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A Reliable Cross-Point MLC ReRAM with Sneak Current Compensation 具有潜流补偿的可靠的跨点MLC ReRAM
Pub Date : 2015-05-17 DOI: 10.1109/IMW.2015.7150272
J. Baek, Sang-Yun Kim, Jae-Koo Park, Jae-Young Park, K. Kwon
In this paper, a reliable cross-point MLC ReRAM is introduced and fully integrated with 350nm CMOS technology. Both resistance states and variations are widely investigated with different compliance current. The self-termination scheme is adopted to prevent overstress to switched cell in set operation. As a result of self termination, write failure is prohibited and the uniformity on LRS of 300 uA compliance improved 2.3 times. In order to deter the compliance current offset in set operation, a sneak current compensation scheme of which controlled by ADC is proposed.
本文介绍了一种可靠的跨点MLC ReRAM,并与350nm CMOS技术完全集成。在不同的顺应电流下,电阻的状态和变化被广泛研究。采用自终止方案,防止开关单元在设定操作时产生过大应力。由于自终止,禁止了写失败,并且遵从300ua的LRS上的均匀性提高了2.3倍。为了防止在设定操作中产生顺应电流偏移,提出了一种由ADC控制的潜行电流补偿方案。
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引用次数: 8
Technology Trends and Near-Future Applications of Embedded STT-MRAM 嵌入式STT-MRAM的技术趋势和近期应用
Pub Date : 2015-05-17 DOI: 10.1109/IMW.2015.7150308
S. Fujita, H. Noguchi, K. Ikegami, S. Takeda, K. Nomura, K. Abe
This paper presents fast and low-power embedded nonvolatile memory technologies and circuit designs based on perpendicular STT-MRAM. Future prospects of applications are also discussed.
本文介绍了基于垂直STT-MRAM的快速低功耗嵌入式非易失性存储器技术和电路设计。并对其应用前景进行了展望。
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引用次数: 10
Improved Lateral Coupling Cell for a Standard Logic Process eNVM Application 标准逻辑过程eNVM应用的改进横向耦合单元
Pub Date : 2015-05-17 DOI: 10.1109/IMW.2015.7150289
Kwang-il Choi, Nam-Yun Kim, Sung-Kun Park, I. Cho
In this paper, we describe a new single poly MTP (multiple time programmable) cell using contact plate and select gate coupling manufactured by 90 nm standard CMOS (complementary metal-oxide semiconductor) process. Proposed MTP cell size is smaller than conventional well coupled MTP cell and only select gate lateral coupling MTP cell in order to have the similar coupling ratio (CR) as the 1.98~3.26 μm2. The program erase operation use channel hot electron injection (CHEI) and band to band hot hole injection (BTBT-HHI). The cell performances are compared with splits group by coupling ratio (CR). Through the results represented by the experiments, we were able to achieve cell endurance of 100 cycle and 10 year retention lifetime at 150 °C, and realize operation margin with ease if coupling ratio is increased by adding plate contact. The describing cell using coupling of select gate and plate contact is thought to have more useful application due to technology shrink.
本文描述了一种采用90 nm标准CMOS(互补金属氧化物半导体)工艺,采用接触板和选择栅耦合制造的新型单聚MTP(多时间可编程)电池。本文提出的MTP电池尺寸比传统的井耦合MTP电池小,并且为了使耦合比(CR)保持在1.98~3.26 μm2之间,只选择栅极侧向耦合MTP电池。程序擦除操作采用通道热电子注入(CHEI)和带对带热孔注入(BTBT-HHI)。通过耦合比(CR)与分裂组比较电池性能。实验结果表明,在150℃条件下,电池续航时间可达100次,保留寿命可达10年,通过增加板接触增加耦合比,可轻松实现操作裕度。由于技术收缩,采用选择栅与极板接触耦合的描述单元具有更大的应用价值。
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引用次数: 0
Understanding NAND’s Intrinsic Characteristics Critical Role in Solid State Drive (SSD) Design 理解NAND的内在特性在固态硬盘(SSD)设计中的关键作用
Pub Date : 2015-05-17 DOI: 10.1109/IMW.2015.7150310
William E. Akin
The use of NAND flash-based SSDs in enterprises has grown at a ~33% compound annual growth rate [1] worldwide for the past three years. The majority of the growth comes from enterprise data center applications where the trend is to leverage the cost benefits of using MLC and TLC NAND flash memory by focusing on the use model behavior to optimize performance and life characteristics. In the data center, requirements for these MLC/TLC SSDs demand high sequential performance and reliability, moderate IOPS, and low power consumption along with maintaining 3 to 5 years of useful life. These challenges are tackled by tightening the links between the SSD's operation, host operating environment, and intrinsic NAND memory behavior and by exploiting increasingly sophisticated controllers, firmware, and flash memory error management techniques.
在过去的三年里,全球企业中基于NAND闪存的ssd的使用以33%的复合年增长率增长。大部分增长来自企业数据中心应用,其趋势是通过关注使用模型行为来优化性能和寿命特征,从而利用使用MLC和TLC NAND闪存的成本优势。在数据中心,对这些MLC/TLC ssd的要求是高顺序性能和可靠性、中等IOPS和低功耗,并保持3到5年的使用寿命。通过加强SSD操作、主机操作环境和内在NAND存储器行为之间的联系,以及利用日益复杂的控制器、固件和闪存错误管理技术,可以解决这些挑战。
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引用次数: 2
A Triple-Protection Structured COB FRAM with 1.2-V Operation and 1017-Cycle Endurance 一种具有1.2 v工作和1017循环寿命的三保护结构COB FRAM
Pub Date : 2015-05-17 DOI: 10.1109/IMW.2015.7150275
H. Saito, T. Sugimachi, Ko Nakamura, S. Ozawa, N. Sashida, S. Mihara, Y. Hikosaka, Wensheng Wang, Tomoyuki Hori, K. Takai, M. Nakazawa, N. Kosugi, M. Okuda, M. Hamada, S. Kawashima, T. Eshita, M. Matsumiya
We have developed a ferroelectric RAM (FRAM) with a low operation voltage of 1.2 V and a high switching endurance up to 1017 cycles. Our newly developed triple-protection structured cell array, has constructed without an additional mask step, effectively protects 0.4-μm2 ferroelectric capacitors from hydrogen and moisture degradation. We have designed our capacitor-over-bit-line (COB) structure to have a small cell size of 0.5 μm2.
我们开发了一种铁电RAM (FRAM),具有1.2 V的低工作电压和高达1017次循环的高开关续航时间。我们新开发的三重保护结构电池阵列,没有额外的掩膜步骤,有效地保护0.4 μm2铁电电容器免受氢和湿降解。我们已经设计了我们的电容-比特线(COB)结构,使其具有0.5 μm2的小电池尺寸。
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引用次数: 3
Dynamic Reference Sensing Scheme for Deeply Scaled STT-MRAM 深度缩放STT-MRAM的动态参考感知方案
Pub Date : 2015-05-17 DOI: 10.1109/IMW.2015.7150282
W. Kang, Tingting Pang, Youguang Zhang, D. Ravelosona, Weisheng Zhao
Spin transfer torque magnetic random access memory (STT-MRAM) has been considered as a potential candidate for the next-generation nonvolatile memory. However, as technology continuously scales down, the sensing margin (SM) of STT-MRAM is significantly degraded because of the increased process variations and reduced supply voltage. Meanwhile the critical switching current of magnetic tunnel junction (MTJ) also reduces with technology scaling. The sensing current, which should be limited to prevent read disturbance (RD) during read operations, further degrades the SM. Therefore, the readability becomes a new challenge for the deeply scaled STT-MRAM. To alleviate this problem, various sensing circuits and schemes have recently been proposed. However, it is rather difficult to achieve a good tradeoff among the sensing reliability, latency, power and hardware efficiency etc. This paper presents a dynamic reference cell (DRC) as well as a dynamic reference sensing (DRS) scheme to deal with this problem. Monte-Carlo statistical simulations have been performed to show the superiority of the proposed DRS scheme compared with conventional sensing schemes.
自旋传递转矩磁随机存取存储器(STT-MRAM)被认为是下一代非易失性存储器的潜在候选者。然而,随着技术的不断缩小,STT-MRAM的传感裕度(SM)由于工艺变化的增加和电源电压的降低而显着下降。同时,磁隧道结的临界开关电流(MTJ)也随着技术的缩放而减小。在读取操作过程中,应该限制传感电流以防止读取干扰(RD),这进一步降低了SM。因此,可读性成为深度规模化STT-MRAM面临的新挑战。为了缓解这个问题,最近提出了各种传感电路和方案。然而,在传感可靠性、延迟、功耗和硬件效率等方面取得良好的平衡是相当困难的。本文提出了一种动态参考单元(DRC)和动态参考感知(DRS)方案来解决这一问题。通过蒙特卡罗统计仿真,证明了所提出的DRS方案与传统传感方案相比的优越性。
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引用次数: 9
Optimization of Ru Based Hybrid Floating Gate for Planar NAND Flash 平面NAND闪存中Ru基混合浮栅的优化设计
Pub Date : 2015-05-17 DOI: 10.1109/IMW.2015.7150298
L. Breuil, J. Lisoni, P. Blomme, G. Van den bosch, J. van Houdt
The required transition from Control Gate wrap-around to planar structure for NAND flash scaling below 20nm node causes important loss of coupling factor. In order to recover the Programming window, we develop a Hybrid Floating Gate using Ru as high work-function metal. With a proper nitridation of the underlying Si and ALD technique, we obtain a continuous Ru layer as thin as 2nm that is thermally stable in contact with Si. Thanks to the higher work function of Ru, a programming window of more than 10V has been be achieved.
对于20nm以下节点的NAND闪存缩放,从控制门环绕到平面结构的过渡导致了重要的耦合因子损失。为了恢复编程窗口,我们开发了一种以Ru为高工作功能金属的混合浮栅。通过适当的氮化和ALD技术,我们获得了薄至2nm的连续Ru层,该层与Si接触时热稳定。由于Ru的功函数更高,实现了10V以上的编程窗口。
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引用次数: 2
Efficiently Realizing Weak Cell Aware DRAM Error Tolerance for Sub-20nm Technology Nodes 有效实现亚20nm节点弱单元感知DRAM容错
Pub Date : 2015-05-17 DOI: 10.1109/IMW.2015.7150283
Hao Wang, Kai Zhao, Tong Zhang
DRAM industry faces a grand challenge on continuing the scaling of storage node aspect ratio (A/R) to maintain the storage node storage capacitance. One viable option is to intentionally slow down the A/R scaling at the penalty of irreparable weak cells that cannot guarantee target data retention time under worst-case scenarios, and compensate the weak-cell-induced memory errors at the system level. Although the availability of weak cell location information can be leveraged to maximize the weak-cell-induced error tolerance, a straightforward realization of weak cell aware error tolerance tends to suffer from significant memory access latency overhead, especially in the presence of a large number of weak cells. This paper presents a design solution that can realize weak cell aware error tolerance at very small memory access latency overhead. The key is to use a hybrid error detection/correction process to eliminate unnecessary access to the weak cell location information. We carried out extensive simulations and evaluations to demonstrate the effectiveness of this design solution and the trade-offs. Beyond theoretical analysis on the latency overhead, we further performed full-system simulations based upon a cycle-accurate x86 simulator and DRAM simulation, and implemented our design solution using an FPGA development board with on-board DRAM chips. The results successfully show that our design solution can readily handle the weak-cell-induced memory error rate of upto 10-4 ~ 10-3 at very small (even negligible) latency overhead.
DRAM产业面临的一个巨大挑战是如何继续缩小存储节点宽高比(a /R)以保持存储节点的存储电容。一个可行的选择是故意降低A/R的扩展速度,但代价是不可修复的弱单元不能保证在最坏情况下的目标数据保留时间,并在系统级别补偿弱单元引起的内存错误。尽管可以利用弱单元位置信息的可用性来最大限度地提高弱单元诱导的容错能力,但直接实现弱单元感知的容错能力往往会遭受巨大的内存访问延迟开销,特别是在存在大量弱单元的情况下。本文提出了一种在很小的存储器访问延迟开销下实现弱单元感知容错的设计方案。关键是使用混合错误检测/纠正过程来消除对弱小区位置信息的不必要访问。我们进行了大量的模拟和评估,以证明该设计解决方案的有效性和权衡。除了对延迟开销进行理论分析之外,我们还进一步进行了基于周期精确的x86模拟器和DRAM仿真的全系统仿真,并使用带有板上DRAM芯片的FPGA开发板实现了我们的设计解决方案。结果成功地表明,我们的设计方案可以在非常小(甚至可以忽略不计)的延迟开销下轻松处理高达10-4 ~ 10-3的弱细胞诱导内存错误率。
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引用次数: 0
Novel Multi-Bit Non-Volatile SRAM Cells for Runtime Reconfigurable Computing 用于运行时可重构计算的新型多比特非易失SRAM单元
Pub Date : 2015-05-17 DOI: 10.1109/IMW.2015.7150297
Yanjun Ma
We discuss non-volatile SRAM cells capable of storing multiple bits and their applications as multi-context configuration memory. The cells are based on the standard 6T SRAM with multiple pairs of programmable resistors such as magnetic tunnel junction or resistive memory elements. In one of the cell designs the active state of the SRAM can be switched in one clock cycle by the use of an additional equalizer transistor, without the need to turn off the power to the cell, allowing real-time and low energy switching between different contexts in reconfigurable circuits. Other variations of the multistate non-volatile SRAM cells are also discussed.
我们讨论了能够存储多个比特的非易失性SRAM单元及其作为多上下文配置存储器的应用。该单元基于标准的6T SRAM,具有多对可编程电阻,如磁隧道结或电阻存储器元件。在其中一种单元设计中,SRAM的有源状态可以通过使用额外的均衡器晶体管在一个时钟周期内切换,而无需关闭单元的电源,从而允许在可重构电路中的不同环境之间进行实时和低能量切换。本文还讨论了多态非易失性SRAM单元的其他变体。
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引用次数: 1
Optimization of TiN/TaOx/HfO2/TiN RRAM Arrays for Improved Switching and Data Retention 优化TiN/TaOx/HfO2/TiN RRAM阵列以改善交换和数据保留
Pub Date : 2015-05-17 DOI: 10.1109/IMW.2015.7150300
Xueyao Huang, Huaqiang Wu, D. Sekar, S. Nguyen, Kun Wang, H. Qian
Recently, we demonstrated a TiN/TaOx/HfO2/TiN RRAM [1]. The Conductive Metal Oxide (TaOx) acted as an in-built current compliance layer and improved thermal efficiency too, leading to high-quality RRAM characteristics [1]. In this work, we report excellent resistance uniformity and endurance for these TiN/TaOx/HfO2/TiN RRAMs and present techniques to optimize switching and data retention. An oxygen anneal after HfO2 atomic layer deposition is shown to improve data retention quite significantly for 1kb arrays, while not having a deleterious effect on switching. Experiments on different HfO2 thicknesses indicate that an optimal thickness exists which gives a good tradeoff between FORM voltage and data retention.
最近,我们展示了一个TiN/TaOx/HfO2/TiN RRAM[1]。导电金属氧化物(TaOx)作为内置的电流顺应层,也提高了热效率,导致高质量的RRAM特性[1]。在这项工作中,我们报告了这些TiN/TaOx/HfO2/TiN rram具有优异的电阻均匀性和耐用性,并提出了优化开关和数据保留的技术。在HfO2原子层沉积后进行氧退火可以显著改善1kb阵列的数据保留,同时对开关没有有害影响。对不同HfO2厚度的实验表明,存在一个最优厚度,可以在FORM电压和数据保留之间取得很好的平衡。
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引用次数: 20
期刊
2015 IEEE International Memory Workshop (IMW)
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