a CCD image sensor chip and radiated susceptibility measurements were performed on a camera system which uses the same CCD chip as the image sensor. The measurement results indicate that imaging systems which employ CCD sensors are susceptible to modest electromagnetic (EM) environments. Thus, when operated in severe EM environments, CCD-based imaging systems will require significant hardening to operate without upset. The work described in this paper was sponsored by Rome Laboratory under Contract No. F30602-89-C-0165.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"26 1","pages":"416-422"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88546829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626049
R. Corcoran
Military electrical and electronic equipment inherently radiate extremely low frequency (ELF) (30 to 300 Hz) fields. In this paper, ELF magnetic field limits from several national and international agencies are compared to MIL-STD-461C radiated emission (REO1) limits which some military electrical and electronic equipments must meet to maintain electromagnetic compatibility. The comparison shows that by meeting the REOl limits, military equipment magnetic field emissions will be below the currently available interim ELF limits and guidelines. Using the existing REOl magnetic field limits as a reference, interim guidelines are suggested for dealing with cases where the REOl limit must be relaxed in the design of electrical and electronic equipments for some military applications.
{"title":"Extremely Low Frequency Exposure Limits Relative To Military Electrical/electronic System Environments","authors":"R. Corcoran","doi":"10.1109/ISEMC.1992.626049","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626049","url":null,"abstract":"Military electrical and electronic equipment inherently radiate extremely low frequency (ELF) (30 to 300 Hz) fields. In this paper, ELF magnetic field limits from several national and international agencies are compared to MIL-STD-461C radiated emission (REO1) limits which some military electrical and electronic equipments must meet to maintain electromagnetic compatibility. The comparison shows that by meeting the REOl limits, military equipment magnetic field emissions will be below the currently available interim ELF limits and guidelines. Using the existing REOl magnetic field limits as a reference, interim guidelines are suggested for dealing with cases where the REOl limit must be relaxed in the design of electrical and electronic equipments for some military applications.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"1 1","pages":"62-67"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81437005","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626137
J. Quine, K.E. Larsen, G. Wellenc, W. Quinn, J.P. Streeter, J. Pešta, C. Blank
Methodologies are described for measuring the total absorption area of electronic subassemblies. In the first approach the subassembly is placed inside a large high-Q test enclosure, and the total absorption area of the subassembly is calculated from the measured reduction in Q-value of the test enclosure. This non-invasive method does not require the placement of field probes inside the subassembly. In the second approach, which is invasive, the total absorption area of the subassembly is calculated from the values of shielding effectiveness and Q of the subassembly that are measured by means of probes placed inside the subassembly. Experimental data are presented for the 1.0 to 6.0 GHz region.
{"title":"Measurement Of Total Absorption Area Of Electronic Subassemblies","authors":"J. Quine, K.E. Larsen, G. Wellenc, W. Quinn, J.P. Streeter, J. Pešta, C. Blank","doi":"10.1109/ISEMC.1992.626137","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626137","url":null,"abstract":"Methodologies are described for measuring the total absorption area of electronic subassemblies. In the first approach the subassembly is placed inside a large high-Q test enclosure, and the total absorption area of the subassembly is calculated from the measured reduction in Q-value of the test enclosure. This non-invasive method does not require the placement of field probes inside the subassembly. In the second approach, which is invasive, the total absorption area of the subassembly is calculated from the values of shielding effectiveness and Q of the subassembly that are measured by means of probes placed inside the subassembly. Experimental data are presented for the 1.0 to 6.0 GHz region.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"64 1","pages":"438-438"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77140401","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626089
S. Cristina, A. Orlandi
{"title":"Electromagnetic Interferences Caused By Internal Sources In Road Vehicles","authors":"S. Cristina, A. Orlandi","doi":"10.1109/ISEMC.1992.626089","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626089","url":null,"abstract":"","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"34 1","pages":"251-255"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85580287","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626162
A. Drozd
This paper provides a brief overview of major EMC analysis and prediction codes that are presently available and in wide use. In particular, this paper highlights the capabilities of the latest versions of the lntrasystem Electromagnetic Compatibility Analysis Program (IEMCAP) and the General Electroma netic Model for the Analysis of Complex Systems (GEMACSqcodes. First, the analysis methodolog and general concepts for applying sophisticatec!tools like IEMCAP and GEMACS to complex systems that incorporate many electroma netic are overviewed. Since IEMCAP represents a class of widely used EMC tools and since it can address a relatively wide range of EMC problem solving concernsfor complex systems, it is emphasized throughout the discussions. In particular, IEMCAP's software structure, basic input data parameters list, built-in engineering models, and stored EMC limits which are in accordance with MIL-STD-461 and MIL-E-6051, will be overviewed. Also summarized in this paper are several important thrusts directed at advancing the state-of-the-art in computational electromagnetics software using artificial intelligence/expert system (AI/ES) technologies. transceivers (i.e., boxes, antennas, wire/ca % le bundles, etc.)
{"title":"Overview Of Present EMC Analysis/prediction Tools And Future Thrusts Directed At Developing Avexpert Systems","authors":"A. Drozd","doi":"10.1109/ISEMC.1992.626162","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626162","url":null,"abstract":"This paper provides a brief overview of major EMC analysis and prediction codes that are presently available and in wide use. In particular, this paper highlights the capabilities of the latest versions of the lntrasystem Electromagnetic Compatibility Analysis Program (IEMCAP) and the General Electroma netic Model for the Analysis of Complex Systems (GEMACSqcodes. First, the analysis methodolog and general concepts for applying sophisticatec!tools like IEMCAP and GEMACS to complex systems that incorporate many electroma netic are overviewed. Since IEMCAP represents a class of widely used EMC tools and since it can address a relatively wide range of EMC problem solving concernsfor complex systems, it is emphasized throughout the discussions. In particular, IEMCAP's software structure, basic input data parameters list, built-in engineering models, and stored EMC limits which are in accordance with MIL-STD-461 and MIL-E-6051, will be overviewed. Also summarized in this paper are several important thrusts directed at advancing the state-of-the-art in computational electromagnetics software using artificial intelligence/expert system (AI/ES) technologies. transceivers (i.e., boxes, antennas, wire/ca % le bundles, etc.)","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"63 1","pages":"528-529"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79430770","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626043
W. Leahy
Once the classic approaches relating field theory to EM propagation and attenuation are examined in contrast to the newer approaches (nouvelle approaches) using circuit theory, two questions emerge. First, we must ask, “who’s right?” Second, “who cares?” This paper addresses these two questions and their ramifications to the EM engineer and the EM field.
{"title":"EM analysis, classic or nouvelle","authors":"W. Leahy","doi":"10.1109/ISEMC.1992.626043","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626043","url":null,"abstract":"Once the classic approaches relating field theory to EM propagation and attenuation are examined in contrast to the newer approaches (nouvelle approaches) using circuit theory, two questions emerge. First, we must ask, “who’s right?” Second, “who cares?” This paper addresses these two questions and their ramifications to the EM engineer and the EM field.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"25 1","pages":"27-29"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73721407","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626077
J. Randa, M. Kanda, R. Orr
We report the design and testing of electric-field probes for use at frequencies in the microwave and millimeter-wave range. consist of a resistive element whose temperature rise is measured by an optically sensed thermometer. Design parameters of the resistive element were optimized theoretically, with empirical confirmation. The optimized probe has a flat response above about 13 GHz and can measure fields as small as 17 V/m. The probes
{"title":"Optimized thermo-optic electric-field probes for microwaves and millimeter waves","authors":"J. Randa, M. Kanda, R. Orr","doi":"10.1109/ISEMC.1992.626077","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626077","url":null,"abstract":"We report the design and testing of electric-field probes for use at frequencies in the microwave and millimeter-wave range. consist of a resistive element whose temperature rise is measured by an optically sensed thermometer. Design parameters of the resistive element were optimized theoretically, with empirical confirmation. The optimized probe has a flat response above about 13 GHz and can measure fields as small as 17 V/m. The probes","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"86 1","pages":"200-203"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73223121","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626080
D.L. Williams, M. Idoguchi, W. McGinnis
A comparison was made between Whole-Vehicle Susceptibility ( W V S ) test results and results from laboratory tests utilizing Bulk Current Injection (BCI) and Transverse Electromagnetic ( E M ) cell testing techniques. All tests were performed on three electronic systems used in a 11.5 meter (36 ft), 67 passenger touring bus. The measured induced currents for each of the three systems during the WVS test were compared with the measured induced currents for each of the three systems using the BCI and TEM cell techniques. The data gathered during the tests were used to establish a set of design curves as a guide for future electromagnetic compatibility testing to meet industry standards and international requirements.
{"title":"Whole-vehicle susceptibility correlation with laboratory test techniques","authors":"D.L. Williams, M. Idoguchi, W. McGinnis","doi":"10.1109/ISEMC.1992.626080","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626080","url":null,"abstract":"A comparison was made between Whole-Vehicle Susceptibility ( W V S ) test results and results from laboratory tests utilizing Bulk Current Injection (BCI) and Transverse Electromagnetic ( E M ) cell testing techniques. All tests were performed on three electronic systems used in a 11.5 meter (36 ft), 67 passenger touring bus. The measured induced currents for each of the three systems during the WVS test were compared with the measured induced currents for each of the three systems using the BCI and TEM cell techniques. The data gathered during the tests were used to establish a set of design curves as a guide for future electromagnetic compatibility testing to meet industry standards and international requirements.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"12 1","pages":"214-218"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83501591","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1992-01-01DOI: 10.1109/ISEMC.1992.626056
J. Fessler, K. Whites, C. R. Paul
The effect of finite dimensions of an image plane on the reduction of radiated emissions is investigated numerically. The applications are important in the reduction of the radiated fields from common-mode currents on Printed Circuit Board (PCB) conductors (lands). Earlier experimental results showed that common-mode currents tend to be the dominant contributors to the emissions from PCB lands [1,2]. Additional experimental results showed that placement of a metallic plane beneath the PCB could dramatically reduce the emissions [3]. The numerical results presented in this paper are intended to confirm these observations and are obtained for a ground plane of infinite length but finite width (2D) and for a ground plane (and current) of finite width and length (3D). These results show that reductions of radiated emissions of the isolated current of around lOdB are obtained when a finite ground plane is placed beneath it. It is also shown that as long as the ground plane dimensions are larger than approximately one wavelength, the height of the current above the ground plane is electrically small and the current is not too close to the edges of the ground plane, image theory provides an adequate characterization of the problem even though the ground plane dimensions are finite.
{"title":"Effect Of Image Plane Dimensions On Radiated Emissions","authors":"J. Fessler, K. Whites, C. R. Paul","doi":"10.1109/ISEMC.1992.626056","DOIUrl":"https://doi.org/10.1109/ISEMC.1992.626056","url":null,"abstract":"The effect of finite dimensions of an image plane on the reduction of radiated emissions is investigated numerically. The applications are important in the reduction of the radiated fields from common-mode currents on Printed Circuit Board (PCB) conductors (lands). Earlier experimental results showed that common-mode currents tend to be the dominant contributors to the emissions from PCB lands [1,2]. Additional experimental results showed that placement of a metallic plane beneath the PCB could dramatically reduce the emissions [3]. The numerical results presented in this paper are intended to confirm these observations and are obtained for a ground plane of infinite length but finite width (2D) and for a ground plane (and current) of finite width and length (3D). These results show that reductions of radiated emissions of the isolated current of around lOdB are obtained when a finite ground plane is placed beneath it. It is also shown that as long as the ground plane dimensions are larger than approximately one wavelength, the height of the current above the ground plane is electrically small and the current is not too close to the edges of the ground plane, image theory provides an adequate characterization of the problem even though the ground plane dimensions are finite.","PeriodicalId":93568,"journal":{"name":"IEEE International Symposium on Electromagnetic Compatibility : [proceedings]. IEEE International Symposium on Electromagnetic Compatibility","volume":"35 1","pages":"106-111"},"PeriodicalIF":0.0,"publicationDate":"1992-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90118172","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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