International Journal of Machine Tools & Manufacture最新文献

{"title":"Ultrafast laser plasma dynamics enabled ultrafine vertical nanochannel array in transparent materials","authors":"Taijin Wang ,&nbsp;Lingfeng Wang ,&nbsp;Feng Liu ,&nbsp;Gary J. Cheng","doi":"10.1016/j.ijmachtools.2025.104322","DOIUrl":"10.1016/j.ijmachtools.2025.104322","url":null,"abstract":"<div><div>The direct fabrication of vertical nanochannels with ultrahigh aspect ratios (1000:1) in transparent materials has long been hindered by diffraction-limited focal spots and plasma-induced instabilities inherent to conventional ultrafast laser processing. To address these challenges, we introduce a dynamic focusing homogenized light field technique, which integrates a high-refractive-index optical medium to compress the laser focal spot below the diffraction limit (∼700 nm) while leveraging nonlinear Kerr effects to elongate the axial energy distribution. This approach dynamically redistributes energy spatiotemporally, suppressing plasma explosion pressures by 86 % (1440 nm vs. 192 nm) and enabling deterministic control over nanochannel geometry. Through dual-temperature equation simulations and time-resolved plasma spectroscopy, we establish a predictive framework linking processing parameters—such as cover glass thickness, pulse width, and energy—to nanostructure dimensions, achieving aspect ratio close to 1000:1, exemplified by nanochannels measuring 182 μm in length and 192 nm in width. Key innovations of this technique include nonlinear focal drift engineering, which decouples transverse resolution from longitudinal energy deposition, and a plasma suppression mechanism informed by numerical simulations and spectroscopy, ensuring structural integrity through multi-dimensional light field control. Furthermore, we demonstrate the first single-step fabrication of 3D volumetric diffraction gratings in fused silica with sub-1.25 μm channel spacing and tailored optical responses, such as 35.9 % diffuse transmittance and a 0.52 absorption coefficient at 247 nm. This method transcends traditional trade-offs, offering precision, scalability, and versatility: it achieves sub-100 nm feature control, enables scalable fabrication of complex architectures like through-hole and multi-depth structures, and tailors optical properties for metamaterials in integrated photonics, nanofluidics, and quantum optics. By resolving plasma-driven instability and thermal accumulation, our technique unlocks transformative applications in low-loss waveguides, single-molecule sensors, and topological photonic crystals. This work redefines laser nanofabrication as a universal platform for high-precision, scalable 3D structuring in brittle materials, positioning it as a cornerstone for next-generation optical and quantum technologies.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"211 ","pages":"Article 104322"},"PeriodicalIF":18.8,"publicationDate":"2025-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144896640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Review of physicochemical-assisted nanomanufacturing processes for wide-bandgap semiconductor wafers","authors":"Kazuya Yamamura ,&nbsp;Hui Deng ,&nbsp;Yasuhisa Sano ,&nbsp;Junji Murata ,&nbsp;Xu Yang ,&nbsp;Rongyan Sun","doi":"10.1016/j.ijmachtools.2025.104321","DOIUrl":"10.1016/j.ijmachtools.2025.104321","url":null,"abstract":"<div><div>Nanomanufacturing involves not only fabricating nanoscale three-dimensional microstructures but also achieving nanoscale surface planarization and smoothing—an indispensable requirement in semiconductor-wafer processing. Wide-bandgap semiconductors such as SiC, GaN, diamond, and AlN combine high hardness, brittleness, and chemical inertness, making it exceptionally difficult to produce large size wafers with damage-free, atomic-level smoothness that meets the performance demands of next-generation devices. Physical–chemical composite methods, which marry the high-efficiency planarization of mechanical removal with the damage-free of chemical reactions, have emerged as the most promising route to overcome this challenge. Chemical mechanical polishing (CMP), the first-generation composite technique, was well established in industry; however, its low material removal rates, extensive consumable use, and environmental burden were increasingly problematic as wafer sizes grow and new wide-bandgap materials become mainstream. This review surveys the principal physicochemical processing techniques and examines four representative approaches—plasma-assisted polishing (PAP), plasma-based atomic-selective etching (PASE), catalyst-assisted etching (CARE), and electrochemical mechanical polishing (ECMP). A systematic comparison of their mechanisms, advantages, and limitations clarifies how these methods maintain crystal integrity while enabling selective material removal, thereby delivering atomically smooth surfaces with significantly higher throughput. The review provides both theoretical insight and practical guidance for cost-effective, atomically precise processing of wide-bandgap semiconductor wafers.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"211 ","pages":"Article 104321"},"PeriodicalIF":18.8,"publicationDate":"2025-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144840819","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A novel strategy for electrochemical additive manufacturing: Femtosecond laser-assisted localized electrochemical deposition","authors":"Zhaoqiang Zou ,&nbsp;Wanfei Ren ,&nbsp;Jinkai Xu ,&nbsp;Hanhan Wei ,&nbsp;Zhanjiang Yu ,&nbsp;Ningqian Tang ,&nbsp;Huadong Yu","doi":"10.1016/j.ijmachtools.2025.104319","DOIUrl":"10.1016/j.ijmachtools.2025.104319","url":null,"abstract":"<div><div>Localized electrochemical deposition (LECD) exhibits significant advantages in fabricating microscale 3D metallic structures. However, conventional LECD technologies are inherently constrained by diffusion-controlled mechanisms, where pursuit of enhanced deposition efficiency inevitably degrades deposition quality (such as increased surface roughness and internal defects), consequently impairing structural mechanical properties. This study presents a femtosecond laser-assisted localized electrochemical deposition (FsLA-LECD) technology. By precisely coupling femtosecond laser irradiation with the electrodeposition microzone and leveraging laser energy to regulate electrodeposition process, this approach simultaneously achieves efficient fabrication of complex metallic microstructures with enhanced mechanical performance. The regulating effects of laser irradiation on mass transfer, nucleation kinetics, and grain growth evolution are investigated throughout the evolution process of point-surface-structure. Experimental and computational analysis elucidate that the laser-induced Marangoni effect within the reaction microenvironment enhances microzone electrolyte replenishment, consequently elevating deposition current density. This results in a volume deposition rate of 15.47 μm³/s, representing a 3 times enhancement over laser-free conditions. Laser-mediated regulation of deposition rates enabled fabrication of uniform-diameter, bamboo-like, and hourglass-shaped microstructures. Furthermore, pulsed laser energy facilitated stepwise current amplification, thereby inducing nanotwin formation within copper micro-geometrical features. This approach attained a tensile yield strength of 1.08 GPa, significantly surpassing that of traditional electrodeposited counterparts. This work demonstrates the capability of FsLA-LECD to simultaneously enable high-efficiency manufacturing and enhanced mechanical properties, establishing the groundwork for innovative approaches to high-performance micromanufacturing.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"211 ","pages":"Article 104319"},"PeriodicalIF":18.8,"publicationDate":"2025-08-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144827311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Understanding the surface polishability and hardness-softening mechanisms of martensitic mould steel in multi-mode nanosecond laser polishing","authors":"Erju Liu ,&nbsp;Donghe Zhang ,&nbsp;La Han ,&nbsp;Zhikun Liu ,&nbsp;Debin Shan ,&nbsp;Bin Guo ,&nbsp;Jie Xu","doi":"10.1016/j.ijmachtools.2025.104311","DOIUrl":"10.1016/j.ijmachtools.2025.104311","url":null,"abstract":"<div><div>Laser polishing is an efficient, reliable, and environmentally friendly surface-finishing technique aimed at improving the surface quality. However, its application to martensitic mould steel is limited by surface-softening issues induced by the pronounced thermal effects of conventional continuous-wave laser polishing. This study proposes a multi-mode nanosecond laser polishing approach that employs a millimetre-diameter beam with top-hat energy distribution to mitigate the thermal effects and alleviate surface softening. A key challenge is achieving high-quality polishing at shallow melting depths. Further, the proposed process may alter the surface-softening mechanism when considering the unique phase-transformation behaviour of martensitic mould steel. To clarify these aspects, the characteristics of multi-mode nanosecond laser polishing, related to the process and properties, are investigated via finite-element simulations and experiments. The results demonstrate that, unlike the multi-directional melt flow induced by the intense melt pool reaction in continuous-wave laser polishing, multi-mode nanosecond laser polishing drives long-range horizontal melt flow and simultaneously induces multiple convex peaks to fill concave valleys, thereby achieving high-quality surface smoothing (Sa = 0.23 μm) with a minimal melting depth (&lt;2 μm). Moreover, a novel surface-softening mechanism involving the synergistic induction of residual austenite enrichment (up to 90 %) in the fusion zone and martensite tempering effects in the heat-affected zone is presented, which contrasts with the traditional mechanism that relies solely on tempering-induced softening in the heat-affected zone. This study presents a low-thermal-effect, high-quality, and high-efficiency polishing solution for metal components, while advancing the theoretical understanding of hardness-softening mechanisms in the laser manufacturing of martensitic steel.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"211 ","pages":"Article 104311"},"PeriodicalIF":18.8,"publicationDate":"2025-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144724029","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Model-driven 3D laser focus shifting for precision fabrication of microstructures in transparent flexible polymers","authors":"Rui Chen ,&nbsp;Chunjin Wang ,&nbsp;Tao Luo ,&nbsp;Wenjun Xu ,&nbsp;Qixian Zhang ,&nbsp;Jie Zhou ,&nbsp;Rui Gao ,&nbsp;Chi Fai Cheung ,&nbsp;Wei Zhou","doi":"10.1016/j.ijmachtools.2025.104310","DOIUrl":"10.1016/j.ijmachtools.2025.104310","url":null,"abstract":"<div><div>Micro-engineered transparent flexible polymers components play a crucial role in various microsystem fields, such as flexible electronics and microfluidics. However, conventional laser fabrication techniques face significant challenges in overcoming issues of energy deposition inaccuracies and focal mismatch, which hinder the fabrication of high-fidelity and controllable 3D microstructure in transparent polymer materials. In this study, we propose a universal 3D dynamic-focusing laser (3D-DFL) fabrication strategy using an infrared (IR) picosecond laser. By dynamically adjusting the Z-axis focus in real time, the system effectively compensates for the depth shifts caused by ablation, ensuring consistent energy deposition and stable fabrication quality. High-speed imaging reveals a three-stage ablation mechanism (stabilization, expansion, and contraction) under laser irradiation. To support the multi-layer dynamic shifting process of the 3D-DFL approach, a universal ablation depth prediction model was established to compensate depth deviations during laser-material interactions. The validity of the model has been proven by its ability to predict ablation depth in different polymer materials with low mean absolute percentage errors (MAPE), achieving 5.99 % for polydimethylsiloxane (PDMS) and 2.68 % for polyethylene terephthalate (PET). The model enables the accurate fabrication of 3D microstructures, achieving normalized peak-to-valley deviations within 8.0 % and normalized root-mean-square deviations below 3.0 %, with an arithmetic surface roughness of approximately 2 μm. The 3D dynamic-focusing laser (3D-DFL) approach enables rapid tailoring of complex geometries, including protruding and recessed microstructures on PDMS and PET substrates. Experimental validation highlights its capability to fabricate functional components such as flexible pressure sensors, microfluidic chips, and ultrasonic droplet manipulation platforms. This study provides an efficient and reliable pathway for the scalable fabricating of high-precision transparent polymers micro-engineered devices and promotes the advancement of research and industry in advanced flexible microsystems.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"210 ","pages":"Article 104310"},"PeriodicalIF":14.0,"publicationDate":"2025-07-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144613261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Systematic review of Cutting Force Measuring Systems in machining: Principles, design, filtering techniques and applications","authors":"Pengfei Zhang ,&nbsp;Dongbo Hong ,&nbsp;Giovanni Totis ,&nbsp;Federico Scalzo ,&nbsp;Zengbin Yin ,&nbsp;Liming Shu ,&nbsp;Naohiko Sugita","doi":"10.1016/j.ijmachtools.2025.104308","DOIUrl":"10.1016/j.ijmachtools.2025.104308","url":null,"abstract":"<div><div>Cutting force measurement plays a key role in modern manufacturing, supporting machinability testing, tool development, process optimization, real-time monitoring and control, and indirect evaluation of part quality. Over the past 50 years, numerous Cutting Force Measuring Systems (CFMS) have been developed and applied successfully in both laboratory and industrial settings. However, their adoption in real industrial environments has been limited by several practical drawbacks. Today, the need for more effective, less invasive, and lower-cost sensing solutions is driving renewed interest in CFMS and fostering deeper integration into manufacturing systems. Despite their relevance, comprehensive and updated reviews of CFMS are scarce. This systematic review aims to present the fundamental principles of cutting force sensing, outline the main types of CFMS, and provide general design guidelines. The strengths and limitations of each type of CFMS are discussed and compared—particularly their limited frequency bandwidth, which can be further reduced when integrated into actual machining systems. To address these challenges, advanced identification and filtering techniques are described, focusing on the dynamic relationship between input forces and measured outputs, along with modern methods for their determination. Parametric (Kalman) filters are introduced, while greater emphasis is placed on recent non-parametric filters, which offer easier implementation in industrial contexts. The review also highlights key CFMS applications, including machinability testing, cutting force model identification, tool development and tool condition monitoring. Emerging trends are examined, such as PVDF-based sensors, the Universal Inverse Filter, and other innovative technologies. Current research challenges involve developing solutions for wireless power transmission, fast calibration, low-latency data transfer, and embedded signal processing. Continued progress in CFMS research and application will be essential to advancing intelligent manufacturing and improving industrial competitiveness.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"210 ","pages":"Article 104308"},"PeriodicalIF":14.0,"publicationDate":"2025-07-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144613233","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Decoupling the heat source and remelting depth for equiaxed transition in wire arc additive manufacturing of titanium alloy","authors":"Yimin Zhuo ,&nbsp;Fu Chen ,&nbsp;Yongqiang Ye ,&nbsp;Jiaming Zhang ,&nbsp;Zichao Wei ,&nbsp;Ke Chen ,&nbsp;Jianwen Le ,&nbsp;Guangfa Huang ,&nbsp;Yuanfei Han ,&nbsp;Bo Cui ,&nbsp;Weijie Lu","doi":"10.1016/j.ijmachtools.2025.104309","DOIUrl":"10.1016/j.ijmachtools.2025.104309","url":null,"abstract":"<div><div>The columnar to equiaxed transition (CET) of grain structures presents significant challenges in titanium alloy additive manufacturing (AM), especially in wire arc additive manufacturing (WAAM) with highly localized heat input and large temperature gradient. In this work, the strategy of decoupling the relationship between heat source and remelting depth was proposed, which was achieved by altering the electrode connection type with arc discharge between the tungsten electrode and the welding wire (IPAW-Wire method). Compared to the conventional WAAM methods based on tungsten inert gas welding (Conventional-TIG method), the IPAW-Wire method reduces the average β grains width from 2 mm to around 200 μm and the maximum texture intensity by approximately three times. The decoupling strategy combined with thermal undercooling and periodic solidification effect of low-frequency pulse arc promotes CET results. The IPAW-Wire method increases tensile strength by 50–80 MPa without altering the alloy composition or making external equipment modifications, and significantly weaken the anisotropy of mechanical properties, both in terms of ultimate strength and plasticity. The strength enhancement and anisotropy reduction are attributed to the coupling of β grains refinement, weakened α crystallographic texture, fine needle-like α′ martensite, and high-density dislocation with multiple types of &lt;a&gt; dislocations, &lt;c&gt; dislocations and &lt;c+a&gt; dislocations. This innovative IPAW-Wire method effectively mitigates coarse columnar grains and anisotropy by decoupling the relationship between heat source and remelting depth. This control strategy can inspire other heat sources and material additive manufacturing process, addressing hotspot challenges such as programmable microstructure, metamaterials structure, multi-material, and bioinspired printing.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"210 ","pages":"Article 104309"},"PeriodicalIF":14.0,"publicationDate":"2025-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144581022","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Quantitative study of oxidation mechanism in photoelectrochemical mechanical polishing of difficult-to-process semiconductor wafers","authors":"Yuewen Sun ,&nbsp;Shang Gao ,&nbsp;Bi Zhang ,&nbsp;Yang Zhao ,&nbsp;Xiaoguang Guo ,&nbsp;Renke Kang ,&nbsp;Zhigang Dong","doi":"10.1016/j.ijmachtools.2025.104307","DOIUrl":"10.1016/j.ijmachtools.2025.104307","url":null,"abstract":"<div><div>The excellent properties of gallium nitride (GaN), silicon carbide (SiC), and diamond make them the most promising semiconductor materials for the future. However, their extremely stable chemical properties and high hardness lead to a low efficiency in chemical mechanical polishing (CMP). Photoelectrochemical mechanical polishing (PECMP) is an efficient and high-quality machining method for difficult-to-process semiconductor materials, integrating photo, electric, chemical, and mechanical fields. However, the coupling of these fields creates complex mechanisms, making it difficult to quantitatively describe the oxidation mechanism driven by the electric field. As a result, selecting the appropriate applied voltage for specific polishing requirements is challenging. To address this, a detailed analysis of the transfer of electrons and holes at the wafer/solution interface was conducted, and an innovative relationship between variations in the energy field and the wafer surface potential in PECMP was established. For the first time, the Poisson equation was applied to the wafer/solution interface, and a novel theoretical model for the oxidation rate and applied voltage on the wafer surface in PECMP was developed. Specifically, at the voltage threshold, the surface charge type changes from electrons to holes, resulting in a significant increase in hole density. Finally, the model was validated through surface modification and PECMP tests. This research not only presents an innovative theoretical method for determining the applied voltage in photoelectric field-assisted polishing for any semiconductor material but also offers new insights into how surface charge transitions between electrons and holes under varying applied voltages can significantly influence polishing efficiency in photoelectric field-assisted polishing.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"210 ","pages":"Article 104307"},"PeriodicalIF":14.0,"publicationDate":"2025-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144515814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Novel multi-axis differential velocity sideways extrusion process for 3D curved profiles: Feasibility and forming mechanisms studies","authors":"Yutong Sun ,&nbsp;Junquan Yu ,&nbsp;Guoqun Zhao ,&nbsp;Xiqing Ge","doi":"10.1016/j.ijmachtools.2025.104306","DOIUrl":"10.1016/j.ijmachtools.2025.104306","url":null,"abstract":"<div><div>3D curved profiles or extrudates are widely used in industry; however, their flexible manufacturing with very few processing steps remains a great challenge. In this study, a novel extrusion-bending integrated process, termed multi-axis differential velocity sideways extrusion (MX-DVSE), was developed to form controlled 3D curved extrudates within a single operation, and its forming mechanics was clarified by experiments and finite element modelling. The MX-DVSE equipment was set up, and a set of dies was designed to perform a series of experiments in which two pairs of opposing punches were moved at different velocities. During the MX-DVSE process, the superposition of the velocity gradients generated by the four extrusion velocities induces the bending deformation of the extrudates with a controllable bending radius and deflection angle. The bending radius is determined by velocity gradient, velocity gradient ratio, and extrusion ratio. The bending radius decreased with an increase in the deviation of the velocity gradients from 1, reduction in the velocity gradient ratio, and increase in the extrusion ratio. The velocity gradient and velocity gradient ratio can be unified into a proposed indicator, termed the bending radius control factor, which exhibits a monotonic relationship with the bending radius. The deflection angle depends on the extrusion velocity and the velocity gradient. The bending plane of the extrudate was close to the direction of the velocity gradient, which deviated from 1 or the direction of the maximum velocity. This is reflected in another proposed indicator: the deflection angle control factor. The feasibility of the MX-DVSE technique was further verified by considering the specific shape and size of 3D curved extrudates as the forming targets. The experimental results show that MX-DVSE can form 3D curved extrudates with acceptable dimensional accuracy, and the proposed control factors for the bending radius and deflection angle can accurately control the shape of the 3D curved extrudates. Moreover, compared to forward extrusion, MX-DVSE was more effective in refining grains and enhancing the strength and ductility of extrudates with the same extrusion parameters. This study demonstrates that MX-DVSE has great potential for the development and application of flexible manufacturing of 3D curved extrudates.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"210 ","pages":"Article 104306"},"PeriodicalIF":14.0,"publicationDate":"2025-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144304944","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A review of robust thermal error reduction of machine tools","authors":"Lingtao Weng ,&nbsp;Toru Kizaki ,&nbsp;Chi Ma ,&nbsp;Weiguo Gao ,&nbsp;Daisuke Kono","doi":"10.1016/j.ijmachtools.2025.104298","DOIUrl":"10.1016/j.ijmachtools.2025.104298","url":null,"abstract":"<div><div>Thermal error reduction in machine tools has attracted increasing attention owing to its influence on the accuracy, productivity, and energy efficiency of machining processes. In several traditional studies, the thermal error has been modeled as a straightforward relationship between the heat input and the output machining error. However, the demand for thermal error reduction in complex practical conditions with the interactive variation of influencing factors has been increasing because energy saving and a predictive countermeasure for defects, even in transient conditions, are expected. Robust reduction in the thermal error under such complex conditions remains a challenging issue. This paper reviews the strategy and methodology for realizing robust thermal error reduction considering the variation in influencing factors. A comprehensive model of thermal error that considers the interaction of thermal and mechanical systems is described to provide an overview of the targeted topic. Specific methodologies published over the last 15 years, such as adaptive modeling and compensation, machine design optimization, and temperature control, are reviewed. We focus on the evolution of data-driven models and digital twin systems for thermal error compensation by describing their implementation frameworks. An open question regarding strategy selection for thermal error compensation considering uncertainty is discussed. This review reveals the current research gap and provides an outlook for future challenges in realizing real-time and adaptive thermal error compensation.</div></div>","PeriodicalId":14011,"journal":{"name":"International Journal of Machine Tools & Manufacture","volume":"209 ","pages":"Article 104298"},"PeriodicalIF":14.0,"publicationDate":"2025-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144223560","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}