International Journal of Machine Tools & Manufacture最新文献

{"title":"Model-driven 3D laser focus shifting for precision fabrication of microstructures in transparent flexible polymers","authors":"Rui Chen ,&nbsp;Chunjin Wang ,&nbsp;Tao Luo ,&nbsp;Wenjun Xu ,&nbsp;Qixian Zhang ,&nbsp;Jie Zhou ,&nbsp;Rui Gao ,&nbsp;Chi Fai Cheung ,&nbsp;Wei Zhou","doi":"10.1016/j.ijmachtools.2025.104310","DOIUrl":"10.1016/j.ijmachtools.2025.104310","url":null,"abstract":"<div><div>Micro-engineered transparent flexible polymers components play a crucial role in various microsystem fields, such as flexible electronics and microfluidics. However, conventional laser fabrication techniques face significant challenges in overcoming issues of energy deposition inaccuracies and focal mismatch, which hinder the fabrication of high-fidelity and controllable 3D microstructure in transparent polymer materials. In this study, we propose a universal 3D dynamic-focusing laser (3D-DFL) fabrication strategy using an infrared (IR) picosecond laser. By dynamically adjusting the Z-axis focus in real time, the system effectively compensates for the depth shifts caused by ablation, ensuring consistent energy deposition and stable fabrication quality. High-speed imaging reveals a three-stage ablation mechanism (stabilization, expansion, and contraction) under laser irradiation. To support the multi-layer dynamic shifting process of the 3D-DFL approach, a universal ablation depth prediction model was established to compensate depth deviations during laser-material interactions. The validity of the model has been proven by its ability to predict ablation depth in different polymer materials with low mean absolute percentage errors (MAPE), achieving 5.99 % for polydimethylsiloxane (PDMS) and 2.68 % for polyethylene terephthalate (PET). The model enables the accurate fabrication of 3D microstructures, achieving normalized peak-to-valley deviations within 8.0 % and normalized root-mean-square deviations below 3.0 %, with an arithmetic surface roughness of approximately 2 μm. The 3D dynamic-focusing laser (3D-DFL) approach enables rapid tailoring of complex geometries, including protruding and recessed microstructures on PDMS and PET substrates. Experimental validation highlights its capability to fabricate functional components such as flexible pressure sensors, microfluidic chips, and ultrasonic droplet manipulation platforms. This study provides an efficient and reliable pathway for the scalable fabricating of high-precision transparent polymers micro-engineered devices and promotes the advancement of research and industry in advanced flexible microsystems.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"210 ","pages":"Article 104310"},"PeriodicalIF":14.0,"publicationDate":"2025-07-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144613261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Systematic review of Cutting Force Measuring Systems in machining: Principles, design, filtering techniques and applications","authors":"Pengfei Zhang ,&nbsp;Dongbo Hong ,&nbsp;Giovanni Totis ,&nbsp;Federico Scalzo ,&nbsp;Zengbin Yin ,&nbsp;Liming Shu ,&nbsp;Naohiko Sugita","doi":"10.1016/j.ijmachtools.2025.104308","DOIUrl":"10.1016/j.ijmachtools.2025.104308","url":null,"abstract":"<div><div>Cutting force measurement plays a key role in modern manufacturing, supporting machinability testing, tool development, process optimization, real-time monitoring and control, and indirect evaluation of part quality. Over the past 50 years, numerous Cutting Force Measuring Systems (CFMS) have been developed and applied successfully in both laboratory and industrial settings. However, their adoption in real industrial environments has been limited by several practical drawbacks. Today, the need for more effective, less invasive, and lower-cost sensing solutions is driving renewed interest in CFMS and fostering deeper integration into manufacturing systems. Despite their relevance, comprehensive and updated reviews of CFMS are scarce. This systematic review aims to present the fundamental principles of cutting force sensing, outline the main types of CFMS, and provide general design guidelines. The strengths and limitations of each type of CFMS are discussed and compared—particularly their limited frequency bandwidth, which can be further reduced when integrated into actual machining systems. To address these challenges, advanced identification and filtering techniques are described, focusing on the dynamic relationship between input forces and measured outputs, along with modern methods for their determination. Parametric (Kalman) filters are introduced, while greater emphasis is placed on recent non-parametric filters, which offer easier implementation in industrial contexts. The review also highlights key CFMS applications, including machinability testing, cutting force model identification, tool development and tool condition monitoring. Emerging trends are examined, such as PVDF-based sensors, the Universal Inverse Filter, and other innovative technologies. Current research challenges involve developing solutions for wireless power transmission, fast calibration, low-latency data transfer, and embedded signal processing. Continued progress in CFMS research and application will be essential to advancing intelligent manufacturing and improving industrial competitiveness.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"210 ","pages":"Article 104308"},"PeriodicalIF":14.0,"publicationDate":"2025-07-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144613233","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Decoupling the heat source and remelting depth for equiaxed transition in wire arc additive manufacturing of titanium alloy","authors":"Yimin Zhuo ,&nbsp;Fu Chen ,&nbsp;Yongqiang Ye ,&nbsp;Jiaming Zhang ,&nbsp;Zichao Wei ,&nbsp;Ke Chen ,&nbsp;Jianwen Le ,&nbsp;Guangfa Huang ,&nbsp;Yuanfei Han ,&nbsp;Bo Cui ,&nbsp;Weijie Lu","doi":"10.1016/j.ijmachtools.2025.104309","DOIUrl":"10.1016/j.ijmachtools.2025.104309","url":null,"abstract":"<div><div>The columnar to equiaxed transition (CET) of grain structures presents significant challenges in titanium alloy additive manufacturing (AM), especially in wire arc additive manufacturing (WAAM) with highly localized heat input and large temperature gradient. In this work, the strategy of decoupling the relationship between heat source and remelting depth was proposed, which was achieved by altering the electrode connection type with arc discharge between the tungsten electrode and the welding wire (IPAW-Wire method). Compared to the conventional WAAM methods based on tungsten inert gas welding (Conventional-TIG method), the IPAW-Wire method reduces the average β grains width from 2 mm to around 200 μm and the maximum texture intensity by approximately three times. The decoupling strategy combined with thermal undercooling and periodic solidification effect of low-frequency pulse arc promotes CET results. The IPAW-Wire method increases tensile strength by 50–80 MPa without altering the alloy composition or making external equipment modifications, and significantly weaken the anisotropy of mechanical properties, both in terms of ultimate strength and plasticity. The strength enhancement and anisotropy reduction are attributed to the coupling of β grains refinement, weakened α crystallographic texture, fine needle-like α′ martensite, and high-density dislocation with multiple types of &lt;a&gt; dislocations, &lt;c&gt; dislocations and &lt;c+a&gt; dislocations. This innovative IPAW-Wire method effectively mitigates coarse columnar grains and anisotropy by decoupling the relationship between heat source and remelting depth. This control strategy can inspire other heat sources and material additive manufacturing process, addressing hotspot challenges such as programmable microstructure, metamaterials structure, multi-material, and bioinspired printing.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"210 ","pages":"Article 104309"},"PeriodicalIF":14.0,"publicationDate":"2025-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144581022","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Quantitative study of oxidation mechanism in photoelectrochemical mechanical polishing of difficult-to-process semiconductor wafers","authors":"Yuewen Sun ,&nbsp;Shang Gao ,&nbsp;Bi Zhang ,&nbsp;Yang Zhao ,&nbsp;Xiaoguang Guo ,&nbsp;Renke Kang ,&nbsp;Zhigang Dong","doi":"10.1016/j.ijmachtools.2025.104307","DOIUrl":"10.1016/j.ijmachtools.2025.104307","url":null,"abstract":"<div><div>The excellent properties of gallium nitride (GaN), silicon carbide (SiC), and diamond make them the most promising semiconductor materials for the future. However, their extremely stable chemical properties and high hardness lead to a low efficiency in chemical mechanical polishing (CMP). Photoelectrochemical mechanical polishing (PECMP) is an efficient and high-quality machining method for difficult-to-process semiconductor materials, integrating photo, electric, chemical, and mechanical fields. However, the coupling of these fields creates complex mechanisms, making it difficult to quantitatively describe the oxidation mechanism driven by the electric field. As a result, selecting the appropriate applied voltage for specific polishing requirements is challenging. To address this, a detailed analysis of the transfer of electrons and holes at the wafer/solution interface was conducted, and an innovative relationship between variations in the energy field and the wafer surface potential in PECMP was established. For the first time, the Poisson equation was applied to the wafer/solution interface, and a novel theoretical model for the oxidation rate and applied voltage on the wafer surface in PECMP was developed. Specifically, at the voltage threshold, the surface charge type changes from electrons to holes, resulting in a significant increase in hole density. Finally, the model was validated through surface modification and PECMP tests. This research not only presents an innovative theoretical method for determining the applied voltage in photoelectric field-assisted polishing for any semiconductor material but also offers new insights into how surface charge transitions between electrons and holes under varying applied voltages can significantly influence polishing efficiency in photoelectric field-assisted polishing.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"210 ","pages":"Article 104307"},"PeriodicalIF":14.0,"publicationDate":"2025-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144515814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Novel multi-axis differential velocity sideways extrusion process for 3D curved profiles: Feasibility and forming mechanisms studies","authors":"Yutong Sun ,&nbsp;Junquan Yu ,&nbsp;Guoqun Zhao ,&nbsp;Xiqing Ge","doi":"10.1016/j.ijmachtools.2025.104306","DOIUrl":"10.1016/j.ijmachtools.2025.104306","url":null,"abstract":"<div><div>3D curved profiles or extrudates are widely used in industry; however, their flexible manufacturing with very few processing steps remains a great challenge. In this study, a novel extrusion-bending integrated process, termed multi-axis differential velocity sideways extrusion (MX-DVSE), was developed to form controlled 3D curved extrudates within a single operation, and its forming mechanics was clarified by experiments and finite element modelling. The MX-DVSE equipment was set up, and a set of dies was designed to perform a series of experiments in which two pairs of opposing punches were moved at different velocities. During the MX-DVSE process, the superposition of the velocity gradients generated by the four extrusion velocities induces the bending deformation of the extrudates with a controllable bending radius and deflection angle. The bending radius is determined by velocity gradient, velocity gradient ratio, and extrusion ratio. The bending radius decreased with an increase in the deviation of the velocity gradients from 1, reduction in the velocity gradient ratio, and increase in the extrusion ratio. The velocity gradient and velocity gradient ratio can be unified into a proposed indicator, termed the bending radius control factor, which exhibits a monotonic relationship with the bending radius. The deflection angle depends on the extrusion velocity and the velocity gradient. The bending plane of the extrudate was close to the direction of the velocity gradient, which deviated from 1 or the direction of the maximum velocity. This is reflected in another proposed indicator: the deflection angle control factor. The feasibility of the MX-DVSE technique was further verified by considering the specific shape and size of 3D curved extrudates as the forming targets. The experimental results show that MX-DVSE can form 3D curved extrudates with acceptable dimensional accuracy, and the proposed control factors for the bending radius and deflection angle can accurately control the shape of the 3D curved extrudates. Moreover, compared to forward extrusion, MX-DVSE was more effective in refining grains and enhancing the strength and ductility of extrudates with the same extrusion parameters. This study demonstrates that MX-DVSE has great potential for the development and application of flexible manufacturing of 3D curved extrudates.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"210 ","pages":"Article 104306"},"PeriodicalIF":14.0,"publicationDate":"2025-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144304944","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A review of robust thermal error reduction of machine tools","authors":"Lingtao Weng ,&nbsp;Toru Kizaki ,&nbsp;Chi Ma ,&nbsp;Weiguo Gao ,&nbsp;Daisuke Kono","doi":"10.1016/j.ijmachtools.2025.104298","DOIUrl":"10.1016/j.ijmachtools.2025.104298","url":null,"abstract":"<div><div>Thermal error reduction in machine tools has attracted increasing attention owing to its influence on the accuracy, productivity, and energy efficiency of machining processes. In several traditional studies, the thermal error has been modeled as a straightforward relationship between the heat input and the output machining error. However, the demand for thermal error reduction in complex practical conditions with the interactive variation of influencing factors has been increasing because energy saving and a predictive countermeasure for defects, even in transient conditions, are expected. Robust reduction in the thermal error under such complex conditions remains a challenging issue. This paper reviews the strategy and methodology for realizing robust thermal error reduction considering the variation in influencing factors. A comprehensive model of thermal error that considers the interaction of thermal and mechanical systems is described to provide an overview of the targeted topic. Specific methodologies published over the last 15 years, such as adaptive modeling and compensation, machine design optimization, and temperature control, are reviewed. We focus on the evolution of data-driven models and digital twin systems for thermal error compensation by describing their implementation frameworks. An open question regarding strategy selection for thermal error compensation considering uncertainty is discussed. This review reveals the current research gap and provides an outlook for future challenges in realizing real-time and adaptive thermal error compensation.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"209 ","pages":"Article 104298"},"PeriodicalIF":14.0,"publicationDate":"2025-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144223560","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A high efficiency pre-dissolution electrochemical polishing method for improving surface uniformity in additively manufactured alloys","authors":"Jierui Mu ,&nbsp;Qiang Lu ,&nbsp;Zijue Tang ,&nbsp;Yi Wu ,&nbsp;Haowei Wang ,&nbsp;Hongze Wang","doi":"10.1016/j.ijmachtools.2025.104297","DOIUrl":"10.1016/j.ijmachtools.2025.104297","url":null,"abstract":"<div><div>Electrochemical polishing (ECP) offers significant advantages in reducing surface roughness of complex additively manufactured (AMed) components. However, conventional one-step ECP methods hinder further removal of near-surface defects, such as inherent adhesive powders and step effects, owing to the simultaneous dissolution and smoothing processes. Additionally, the topological conformity between the formed high-resistance oxide layer and the metal matrix limits the polishing effectiveness, producing undesirable surface inconsistency and poor dimensional accuracy. In this study, we introduce a pre-dissolution step prior to the conventional ECP process, namely pre-dissolution ECP. This approach is based on the electrochemical dissolution behavior of adhesive powders and the melt pool (MP) structure to transform the irregular, rough as-built surface into a pre-dissolved MP morphology with a uniform current density distribution, aiming to optimize the subsequent ECP process. By combining <em>in situ</em> X-ray synchrotron radiation observation with comparative quantitative analysis of samples before and after mechanical polishing, precise dissolution parameters were determined to achieve a polished surface with uniformly distributed height differences. For AMed Al alloys with high Si content, when the percentage change rate of dissolved areas of the cross-sectional profile in the pre-dissolution step is 0.060 ± 0.003 %/min, different adhesive powder regions exhibit consistent height differences on the pre-dissolved surface. During the subsequent polishing step, compared to direct ECP (∼5.3 μm), the isotropic etching-based smoothing effect in NaOH solution further reduces surface roughness of the pre-dissolved surface to ∼1.5 μm, and the corresponding standard deviation of height difference is reduced by 80.7 %. Moreover, the use of low voltage and the one-time removal of surface cluster layers ensures improved roundness tolerance (85.7 %) and capillary action (304.4 %) for AMed heat pipes with internal channels (Φ1.4 mm) after polishing. This pre-dissolution strategy mitigates the complexity and randomness of as-built surface features, facilitating better ECP performance. It can also be integrated with advanced ECP technologies, thereby expanding the application potential of AMed structures, including but not limited to internal channels.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"209 ","pages":"Article 104297"},"PeriodicalIF":14.0,"publicationDate":"2025-05-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144138301","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A novel computational approach using receptance coupling substructure analysis for prediction of tool tip dynamics in industrial machining applications","authors":"Jesus David Chaux,&nbsp;Patxi X. Aristimuño Osoro,&nbsp;Pedro J. Arrazola","doi":"10.1016/j.ijmachtools.2025.104296","DOIUrl":"10.1016/j.ijmachtools.2025.104296","url":null,"abstract":"","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"209 ","pages":"Article 104296"},"PeriodicalIF":14.0,"publicationDate":"2025-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144137745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Inducing electrochemical discharges on insulating surfaces for damage-free electrochemical jet machining of glass","authors":"Genglin Zhu ,&nbsp;Hexin Li ,&nbsp;Wenjun Lu ,&nbsp;Sanjun Liu ,&nbsp;Weidong Liu ,&nbsp;Yonghua Zhao","doi":"10.1016/j.ijmachtools.2025.104293","DOIUrl":"10.1016/j.ijmachtools.2025.104293","url":null,"abstract":"<div><div>A key limitation of electrochemical jet machining (EJM) is its inability to process insulating materials. While electrochemical discharge machining (ECDM) can handle such materials, its contact-based nature often causes thermal damage. Additionally, the challenge of initiating electrochemical discharges on the insulating workpiece, rather than on the tool electrode, remains unresolved. This study presents a new mechanism for directly inducing electrochemical discharges on insulating surfaces through the controlled interplay of electro- and hydrodynamic fields. For the first time, we demonstrate damage-free machining of insulating materials using an electrolyte jet, in a new process termed jet-electrochemical discharge machining (Jet-ECDM). This is achieved by generating electrochemical discharges at the jet-impingement zone on the insulating workpiece surface, with the gas evolved at the nozzle electrode acting as a dielectric. The spatiotemporal dynamics of discharges, including location, frequency, and intensity, are analyzed and shown to critically influence machining results. High-speed imaging visualizes the gas bubble behaviors, while simulation reveals how discharges are focused onto a localized machining area through concentrated electric fields and gas distribution. Key process parameters, including voltage, working gap, and electrolyte flow rate, are identified for effective process control. Thermocouple measurements show a discharge-induced average temperature rise of ∼160 °C at the machining site. Unlike conventional ECDM, Jet-ECDM's non-contact approach avoids thermal damage, enabling stress-free, purely chemical material removal. This is validated by machining microfeatures in quartz glass, achieving superior surface finishes (∼Ra 50 nm) and a damage-free subsurface. This research extends the material applicability of EJM to insulating materials and introduces a novel method for stress-free machining of glass and ceramics using electrochemical discharges.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"209 ","pages":"Article 104293"},"PeriodicalIF":14.0,"publicationDate":"2025-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144137626","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Ultrafast phase transformation and strengthening mechanisms in alloys induced by femtosecond laser shock: a novel strategy for intermetallic control","authors":"Zhiyuan Liu ,&nbsp;Wenmin Tang ,&nbsp;Feng Pan ,&nbsp;Xueran Deng ,&nbsp;Fei Fan ,&nbsp;Jingjing Yang ,&nbsp;Cheng Lei ,&nbsp;Sheng Liu ,&nbsp;Qiao Xu ,&nbsp;Du Wang","doi":"10.1016/j.ijmachtools.2025.104292","DOIUrl":"10.1016/j.ijmachtools.2025.104292","url":null,"abstract":"<div><div>This study proposes a novel alloy-strengthening strategy enabled by femtosecond laser shock peening (FLSP), which utilizes ultrahigh peak shock pressures exceeding the intrinsic bond rupture strength of metallic bonds to achieve atomic-level microstructural modification. In contrast to conventional nanosecond laser shock peening (NLSP), FLSP induces a distinct strengthening mechanism through the dynamic fragmentation of intermetallic phases and the controllable precipitation of nanoscale strengthening phases. Through integrating a synergistic experimental investigation with molecular dynamics (MD) simulation, we establish a generalized pressure–dependent phase transformation framework, identifying critical thresholds of shock pressure required to initiate atomic bond rupture and subsequent phase evolution. This framework enables precise tuning of energy input to promote the formation of nanoscale strengthening phases while suppressing undesirable microscale precipitates. Compared to NLSP, FLSP demonstrates superior efficacy in microstructure refinement capabilities, enabling synergistic strengthening through grain refinement, dislocation multiplication, and pressure-mediated phase transformation. Notably, the discovered pressure–sensitive phase evolution behavior provides a transferable paradigm for microstructural design and performance optimization across a wide range of metallic systems. This work advances the fundamental understanding of laser–matter interactions under extreme conditions and offers a physics-informed pathway for the design of high-performance structural materials through targeted laser parameter engineering.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"209 ","pages":"Article 104292"},"PeriodicalIF":14.0,"publicationDate":"2025-05-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144115134","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}