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Failure Mechanisms and Characterization of High-Temperature-Vulcanized Silicone Rubber Under AC Electric Fields Subject to Corrosive Environments 高温硫化硅橡胶在交流电场和腐蚀环境下的失效机理及特性研究
IF 1.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/MEI.2026.11306299
Guohui Pang;Zhijin Zhang;Steven Qi Li;Jiayu Li;Simon M. Rowland;Song Yue;Konstantinos Kopsidas;Xingliang Jiang
This study predicts the failure of energized silicone rubber exposed to corrosive fog environments by analyzing leakage current characteristics and the hydrophobicity loss ratio, which serve as indicators of insulation degradation and operational reliability.
本研究通过分析泄漏电流特性和疏水损失率,作为绝缘劣化和运行可靠性的指标,预测带电硅橡胶在腐蚀雾环境下的失效。
{"title":"Failure Mechanisms and Characterization of High-Temperature-Vulcanized Silicone Rubber Under AC Electric Fields Subject to Corrosive Environments","authors":"Guohui Pang;Zhijin Zhang;Steven Qi Li;Jiayu Li;Simon M. Rowland;Song Yue;Konstantinos Kopsidas;Xingliang Jiang","doi":"10.1109/MEI.2026.11306299","DOIUrl":"https://doi.org/10.1109/MEI.2026.11306299","url":null,"abstract":"This study predicts the failure of energized silicone rubber exposed to corrosive fog environments by analyzing leakage current characteristics and the hydrophobicity loss ratio, which serve as indicators of insulation degradation and operational reliability.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"42 1","pages":"16-29"},"PeriodicalIF":1.3,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Electrical Insulation Magazine, a Publication of DEIS IEEE电气绝缘杂志,DEIS的出版物
IF 1.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/MEI.2026.11306320
{"title":"IEEE Electrical Insulation Magazine, a Publication of DEIS","authors":"","doi":"10.1109/MEI.2026.11306320","DOIUrl":"https://doi.org/10.1109/MEI.2026.11306320","url":null,"abstract":"","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"42 1","pages":"C2-C2"},"PeriodicalIF":1.3,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306320","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778382","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Device and Materials Reliability Information for Authors IEEE器件与材料可靠性信息学报
IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/TDMR.2025.3638080
{"title":"IEEE Transactions on Device and Materials Reliability Information for Authors","authors":"","doi":"10.1109/TDMR.2025.3638080","DOIUrl":"https://doi.org/10.1109/TDMR.2025.3638080","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 4","pages":"C3-C3"},"PeriodicalIF":2.3,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306201","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778419","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
New Categories for Phase-Resolved Partial Discharge Pattern Classification 相位分辨局部放电模式分类的新类别
IF 1.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/MEI.2026.11306325
Alfredo Contin;Andrea Piccolo;Andrea Cavallini
New categories of partial discharge activity are proposed to enable source identification consistent with the intrinsic nature of partial discharges.
提出了部分放电活动的新类别,以便能够与部分放电的内在性质相一致地识别源。
{"title":"New Categories for Phase-Resolved Partial Discharge Pattern Classification","authors":"Alfredo Contin;Andrea Piccolo;Andrea Cavallini","doi":"10.1109/MEI.2026.11306325","DOIUrl":"https://doi.org/10.1109/MEI.2026.11306325","url":null,"abstract":"New categories of partial discharge activity are proposed to enable source identification consistent with the intrinsic nature of partial discharges.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"42 1","pages":"6-15"},"PeriodicalIF":1.3,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
News from Japan 来自日本的新闻
IF 1.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/MEI.2026.11306327
Yoshimichi Ohki
In recent years, the development of CO2-free power generation has been progressing around the world to reach the goal of realizing a sustainable society. As an island nation surrounded by oceans, Japan has begun to promote the introduction of off-shore wind power generation. However, in many projects being planned, it is envisaged that large-scale offshore wind farms may be in areas away from major electricity consumption areas because of the restrictions of favorable wind and other conditions. To expand offshore wind power generation, we need to introduce a DC power transmission system with an excellent long-distance power transmission efficiency. Specifically, to increase the capacity of highly stable and efficient power transmission, it is desirable to introduce a DC power transmission system that connects via multiple terminals many offshore wind farms and power grids, transmitting power to demanding areas.
近年来,无二氧化碳发电的发展在世界范围内不断取得进展,以实现可持续社会的目标。作为一个被海洋包围的岛国,日本已经开始推动引进海上风力发电。然而,在许多正在规划的项目中,由于有利的风力和其他条件的限制,设想大型海上风力发电场可能位于远离主要电力消费地区的地区。为了扩大海上风力发电,我们需要引进一种具有良好远距离输电效率的直流输电系统。具体而言,为了提高高稳定高效的输电能力,需要引入直流输电系统,通过多个终端连接多个海上风电场和电网,将电力输送到有需求的地区。
{"title":"News from Japan","authors":"Yoshimichi Ohki","doi":"10.1109/MEI.2026.11306327","DOIUrl":"https://doi.org/10.1109/MEI.2026.11306327","url":null,"abstract":"In recent years, the development of CO2-free power generation has been progressing around the world to reach the goal of realizing a sustainable society. As an island nation surrounded by oceans, Japan has begun to promote the introduction of off-shore wind power generation. However, in many projects being planned, it is envisaged that large-scale offshore wind farms may be in areas away from major electricity consumption areas because of the restrictions of favorable wind and other conditions. To expand offshore wind power generation, we need to introduce a DC power transmission system with an excellent long-distance power transmission efficiency. Specifically, to increase the capacity of highly stable and efficient power transmission, it is desirable to introduce a DC power transmission system that connects via multiple terminals many offshore wind farms and power grids, transmitting power to demanding areas.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"42 1","pages":"37-41"},"PeriodicalIF":1.3,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306327","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778316","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Performance of Filter-Type Laminar Air Curtains When the FOUP Door Opened 过滤式层流风幕开启后的性能
IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/TSM.2025.3646324
Shih-Cheng Hu;Tee Lin;Omid Ali Zargar;Chen-Lin Cho;Yang-Cheng Shih;Graham Leggett
Studies have shown that when the door of a Front Opening Unified Pod (FOUP) opens, the moisture or airborne molecular contamination (AMC) in the microenvironment can be influenced by the equipment layout, forming a skewed flow field. This skewed flow field can allow contaminants to enter the FOUP, adversely affecting the yield of the semiconductor manufacturing process. To effectively eliminate contaminants inside the FOUP, in addition to the common method of purging the FOUP, a laminar air curtain (LAC) device can be added to the FOUP door. This device introduces compressed dry air (CDA) at the interface between the microenvironment and the FOUP, forming flow barrier. This method effectively controls the cleanliness and humidity inside the FOUP. Currently, with the use of the laminar air curtain device, the humidity inside the FOUP significantly decreases. However, when the air reaches the bottom of the wafer box, it tends to diffuse outward, allowing contaminants to invade. To enhance the barrier effect of the air curtain, increasing the flow rate of the injected air is considered, but this can cause deformation of the perforated plate. Since the laminar air curtain device is installed near the door of the Load-Port Unit (LPU), the deformed perforated plate might collide with the LPU door, causing structural damage, generating particles, or displacing the laminar air curtain device, thus compromising its ability to effectively block contaminants from entering the FOUP. The previously developed filter-type laminar air curtain device has met the high flow rate (700 L/min) requirements and improved issues related to deformation and particle generation caused by high flow rates. However, comparative testing of performance across multiple samples in mass production is lacking. Therefore, this study will optimize the configuration of the filter-type laminar air curtain device, including the use of a perforated plate at the outlet and an airflow diffusion device inside the structure. After mass production, we will conduct performance comparisons, including indicators such as airflow uniformity and particle concentration. We expect that advancements in this research and technology will promote broader application of the filter-type air curtain device in the semiconductor industry.
{"title":"Performance of Filter-Type Laminar Air Curtains When the FOUP Door Opened","authors":"Shih-Cheng Hu;Tee Lin;Omid Ali Zargar;Chen-Lin Cho;Yang-Cheng Shih;Graham Leggett","doi":"10.1109/TSM.2025.3646324","DOIUrl":"https://doi.org/10.1109/TSM.2025.3646324","url":null,"abstract":"Studies have shown that when the door of a Front Opening Unified Pod (FOUP) opens, the moisture or airborne molecular contamination (AMC) in the microenvironment can be influenced by the equipment layout, forming a skewed flow field. This skewed flow field can allow contaminants to enter the FOUP, adversely affecting the yield of the semiconductor manufacturing process. To effectively eliminate contaminants inside the FOUP, in addition to the common method of purging the FOUP, a laminar air curtain (LAC) device can be added to the FOUP door. This device introduces compressed dry air (CDA) at the interface between the microenvironment and the FOUP, forming flow barrier. This method effectively controls the cleanliness and humidity inside the FOUP. Currently, with the use of the laminar air curtain device, the humidity inside the FOUP significantly decreases. However, when the air reaches the bottom of the wafer box, it tends to diffuse outward, allowing contaminants to invade. To enhance the barrier effect of the air curtain, increasing the flow rate of the injected air is considered, but this can cause deformation of the perforated plate. Since the laminar air curtain device is installed near the door of the Load-Port Unit (LPU), the deformed perforated plate might collide with the LPU door, causing structural damage, generating particles, or displacing the laminar air curtain device, thus compromising its ability to effectively block contaminants from entering the FOUP. The previously developed filter-type laminar air curtain device has met the high flow rate (700 L/min) requirements and improved issues related to deformation and particle generation caused by high flow rates. However, comparative testing of performance across multiple samples in mass production is lacking. Therefore, this study will optimize the configuration of the filter-type laminar air curtain device, including the use of a perforated plate at the outlet and an airflow diffusion device inside the structure. After mass production, we will conduct performance comparisons, including indicators such as airflow uniformity and particle concentration. We expect that advancements in this research and technology will promote broader application of the filter-type air curtain device in the semiconductor industry.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"39 1","pages":"82-90"},"PeriodicalIF":2.3,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146122794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Stories from China 来自中国的故事
IF 1.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/MEI.2026.11306296
Zepeng Lv
Metal oxide varistors (MOV) with excellent nonlinear current density-electric field $(J-E)$ characteristics are the key components of arresters, which are critical for protecting power systems against overvoltage. Metal oxide varistors inevitably undergo aging during their long-term service under continuous electrical stress, typically manifesting as degraded electrical performance such as declined nonlinear coefficient, decreased breakdown voltage, and increased leakage current. As shown in Figure 1, aging of conventional MOV leads to a monotonic increase in power loss, which finally triggers thermal runaway and serious failure. This classical aging behavior has been well described by the ion migration model proposed by Gupta and Carlson in 1985 [1], wherein mobile ions (e.g., zinc interstitials) migrate toward grain boundaries (GB) under an applied electric field, neutralizing negatively charged interface states. The double Schottky barrier (DSB) is thus reduces, resulting in increased power loss. It has been the theoretical foundation for reliability optimization and condition assessment of MOV over the past 40 years.
金属氧化物压敏电阻(MOV)具有优良的非线性电流密度-电场特性,是避雷器的关键部件,对电力系统的过电压保护起着至关重要的作用。金属氧化物压敏电阻在持续的电应力作用下长期使用,不可避免地会发生老化,主要表现为非线性系数下降、击穿电压降低、漏电流增大等电性能下降。如图1所示,常规MOV老化导致功率损耗单调增加,最终引发热失控,严重失效。Gupta和Carlson在1985年提出的离子迁移模型很好地描述了这种经典的老化行为,其中移动离子(例如锌间隙)在外加电场下向晶界(GB)迁移,中和带负电荷的界面态。双肖特基势垒(DSB)因此减少,导致功率损耗增加。在过去的40年中,它一直是MOV可靠性优化和状态评估的理论基础。
{"title":"Stories from China","authors":"Zepeng Lv","doi":"10.1109/MEI.2026.11306296","DOIUrl":"https://doi.org/10.1109/MEI.2026.11306296","url":null,"abstract":"Metal oxide varistors (MOV) with excellent nonlinear current density-electric field <tex>$(J-E)$</tex> characteristics are the key components of arresters, which are critical for protecting power systems against overvoltage. Metal oxide varistors inevitably undergo aging during their long-term service under continuous electrical stress, typically manifesting as degraded electrical performance such as declined nonlinear coefficient, decreased breakdown voltage, and increased leakage current. As shown in Figure 1, aging of conventional MOV leads to a monotonic increase in power loss, which finally triggers thermal runaway and serious failure. This classical aging behavior has been well described by the ion migration model proposed by Gupta and Carlson in 1985 [1], wherein mobile ions (e.g., zinc interstitials) migrate toward grain boundaries (GB) under an applied electric field, neutralizing negatively charged interface states. The double Schottky barrier (DSB) is thus reduces, resulting in increased power loss. It has been the theoretical foundation for reliability optimization and condition assessment of MOV over the past 40 years.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"42 1","pages":"42-44"},"PeriodicalIF":1.3,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306296","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778117","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Bulletin Board: First Asian Summer School on Dielectric Insulation (ASSDI 2025) Successfully Held in Harbin, China 公告栏:第一届亚洲绝缘暑期学校(ASSDI 2025)在中国哈尔滨成功举办
IF 1.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/MEI.2026.11306326
Xinyue Zhang
Harbin, China, August 7–10, 2025—The inaugural Asian Summer School on Dielectric Insulation (ASSDI 2025) was successfully held at the Ice Island Hotel on Sun Island, Harbin (Figure 1). The event was organized by Xi'an Jiaotong University, sponsored by the IEEE Dielectrics and Electrical Insulation Society (IEEE DEIS), and co-organized by Harbin University of Science and Technology.
中国,哈尔滨,2025年8月7-10日——首届亚洲绝缘暑期学校(ASSDI 2025)在哈尔滨太阳岛冰岛酒店成功举办(图1)。本次会议由西安交通大学主办,IEEE介电与电气绝缘学会(IEEE DEIS)赞助,哈尔滨科技大学协办。
{"title":"Bulletin Board: First Asian Summer School on Dielectric Insulation (ASSDI 2025) Successfully Held in Harbin, China","authors":"Xinyue Zhang","doi":"10.1109/MEI.2026.11306326","DOIUrl":"https://doi.org/10.1109/MEI.2026.11306326","url":null,"abstract":"Harbin, China, August 7–10, 2025—The inaugural Asian Summer School on Dielectric Insulation (ASSDI 2025) was successfully held at the Ice Island Hotel on Sun Island, Harbin (Figure 1). The event was organized by Xi'an Jiaotong University, sponsored by the IEEE Dielectrics and Electrical Insulation Society (IEEE DEIS), and co-organized by Harbin University of Science and Technology.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"42 1","pages":"58-61"},"PeriodicalIF":1.3,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306326","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Author's Guide for IEEE Electrical Insulation Magazine Technical Articles IEEE电气绝缘杂志技术文章作者指南
IF 1.3 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2025-12-19 DOI: 10.1109/MEI.2026.11306324
{"title":"Author's Guide for IEEE Electrical Insulation Magazine Technical Articles","authors":"","doi":"10.1109/MEI.2026.11306324","DOIUrl":"https://doi.org/10.1109/MEI.2026.11306324","url":null,"abstract":"","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"42 1","pages":"C3-C3"},"PeriodicalIF":1.3,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306324","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778243","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Guest Editorial: Special Issue in Memory of Prof. Brajesh Kumar Kaushik 嘉宾评论:纪念Brajesh Kumar Kaushik教授特刊
IF 1.9 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2025-12-19 DOI: 10.1109/OJNANO.2025.3635934
Supriyo Bandyopadhyay;Giovanni Finocchio
{"title":"Guest Editorial: Special Issue in Memory of Prof. Brajesh Kumar Kaushik","authors":"Supriyo Bandyopadhyay;Giovanni Finocchio","doi":"10.1109/OJNANO.2025.3635934","DOIUrl":"https://doi.org/10.1109/OJNANO.2025.3635934","url":null,"abstract":"","PeriodicalId":446,"journal":{"name":"IEEE Open Journal of Nanotechnology","volume":"6 ","pages":"187-188"},"PeriodicalIF":1.9,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306198","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778248","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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