Single-crystal silicon carbide (4H-SiC) is widely recognized for its exceptional physical and chemical properties, which make it an essential material in high-end electronic devices and optoelectronics; however, the challenges posed by its high hardness and chemical inertness complicate the processing of its surface. This study sought to enhance the material removal rate during 4H-SiC surface processing using microwave plasma modification-assisted shear-thickening polishing by focusing on the surface modification rate. The impacts of the microwave irradiation parameters on the surface modification of 4H-SiC were investigated using simulations, orthogonal experiments, and single-factor experiments. The temperature and velocity distributions of the microwave plasma torch were simulated using the COMSOL Multiphysics software, providing valuable theoretical insights. An orthogonal experiment was subsequently conducted to analyze the effects of the microwave power level, Ar flow rate, O2 flow rate, and scanning speed on the surface modification process and inform the determination of the optimal processing conditions. Finally, the results of the orthogonal experiments were validated through single-factor experiments determining that a processing power of 160 W, Ar flow rate of 5500 sccm, O2 flow rate of 8 sccm, scanning speed of 65 mm/min, and scanning grid spacing of 1 mm provided a uniform modified layer with a thickness of 139.59 ± 3.08 nm generated at a remarkable 453.67 ± 10 nm/h. The results of this study offer a theoretical foundation and experimental guidance for improving the microwave plasma modification of 4H-SiC, which is crucial for advancing the application of this material.
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