Pub Date : 2024-06-20DOI: 10.1109/TDMR.2024.3405819
{"title":"IEEE Transactions on Device and Materials Reliability Information for Authors","authors":"","doi":"10.1109/TDMR.2024.3405819","DOIUrl":"https://doi.org/10.1109/TDMR.2024.3405819","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10566483","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141435446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-20DOI: 10.1109/TDMR.2024.3407548
Charles LaRow
The IEEE International Integrated Reliability Workshop (IIRW) is a distinctive event which brings together reliability researchers, professionals, and students from around the globe to a common forum for lively discussions, wonderful technical presentations, and beautiful scenery for 4 days and nights. The event takes place every year at Fallen Leaf Lake in South Lake Tahoe, CA, USA, where attendees are housed within a secluded camp with informal meeting spaces and access to boats, trails, and many other outdoor activities. The scope of content centers around hot topics in, novel techniques for, and general knowledge on semiconductor reliability research and industry challenges. Talks on transistor and front-end-of-the-line (FEOL) reliability, bias temperature instability (BTI), hot carrier (HC), gate dielectric time-dependent dielectric breakdown (TDDB), back-end-of-the-line (BEOL) reliability, Interconnect TDDB, electro-migration (EM), circuit reliability, packaging reliability, conventional and emerging memory reliability, failure analysis (FA), wafer-level reliability (WLR), among other topic are presented. The key focus areas at IIRW 2023 were Advanced node scaling solutions (FEOL/MOL/BEOL), circuit reliability (device-circuit degradation and aging).
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Pub Date : 2024-06-20DOI: 10.1109/TDMR.2024.3405818
{"title":"IEEE Transactions on Device and Materials Reliability Publication Information","authors":"","doi":"10.1109/TDMR.2024.3405818","DOIUrl":"https://doi.org/10.1109/TDMR.2024.3405818","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10566480","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141435327","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-20DOI: 10.1109/TSTE.2024.3410716
{"title":"IEEE Transactions on Sustainable Energy Publication Information","authors":"","doi":"10.1109/TSTE.2024.3410716","DOIUrl":"https://doi.org/10.1109/TSTE.2024.3410716","url":null,"abstract":"","PeriodicalId":452,"journal":{"name":"IEEE Transactions on Sustainable Energy","volume":null,"pages":null},"PeriodicalIF":8.6,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10566115","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141444721","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-20DOI: 10.1109/TDMR.2024.3412348
{"title":"Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers","authors":"","doi":"10.1109/TDMR.2024.3412348","DOIUrl":"https://doi.org/10.1109/TDMR.2024.3412348","url":null,"abstract":"","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10566482","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141435413","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-20DOI: 10.1109/JPHOTOV.2024.3412475
{"title":"IEEE Journal of Photovoltaics Information for Authors","authors":"","doi":"10.1109/JPHOTOV.2024.3412475","DOIUrl":"https://doi.org/10.1109/JPHOTOV.2024.3412475","url":null,"abstract":"","PeriodicalId":445,"journal":{"name":"IEEE Journal of Photovoltaics","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10566072","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141435523","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-20DOI: 10.1109/TSTE.2024.3410726
{"title":"IEEE Transactions on Sustainable Energy Information for Authors","authors":"","doi":"10.1109/TSTE.2024.3410726","DOIUrl":"https://doi.org/10.1109/TSTE.2024.3410726","url":null,"abstract":"","PeriodicalId":452,"journal":{"name":"IEEE Transactions on Sustainable Energy","volume":null,"pages":null},"PeriodicalIF":8.6,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10566090","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141435317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-20DOI: 10.1109/JPHOTOV.2024.3412813
{"title":"Call for Papers: Special Issue on Intelligent Sensor Systems for the IEEE Journal of Electron Devices","authors":"","doi":"10.1109/JPHOTOV.2024.3412813","DOIUrl":"https://doi.org/10.1109/JPHOTOV.2024.3412813","url":null,"abstract":"","PeriodicalId":445,"journal":{"name":"IEEE Journal of Photovoltaics","volume":null,"pages":null},"PeriodicalIF":2.5,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10566079","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141435443","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-20DOI: 10.1109/TSTE.2024.3410724
{"title":"IEEE Industry Applications Society Information","authors":"","doi":"10.1109/TSTE.2024.3410724","DOIUrl":"https://doi.org/10.1109/TSTE.2024.3410724","url":null,"abstract":"","PeriodicalId":452,"journal":{"name":"IEEE Transactions on Sustainable Energy","volume":null,"pages":null},"PeriodicalIF":8.6,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10566114","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141435338","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-20DOI: 10.1109/TSTE.2024.3410718
{"title":"Get Published in the New IEEE Open Access Journal of Power and Energy","authors":"","doi":"10.1109/TSTE.2024.3410718","DOIUrl":"https://doi.org/10.1109/TSTE.2024.3410718","url":null,"abstract":"","PeriodicalId":452,"journal":{"name":"IEEE Transactions on Sustainable Energy","volume":null,"pages":null},"PeriodicalIF":8.6,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10566088","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141435314","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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