Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838609
A. Dessai, Sangwook Lee, Y. Tai
In order to have a working bio-particle analysis system, a method of capturing the particles from the air into the liquid is required. Here, we report a complete MEMS system that includes an air-to-liquid MEMS interface (made of glass and PDMS) for airborne bioparticle (<10 /spl mu/m) analysis, and demonstrate its successful integration with our DEP (dielectrophoretic) particle transportation and active filter membrane technology. Two types of air-to-liquid interfaces were investigated. The first, consisted of a stationary meniscus with moving particles; and second, stationary particles with an oscillating liquid meniscus. Due to large interfacial forces required in penetrating the liquid meniscus, the first design performed inadequately. However, these roadblocks were eliminated in the second technique and demonstrated as a working system.
{"title":"An air-to-liquid MEMS particle sampler","authors":"A. Dessai, Sangwook Lee, Y. Tai","doi":"10.1109/MEMSYS.2000.838609","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838609","url":null,"abstract":"In order to have a working bio-particle analysis system, a method of capturing the particles from the air into the liquid is required. Here, we report a complete MEMS system that includes an air-to-liquid MEMS interface (made of glass and PDMS) for airborne bioparticle (<10 /spl mu/m) analysis, and demonstrate its successful integration with our DEP (dielectrophoretic) particle transportation and active filter membrane technology. Two types of air-to-liquid interfaces were investigated. The first, consisted of a stationary meniscus with moving particles; and second, stationary particles with an oscillating liquid meniscus. Due to large interfacial forces required in penetrating the liquid meniscus, the first design performed inadequately. However, these roadblocks were eliminated in the second technique and demonstrated as a working system.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128857206","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838495
J. Shinohara, M. Suda, K. Furuta, T. Sakuhara
A novel micropump that has two active and normally-closed valves was developed using micromachine technology. This micropump can pump in forward and backward direction, and hold the fluid without consuming energy even when the fluid source has some pressure. This normally-closed valve is manufactured in the way of filling up silicone rubber paste after bonding glass substrate and silicon substrate. This silicone rubber works as a "gate" for shutting off the flow. Therefore, high pressure-resistance micropump is realized with no influence of fabrication error. In this paper, basic characteristics of this micropump about flow rate, outlet pressure and pressure-resistance are described.
{"title":"A high pressure-resistance micropump using active and normally-closed valves","authors":"J. Shinohara, M. Suda, K. Furuta, T. Sakuhara","doi":"10.1109/MEMSYS.2000.838495","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838495","url":null,"abstract":"A novel micropump that has two active and normally-closed valves was developed using micromachine technology. This micropump can pump in forward and backward direction, and hold the fluid without consuming energy even when the fluid source has some pressure. This normally-closed valve is manufactured in the way of filling up silicone rubber paste after bonding glass substrate and silicon substrate. This silicone rubber works as a \"gate\" for shutting off the flow. Therefore, high pressure-resistance micropump is realized with no influence of fabrication error. In this paper, basic characteristics of this micropump about flow rate, outlet pressure and pressure-resistance are described.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126392300","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838500
Mingxiang Wang, Z. Meng, Y. Zohar, M. Wong
A novel metal-induced lateral crystallization (MILC) technique has been applied to the formation of polycrystalline silicon (poly-Si) with greatly enhanced material characteristics. Compared to conventional poly-Si, MILC poly-Si gives rise to much improved performance not only in sensors but also in thin film transistors. A variety of sensing and electronic devices can be realized simultaneously on MILC poly-Si, thus making MILC an enabling technology for integrated silicon micro-machining.
{"title":"A new polycrystalline silicon technology for integrated sensor applications","authors":"Mingxiang Wang, Z. Meng, Y. Zohar, M. Wong","doi":"10.1109/MEMSYS.2000.838500","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838500","url":null,"abstract":"A novel metal-induced lateral crystallization (MILC) technique has been applied to the formation of polycrystalline silicon (poly-Si) with greatly enhanced material characteristics. Compared to conventional poly-Si, MILC poly-Si gives rise to much improved performance not only in sensors but also in thin film transistors. A variety of sensing and electronic devices can be realized simultaneously on MILC poly-Si, thus making MILC an enabling technology for integrated silicon micro-machining.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121119603","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838617
H. Takao, H. Fukumoto, M. Ishida
In the present study, a fabrication technology of bulk-micromachined three-axis accelerometer integrated with commercial CMOS circuits has been investigated for low cost realization and improvement of device performance. The key technologies in the developed fabrication technology are wafer thickness control, backside polishing with chemical spin etching and anisotropic etching with PVD SiO/sub 2/ mask. The signal processing circuits were fabricated with a commercial 0.8 /spl mu/m-CMOS technology, and all the micromachining processes were performed to complete CMOS wafers. Characteristics of the devices and reliability for the repetitive vibration load were evaluated. As a result, basic performance of the accelerometers with this technology was confirmed.
{"title":"Fabrication of a three-axis accelerometer integrated with commercial 0.8 /spl mu/m-CMOS circuits","authors":"H. Takao, H. Fukumoto, M. Ishida","doi":"10.1109/MEMSYS.2000.838617","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838617","url":null,"abstract":"In the present study, a fabrication technology of bulk-micromachined three-axis accelerometer integrated with commercial CMOS circuits has been investigated for low cost realization and improvement of device performance. The key technologies in the developed fabrication technology are wafer thickness control, backside polishing with chemical spin etching and anisotropic etching with PVD SiO/sub 2/ mask. The signal processing circuits were fabricated with a commercial 0.8 /spl mu/m-CMOS technology, and all the micromachining processes were performed to complete CMOS wafers. Characteristics of the devices and reliability for the repetitive vibration load were evaluated. As a result, basic performance of the accelerometers with this technology was confirmed.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"235 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115577876","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838587
U. Munch, O. Brand, O. Paul, H. Baltes, M. Bossel
This paper reports a new protection for the front side of fully processed CMOS wafers against KOH etching solutions. The protection is based on thin TiW and Au films and is fully CMOS compatible. No mechanical fixture is required during the anisotropic etching step. Therefore, the new method is excellently suited for batch micromachining. Up to 100% of all chips on 6 inch wafers were fully operational after 4 hours KOH etching. The membrane yield after KOH etching was 100% and nearly 90% after the not yet optimized removal of the protection films. Thus, this protection fulfils the requirements of inexpensive and reliable sensor production.
{"title":"Metal film protection of CMOS wafers against KOH","authors":"U. Munch, O. Brand, O. Paul, H. Baltes, M. Bossel","doi":"10.1109/MEMSYS.2000.838587","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838587","url":null,"abstract":"This paper reports a new protection for the front side of fully processed CMOS wafers against KOH etching solutions. The protection is based on thin TiW and Au films and is fully CMOS compatible. No mechanical fixture is required during the anisotropic etching step. Therefore, the new method is excellently suited for batch micromachining. Up to 100% of all chips on 6 inch wafers were fully operational after 4 hours KOH etching. The membrane yield after KOH etching was 100% and nearly 90% after the not yet optimized removal of the protection films. Thus, this protection fulfils the requirements of inexpensive and reliable sensor production.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123267659","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838602
N. Kaou, V. Armbruster, J. Jeannot, P. Mollier, H. Porte, N. Devoldère, M. de Labachelerie
This paper describes the fabrication of a new mechanical microconnector, which is used for the precise optical self-alignment of multi-waveguide Optical Integrated Circuits (OIC) to ribbon optical fibers, without injecting light in the fiber. Nickel alignment pins are electrodeposited on the OIC using a photolithographic process, and the pins are inserted into suitable openings made on a silicon micromachined platform, on which optical fibers are accurately positioned using V-grooves. Design and fabrication issues are reported, as well as preliminary experimental results which show that excess optical losses on the order of 3 dB can be obtained.
{"title":"Microconnectors for the passive alignment of optical waveguides and ribbon optical fibers","authors":"N. Kaou, V. Armbruster, J. Jeannot, P. Mollier, H. Porte, N. Devoldère, M. de Labachelerie","doi":"10.1109/MEMSYS.2000.838602","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838602","url":null,"abstract":"This paper describes the fabrication of a new mechanical microconnector, which is used for the precise optical self-alignment of multi-waveguide Optical Integrated Circuits (OIC) to ribbon optical fibers, without injecting light in the fiber. Nickel alignment pins are electrodeposited on the OIC using a photolithographic process, and the pins are inserted into suitable openings made on a silicon micromachined platform, on which optical fibers are accurately positioned using V-grooves. Design and fabrication issues are reported, as well as preliminary experimental results which show that excess optical losses on the order of 3 dB can be obtained.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"9 20","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120842687","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838539
T. Harpster, S. Hauvespre, M. Dokmeci, B. Stark, A. Vosoughi, K. Najafi
This paper reports a small passive wireless humidity monitoring system (HMS) for continuous monitoring of humidity changes inside miniature hermetic packages, presents its application in determining hermeticity of an implantable biomedical package, and presents long-term performance results obtained from packages implanted in guinea pigs. This 7/spl times/1.2/spl times/1.5 mm/sup 3/ system consists of a high-sensitivity capacitive humidity sensor that forms an LC tank circuit together with a hybrid coil wound around a ferrite substrate. The resonant frequency of the circuit changes when the humidity sensor capacitance changes in response to changes in humidity. The HMS can resolve humidity changes of /spl plusmn/2.5%RH over a 2 cm range. The resolution is sufficient enough to monitor internal package humidity for either in in-vitro or in-vivo testing.
{"title":"A passive humidity monitoring system for in-situ remote wireless testing of micropackages","authors":"T. Harpster, S. Hauvespre, M. Dokmeci, B. Stark, A. Vosoughi, K. Najafi","doi":"10.1109/MEMSYS.2000.838539","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838539","url":null,"abstract":"This paper reports a small passive wireless humidity monitoring system (HMS) for continuous monitoring of humidity changes inside miniature hermetic packages, presents its application in determining hermeticity of an implantable biomedical package, and presents long-term performance results obtained from packages implanted in guinea pigs. This 7/spl times/1.2/spl times/1.5 mm/sup 3/ system consists of a high-sensitivity capacitive humidity sensor that forms an LC tank circuit together with a hybrid coil wound around a ferrite substrate. The resonant frequency of the circuit changes when the humidity sensor capacitance changes in response to changes in humidity. The HMS can resolve humidity changes of /spl plusmn/2.5%RH over a 2 cm range. The resolution is sufficient enough to monitor internal package humidity for either in in-vitro or in-vivo testing.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121511573","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838555
A. Koide, Y. Sasaki, Y. Yoshimura, R. Miyake, T. Terayama
A micromachined dispenser with a high flow rate and high resolution for chemical analysis is described. The flow rate as a function of the actuation frequency increases linearly up to a frequency of 700 Hz with a final value of about 148 /spl mu/l/s using water as a pump medium. The dispensing accuracy is better than 1% (coefficient of variance) at a dispensing volume of 56 /spl mu/l. This dispenser shows good dispensing performance thanks to its precise valve structure and surface-treated nozzle.
{"title":"Micromachined dispenser with high flow rate and high resolution","authors":"A. Koide, Y. Sasaki, Y. Yoshimura, R. Miyake, T. Terayama","doi":"10.1109/MEMSYS.2000.838555","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838555","url":null,"abstract":"A micromachined dispenser with a high flow rate and high resolution for chemical analysis is described. The flow rate as a function of the actuation frequency increases linearly up to a frequency of 700 Hz with a final value of about 148 /spl mu/l/s using water as a pump medium. The dispensing accuracy is better than 1% (coefficient of variance) at a dispensing volume of 56 /spl mu/l. This dispenser shows good dispensing performance thanks to its precise valve structure and surface-treated nozzle.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"134 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117301926","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838535
O. Kurosawa, K. Okabe, M. Washizu
A novel DNA analysis method based on physical molecular manipulation is proposed and experimentally demonstrated. On a glass substrate is deposited a sacrificial layer, carrier layer and a pair of electrodes, onto which the DNA solution is fed. By applying high frequency voltage, the DNA is stretched straight and aligned, with one of its molecular end anchored on the electrode edge, and immobilized onto the carrier layer. Then using an AFM stylus as a knife, a portion of the DNA together with the carrier layer is cut, and by dissolving the sacrificial layer, recovered onto a membrane filter. Successful recovery is demonstrated using PCR.
{"title":"DNA analysis based on physical manipulation","authors":"O. Kurosawa, K. Okabe, M. Washizu","doi":"10.1109/MEMSYS.2000.838535","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838535","url":null,"abstract":"A novel DNA analysis method based on physical molecular manipulation is proposed and experimentally demonstrated. On a glass substrate is deposited a sacrificial layer, carrier layer and a pair of electrodes, onto which the DNA solution is fed. By applying high frequency voltage, the DNA is stretched straight and aligned, with one of its molecular end anchored on the electrode edge, and immobilized onto the carrier layer. Then using an AFM stylus as a knife, a portion of the DNA together with the carrier layer is cut, and by dissolving the sacrificial layer, recovered onto a membrane filter. Successful recovery is demonstrated using PCR.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115472462","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838559
N. Uchida, K. Uchimaru, M. Yonezawa, M. Sekimura
A method of analyzing the damping characteristics of electrostatically driven torsion mirror actuators which have deep grooves on their electrodes is described. The damping force is caused by viscous friction of the gas film between a moving mirror plate and the electrodes. The grooves decrease the damping force and enable the moving plate to be driven at high speed and low driving voltage. To calculate the damping force correctly, it is necessary to consider the viscous friction not only on the moving plate and electrodes, but also on the sidewalls of the grooves. For that purpose, the idea of hydraulic mean depth is introduced and is applied to the Reynolds equation. The calculated damping force shows good agreement with the measured damping force of the developed torsion mirror actuator for optical heads.
{"title":"Damping of micro electrostatic torsion mirror caused by air-film viscosity","authors":"N. Uchida, K. Uchimaru, M. Yonezawa, M. Sekimura","doi":"10.1109/MEMSYS.2000.838559","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838559","url":null,"abstract":"A method of analyzing the damping characteristics of electrostatically driven torsion mirror actuators which have deep grooves on their electrodes is described. The damping force is caused by viscous friction of the gas film between a moving mirror plate and the electrodes. The grooves decrease the damping force and enable the moving plate to be driven at high speed and low driving voltage. To calculate the damping force correctly, it is necessary to consider the viscous friction not only on the moving plate and electrodes, but also on the sidewalls of the grooves. For that purpose, the idea of hydraulic mean depth is introduced and is applied to the Reynolds equation. The calculated damping force shows good agreement with the measured damping force of the developed torsion mirror actuator for optical heads.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128727214","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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