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アルミニウムチップからFriction Stir Back Extrusionにより作製したアルミニウムパイプ Friction Stir Back Extrusion从铝芯片制成的铝管
4区 材料科学 Q4 METALLURGY & METALLURGICAL ENGINEERING Pub Date : 2017-11-17 DOI: 10.2320/JINSTMET.J2017045
禎彦 半谷, 龍生 小林, 良祐 鈴木, 雅昭 松原, 暢宏 吉川
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引用次数: 2
Development of measurement system for ph distribution on metal surface under atmospheric corrosion 大气腐蚀下金属表面ph分布测量系统的研制
4区 材料科学 Q4 METALLURGY & METALLURGICAL ENGINEERING Pub Date : 2017-09-25 DOI: 10.2320/JINSTMET.JAW201704
Youhei Hirohata, Kentaro Nishida, T. Haruna, K. Noda
Thin water film is formed on metal surfaces that are exposed to the atmosphere. The conditions of this film change according to environmental factors, such as temperature, wind, and rainfall. Hence, it is difficult to investigate atmospheric corrosion on metal surfaces.This paper aimed to develop a measurement system for the pH distribution on a metal surface in simulated atmospheric envi -ronment. The surface pH distribution was measured with agar film including pH indicators and MgCl 2 . The pH indicators used were a universal indicator and an MR ︲ BTB indicator. Agar film of 0 . 5 mm thickness was placed on an iron specimen. The specimen was set in a chamber with a relative humidity of 100 % to prevent the agar film from drying out. The surface pH distribution was deter - mined from the color of the agar film with an RGB color model. The surface pH distribution on the iron showed that anodic reac tions produced acidic regions and cathodic reactions produced basic regions. The observed phenomena were the same as that found under a water droplet which contained the pH indicator and MgCl 2 . Therefore, we conclude that the agar film could simulate thin water film in an atmospheric environment and allow measurement of the surface pH distribution on iron under corro sion.
暴露在大气中的金属表面会形成一层薄薄的水膜。这种薄膜的条件根据环境因素,如温度、风和降雨而变化。因此,研究大气对金属表面的腐蚀是困难的。本文旨在研制一种模拟大气环境下金属表面pH值分布的测量系统。用琼脂膜(含pH指示剂和氯化镁)测定表面pH分布。使用的pH指示剂为通用指示剂和MR︲BTB指示剂。琼脂膜0。在铁试样上放置5mm的厚度。将标本置于相对湿度为100%的室中,以防止琼脂膜变干。用RGB颜色模型测定了琼脂膜的表面pH值分布。铁表面的pH分布表明,阳极反应产生酸性区,阴极反应产生碱性区。所观察到的现象与在含有pH指示剂和mgcl2的水滴下发现的现象相同。因此,我们得出结论,琼脂膜可以模拟大气环境中的薄水膜,并可以测量铁在腐蚀下的表面pH分布。
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引用次数: 2
High Temperature Corrosion of Ni-5, -8 and -10 at%Al Alloys in Air with a Trace Amount of NaCl Vapor 微量NaCl蒸气对Ni-5、-8和-10 at%Al合金的高温腐蚀
4区 材料科学 Q4 METALLURGY & METALLURGICAL ENGINEERING Pub Date : 2017-09-01 DOI: 10.2320/JINSTMET.JB201702
Y. Sato, K. Kawabe, K. Sugawara, M. Hara
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引用次数: 1
Ti-xNb-7Alの焼戻しに伴うβ→α″変態に及ぼすNb添加量の影響 Nb添加量对Ti-xNb-7Al的回火产生的β→α’变态的影响
4区 材料科学 Q4 METALLURGY & METALLURGICAL ENGINEERING Pub Date : 2017-07-01 DOI: 10.2320/JINSTMET.J2017011
Masataka Ijiri, Yukihito Tomita, Takafumi Ishikawa, K. Kadowaki, Y. Takemoto
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引用次数: 1
Effect of Cu and Ni addition on high temperature deformation behavior in Sn-Cu-Ni solder alloys Cu和Ni加入对Sn-Cu-Ni钎料合金高温变形行为的影响
4区 材料科学 Q4 METALLURGY & METALLURGICAL ENGINEERING Pub Date : 2017-05-12 DOI: 10.2320/JINSTMET.J2016069
M. Takano, Keiji Kuroda, Kohei Hase, Shuuto Tanaka, S. Yamasaki, M. Mitsuhara, H. Nakashima
In recent years, it has become necessary to develop lead substitutes, such as lead–free solder alloys, because of increased environmental concerns regarding the use of leaded materials. In addition, electronic components that use lead–free solder alloys will need to be smaller and usable at higher operating temperatures in next–generation semiconductor devices. Therefore, lead–free solder alloys must be made more reliable. In this work, tin–copper–nickel (Sn–Cu–Ni) solder alloys, Sn–Cu solder alloys, and Sn–Ni solder alloys, as well as 99.96 mass% pure Sn, were subjected to tensile testing. The results showed the effects of adding Cu and Ni to Sn on the high–temperature deformation behavior of the Sn–Cu–Ni solder alloys. For each alloy and Sn, the stress exponent was estimated to be >5. This result indicated that, in each sample, the high–temperature deformation was controlled by dislocation creep. Furthermore, the creep activation energy was dependent on stress, and was affected to the greatest extent when adding Cu. [doi:10.2320/jinstmet.J2016069]
近年来,由于使用含铅材料引起的环境问题日益严重,有必要开发铅替代品,例如无铅焊料合金。此外,在下一代半导体器件中,使用无铅焊料合金的电子元件需要更小,并能在更高的工作温度下使用。因此,必须使无铅焊料合金更加可靠。本文对锡-铜-镍(Sn - cu - ni)钎料合金、Sn - cu钎料合金和Sn - ni钎料合金以及99.96质量%纯锡进行了拉伸试验。结果表明,在Sn中加入Cu和Ni对Sn - Cu - Ni钎料合金的高温变形行为有影响。各合金和Sn的应力指数均大于5。结果表明,各试样的高温变形均受位错蠕变控制。蠕变活化能与应力有关,其中Cu对蠕变活化能的影响最大。(doi: 10.2320 / jinstmet.J2016069)
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引用次数: 0
Molecular Dynamics Study on Structural Relaxation Processes in Amorphous Germanium 非晶锗结构弛豫过程的分子动力学研究
4区 材料科学 Q4 METALLURGY & METALLURGICAL ENGINEERING Pub Date : 2017-04-14 DOI: 10.2320/JINSTMET.J2016051
Shigetaka Imabayashi, M. Ishimaru
The structural relaxation of amorphous germanium was examined by molecular dynamics simulations based on the empirical Tersoff interatomic potential. Although the Tersoff potential overestimated both the melting and glass transition temperatures, it was able to reproduce the structural relaxation behavior. The potential energy decreases with thermal annealing below the glass transition temperature, but occasionally increases during structural relaxation. The mean square displacement of atoms also increases in these periods. These changes were attributed to cooperative atomic motion during the structural relaxation. Atomic trajectories revealed that structural changes are induced by spatiallyand temporally-inhomogeneous atomic motions: atomically mobile and immobile regions coexist during structural relaxation. [doi:10.2320/matertrans.M2017036]
基于经验Tersoff原子间势的分子动力学模拟研究了非晶态锗的结构弛豫。虽然Tersoff势高估了熔融温度和玻璃化转变温度,但它能够再现结构弛豫行为。在玻璃化转变温度以下,势能随热退火而减小,但在结构弛豫过程中偶尔增大。原子的均方位移也在这些周期内增加。这些变化归因于结构弛豫过程中的协同原子运动。原子轨迹揭示了结构变化是由空间和时间上的非均匀原子运动引起的:在结构弛豫过程中,原子可动区和不动区共存。(doi: 10.2320 / matertrans.M2017036)
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引用次数: 2
ガスブローIH窒化を施したTi-6Al-4V合金の表面特性に及ぼすガス流速の影響 气体流速对采用IH气吹氮化的Ti-6Al-4V合金表面特性的影响
4区 材料科学 Q4 METALLURGY & METALLURGICAL ENGINEERING Pub Date : 2017-04-07 DOI: 10.2320/JINSTMET.JBW201605
Shogo Takesue, S. Kikuchi, H. Akebono, J. Komotori, Kengo Fukazawa, Yoshitaka Misaka
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引用次数: 0
Frontier of recycling technology for precious metals 贵金属回收技术的前沿
4区 材料科学 Q4 METALLURGY & METALLURGICAL ENGINEERING Pub Date : 2017-04-01 DOI: 10.2320/JINSTMET.JPR2017901
Yu-ki Taninouchi, T. Okabe
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引用次数: 0
Activation stress for slip systems of pure magnesium single crystals in pure shear test 纯剪切试验中纯镁单晶滑移体系的激活应力
4区 材料科学 Q4 METALLURGY & METALLURGICAL ENGINEERING Pub Date : 2017-04-01 DOI: 10.2320/JINSTMET.J2015062
Kazutaka Fukuda, Y. Koyanagi, M. Tsushida, H. Kitahara, T. Mayama, S. Ando
1Graduate School of Science and Technology, Kumamoto University, Kumamoto 8608555 2Department of Materials Science and Engineering, Faculty of Engineering, Kumamoto University, Kumamoto 8608555 3Faculty of Engineering, Kumamoto University, Kumamoto 8608555 4Institute of Pulsed Power Science, Kumamoto University, Kumamoto 8608555 5Priority Organization for Innovation and Excellence, Kumamoto University, Kumamoto 8608555 6Magnesium Research Center, Kumamoto University, Kumamoto 8608555
1熊本大学科学技术研究生院熊本8608555 2熊本大学工学院材料科学与工程系熊本8608555 3熊本大学工学院熊本8608555 4熊本大学脉冲功率科学研究所熊本8608555 5熊本大学创新与卓越优先组织熊本8608555 6熊本大学镁研究中心熊本8608555
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引用次数: 12
高Sc濃度を有するMg-Sc-Zn系合金の引張変形挙動に及ぼす初期組織の影響 初始组织对具有高Sc浓度的Mg-Sc-Zn类合金的拉伸变形行为的影响
4区 材料科学 Q4 METALLURGY & METALLURGICAL ENGINEERING Pub Date : 2017-03-31 DOI: 10.2320/JINSTMET.JBW201612
悠 竹内, 小川 由希子, 大輔 安藤, 祐司 須藤, 淳一 小池
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引用次数: 1
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