International Journal of Machine Tools & Manufacture最新文献

{"title":"Towards a differentiated understanding of process damping and the introduction of process stiffening effects","authors":"Florian Wöste ,&nbsp;Timo Platt ,&nbsp;Jonas Baumann ,&nbsp;Dirk Biermann ,&nbsp;Petra Wiederkehr","doi":"10.1016/j.ijmachtools.2024.104233","DOIUrl":"10.1016/j.ijmachtools.2024.104233","url":null,"abstract":"<div><div>The effect of process damping is an effective means to favorably influence the stability of machining processes. Its occurrence depends on the dynamic contact between the flank face of the tool and the workpiece surface. To specifically investigate the fundamentals of process damping effects in the context of process stabilization, different configurations of modified cutting tools were prepared and applied for this contribution. These modifications consisted of tools with conventional and functionally structured flank face chamfers and were expected to cause distinctly different interaction characteristics. While the use of conventional flank face chamfers was expected to cause a rather significant share of elastic deformation of workpiece material, the application of surface structures was intended to provoke an increased degree of dissipative, i.e., process damping effects due to plastic deformation of workpiece material. By conducting orthogonal cutting experiments using a sensor-integrated analogy setup, milling tests as well as representative simulation approaches, the fundamental interrelations of the dynamic interaction between the workpiece surface and tools with both conventional and structured chamfers were characterized. It was observed that a conventional flank face chamfer in contact with the workpiece surface causes predominantly elastic deformations of the workpiece material due to a relatively large contact area, resulting in distributed, low local contact stresses below the yield stress. These elastic deformations led to a temporary stiffening effect on the dynamic system significantly affecting its dynamic behavior, e.g., in form of increased vibration frequencies. In contrast, surface structures led to an increased share of plastic deformation due to concentrated contact stresses at the structure tips and, thus, to dissipative, i.e., damping effects. Based on the experimental and simulation-based results presented as part of this contribution, which are consistent with observations made in previous studies, a differentiated consideration of process damping as one of five methods for process stabilization is discussed. In this context, the introduction of process stiffening in addition to process damping as a stabilizing process inherent contact phenomenon is proposed for future consideration.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"204 ","pages":"Article 104233"},"PeriodicalIF":14.0,"publicationDate":"2024-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142696897","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Revealing mechanisms of processing defect mitigation in laser powder bed fusion via shaped beams using high-speed X-ray imaging","authors":"Jiandong Yuan ,&nbsp;Qilin Guo ,&nbsp;Samuel J. Clark ,&nbsp;Luis I. Escano ,&nbsp;Ali Nabaa ,&nbsp;Minglei Qu ,&nbsp;Junye Huang ,&nbsp;Qingyuan Li ,&nbsp;Allen Jonathan Román ,&nbsp;Tim A. Osswald ,&nbsp;Kamel Fezzaa ,&nbsp;Lianyi Chen","doi":"10.1016/j.ijmachtools.2024.104232","DOIUrl":"10.1016/j.ijmachtools.2024.104232","url":null,"abstract":"<div><div>The laser powder bed fusion (LPBF) process utilizing a focused Gaussian-shaped beam faces challenges, including pore formation, melt pool fluctuation and liquid spattering. While beam shaping technology has been explored as a potential approach for defect mitigation, the beam-matter interaction dynamics during melting with shaped beams remain unclear. Here, we report the direct observation of ring-shaped beam-matter interaction dynamics, including pore formation, melt pool fluctuation and liquid spattering, and unveil defect mitigation mechanisms in ring-shaped beam laser powder bed fusion process. We find that, by spatially manipulating incident laser rays, the ring-shaped beam controls keyhole morphology, thereby managing the distribution of the reflected rays. This manipulation can effectively eliminate the formation of an unstable cavity at the keyhole tip, stabilizing the keyhole and mitigating keyhole pores. This enhanced keyhole stability effectively reduces the melt pool fluctuation, the formation of liquid breakup induced spatters and liquid droplet colliding induced large spatters in the laser powder bed fusion process. Additionally, the high-energy forefront of the ring-shaped beam effectively melts the powder bed, reducing agglomeration liquid spatter in the laser powder bed fusion process. The discovered defect mitigation mechanisms may guide the design of beam shaping strategies for simultaneously increasing the quality and productivity of metal additive manufacturing.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"204 ","pages":"Article 104232"},"PeriodicalIF":14.0,"publicationDate":"2024-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142705505","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Combining in situ synchrotron X-ray imaging and multiphysics simulation to reveal pore formation dynamics in laser welding of copper","authors":"T. Florian ,&nbsp;K. Schricker ,&nbsp;C. Zenz ,&nbsp;A. Otto ,&nbsp;L. Schmidt ,&nbsp;C. Diegel ,&nbsp;H. Friedmann ,&nbsp;M. Seibold ,&nbsp;P. Hellwig ,&nbsp;F. Fröhlich ,&nbsp;F. Nagel ,&nbsp;P. Kallage ,&nbsp;M. Buttazzoni ,&nbsp;A. Rack ,&nbsp;H. Requardt ,&nbsp;Y. Chen ,&nbsp;J.P. Bergmann","doi":"10.1016/j.ijmachtools.2024.104224","DOIUrl":"10.1016/j.ijmachtools.2024.104224","url":null,"abstract":"<div><div>Laser beam welding has emerged as a powerful tool for manufacturing copper components in electrical vehicles, electronic devices or energy storage, owing to its rapid processing capabilities. Nonetheless, the material’s high thermal conductivity and low absorption of infrared light can introduce process instabilities, resulting in defects such as pores. This study employs a hybrid approach that combines in situ synchrotron X-ray imaging with compressible multiphysics process simulation to elucidate pore-forming mechanisms during laser beam welding of copper. High-speed synchrotron X-ray imaging with an acquisition rate of 20,000 images/second facilitates the identification of relevant process regimes concerning pore formation during laser beam welding of copper with a wavelength of 1070 nm. Furthermore, in situ observations with high temporal and spatial resolution present a unique database for extensive validation of a multi-physics process simulation based on welding processes using different concentric intensity distributions. These validated simulation results enable thorough comprehension of process-related pore formation based on the interaction between keyhole, melt pool and resulting flow field. The findings show that pore formation is driven by four different mechanisms: bulging, spiking, upwelling waves at the keyhole rear wall and melt pool ejections. The synergy of high-speed synchrotron X-ray imaging and multi-physics modeling provides a fundamental understanding of the chronological sequence of events leading to process-related pore formation during laser beam welding of copper.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"204 ","pages":"Article 104224"},"PeriodicalIF":14.0,"publicationDate":"2024-10-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142663709","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A distinctive material removal mechanism in the diamond grinding of (0001)-oriented single crystal gallium nitride and its implications in substrate manufacturing of brittle materials","authors":"Yueqin Wu ,&nbsp;Qijian Rao ,&nbsp;Zhiyuan Qin ,&nbsp;Shuiping Tan ,&nbsp;Guoqin Huang ,&nbsp;Hui Huang ,&nbsp;Xipeng Xu ,&nbsp;Han Huang","doi":"10.1016/j.ijmachtools.2024.104222","DOIUrl":"10.1016/j.ijmachtools.2024.104222","url":null,"abstract":"<div><div>Single crystal gallium nitride (GaN) substrates are highly demanded for fabricating advanced optoelectronic devices. It is thus essential to develop high efficiency machining technologies for this difficult-to-machine material, which in turn necessitates a thorough understanding of its deformation mechanism. In this study, the deformation and removal characteristics of (0001)-oriented single crystal GaN involved in diamond grinding were systematically investigated. The material removal exhibited a brittle mode when using relatively coarse diamond abrasives of 2000 in mesh size, while ductile removal was achieved when diamond abrasives of 6000 in mesh size were utilized. A novel peeling phenomenon was observed along (0001) lattice plane (c-plane) in the coarse grinding, as the crystal has a hexagonal crystal structure with c-planes serving as the preferable slip/cracking planes. Peeling observed in material removal agrees well with the findings that lateral planar defects were prone to initiate in nanoscratching in comparison to nanoindentation in the ductile regime, indicating that the effect of tangential grinding force is significant. The application of Molecular dynamics (MD) simulations, employing smaller indentation/scratching models, provided additional confirmation of the crucial role played by lateral force in initiating planar defects on c-planes. Furthermore, larger-scale MD scratching models substantiated the occurrence of peeling in the deformation process on c-plane, a finding corroborated by scratching experiments conducted in the brittle regime. Conversely, such peeling is absent on m- and a-planes. Complementary to the simulations, specifically designed grinding experiments were conducted to empirically demonstrate that peeling phenomena were intensified with elevated rotational wheel speeds. This enhancement was attributed to the increased tangential grinding force associated with higher speeds. These findings contribute to a comprehensive understanding of the intricate relationship between rotational wheel speed, tangential grinding force, and the observed peeling mechanisms in the context of single crystal GaN machining.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"203 ","pages":"Article 104222"},"PeriodicalIF":14.0,"publicationDate":"2024-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142552965","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Strengthening flat-die friction self-pierce riveting joints via manipulating stir zone geometry by tailored rivet structures","authors":"Bowen Zhang ,&nbsp;Yunwu Ma ,&nbsp;Feilong Yu ,&nbsp;Yunpeng Liu ,&nbsp;Entao Zhou ,&nbsp;Zhilei Fan ,&nbsp;Ende Ge ,&nbsp;Yongbing Li ,&nbsp;Zhongqin Lin","doi":"10.1016/j.ijmachtools.2024.104223","DOIUrl":"10.1016/j.ijmachtools.2024.104223","url":null,"abstract":"<div><div>Achieving high-strength joints with flat surfaces is of significant importance for reducing wind resistance and enhancing aesthetic appeal. In this study, a novel flat-die friction self-piercing riveting (flat-die F-SPR) process is proposed. The rivet flaring without die guidance was achieved through the sophisticated design of rivet structures. Three types of rivets with different internal structures were designed to manipulate the material flow and microstructure evolution during the joining process. Based on the method of emergency stop, the load-stroke curves, evolutions of macroscopic morphology, and microstructure of the joints made with different rivets were investigated. A novel mechanism for solid-state bonding of joints was proposed to elucidate the generation and evolution of fine grain regions. The results indicate when downward pressure is applied to the material inside the rivet cavity, a central stirring zone appears. By using a rivet with an annular boss structure, the base material flows continuously into the stirring zone and piled up in the rivet cavity, forming a unique conical-shaped fine grain zone. Finally, a comprehensive assessment of the strength of different types of joints and the transition of the fracture modes were conducted based on different lower sheet thicknesses. The joints of Rivet_B and Rivet_C demonstrate 11.1 % and 6.9 % strength enhancement compared with the joint of Rivet_A, respectively. Two strategies for enhancing the strength of solid-state bonding are proposed, which offers insights for the optimizations of rivet structures.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"203 ","pages":"Article 104223"},"PeriodicalIF":14.0,"publicationDate":"2024-10-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142552964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A novel method of induction electrode through-mask electrochemical micromachining","authors":"Xiaochen Yang ,&nbsp;Liqun Du ,&nbsp;Aoqi Li ,&nbsp;Mengxi Wu ,&nbsp;Changhao Wu ,&nbsp;Jingmin Li","doi":"10.1016/j.ijmachtools.2024.104221","DOIUrl":"10.1016/j.ijmachtools.2024.104221","url":null,"abstract":"<div><div>Through-mask electrochemical micromachining (TMEMM) is a key method for fabricating metal microstructures. However, the accuracy of TMEMM often falls short of the stringent requirements for many applications, primarily due to the uncontrolled electric field during the machining process. To overcome this limitation, this paper introduces a novel method: induction electrode through-mask electrochemical micromachining (IETMEMM). In this method, two feeder electrodes act as the anode and cathode, generating an electric field where the wireless workpiece is placed. This study explores the principles of electric field control in IETMEMM and develops a simulation model to highlight the method's unique advantages under specific electric field distributions. The findings indicate substantial improvements. Leveraging the self-stopping feature, a MEMS inertial switch was fabricated with high accuracy, achieving a non-uniformity of just 3.8%—a remarkable 96.2 % enhancement in accuracy compared to traditional TMEMM. Additionally, the gradient etching advantage facilitated the creation of both gradient-depth and V-shaped microchannel arrays. Moreover, the parallel machining advantage enabled the simultaneous fabrication of three identical microstructures in just 20 s. These outcomes demonstrate the significant potential of IETMEMM for industrial applications.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"203 ","pages":"Article 104221"},"PeriodicalIF":14.0,"publicationDate":"2024-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142438046","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation on the material removal mechanism in ion implantation-assisted elliptical vibration cutting of hard and brittle material","authors":"Jinyang Ke ,&nbsp;Jianguo Zhang ,&nbsp;Xiao Chen ,&nbsp;Changlin Liu ,&nbsp;Gui Long ,&nbsp;Hao Sun ,&nbsp;Jianfeng Xu","doi":"10.1016/j.ijmachtools.2024.104220","DOIUrl":"10.1016/j.ijmachtools.2024.104220","url":null,"abstract":"<div><div>Ductile-regime machining has been used to generate damage-free surface of hard and brittle materials by setting the cutting depth to be smaller than the ductile-brittle transition depth (DBTD). However, the ductile-regime cutting of sapphire remains challenging owing to its extreme hardness, small DBTD, serious surface fractures, and severe tool wear. To solve this problem, ion implantation-assisted elliptical vibration cutting (Ii-EVC) has been proposed in this study to enhance the machinability of hard and brittle materials. Taking sapphire as an example, high-energy phosphorus ions were implanted into the workpiece to modify its surface. Nanoindentation tests revealed that the modified materials undergo plastic and elastic deformation more easily due to the decrease in hardness and modulus. Compared with nanocutting without implantation assistance, the DBTD of implanted sapphire has been increased by more than five times. The advantageous effects of Ii-EVC achieve great enhancement in machinability, including surface fractures suppression, tool-wear reduction, chips morphology transformation from discontinuous to continuous, and cutting force decrease. Furthermore, even near the cracks in the brittle region after Ii-EVC, the subsurface microstructure showed a more complete lattice arrangement and a strain distribution close to zero, indicating that crack propagation was effectively suppressed. Due to the promoted localized plastic deformation, the stress distribution in the implanted material is much smaller than that in pristine workpiece. Implantation-induced defects not only serve as a core for absorbing external energy from the high-frequency vibration and improving the in-grain deformation but also facilitate the formation of shear bands. The interface with high distortion between the modified layer and substrate can effectively dissipate strain energy and hinder crack propagation to the free surface. The turning experiments verified that Ii-EVC can achieve better surface quality, less tool wear and higher optical transmittance. Overall, Ii-EVC addresses the challenges of tool breakage and surface fracture caused by high-frequency collision between tool and workpiece in traditional EVC, overcomes the problem of limited modification depth in ion implantation, and increases the ductile-regime removal depth of extremely hard and brittle materials to several microns. Such findings demonstrate that Ii-EVC is a promising method for the ultra-precision manufacturing of advanced materials.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"203 ","pages":"Article 104220"},"PeriodicalIF":14.0,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142432126","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Cutting mechanism of reaction-bonded silicon carbide in laser-assisted ultra-precision machining","authors":"Changlin Liu ,&nbsp;Jinyang Ke ,&nbsp;Tengfei Yin ,&nbsp;Wai Sze Yip ,&nbsp;Jianguo Zhang ,&nbsp;Suet To ,&nbsp;Jianfeng Xu","doi":"10.1016/j.ijmachtools.2024.104219","DOIUrl":"10.1016/j.ijmachtools.2024.104219","url":null,"abstract":"<div><div>Reaction-bonded silicon carbide (RB-SiC) is an important material used in aerospace optical systems. Due to the property mismatch between Si and SiC phases, the underlying cutting mechanism in ultra-precision machining of RB-SiC remains relatively unclear. Recently, laser-assisted machining (LAM) has emerged as an effective technique to improve the machinability of hard and brittle materials, which brings the question that how the high temperature affects the machining mechanism of RB-SiC. To elucidate these aspects, a series of grooving experiments and MD simulations were conducted in this study. The interaction mechanism between phases on material removal and subsurface damage was revealed and the effect of cutting temperature on Si-SiC interaction was explored. The results indicate that in conventional ultra-precision machining, SiC grains could affect the deformation of Si phase, whereas the influence of Si phase on SiC deformation is limited. As the cutting temperature increases, the Si-SiC interaction is less apparent and the deformation of Si and SiC becomes more independent. Meanwhile, the prominence of phase property mismatch on subsurface damage are reduced while the extension of disordered phases into boundaries merges as an important mechanism in subsurface damage formation. This research helps to understand the thermal effect on material interaction between phases during machining and aid to improve the performance of LAM on RB-SiC.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"203 ","pages":"Article 104219"},"PeriodicalIF":14.0,"publicationDate":"2024-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142432258","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Leveraging artificial intelligence for real-time indirect tool condition monitoring: From theoretical and technological progress to industrial applications","authors":"Delin Liu ,&nbsp;Zhanqiang Liu ,&nbsp;Bing Wang ,&nbsp;Qinghua Song ,&nbsp;Hongxin Wang ,&nbsp;Lizeng Zhang","doi":"10.1016/j.ijmachtools.2024.104209","DOIUrl":"10.1016/j.ijmachtools.2024.104209","url":null,"abstract":"<div><p>Tool condition monitoring (TCM) during mechanical cutting is critical for maximising the utilisation of cutting tools and minimising the risk of equipment damage and personnel injury. The demand for highly efficient and sustainable machining in modern industries has led to the development of new processes operating under specific conditions. Real-world datasets obtained under harsh cutting conditions often suffer from intense interference, making the anti-interference capabilities of TCM methods crucial for effective industrial applications. Previous literature reviews on TCM have focused on theoretical methods for monitoring tool wear and breakage. However, reviews of the scientific methodologies and technologies employed in TCM for industrial production are limited. The lack of scientific understanding relevant to the monitoring of cutting tools in industrial production should be addressed urgently. The current data processing, feature dimensionality reduction, and decision-making methods utilised in TCM may not adequately fulfil the real-time and anti-interference demands. The TCM methods also face the challenges of small sample sizes and imbalanced data during real-world dataset processing. Therefore, this study conducts a systematic review of TCM methods to overcome these limitations. First, the theoretical guidelines for the application of TCM methods in industrial production are provided. The sensing system, signal processing, feature dimensionality reduction, and decision-making methods for TCM methods are comprehensively discussed in terms of both their advantages and limitations for applications in industrial production. Considering the effects of real-world datasets with small samples and imbalanced data caused by the harsh environment of a real factory, a systematic presentation is proposed at the data, feature, and decision levels. Finally, the challenges and potential research directions of TCM methods for industrial applications are discussed. A research route for smart factory-oriented machining system management is proposed based on published literature. This review bridges the gap between theoretical research and the industrial application of TCM techniques in industrial production. Prospective research and further development of TCM systems will provide the groundwork for establishing smart factories.</p></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"202 ","pages":"Article 104209"},"PeriodicalIF":14.0,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142173875","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Optimal milling cutter helix selection for period doubling chatter suppression","authors":"M. Sanz-Calle ,&nbsp;A. Iglesias ,&nbsp;L.N. López de Lacalle ,&nbsp;Z. Dombovari ,&nbsp;J. Munoa","doi":"10.1016/j.ijmachtools.2024.104211","DOIUrl":"10.1016/j.ijmachtools.2024.104211","url":null,"abstract":"<div><p>In high speed milling, interrupted cutting conditions can lead to period doubling chatter vibrations. While many studies have already confirmed that the use of helical tools can effectively shrink or remove these regions of unstable cutting, none of them has provided clear guidance to select the minimum helix that completely cancels the period doubling lobes. This study addresses this gap by introducing a novel analytical formula for a critical tool helix pitch: if the helix pitch is below the critical flip depth of cut of the straight helix cutter multiplied by <span><math><mi>π</mi></math></span>, the flip lobes will totally vanish. This rule is not only valuable for chatter-free process planning purposes, but it also establishes exact limit below which the fast and simple zeroth order stability algorithm can provide exact stability boundaries for helical tools. The effectiveness of the formula is numerically corroborated over three different milling scenarios: thin wall milling, slender tool and machine tool structure chatter cases. Finally, the findings are validated through experimental cutting tests.</p></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"202 ","pages":"Article 104211"},"PeriodicalIF":14.0,"publicationDate":"2024-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S089069552400097X/pdfft?md5=ceae5b4ea8c38d066d97e82e41a17883&pid=1-s2.0-S089069552400097X-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142230354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}