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Quantitative study of oxidation mechanism in photoelectrochemical mechanical polishing of difficult-to-process semiconductor wafers 难加工半导体晶圆光电机械抛光氧化机理的定量研究
IF 14 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Pub Date : 2025-06-27 DOI: 10.1016/j.ijmachtools.2025.104307
Yuewen Sun , Shang Gao , Bi Zhang , Yang Zhao , Xiaoguang Guo , Renke Kang , Zhigang Dong
The excellent properties of gallium nitride (GaN), silicon carbide (SiC), and diamond make them the most promising semiconductor materials for the future. However, their extremely stable chemical properties and high hardness lead to a low efficiency in chemical mechanical polishing (CMP). Photoelectrochemical mechanical polishing (PECMP) is an efficient and high-quality machining method for difficult-to-process semiconductor materials, integrating photo, electric, chemical, and mechanical fields. However, the coupling of these fields creates complex mechanisms, making it difficult to quantitatively describe the oxidation mechanism driven by the electric field. As a result, selecting the appropriate applied voltage for specific polishing requirements is challenging. To address this, a detailed analysis of the transfer of electrons and holes at the wafer/solution interface was conducted, and an innovative relationship between variations in the energy field and the wafer surface potential in PECMP was established. For the first time, the Poisson equation was applied to the wafer/solution interface, and a novel theoretical model for the oxidation rate and applied voltage on the wafer surface in PECMP was developed. Specifically, at the voltage threshold, the surface charge type changes from electrons to holes, resulting in a significant increase in hole density. Finally, the model was validated through surface modification and PECMP tests. This research not only presents an innovative theoretical method for determining the applied voltage in photoelectric field-assisted polishing for any semiconductor material but also offers new insights into how surface charge transitions between electrons and holes under varying applied voltages can significantly influence polishing efficiency in photoelectric field-assisted polishing.
氮化镓(GaN)、碳化硅(SiC)和金刚石的优异性能使它们成为未来最有前途的半导体材料。然而,由于其化学性质非常稳定,硬度高,导致化学机械抛光效率低。光电化学机械抛光(PECMP)是一种集光、电、化学、机械等多个领域于一体的高效、高质量的难加工半导体材料加工方法。然而,这些场的耦合产生了复杂的机制,使得难以定量描述电场驱动的氧化机制。因此,为特定的抛光要求选择合适的施加电压是具有挑战性的。为了解决这个问题,我们对晶圆/溶液界面上的电子和空穴转移进行了详细的分析,并在PECMP中建立了能量场变化与晶圆表面电位之间的创新关系。首次将泊松方程应用于晶圆/溶液界面,建立了PECMP中晶圆表面氧化速率和外加电压的理论模型。具体来说,在电压阈值处,表面电荷类型由电子变为空穴,导致空穴密度显著增加。最后,通过表面改性和PECMP试验对模型进行了验证。该研究不仅为确定任何半导体材料的光电场辅助抛光中的施加电压提供了一种创新的理论方法,而且为在不同的施加电压下电子和空穴之间的表面电荷跃迁如何显著影响光电场辅助抛光中的抛光效率提供了新的见解。
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引用次数: 0
Novel multi-axis differential velocity sideways extrusion process for 3D curved profiles: Feasibility and forming mechanisms studies 三维弯曲型材的新型多轴差速侧向挤压工艺:可行性及成形机理研究
IF 14 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Pub Date : 2025-06-12 DOI: 10.1016/j.ijmachtools.2025.104306
Yutong Sun , Junquan Yu , Guoqun Zhao , Xiqing Ge
3D curved profiles or extrudates are widely used in industry; however, their flexible manufacturing with very few processing steps remains a great challenge. In this study, a novel extrusion-bending integrated process, termed multi-axis differential velocity sideways extrusion (MX-DVSE), was developed to form controlled 3D curved extrudates within a single operation, and its forming mechanics was clarified by experiments and finite element modelling. The MX-DVSE equipment was set up, and a set of dies was designed to perform a series of experiments in which two pairs of opposing punches were moved at different velocities. During the MX-DVSE process, the superposition of the velocity gradients generated by the four extrusion velocities induces the bending deformation of the extrudates with a controllable bending radius and deflection angle. The bending radius is determined by velocity gradient, velocity gradient ratio, and extrusion ratio. The bending radius decreased with an increase in the deviation of the velocity gradients from 1, reduction in the velocity gradient ratio, and increase in the extrusion ratio. The velocity gradient and velocity gradient ratio can be unified into a proposed indicator, termed the bending radius control factor, which exhibits a monotonic relationship with the bending radius. The deflection angle depends on the extrusion velocity and the velocity gradient. The bending plane of the extrudate was close to the direction of the velocity gradient, which deviated from 1 or the direction of the maximum velocity. This is reflected in another proposed indicator: the deflection angle control factor. The feasibility of the MX-DVSE technique was further verified by considering the specific shape and size of 3D curved extrudates as the forming targets. The experimental results show that MX-DVSE can form 3D curved extrudates with acceptable dimensional accuracy, and the proposed control factors for the bending radius and deflection angle can accurately control the shape of the 3D curved extrudates. Moreover, compared to forward extrusion, MX-DVSE was more effective in refining grains and enhancing the strength and ductility of extrudates with the same extrusion parameters. This study demonstrates that MX-DVSE has great potential for the development and application of flexible manufacturing of 3D curved extrudates.
三维曲面型材或挤出物在工业中应用广泛;然而,它们的柔性制造和很少的加工步骤仍然是一个巨大的挑战。在这项研究中,开发了一种新的挤压弯曲集成工艺,称为多轴差速侧向挤压(MX-DVSE),可以在一次操作中形成受控的3D弯曲挤出物,并通过实验和有限元建模阐明了其成形机理。建立了MX-DVSE设备,设计了一套模具,进行了一系列实验,其中两对相反的冲头以不同的速度移动。在MX-DVSE过程中,四种挤出速度产生的速度梯度叠加,使挤出物发生弯曲变形,弯曲半径和偏转角可控。弯曲半径由速度梯度、速度梯度比和挤压比决定。弯曲半径随速度梯度与1的偏差增大、速度梯度比减小、挤压比增大而减小。速度梯度和速度梯度比可以统一为一个指标,称为弯曲半径控制因子,它与弯曲半径呈单调关系。偏转角度取决于挤压速度和速度梯度。挤出物弯曲面接近速度梯度方向,偏离最大速度方向1。这反映在另一个拟议的指标:偏转角控制系数。以三维弯曲挤出物的特定形状和尺寸为成形目标,进一步验证了MX-DVSE技术的可行性。实验结果表明,MX-DVSE能够以可接受的尺寸精度形成三维弯曲挤出物,所提出的弯曲半径和挠度控制因子能够精确控制三维弯曲挤出物的形状。此外,与正挤压相比,在相同挤压参数下,MX-DVSE能更有效地细化晶粒,提高挤压物的强度和塑性。该研究表明,MX-DVSE在三维弯曲挤出物的柔性制造中具有很大的开发和应用潜力。
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引用次数: 0
A review of robust thermal error reduction of machine tools 机床热误差鲁棒减小研究进展
IF 14 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Pub Date : 2025-06-01 DOI: 10.1016/j.ijmachtools.2025.104298
Lingtao Weng , Toru Kizaki , Chi Ma , Weiguo Gao , Daisuke Kono
Thermal error reduction in machine tools has attracted increasing attention owing to its influence on the accuracy, productivity, and energy efficiency of machining processes. In several traditional studies, the thermal error has been modeled as a straightforward relationship between the heat input and the output machining error. However, the demand for thermal error reduction in complex practical conditions with the interactive variation of influencing factors has been increasing because energy saving and a predictive countermeasure for defects, even in transient conditions, are expected. Robust reduction in the thermal error under such complex conditions remains a challenging issue. This paper reviews the strategy and methodology for realizing robust thermal error reduction considering the variation in influencing factors. A comprehensive model of thermal error that considers the interaction of thermal and mechanical systems is described to provide an overview of the targeted topic. Specific methodologies published over the last 15 years, such as adaptive modeling and compensation, machine design optimization, and temperature control, are reviewed. We focus on the evolution of data-driven models and digital twin systems for thermal error compensation by describing their implementation frameworks. An open question regarding strategy selection for thermal error compensation considering uncertainty is discussed. This review reveals the current research gap and provides an outlook for future challenges in realizing real-time and adaptive thermal error compensation.
机床热误差的减小由于其对加工过程的精度、生产率和能源效率的影响而受到越来越多的关注。在一些传统的研究中,热误差被建模为热输入和输出加工误差之间的直接关系。然而,在影响因素相互作用变化的复杂实际条件下,由于期望节能和对缺陷的预测对策,即使在瞬态条件下,对热误差减小的需求也在增加。在如此复杂的条件下,如何有效地减小热误差仍然是一个具有挑战性的问题。本文综述了考虑影响因素变化而实现鲁棒热误差减小的策略和方法。考虑到热和机械系统的相互作用的热误差的综合模型被描述为提供目标主题的概述。回顾了过去15年来发表的具体方法,如自适应建模和补偿,机器设计优化和温度控制。我们通过描述其实现框架,重点关注热误差补偿的数据驱动模型和数字孪生系统的发展。讨论了考虑不确定性的热误差补偿策略选择问题。本文综述了目前的研究差距,并对实现实时和自适应热误差补偿的未来挑战进行了展望。
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引用次数: 0
A high efficiency pre-dissolution electrochemical polishing method for improving surface uniformity in additively manufactured alloys 一种提高增材制造合金表面均匀性的高效预溶电化学抛光方法
IF 14 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Pub Date : 2025-05-24 DOI: 10.1016/j.ijmachtools.2025.104297
Jierui Mu , Qiang Lu , Zijue Tang , Yi Wu , Haowei Wang , Hongze Wang
Electrochemical polishing (ECP) offers significant advantages in reducing surface roughness of complex additively manufactured (AMed) components. However, conventional one-step ECP methods hinder further removal of near-surface defects, such as inherent adhesive powders and step effects, owing to the simultaneous dissolution and smoothing processes. Additionally, the topological conformity between the formed high-resistance oxide layer and the metal matrix limits the polishing effectiveness, producing undesirable surface inconsistency and poor dimensional accuracy. In this study, we introduce a pre-dissolution step prior to the conventional ECP process, namely pre-dissolution ECP. This approach is based on the electrochemical dissolution behavior of adhesive powders and the melt pool (MP) structure to transform the irregular, rough as-built surface into a pre-dissolved MP morphology with a uniform current density distribution, aiming to optimize the subsequent ECP process. By combining in situ X-ray synchrotron radiation observation with comparative quantitative analysis of samples before and after mechanical polishing, precise dissolution parameters were determined to achieve a polished surface with uniformly distributed height differences. For AMed Al alloys with high Si content, when the percentage change rate of dissolved areas of the cross-sectional profile in the pre-dissolution step is 0.060 ± 0.003 %/min, different adhesive powder regions exhibit consistent height differences on the pre-dissolved surface. During the subsequent polishing step, compared to direct ECP (∼5.3 μm), the isotropic etching-based smoothing effect in NaOH solution further reduces surface roughness of the pre-dissolved surface to ∼1.5 μm, and the corresponding standard deviation of height difference is reduced by 80.7 %. Moreover, the use of low voltage and the one-time removal of surface cluster layers ensures improved roundness tolerance (85.7 %) and capillary action (304.4 %) for AMed heat pipes with internal channels (Φ1.4 mm) after polishing. This pre-dissolution strategy mitigates the complexity and randomness of as-built surface features, facilitating better ECP performance. It can also be integrated with advanced ECP technologies, thereby expanding the application potential of AMed structures, including but not limited to internal channels.
电化学抛光(ECP)在降低复杂增材制造(AMed)部件的表面粗糙度方面具有显著的优势。然而,传统的一步ECP方法阻碍了进一步去除近表面缺陷,如固有的粘合剂粉末和台阶效应,由于同时溶解和平滑过程。此外,形成的高阻氧化层与金属基体之间的拓扑一致性限制了抛光效果,产生不良的表面不一致和尺寸精度差。在本研究中,我们在常规ECP工艺之前引入了一个预溶步骤,即预溶ECP。该方法基于粘接粉末的电化学溶解行为和熔池(MP)结构,将不规则、粗糙的建成表面转化为电流密度分布均匀的预溶解MP形态,旨在优化后续的ECP工艺。通过现场x射线同步辐射观测与机械抛光前后样品的对比定量分析相结合,确定了精确的溶解参数,获得了高度差分布均匀的抛光表面。对于高Si含量的AMed铝合金,当预溶步骤中截面轮廓溶解区域百分比变化率为0.060±0.003% /min时,不同的粘接粉末区域在预溶表面呈现一致的高度差异。在随后的抛光步骤中,与直接ECP (~ 5.3 μm)相比,NaOH溶液中基于各向同性蚀刻的平滑效应进一步将预溶表面的表面粗糙度降低到~ 1.5 μm,相应的高度差标准差降低了80.7%。此外,使用低电压和一次性去除表面簇层可确保抛光后具有内部通道(Φ1.4 mm)的AMed热管的圆度公差(85.7%)和毛细作用(304.4%)得到改善。这种预溶解策略减轻了建成表面特征的复杂性和随机性,促进了更好的ECP性能。它还可以与先进的ECP技术集成,从而扩大AMed结构的应用潜力,包括但不限于内部通道。
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引用次数: 0
A novel computational approach using receptance coupling substructure analysis for prediction of tool tip dynamics in industrial machining applications 基于接受耦合子结构分析的新型计算方法在工业加工中的应用
IF 14 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Pub Date : 2025-05-23 DOI: 10.1016/j.ijmachtools.2025.104296
Jesus David Chaux, Patxi X. Aristimuño Osoro, Pedro J. Arrazola
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引用次数: 0
Inducing electrochemical discharges on insulating surfaces for damage-free electrochemical jet machining of glass 在绝缘表面诱导电化学放电,用于玻璃的无损伤电化学喷射加工
IF 14 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Pub Date : 2025-05-20 DOI: 10.1016/j.ijmachtools.2025.104293
Genglin Zhu , Hexin Li , Wenjun Lu , Sanjun Liu , Weidong Liu , Yonghua Zhao
A key limitation of electrochemical jet machining (EJM) is its inability to process insulating materials. While electrochemical discharge machining (ECDM) can handle such materials, its contact-based nature often causes thermal damage. Additionally, the challenge of initiating electrochemical discharges on the insulating workpiece, rather than on the tool electrode, remains unresolved. This study presents a new mechanism for directly inducing electrochemical discharges on insulating surfaces through the controlled interplay of electro- and hydrodynamic fields. For the first time, we demonstrate damage-free machining of insulating materials using an electrolyte jet, in a new process termed jet-electrochemical discharge machining (Jet-ECDM). This is achieved by generating electrochemical discharges at the jet-impingement zone on the insulating workpiece surface, with the gas evolved at the nozzle electrode acting as a dielectric. The spatiotemporal dynamics of discharges, including location, frequency, and intensity, are analyzed and shown to critically influence machining results. High-speed imaging visualizes the gas bubble behaviors, while simulation reveals how discharges are focused onto a localized machining area through concentrated electric fields and gas distribution. Key process parameters, including voltage, working gap, and electrolyte flow rate, are identified for effective process control. Thermocouple measurements show a discharge-induced average temperature rise of ∼160 °C at the machining site. Unlike conventional ECDM, Jet-ECDM's non-contact approach avoids thermal damage, enabling stress-free, purely chemical material removal. This is validated by machining microfeatures in quartz glass, achieving superior surface finishes (∼Ra 50 nm) and a damage-free subsurface. This research extends the material applicability of EJM to insulating materials and introduces a novel method for stress-free machining of glass and ceramics using electrochemical discharges.
电化学喷射加工(EJM)的一个关键限制是它不能加工绝缘材料。虽然电化学放电加工(ECDM)可以处理这类材料,但其基于接触的性质往往会导致热损伤。此外,在绝缘工件上启动电化学放电的挑战,而不是在工具电极上,仍然没有解决。本研究提出了一种通过控制电场和水动力场的相互作用在绝缘表面上直接诱导电化学放电的新机制。我们首次展示了使用电解液射流对绝缘材料进行无损伤加工,这是一种称为射流-电化学放电加工(jet- ecdm)的新工艺。这是通过在绝缘工件表面的射流撞击区产生电化学放电来实现的,在喷嘴电极处产生的气体充当电介质。分析了放电的时空动态,包括位置、频率和强度,并表明放电对加工结果有重要影响。高速成像可视化气泡的行为,而模拟揭示了放电如何通过集中的电场和气体分布集中在局部加工区域。确定关键工艺参数,包括电压、工作间隙和电解质流速,以进行有效的过程控制。热电偶测量显示,在加工现场,放电引起的平均温升为~ 160°C。与传统ECDM不同,Jet-ECDM的非接触式方法避免了热损伤,实现了无应力、纯化学材料的去除。通过加工石英玻璃的微特征,实现了卓越的表面光洁度(~ Ra 50 nm)和无损伤的亚表面,验证了这一点。本研究将EJM的材料适用性扩展到绝缘材料,并介绍了一种利用电化学放电无应力加工玻璃和陶瓷的新方法。
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引用次数: 0
Ultrafast phase transformation and strengthening mechanisms in alloys induced by femtosecond laser shock: a novel strategy for intermetallic control 飞秒激光冲击诱导合金的超快相变和强化机制:一种新的金属间控制策略
IF 14 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Pub Date : 2025-05-17 DOI: 10.1016/j.ijmachtools.2025.104292
Zhiyuan Liu , Wenmin Tang , Feng Pan , Xueran Deng , Fei Fan , Jingjing Yang , Cheng Lei , Sheng Liu , Qiao Xu , Du Wang
This study proposes a novel alloy-strengthening strategy enabled by femtosecond laser shock peening (FLSP), which utilizes ultrahigh peak shock pressures exceeding the intrinsic bond rupture strength of metallic bonds to achieve atomic-level microstructural modification. In contrast to conventional nanosecond laser shock peening (NLSP), FLSP induces a distinct strengthening mechanism through the dynamic fragmentation of intermetallic phases and the controllable precipitation of nanoscale strengthening phases. Through integrating a synergistic experimental investigation with molecular dynamics (MD) simulation, we establish a generalized pressure–dependent phase transformation framework, identifying critical thresholds of shock pressure required to initiate atomic bond rupture and subsequent phase evolution. This framework enables precise tuning of energy input to promote the formation of nanoscale strengthening phases while suppressing undesirable microscale precipitates. Compared to NLSP, FLSP demonstrates superior efficacy in microstructure refinement capabilities, enabling synergistic strengthening through grain refinement, dislocation multiplication, and pressure-mediated phase transformation. Notably, the discovered pressure–sensitive phase evolution behavior provides a transferable paradigm for microstructural design and performance optimization across a wide range of metallic systems. This work advances the fundamental understanding of laser–matter interactions under extreme conditions and offers a physics-informed pathway for the design of high-performance structural materials through targeted laser parameter engineering.
本研究提出了一种新型的飞秒激光冲击强化(FLSP)合金强化策略,该策略利用超过金属键固有键断裂强度的超高峰值冲击压力来实现原子级微结构改性。与传统的纳秒激光冲击强化(NLSP)相比,FLSP通过金属间相的动态破碎和纳米级强化相的可控析出诱导出独特的强化机制。通过将协同实验研究与分子动力学(MD)模拟相结合,我们建立了一个广义的压力相关相变框架,确定了启动原子键断裂和随后的相演化所需的冲击压力的临界阈值。该框架能够精确调整能量输入,以促进纳米级强化相的形成,同时抑制不需要的微尺度沉淀。与NLSP相比,FLSP在微观组织细化能力方面表现出更高的效率,可以通过晶粒细化、位错倍增和压力介导的相变实现协同强化。值得注意的是,所发现的压敏相演化行为为广泛的金属体系的微结构设计和性能优化提供了可转移的范例。这项工作促进了对极端条件下激光与物质相互作用的基本理解,并通过定向激光参数工程为高性能结构材料的设计提供了一条物理信息途径。
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引用次数: 0
Suppression of hot cracking in Ni-based single-crystal superalloys fabricated by laser directed energy deposition through thermal cycle regulation 热循环调控抑制激光定向能沉积镍基单晶高温合金热裂
IF 14 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Pub Date : 2025-05-01 DOI: 10.1016/j.ijmachtools.2025.104283
Yan Zeng, Boyuan Guan, Tianyu Yuan, Huitao Chen, Lei Li
The fabrication of Ni-based single-crystal (SX) superalloys through laser directed energy deposition (L-DED) is hindered by the high susceptibility of SX structures to hot cracking. Therefore, achieving crack-free SX superalloys during L-DED is crucial for advancing the application of this technology in SX turbine blade repair. Based on solidification shrinkage and solid-bridging theory, this study systematically investigated the formation mechanisms of hot cracks in a multi-pass multi-layer DD6 SX prepared by L-DED through microstructure characterisation and coupled thermal-mechanical simulations. The results demonstrate that the initiation and propagation of hot cracks are governed by the overlapping characteristics at the inter-pass and interlayer regions, which influence the formation of liquid films and localisation of the stress-strain concentration. Furthermore, the results revealed that the formation of stray grains and hot cracking mutually amplified each other. To address these challenges, a novel strategy for hot crack suppression is to optimise the dwell time at the inter-pass and interlayer regions to regulate the dendrite growth and elemental segregation. Consequently, a three-pass five-layer Ni-based single-crystal sample with a width of 2–3 mm was successfully prepared, which was free of cracks. Moreover, the hot crack suppression method was applied to single-pass thin-wall deposition, achieving a single-crystal structure with height exceeding 10 mm and a proportion of over 95 %. The repair quality surpassed the requirements for single-crystal blade repair. This study provides new insights into the thermal-mechanical mechanisms underlying hot cracking and establishes a scientific framework for mitigating the cracks in L-DED DD6 SX, thereby advancing their applicability in high-end component repair.
激光定向能沉积法制备镍基单晶(SX)高温合金,阻碍了SX结构对热裂的敏感性。因此,在L-DED过程中实现SX高温合金无裂纹对于推进该技术在SX涡轮叶片修复中的应用至关重要。基于凝固收缩和固体桥接理论,通过显微组织表征和热-力学耦合模拟,系统研究了L-DED法制备多道次多层DD6 SX的热裂纹形成机制。结果表明:热裂纹的萌生和扩展受通道间和层间区域的重叠特征控制,这影响了液膜的形成和应力-应变集中的局部化。结果表明,杂散晶粒的形成与热裂是相互放大的。为了解决这些挑战,一种新的热裂纹抑制策略是优化在通道间和层间区域的停留时间,以调节枝晶生长和元素偏析。因此,成功制备了三道五层镍基单晶样品,宽度为2-3 mm,无裂纹。将热裂纹抑制方法应用于单道次薄壁沉积,获得了高度超过10 mm,占比超过95 %的单晶结构。修复质量超过单晶刀片修复要求。本研究为热裂纹的热力学机制提供了新的见解,并为L-DED DD6 SX的裂纹缓解建立了科学的框架,从而提高了其在高端部件修复中的适用性。
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引用次数: 0
Grindability and microstructural effect of nickel-based superalloys in magnetic field-assisted ultra-precision grinding 磁场辅助超精密磨削镍基高温合金的可磨削性及显微组织效应
IF 14 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Pub Date : 2025-05-01 DOI: 10.1016/j.ijmachtools.2025.104284
Te Zhao, Tengfei Yin, Dongbo Wu, Yi Tan, Denghui Li, Waisze Yip, Suet To
The nickel-based superalloy Inconel 718 is essential in the aerospace and automotive industries due to its exceptional mechanical strength, fatigue resistance, and resistance to corrosion and oxidation. However, machining nickel-based alloys poses significant challenges in ultra-precision grinding (UPG), resulting in excessive grinding wheel vibration and poor surface quality. This study introduces an innovative magnetic field-assisted ultra-precision grinding (MFAUPG) technology, representing an advancement in the application of magnetic fields to assist grinding processes. A theoretical model was developed that links magnetic fields to grinding dynamics, elucidating the electromagnetic damping effects that significantly reduce wheel vibration and improve grinding performance. Experimental results reveal microstructural changes in Inconel 718 under magnetic field influence, including reduced grain size, deformation, and dislocation movement. Furthermore, the study elucidates the effects of magnetic fields on thermodynamics and recrystallization during the grinding process. These findings provide critical insights into the behavior of materials under magnetic field-assisted conditions, offering a promising solution to improve the grindability and surface integrity of difficult-to-machine nickel-based superalloys. The research underscores the potential of MFAUPG to achieve ultra-precision machining and enhance mechanical properties, thereby laying the groundwork for future innovations in economically sustainable grinding practices.
镍基高温合金因科乃尔718因其卓越的机械强度、抗疲劳性、抗腐蚀和抗氧化性在航空航天和汽车工业中至关重要。然而,镍基合金的加工在超精密磨削(UPG)方面面临着巨大的挑战,导致砂轮振动过大,表面质量差。本研究介绍了一种创新的磁场辅助超精密磨削(MFAUPG)技术,代表了磁场辅助磨削工艺应用的进步。建立了将磁场与磨削动力学联系起来的理论模型,阐明了电磁阻尼能显著降低砂轮振动,提高磨削性能。实验结果表明,在磁场作用下,Inconel 718的显微组织发生了变化,包括晶粒尺寸减小、变形和位错移动。此外,研究还阐明了磁场对磨削过程中热力学和再结晶的影响。这些发现为材料在磁场辅助条件下的行为提供了重要的见解,为提高难加工镍基高温合金的可磨削性和表面完整性提供了有希望的解决方案。该研究强调了MFAUPG在实现超精密加工和提高机械性能方面的潜力,从而为未来经济可持续磨削实践的创新奠定了基础。
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引用次数: 0
A novel suppressing evaporation method for enhancing micro-complex magnesium alloy parts additive manufacturing 一种增强微复杂镁合金零件增材制造的抑制蒸发新方法
IF 14 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Pub Date : 2025-05-01 DOI: 10.1016/j.ijmachtools.2025.104281
Lin Su , Xujiang Chao , Jun Luo, Lei Zhao, Yi Zhou, Lewen Yang, Lehua Qi
The increasing demand for micro-complex and customizable magnesium (Mg) alloy structures presents significant challenges for additive manufacturing (AM), particularly in controlling porosity and achieving high-dimensional accuracy. These challenges arise from bubble entrapment and explosive events caused by intense Mg evaporation. This study, for the first time, elucidates the fundamental mechanism underlying these defects, identifying spontaneous bubble nucleation and subsequent explosions within the melt pool as the root cause. In metal droplet-based AM (MDBM), experiments demonstrate that larger bubbles destabilize droplets and disrupt deposition trajectories due to intensified energy release, ultimately degrading print quality. To address this issue, a bubble nucleation and growth model, independent of specific Mg alloy AM methods, was developed. Based on this model, a novel strategy was proposed to mitigate Mg evaporation-induced defects. By identifying a critical bubble nucleation temperature, it was established that operating below this threshold completely suppresses bubble nucleation, thereby preventing associated defects. For conditions exceeding this temperature, the bubble growth model enables precise regulation of bubble size through process parameter optimization, effectively minimizing defects and enhancing structural integrity. As a result, the fabricated structures exhibit high dimensional precision and superior mechanical performance, characterized by pore-free microstructures, minimal dimensional deviation, and enhanced mechanical properties. This study introduces a parameter-driven method for suppressing Mg evaporation-induced defects across various Mg alloy AM technologies, with potential applicability to other highly evaporative metal AM processes. Moreover, it represents the first successful fabrication of micro-complex structures using highly evaporative metals, expanding the material selection for MDBM.
对微复杂和可定制镁合金结构的需求不断增长,给增材制造(AM)带来了重大挑战,特别是在控制孔隙率和实现高尺寸精度方面。这些挑战来自气泡夹持和剧烈的Mg蒸发引起的爆炸事件。这项研究首次阐明了这些缺陷的基本机制,确定了熔池内自发气泡成核和随后的爆炸是根本原因。在基于金属液滴的增材制造(MDBM)中,实验表明,由于能量释放加剧,较大的气泡使液滴不稳定,并破坏沉积轨迹,最终降低打印质量。为了解决这一问题,开发了一个独立于特定镁合金增材制造方法的气泡成核和生长模型。在此基础上,提出了一种减轻Mg蒸发缺陷的新策略。通过确定临界气泡成核温度,确定在此阈值以下操作完全抑制气泡成核,从而防止相关缺陷。对于超过该温度的条件,气泡生长模型可以通过工艺参数优化精确调节气泡尺寸,有效地减少缺陷,提高结构完整性。结果表明,制备的结构具有较高的尺寸精度和优异的力学性能,具有无孔微结构,尺寸偏差最小,力学性能增强的特点。本研究介绍了一种参数驱动的方法,用于抑制各种镁合金增材制造技术中Mg蒸发引起的缺陷,该方法可能适用于其他高蒸发金属增材制造工艺。此外,它代表了首次使用高蒸发性金属成功制造微型复杂结构,扩大了MDBM的材料选择。
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International Journal of Machine Tools & Manufacture
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