The rapid evolution of wide bandgap semiconductor technology has positioned gallium nitride (GaN) metal-oxide-semiconductor high electron mobility transistors (MOSHEMTs) and metal-insulator-semiconductor high electron mobility transistors (MISHEMTs) as transformative solutions for next-generation power electronics and radio frequency (RF) applications. This comprehensive review examines twenty years of technological advancement in GaN insulated gate devices, from foundational research breakthroughs in 2005 to cutting-edge commercial implementations in 2025. The fundamental advantages of GaN's wide bandgap (3.39 eV), high critical electric field (3.3 MV/cm), and superior electron mobility (2000 cm2/V·s) enable unprecedented device performance characteristics including breakdown voltages exceeding 3 kV, switching frequencies approaching 10 MHz, and power densities surpassing 7 W/mm. This review systematically analyzes the critical technological pillars enabling these achievements: advanced gate dielectric materials ranging from conventional oxides (Al2O3, HfO2, SiO2) to innovative nitride-based systems (SiNx, AlN) and emerging ferroelectric compounds; sophisticated device architectures including recessed gate structures, field plate configurations, and multi-channel designs that optimize performance trade-offs; and precision fabrication techniques encompassing atomic layer deposition, plasma-enhanced chemical vapor deposition, and plasma-free processing methods. The analysis reveals remarkable progress in enhancement-mode operation with positive threshold voltages exceeding 4 V, ultra-low gate leakage currents below 10−12 A/mm, and frequency responses extending to 320 GHz. Record achievements include maximum current densities of 545 mA/mm, power-added efficiencies above 75 %, and operating temperatures surpassing 450 °C, positioning these devices as enabling technologies for 5G infrastructure, electric vehicle systems, and harsh environment applications. The comprehensive technological foundation established over two decades provides a robust platform for continued innovation, with emerging ultra-wide bandgap substrates and three-dimensional integration approaches promising even greater performance capabilities for future electronic systems.
扫码关注我们
求助内容:
应助结果提醒方式:
