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2016 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)最新文献

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0.84-THz imaging pixel with a lock-in amplifier in CMOS 0.84太赫兹成像像素与CMOS中的锁定放大器
Pub Date : 2016-05-22 DOI: 10.1109/RFIC.2016.7508277
R. Xu, Ja-yol Lee, D. Kim, Shinwoong Park, Z. Ahmad, K. O. Kenneth
An 840-GHz Schottky diode detector is integrated with an analog lock-in amplifier in 130-nm bulk CMOS. The integrated lock-in amplifier can support a modulation frequency of up to 10 MHz with a gain of 54 dB, a dynamic range of 42 dB, and an input referred noise of less than 10 nV/√(Hz) at modulation frequencies higher than 100 kHz. The integrated lock-in amplifier occupies an area of 0.17 mm2 and consumes 4.9 mA from a 1.2-V supply. The detector and on-chip lock-in amplifier combination was used to form terahertz images.
一个840 ghz肖特基二极管探测器与一个模拟锁相放大器集成在130纳米块CMOS中。该集成锁相放大器可支持高达10mhz的调制频率,增益为54 dB,动态范围为42 dB,在高于100khz的调制频率下,输入参考噪声小于10 nV/√(Hz)。集成的锁相放大器占用0.17 mm2的面积,从1.2 v电源消耗4.9 mA。利用探测器和片上锁相放大器组合形成太赫兹图像。
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引用次数: 5
75 – 105 GHz switching power amplifiers using high-breakdown, high-fmax multi-port stacked transistor topologies 采用高击穿、高fmax多端口堆叠晶体管拓扑结构的75 - 105 GHz开关功率放大器
Pub Date : 2016-05-22 DOI: 10.1109/RFIC.2016.7508312
K. Datta, H. Hashemi
High-breakdown, high-fmax multi-port transistor topologies are presented in this work for realizing high power, highly efficient mm-wave switching power amplifiers at 75-105 GHz. Implemented in a 90nm SiGe BiCMOS process, the proposed active structures comprising of two and three stacked transistors with integrated layout parasitics achieve (fmax, breakdown voltage) of (295 GHz, 8V) and (260 GHz, 11 V) respectively and demonstrate peak (output power, PAE) of (22 dBm, 19%) at 85 GHz and (23.3 dBm, 17%) at 83 GHz respectively. The implemented designs are benchmarked against a 88 GHz 19.5 dBm, 16% PAE W-band Class-E power amplifier using native transistor footprints fabricated in the same 90nm SiGe BiCMOS process. The superior performance of the composite transistor designs highlight the benefit of the proposed approach.
本文提出了高击穿、高fmax多端口晶体管拓扑结构,用于实现75-105 GHz的高功率、高效率毫米波开关功率放大器。在90nm SiGe BiCMOS工艺中实现,由两个和三个堆叠晶体管组成的有源结构具有集成布局寄生,分别实现(fmax,击穿电压)为(295 GHz, 8V)和(260 GHz, 11 V),在85 GHz和83 GHz分别显示峰值(输出功率,PAE)为(22 dBm, 19%)和(23.3 dBm, 17%)。实现的设计针对88 GHz 19.5 dBm, 16% PAE w波段e类功率放大器进行基准测试,该功率放大器采用相同的90nm SiGe BiCMOS工艺制造的本地晶体管足迹。复合晶体管设计的优异性能突出了所提出方法的优点。
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引用次数: 10
A wideband delta-sigma based closed-loop fully digital phase modulator in 45nm CMOS SOI 45纳米CMOS SOI中基于δ -sigma的宽带闭环全数字相位调制器
Pub Date : 2016-05-22 DOI: 10.1109/RFIC.2016.7508275
H. Gheidi, T. Nakatani, V. Leung, P. Asbeck
This paper presents a new architecture for an RF phase modulator that significantly improves the phase resolution. The modulator utilizes 32 variable delay elements in a delay lock loop (DLL) configuration to provide wideband 1-3GHz operation with coarse 5-bit resolution. A 5-bit multiplexer selects different taps of the DLL according to the baseband digital phase data to generate desired phase modulated signal at the output. A high speed 5-bit digital delta-sigma modulator is additionally used to compensate for the phase truncation occurring in the 5-bit DLL. The phase modulator IC is implemented in 45nm CMOS SOI and achieves <;2% rms EVM while achieving 55dB rejection of close-to-carrier emissions for an 8Mb/s GMSK signal at 2.3GHz, with power consumption below 35mW.
本文提出了一种新的射频相位调制器结构,可以显著提高相位分辨率。该调制器在延迟锁环(DLL)配置中使用32个可变延迟元件,以粗5位分辨率提供1-3GHz的宽带操作。5位多路复用器根据基带数字相位数据选择DLL的不同分接,在输出端产生所需的相位调制信号。另外使用高速5位数字δ - σ调制器来补偿5位DLL中发生的相位截断。相位调制器IC采用45nm CMOS SOI实现,在2.3GHz频率下实现8Mb/s GMSK信号的近载波发射抑制55dB,实现< 2%有效值EVM,功耗低于35mW。
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引用次数: 3
A mixer frontend for a four-channel Modulated Wideband Converter with 62 dB blocker rejection 具有62 dB阻滞器抑制的四通道调制宽带转换器的混频器前端
Pub Date : 2016-05-22 DOI: 10.1109/RFIC.2016.7508307
D. Adams, Yonina C. Eldar, B. Murmann
The Modulated Wideband Converter promises to improve receiver flexibility for cognitive radios by leveraging compressive sensing techniques. We present a prototype IC that adds signal reception to previously demonstrated signal detection. Refactoring the mixing sequence between detection and reception enables targeted reception and blocker rejection. We algorithmically design a three-level mixing sequence and additionally employ delay-based harmonic cancellation. When applied together in our 65-nm chip, we measure 62 dB of in-band blocker rejection, while receiving up to four channels between 0 and 900 MHz.
调制宽带转换器有望通过利用压缩感知技术提高认知无线电接收机的灵活性。我们提出了一种原型IC,它在先前演示的信号检测中增加了信号接收。重构检测和接收之间的混合序列可以实现目标接收和拦截器拒绝。我们通过算法设计了一个三电平混频序列,并采用了基于延迟的谐波抵消。当我们的65纳米芯片一起应用时,我们测量到62 dB的带内阻断器抑制,同时在0到900 MHz之间接收多达四个通道。
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引用次数: 11
A 6 GS/s 9.5 bit pipelined folding-interpolating ADC with 7.3 ENOB and 52.7 dBc SFDR in the 2nd Nyquist band in 0.25 µm SiGe-BiCMOS 在0.25µm SiGe-BiCMOS中,在第2 Nyquist频段具有7.3 ENOB和52.7 dBc SFDR的6 GS/s 9.5位流水折叠插值ADC
Pub Date : 2016-05-22 DOI: 10.1109/RFIC.2016.7508239
M. Buck, M. Grozing, R. Bieg, J. Digel, X.-Q. Du, P. Thomas, M. Berroth, M. Epp, J. Rauscher, M. Schlumpp
A pipelined folding-interpolating ADC with a distributed quantizer is presented. The low-mismatch analog frontend provides for excellent SFDR and SNDR without calibration or digital post processing. The algorithm of the digital coder relaxes the requirements on the interface between analog core and digital coder. The single-core ADC achieves 7.3 ENOB and a SFDR of 52.7 dBc in the 2nd Nyquist band at 6 GS/s with an overall power consumption of 10.2 W.
提出了一种带有分布式量化器的流水线式折叠插值ADC。低失配模拟前端提供出色的SFDR和SNDR,无需校准或数字后处理。数字编码器的算法放宽了对模拟核与数字编码器接口的要求。该单核ADC在第2奈奎斯特频段以6 GS/s的速度实现7.3 ENOB和52.7 dBc的SFDR,总功耗为10.2 W。
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引用次数: 3
A 19.2mW 1Gb/s secure proximity transceiver with ISI pre-correction and hysteresis energy detection 具有ISI预校正和迟滞能量检测的19.2mW 1Gb/s安全近距离收发器
Pub Date : 2016-05-22 DOI: 10.1109/RFIC.2016.7508254
Dang Liu, Xiaofeng Liu, W. Rhee, Zhihua Wang
This paper presents a 1Gb/s 6.5-to-8.5GHz transceiver for secure proximity communication systems. A prototype transceiver implemented in 65nm CMOS achieves the maximum data rate of 1Gb/s with the sensitivity of -53dBm and the communication range of 15cm. Consuming only 19.2mW, the proposed ultra-wideband (UWB) transceiver enables future applications such as smartphone-mirrored high-resolution display systems which require low power mainly for the transmitter in the smartphone, thus making it possible to further improve the transceiver performance with the complex receiver in the display equipment.
本文提出了一种用于安全近距离通信系统的1Gb/s 6.5 ~ 8.5 ghz收发器。在65nm CMOS中实现的收发器原型最大数据速率为1Gb/s,灵敏度为-53dBm,通信范围为15cm。所提出的超宽带(UWB)收发器仅消耗19.2mW,可用于未来的应用,例如智能手机镜像高分辨率显示系统,这些系统主要对智能手机中的发射器要求低功耗,从而可以进一步提高显示设备中复杂接收器的收发器性能。
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引用次数: 10
Experimental characterization of packaged switch devices for RF and millimeter-Wave applications 射频和毫米波应用的封装开关器件的实验特性
Pub Date : 2016-05-22 DOI: 10.1109/RFIC.2016.7508247
T. Dinh, P. Descamps, D. Pasquet, D. Lesenechal, S. Wane
In this paper we present experimental characterization of packaged switch devices in terms of their RF attributes: isolation, insertion loss, power consumption, and linearity. Packaging and Board assembly significantly reduce their RF and mm-Wave performances. A broadband experimental setup is developed for the qualification of packaged switch devices accounting for deembedding effects both with on-board/on-package and on-chip probing. Module-based switch devices have been measured then, plastic molding, Si cap, and bonding wires have been sequentially removed to investigate their influences. Different challenges with packaged switch devices are identified and effective solutions are proposed for their qualification.
在本文中,我们提出了封装开关器件在其RF属性方面的实验特性:隔离,插入损耗,功耗和线性度。封装和电路板组装显著降低了它们的射频和毫米波性能。开发了一种宽带实验装置,用于封装开关器件的鉴定,考虑了板上/封装上和片上探测的脱嵌入效应。然后测量了基于模块的开关器件,依次去除塑料成型、硅帽和键合线,以研究它们的影响。确定了封装开关器件的不同挑战,并提出了有效的解决方案。
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引用次数: 1
160–310 GHz frequency doubler in 65-nm CMOS with 3-dBm peak output power for rotational spectroscopy 160-310 GHz的65纳米CMOS倍频器,峰值输出功率为3 dbm,用于旋转光谱
Pub Date : 2016-05-22 DOI: 10.1109/RFIC.2016.7508282
N. Sharma, W. Choi, K. O. Kenneth
A 160-310 GHz frequency doubler for rotational spectroscopy with a driver amplifier is demonstrated in a 65-nm bulk CMOS process. At 0-dBm input power, the measured output power (Pout) varies from 3 to -8 dBm. The wide operating range is attributed to wide bandwidth driver and matching structure based on broadband open and short leading to >40dB difference between fundamental and second harmonic power at the output. The doubler-amplifier combination has the comparable output power and a larger operating frequency range than 200-300 GHz COTS GaAs modules.
介绍了一种基于驱动放大器的160-310 GHz旋转光谱倍频器,该倍频器采用65纳米体CMOS工艺。输入功率为0-dBm时,测量输出功率为3 ~ - 8dbm。宽工作范围归功于基于宽带开短的宽带驱动和匹配结构,导致输出基次谐波功率与二次谐波功率差>40dB。该双放大器组合具有与200-300 GHz COTS GaAs模块相当的输出功率和更大的工作频率范围。
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引用次数: 21
A 20dBm configurable linear CMOS RF power amplifier for multi-standard transmitters 20dBm可配置线性CMOS射频功率放大器,适用于多标准发射机
Pub Date : 2016-05-22 DOI: 10.1109/RFIC.2016.7508315
Eli Schwartz, S. Anderson, Alex Mostov, Ilya Sima, Udi Suissa, Ron Pongratz, Amit Ezer, A. Cohen, Michael Gulko, Nadav Snir, A. Elazari, A. Bauer
A new approach to PA design in CMOS for 802.11ac that achieves -35dB EVM with output power higher than 100mW and EVM floor of -47dB is demonstrated. The PA is designed to be operated as part of a configurable RF front-end module and meets the requirements for various WiFi standards including 802.11ac.
提出了一种基于CMOS的802.11ac放大器设计新方法,该方法在输出功率高于100mW的情况下实现-35dB EVM, EVM下限为-47dB。该PA被设计为可配置射频前端模块的一部分,满足包括802.11ac在内的各种WiFi标准的要求。
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引用次数: 7
A 200 MSPS reconfigurable ADC with adjacent channel narrowband blocker resiliency 具有相邻通道窄带阻塞器弹性的200 MSPS可重构ADC
Pub Date : 2016-05-22 DOI: 10.1109/RFIC.2016.7508321
Sushil Subramanian, H. Hashemi
A 200 MSPS reconfigurable and blocker resilient analog-to-digital converter (ADC) is presented. The system consists of a discrete-time lossy differentiator frontend and a 6-bit noise shaping, pipeline ADC backend, which enables tolerance of a <;3 MHz narrowband blocker up to 40 dB stronger than the desired signal. Filtering in the presence of the blocker improves quantization by an additional 3 bits to accommodate the desired signal. With lower blocker power, the system defaults to Nyquist performance and an additional reconfiguration switch enables a 3-6 MHz, ΔΣ ADC. The system is designed in a 65 nm CMOS technology, has a total chip area of 1040 μm × 920 μm, and consumes 6.37 mW of power. Enabling blocker resilience improves the figure-of-merit (FOM) of the system from 474 fJ/lvl to 158 fJ/lvl.
提出了一种200 MSPS可重构阻塞弹性模数转换器(ADC)。该系统由一个离散时间有损微分器前端和一个6位噪声整形、流水线ADC后端组成,可实现比期望信号强40 dB的< 3 MHz窄带阻塞容差。在阻断器存在的情况下,滤波通过额外的3位来改善量化,以容纳所需的信号。由于阻塞器功率较低,系统默认为奈奎斯特性能,并且额外的重新配置开关可实现3-6 MHz, ΔΣ ADC。该系统采用65 nm CMOS技术设计,总芯片面积为1040 μm × 920 μm,功耗为6.37 mW。启用阻滞剂弹性可以将系统的性能系数(FOM)从474 fJ/lvl提高到158 fJ/lvl。
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2016 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)
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