Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838536
J. Ducrée, H. Gruhler, N. Hey, M. Muller, S. Békési, M. Freygang, H. Sandmaiser, R. Zengerle
This article outlines the new non-contact TOPSPOT method for printing microarrays in a highly parallelized fashion. It is based on a micromachined print head incorporating a central microarray of presently up to 96 vertical nozzles on the output side. Droplets featuring volumes down to 1nl aligned in a 500 /spl mu/m grid are simultaneously ejected by applying a steep air pressure ramp to the open upper side of the liquid. Each of these nozzles is connected to a distinct fluidic reservoir constituting the interface to the macro world. To allow an automated replenishing of the chip, the alignment of the reservoirs is amenable for liquid handling via standard pipetting robots. Depending on the design of the print head, a maximum of 20 /spl mu/l can be stored thus allowing one to dispend about 20.000 droplets of equal quality in a row. Besides its suitability for a robust biochip manufacturing facility in the laboratory, the print head is also well-integrable in a high-throughput production plant. These versions are scheduled to become commercially available in 2000.
本文概述了一种新的非接触式TOPSPOT方法，用于以高度并行化的方式打印微阵列。它是基于一个微机械打印头结合中央微阵列目前多达96个垂直喷嘴在输出侧。液滴的体积低至1nl，排列在500 /spl / mu/m的网格中，同时通过在液体的开放上方施加陡峭的空气压力坡道喷射出来。这些喷嘴中的每一个都连接到一个不同的储液器，构成了与宏观世界的界面。为了实现芯片的自动补充，储层的对齐可以通过标准移液机器人进行液体处理。根据打印头的设计，最多可存储20 μ l / μ l，从而允许连续分发约20,000个相同质量的液滴。除了适合实验室中强大的生物芯片制造设施外，打印头也可以很好地集成到高通量生产工厂中。这些版本计划在2000年投入商用。
{"title":"TOPSPOT-a new method for the fabrication of microarrays","authors":"J. Ducrée, H. Gruhler, N. Hey, M. Muller, S. Békési, M. Freygang, H. Sandmaiser, R. Zengerle","doi":"10.1109/MEMSYS.2000.838536","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838536","url":null,"abstract":"This article outlines the new non-contact TOPSPOT method for printing microarrays in a highly parallelized fashion. It is based on a micromachined print head incorporating a central microarray of presently up to 96 vertical nozzles on the output side. Droplets featuring volumes down to 1nl aligned in a 500 /spl mu/m grid are simultaneously ejected by applying a steep air pressure ramp to the open upper side of the liquid. Each of these nozzles is connected to a distinct fluidic reservoir constituting the interface to the macro world. To allow an automated replenishing of the chip, the alignment of the reservoirs is amenable for liquid handling via standard pipetting robots. Depending on the design of the print head, a maximum of 20 /spl mu/l can be stored thus allowing one to dispend about 20.000 droplets of equal quality in a row. Besides its suitability for a robust biochip manufacturing facility in the laboratory, the print head is also well-integrable in a high-throughput production plant. These versions are scheduled to become commercially available in 2000.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128068355","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838482
N. Takeda
This paper describes Ball semiconductor technology that realizes integrated circuits and other devices on 1-milimeter sphere. Single crystallization, no-contact processing, spherical lithography, 3D VLSI design and VLSI by clustering are five key enabling technologies of the Ball semiconductor. Three major product categories of the Ball, integrated circuits, RF applications and MEMS (Micro Electro Mechanical System), are described here. Especially electro-statically levitated 3-axis accelerometer is mentioned as an application of Ball semiconductor technology to MEMS.
{"title":"Ball semiconductor technology and its application to MEMS","authors":"N. Takeda","doi":"10.1109/MEMSYS.2000.838482","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838482","url":null,"abstract":"This paper describes Ball semiconductor technology that realizes integrated circuits and other devices on 1-milimeter sphere. Single crystallization, no-contact processing, spherical lithography, 3D VLSI design and VLSI by clustering are five key enabling technologies of the Ball semiconductor. Three major product categories of the Ball, integrated circuits, RF applications and MEMS (Micro Electro Mechanical System), are described here. Especially electro-statically levitated 3-axis accelerometer is mentioned as an application of Ball semiconductor technology to MEMS.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"59 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133642264","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838480
C. Hierold
CMOS including micromechanics using polysilicon structures as functional layers is a promising technology for production of Intelligent CMOS Sensors. Its cost and performance advantages allow to address volume markets like monolithic integrated sensors for automotive application. Using modern silicon processes and their potential for large scale integration, new functions like on-chip calibration and diagnosis are possible. Furthermore, it offers direct digital output signals which is ideal for data processing in microcontrollers. In this technology, the non electric functional blocks (e.g. membranes for pressure sensors) can be miniaturized in a way so that they do not impose a chip real-estate penalty. This immediately reduces the production cost immensely. We will demonstrate the superiority of CMOS as technology for integrated sensors by two examples: An integrated pressure sensor and an integrated fingertip sensor system.
{"title":"Intelligent CMOS sensors","authors":"C. Hierold","doi":"10.1109/MEMSYS.2000.838480","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838480","url":null,"abstract":"CMOS including micromechanics using polysilicon structures as functional layers is a promising technology for production of Intelligent CMOS Sensors. Its cost and performance advantages allow to address volume markets like monolithic integrated sensors for automotive application. Using modern silicon processes and their potential for large scale integration, new functions like on-chip calibration and diagnosis are possible. Furthermore, it offers direct digital output signals which is ideal for data processing in microcontrollers. In this technology, the non electric functional blocks (e.g. membranes for pressure sensors) can be miniaturized in a way so that they do not impose a chip real-estate penalty. This immediately reduces the production cost immensely. We will demonstrate the superiority of CMOS as technology for integrated sensors by two examples: An integrated pressure sensor and an integrated fingertip sensor system.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133131374","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838528
X. Li, T. Abe, M. Esashi
We have developed a deep reactive ion etching of Pyrex glass in SF/sub 6/ plasma. High etch rate (/spl sim/0.6 /spl mu/m/min) and smooth surface (Ra-4 nm) were achieved at low pressure (0.2 Pa) and high self-bias (-390 V). This result indicates energetic ions for physical sputtering and for enhancing chemical reactions are required to etch materials which produce nonvolatile reaction products. Vertical etch profile (base angle /spl sim/88/spl deg/), high aspect ratio (>10) and through-out etching of Pyrex glass (200 /spl mu/m in thickness) were achieved when the mask opening is narrower than 20 /spl mu/m. Relatively low selectivity to the mask material due to the energetic ion is overcame using thick and vertical electroplated Ni film as a mask. We also find out the base angle of the etch profile depends on the mask profile and the opening width.
{"title":"Deep reactive ion etching of Pyrex glass","authors":"X. Li, T. Abe, M. Esashi","doi":"10.1109/MEMSYS.2000.838528","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838528","url":null,"abstract":"We have developed a deep reactive ion etching of Pyrex glass in SF/sub 6/ plasma. High etch rate (/spl sim/0.6 /spl mu/m/min) and smooth surface (Ra-4 nm) were achieved at low pressure (0.2 Pa) and high self-bias (-390 V). This result indicates energetic ions for physical sputtering and for enhancing chemical reactions are required to etch materials which produce nonvolatile reaction products. Vertical etch profile (base angle /spl sim/88/spl deg/), high aspect ratio (>10) and through-out etching of Pyrex glass (200 /spl mu/m in thickness) were achieved when the mask opening is narrower than 20 /spl mu/m. Relatively low selectivity to the mask material due to the energetic ion is overcame using thick and vertical electroplated Ni film as a mask. We also find out the base angle of the etch profile depends on the mask profile and the opening width.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133818578","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838550
Linan Jiang, M. Wong, Y. Zohar
A microchannel heat sink system, consisting of parallel microchannels, distributed temperature micro-sensors and a local heater, has been fabricated and characterized. V-grooves with hydraulic diameter of either 40 /spl mu/m or 80 /spl mu/m were formed by bulk silicon etching. The heater and temperature microsensor array were fabricated using surface micromachining. Microchannels were realized by bonding a glass wafer to the silicon substrate, resulting in a transparent cover for flow visualization. Phase change during the boiling process was studied under forced convection conditions, where DI water was used as the working fluid. No boiling plateau, associated with latent heat, has been observed in the boiling curves of microchannel heat sinks. Flow visualization was carried out to understand the boiling mechanism in such a system. Three phase-change modes were observed depending on the input power level. Local nucleation boiling within the microchannels occurred at low power level. At moderate levels, large bubbles developed at the inlet/outlet regions, and the upstream bubbles were forced through the channels and out of the system. At higher input power levels, a stable annular flow mode was observed, where a thin liquid film coated each channel wall until critical heat flux conditions developed with a dryout of the system.
{"title":"Phase change in microchannel heat sink under forced convection boiling","authors":"Linan Jiang, M. Wong, Y. Zohar","doi":"10.1109/MEMSYS.2000.838550","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838550","url":null,"abstract":"A microchannel heat sink system, consisting of parallel microchannels, distributed temperature micro-sensors and a local heater, has been fabricated and characterized. V-grooves with hydraulic diameter of either 40 /spl mu/m or 80 /spl mu/m were formed by bulk silicon etching. The heater and temperature microsensor array were fabricated using surface micromachining. Microchannels were realized by bonding a glass wafer to the silicon substrate, resulting in a transparent cover for flow visualization. Phase change during the boiling process was studied under forced convection conditions, where DI water was used as the working fluid. No boiling plateau, associated with latent heat, has been observed in the boiling curves of microchannel heat sinks. Flow visualization was carried out to understand the boiling mechanism in such a system. Three phase-change modes were observed depending on the input power level. Local nucleation boiling within the microchannels occurred at low power level. At moderate levels, large bubbles developed at the inlet/outlet regions, and the upstream bubbles were forced through the channels and out of the system. At higher input power levels, a stable annular flow mode was observed, where a thin liquid film coated each channel wall until critical heat flux conditions developed with a dryout of the system.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130331003","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838621
M. Takeda, K. Namura, K. Nakamura, N. Shibaike, T. Haga, H. Takada
Using micromachine technology, we have developed the first prototype of a multiple distributed micromachine system, in which a micromachine can be driven in both the horizontal and vertical directions and automatically connect to and disconnect from adjacent micromachines. The developed micromachine is the world's smallest machine (width: 9 mm, length: 5 mm, height: 6.5 mm, weight: 0.42 g) that can travel in both the horizontal and vertical directions. This paper gives an overview of the prototype and its travel and connection/disconnection performance. The following conclusions were obtained: (1) The developed magnetic wheel-driven micromachine is able to travel both horizontally and vertically. (2) Automatic connection and disconnection are realized by using newly developed microconnectors.
{"title":"Development of chain-type micromachine for inspection of outer tube surfaces (basic performance of the 1st prototype)","authors":"M. Takeda, K. Namura, K. Nakamura, N. Shibaike, T. Haga, H. Takada","doi":"10.1109/MEMSYS.2000.838621","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838621","url":null,"abstract":"Using micromachine technology, we have developed the first prototype of a multiple distributed micromachine system, in which a micromachine can be driven in both the horizontal and vertical directions and automatically connect to and disconnect from adjacent micromachines. The developed micromachine is the world's smallest machine (width: 9 mm, length: 5 mm, height: 6.5 mm, weight: 0.42 g) that can travel in both the horizontal and vertical directions. This paper gives an overview of the prototype and its travel and connection/disconnection performance. The following conclusions were obtained: (1) The developed magnetic wheel-driven micromachine is able to travel both horizontally and vertically. (2) Automatic connection and disconnection are realized by using newly developed microconnectors.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"251 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114158430","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838590
T. Yao, Sangwook Lee, W. Fang, Y. Tai
In this paper, we present a novel type of a "quick-connect" for micro-fluidic devices realized by a simple silicone-rubber O-ring MEMS coupler. As shown in this work, the proposed O-ring couplers are easy to fabricate and utilize, reusable, can withstand high pressure (>60 psi), and provide good seals. In the paper, results from both the leak rate test and pull-out test are presented, demonstrating the functionality of the O-ring couplers.
{"title":"Micromachined rubber O-ring micro-fluidic couplers","authors":"T. Yao, Sangwook Lee, W. Fang, Y. Tai","doi":"10.1109/MEMSYS.2000.838590","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838590","url":null,"abstract":"In this paper, we present a novel type of a \"quick-connect\" for micro-fluidic devices realized by a simple silicone-rubber O-ring MEMS coupler. As shown in this work, the proposed O-ring couplers are easy to fabricate and utilize, reusable, can withstand high pressure (>60 psi), and provide good seals. In the paper, results from both the leak rate test and pull-out test are presented, demonstrating the functionality of the O-ring couplers.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114672317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838532
D. Armani, Chang Liu
In this paper, we report the development of micromachining techniques for a biodegradable polymer for the first time. By virtue of their ability to naturally degrade in tissues, biodegradable polymers hold immense promise as new materials for implantable biomedical microdevices. This work focuses on establishment of microfabrication processes for biodegradable microstructures and microdevices. Three unique fabrication processes have been established: (1) micro-molding process to form 3D microstructures in polycaprolactone (PCL) via a silicon micromachined mold; (2) a method of transferring metal patterns to surfaces of PCL substrates; (3) techniques for sealing both dry and liquid-filled PCL micro-cavities with a metal thin film (e.g. gold). Chemical compatibility of PCL with common micromachining chemicals have been investigated.
{"title":"Microfabrication technology for polycaprolactone, a biodegradable polymer","authors":"D. Armani, Chang Liu","doi":"10.1109/MEMSYS.2000.838532","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838532","url":null,"abstract":"In this paper, we report the development of micromachining techniques for a biodegradable polymer for the first time. By virtue of their ability to naturally degrade in tissues, biodegradable polymers hold immense promise as new materials for implantable biomedical microdevices. This work focuses on establishment of microfabrication processes for biodegradable microstructures and microdevices. Three unique fabrication processes have been established: (1) micro-molding process to form 3D microstructures in polycaprolactone (PCL) via a silicon micromachined mold; (2) a method of transferring metal patterns to surfaces of PCL substrates; (3) techniques for sealing both dry and liquid-filled PCL micro-cavities with a metal thin film (e.g. gold). Chemical compatibility of PCL with common micromachining chemicals have been investigated.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114801938","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838578
T. Katoh, N. Nishi, M. Fukagawa, H. Ueno, S. Sugiyama
This paper presents rapid three-dimensional microfabrication technologies for PTFE by direct writing with the TIEGA process, a LIGA-like process which replaces hard X-ray lithography with synchrotron radiation (SR) direct photo-etching. The etching rates of this process are of the order of 6-100 /spl mu/m/min, depending on the photon flux of the SR light. An X-ray lathe has been modified into an SR etching lathe to form cylindrical, helical, pyramidal, ellipsoidal, and other nonplanar objects. A metallic wire covered with a PTFE sheet is rotated and/or moved while being irradiated with SR through a mask. Moreover, direct writing without using any masks has been developed, by combining a scanning stage with a high degree of freedom under an He atmosphere, for creating any microstructure. The capabilities of these technologies and initial fabrication results are described here.
{"title":"Direct writing for three-dimensional microfabrication using synchrotron radiation etching","authors":"T. Katoh, N. Nishi, M. Fukagawa, H. Ueno, S. Sugiyama","doi":"10.1109/MEMSYS.2000.838578","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838578","url":null,"abstract":"This paper presents rapid three-dimensional microfabrication technologies for PTFE by direct writing with the TIEGA process, a LIGA-like process which replaces hard X-ray lithography with synchrotron radiation (SR) direct photo-etching. The etching rates of this process are of the order of 6-100 /spl mu/m/min, depending on the photon flux of the SR light. An X-ray lathe has been modified into an SR etching lathe to form cylindrical, helical, pyramidal, ellipsoidal, and other nonplanar objects. A metallic wire covered with a PTFE sheet is rotated and/or moved while being irradiated with SR through a mask. Moreover, direct writing without using any masks has been developed, by combining a scanning stage with a high degree of freedom under an He atmosphere, for creating any microstructure. The capabilities of these technologies and initial fabrication results are described here.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"708 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114083087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838515
N. Tas, C. Gui, M. Elwenspoek
Static friction in shearing mode can be expressed as the product of the shear strength of the interface and the real contact area. The influence of roughness on friction in elastic adhesive contact is analyzed. Special attention is paid to low loading conditions, in which the number of contact points is small. The models are used to analyze a friction experiment in a MEMS friction meter.
{"title":"Static friction in elastic adhesive MEMS contacts, models and experiment","authors":"N. Tas, C. Gui, M. Elwenspoek","doi":"10.1109/MEMSYS.2000.838515","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838515","url":null,"abstract":"Static friction in shearing mode can be expressed as the product of the shear strength of the interface and the real contact area. The influence of roughness on friction in elastic adhesive contact is analyzed. Special attention is paid to low loading conditions, in which the number of contact points is small. The models are used to analyze a friction experiment in a MEMS friction meter.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123352156","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：