Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838517
T. Namazu, Y. Isono, T. Tanaka
We carried out a nanometer scale bending test for a single crystal silicon (Si) beam using an atomic force microscope (AFM). Nanometer scale Si beams with widths from 200 nm to 800 nm and a thickness of 255 nm were fabricated on an Si diaphragm by means of the field-enhanced anodization using AFM and the anisotropic wet etching. Bending tests for a micro- and millimeter scale beam were also carried out using an ultra-precision hardness tester and scratch tester, respectively. The mechanical property of Si beams on a nanometer scale was compared with that measured on a micro- and millimeter scale. SEM observations of the fracture surface were performed in order to reveal the size effect on the bending strength.
{"title":"Nano-scale bending test of Si beam for MEMS","authors":"T. Namazu, Y. Isono, T. Tanaka","doi":"10.1109/MEMSYS.2000.838517","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838517","url":null,"abstract":"We carried out a nanometer scale bending test for a single crystal silicon (Si) beam using an atomic force microscope (AFM). Nanometer scale Si beams with widths from 200 nm to 800 nm and a thickness of 255 nm were fabricated on an Si diaphragm by means of the field-enhanced anodization using AFM and the anisotropic wet etching. Bending tests for a micro- and millimeter scale beam were also carried out using an ultra-precision hardness tester and scratch tester, respectively. The mechanical property of Si beams on a nanometer scale was compared with that measured on a micro- and millimeter scale. SEM observations of the fracture surface were performed in order to reveal the size effect on the bending strength.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134440684","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838499
T. Xu, Guoying Wu, Guobing Zhang, Wei Wang, Ting Li
A novel micro gas sensor based on both mass and conductivity measurement is presented. The sensing technique can efficiently improve the selectivity of gas-sensitive films to the detected gas. Consulting the chemical principle that an atom can be identified by its charge-mass ratio, we present an idea that the high selectivity to the detected gas can be obtained through measuring the charge-mass ratio of the gas molecule. To actualize the idea, we designed a sensor that can measure both charge and mass of the detected gas molecules only by one device at the same time. Thereby, the charge-mass ratio of the detected gas molecule can be obtained. The structure of the sensor was designed, simulated and optimized. The fabrication process and a prototype experiment are also presented.
{"title":"A novel micro gas sensor with high selectivity based on both mass and conductivity measurement","authors":"T. Xu, Guoying Wu, Guobing Zhang, Wei Wang, Ting Li","doi":"10.1109/MEMSYS.2000.838499","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838499","url":null,"abstract":"A novel micro gas sensor based on both mass and conductivity measurement is presented. The sensing technique can efficiently improve the selectivity of gas-sensitive films to the detected gas. Consulting the chemical principle that an atom can be identified by its charge-mass ratio, we present an idea that the high selectivity to the detected gas can be obtained through measuring the charge-mass ratio of the gas molecule. To actualize the idea, we designed a sensor that can measure both charge and mass of the detected gas molecules only by one device at the same time. Thereby, the charge-mass ratio of the detected gas molecule can be obtained. The structure of the sensor was designed, simulated and optimized. The fabrication process and a prototype experiment are also presented.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134477478","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838594
H. Camon, F. Larnaudie
We propose in this paper the complete study of a bulk micromachined silicon micromirror able to tilt up to /spl plusmn/20/spl deg/ at a relatively high frequency (1 kHz). These structures actuated with particular electrodes could be also used as a digital micromirror up to 35/spl deg/. Their behaviours have been tested in term of static and frequency responses. A non-linear phenomenon has been observed at very large angle. The pressure dependence of the quality factor of the microstructure is reported. Lifetime aspect has also been tested.
{"title":"Fabrication, simulation and experiment of a rotating electrostatic silicon mirror with large angular deflection","authors":"H. Camon, F. Larnaudie","doi":"10.1109/MEMSYS.2000.838594","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838594","url":null,"abstract":"We propose in this paper the complete study of a bulk micromachined silicon micromirror able to tilt up to /spl plusmn/20/spl deg/ at a relatively high frequency (1 kHz). These structures actuated with particular electrodes could be also used as a digital micromirror up to 35/spl deg/. Their behaviours have been tested in term of static and frequency responses. A non-linear phenomenon has been observed at very large angle. The pressure dependence of the quality factor of the microstructure is reported. Lifetime aspect has also been tested.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132271094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838570
T. Yamamoto, N. Kato, M. Matsui, Y. Takeuchi, Y. Otsuka, S. Akita
We have developed a new processing technique for a capacitive mechanical sensor with a single crystalline silicon microstructure using the SOI structure which enables electrical isolation and interconnected wiring. This technique can make the sensor surface completely flat, allowing the formation of a cap for resin molding and a vacuum package for an angular rate sensor.
{"title":"Capacitive accelerometer with high aspect ratio single crystalline silicon microstructure using the SOI structure with polysilicon-based interconnect technique","authors":"T. Yamamoto, N. Kato, M. Matsui, Y. Takeuchi, Y. Otsuka, S. Akita","doi":"10.1109/MEMSYS.2000.838570","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838570","url":null,"abstract":"We have developed a new processing technique for a capacitive mechanical sensor with a single crystalline silicon microstructure using the SOI structure which enables electrical isolation and interconnected wiring. This technique can make the sensor surface completely flat, allowing the formation of a cap for resin molding and a vacuum package for an angular rate sensor.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132416131","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838563
H. Schenk, P. Durr, D. Kunze, H. Lakner, H. Kuck
A novel resonantly excited 2D-Micro-Scanning-Mirror is presented which makes use of an electrostatic driving principle allowing to locate the driving electrodes in the chip plane. The mechanical elements and the mirror plate consist of a 30 /spl mu/m thick single crystal silicon layer. The mirror plate is suspended by a gimbal mounting and can therefore be deflected along two axes. It is shown that a special isolation technique is suitable to separate the electrical potentials on the movable elements and therefore allows to excite the two oscillations independently. The isolation technique is based on the oxidation and polysilicon filling of 1 /spl mu/m wide trenches in the 30 /spl mu/m thick layer of silicon. The influence of the surrounding gas on the coupling of the oscillations is examined. No significant influence is observed. The performance of the novel 2D-Micro-Scanning-Mirror is demonstrated by the generation of various Lissajous patterns by the reflected laser beam. Frequency ratios of 1:1 up to 13:1 are obtained with the presented devices.
{"title":"An electrostatically excited 2D-micro-scanning-mirror with an in-plane configuration of the driving electrodes","authors":"H. Schenk, P. Durr, D. Kunze, H. Lakner, H. Kuck","doi":"10.1109/MEMSYS.2000.838563","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838563","url":null,"abstract":"A novel resonantly excited 2D-Micro-Scanning-Mirror is presented which makes use of an electrostatic driving principle allowing to locate the driving electrodes in the chip plane. The mechanical elements and the mirror plate consist of a 30 /spl mu/m thick single crystal silicon layer. The mirror plate is suspended by a gimbal mounting and can therefore be deflected along two axes. It is shown that a special isolation technique is suitable to separate the electrical potentials on the movable elements and therefore allows to excite the two oscillations independently. The isolation technique is based on the oxidation and polysilicon filling of 1 /spl mu/m wide trenches in the 30 /spl mu/m thick layer of silicon. The influence of the surrounding gas on the coupling of the oscillations is examined. No significant influence is observed. The performance of the novel 2D-Micro-Scanning-Mirror is demonstrated by the generation of various Lissajous patterns by the reflected laser beam. Frequency ratios of 1:1 up to 13:1 are obtained with the presented devices.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114285627","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838607
K. Hoshino, F. Mura, I. Shimoyama
A micro-sensor that merges sensing and scanning functions on a single-chip has been designed and fabricated, resulting in the successful design of the first integrated scanning retina of its kind. A microfabrication technique has been developed in order to combine a microlens array together with a photodiode array and an electrostatically driven scanning slit on a single chip. The movement of the electrostatic scanner generates an effect similar to that of "retinal scanning vergence" found in the insects' compound eyes. With the fully integrated silicon scanning retina with a micro-mechanical scanner, we propose a new architecture of Retinal Scanning which enhances the resolution of a visual sensor.
{"title":"A one-chip scanning retina with an integrated micro-mechanical scanning actuator for a compound eye visual sensor","authors":"K. Hoshino, F. Mura, I. Shimoyama","doi":"10.1109/MEMSYS.2000.838607","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838607","url":null,"abstract":"A micro-sensor that merges sensing and scanning functions on a single-chip has been designed and fabricated, resulting in the successful design of the first integrated scanning retina of its kind. A microfabrication technique has been developed in order to combine a microlens array together with a photodiode array and an electrostatically driven scanning slit on a single chip. The movement of the electrostatic scanner generates an effect similar to that of \"retinal scanning vergence\" found in the insects' compound eyes. With the fully integrated silicon scanning retina with a micro-mechanical scanner, we propose a new architecture of Retinal Scanning which enhances the resolution of a visual sensor.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"111 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116086086","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838488
G. Suzuki, M. Esashi
This paper reports a new planar fabrication method of multilayer piezoelectric actuator. In this method, three techniques, dicing, electroplating and laser assisted etching (LAE), were used for constructing the multilayer structure. Prototype actuators with 23-120 active layers were fabricated in this method. The measured displacement was 2.5 /spl mu/m (23 layers) and 7.3 /spl mu/m (120 layers) at 100 V, respectively. These values agree with the calculated values from the piezoelectric properties of the material.
{"title":"Planar fabrication of multilayer piezoelectric actuator by groove cutting and electroplating","authors":"G. Suzuki, M. Esashi","doi":"10.1109/MEMSYS.2000.838488","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838488","url":null,"abstract":"This paper reports a new planar fabrication method of multilayer piezoelectric actuator. In this method, three techniques, dicing, electroplating and laser assisted etching (LAE), were used for constructing the multilayer structure. Prototype actuators with 23-120 active layers were fabricated in this method. The measured displacement was 2.5 /spl mu/m (23 layers) and 7.3 /spl mu/m (120 layers) at 100 V, respectively. These values agree with the calculated values from the piezoelectric properties of the material.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122046538","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838565
O. Cugat, P. Mounaix, S. Basrour, C. Divoux, G. Reyne
An alternative approach to compact deformable mirrors for adaptive optics is developed. A prototype of a two inch mirror composed of a thin polymer membrane covered with a matrix of permanent magnets and an array of microcoils was built. Several complementary modelling tools were used to study the behaviour of the device. Promising first results show regular deformations of up to 20 /spl mu/m, a good linearity and a bandwith of 200 Hz. This novel technology should enable higher resolution with smaller, lighter integrated mirrors.
{"title":"Deformable magnetic mirror for adaptive optics: first results","authors":"O. Cugat, P. Mounaix, S. Basrour, C. Divoux, G. Reyne","doi":"10.1109/MEMSYS.2000.838565","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838565","url":null,"abstract":"An alternative approach to compact deformable mirrors for adaptive optics is developed. A prototype of a two inch mirror composed of a thin polymer membrane covered with a matrix of permanent magnets and an array of microcoils was built. Several complementary modelling tools were used to study the behaviour of the device. Promising first results show regular deformations of up to 20 /spl mu/m, a good linearity and a bandwith of 200 Hz. This novel technology should enable higher resolution with smaller, lighter integrated mirrors.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122331326","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838612
Y. Mizukami, D. Rajniak, M. Nishimura
We have fabricated an integrated micro-electrophoretic chip by implementing an acrylic microfluidic channel directly on top of a photosensor array using a new microfabrication process. The cross section of the microchannel is 100 /spl mu/m high/spl times/100 /spl mu/m wide, and the effective length is 4.5 cm. The photosensor consists of 147/spl times/147 pixels, each measuring 39 /spl mu/m/spl times/39 /spl mu/m. The integrated microchip is able to detect electrophoretic signals in real time along the whole microchannel as a two-dimensional image. The microfabrication process named "stereolithography with double controlled surface (SD method)" has been newly proposed in order to realize a highly transparent microchannel with a smooth surface without assembly processes such as bonding of two plates. The accuracy of fabrication is within 5% of the design values. We have also evaluated the performance of the fabricated microchip and confirmed its functionality. After a sample (Blue Dextran) was injected into the microchannel, significant values of absorbance were obtained from the photosensor along the whole microchannel. The absorbance was proportional to the concentration of Blue Dextran.
{"title":"An integrated micro-electrophoretic chip fabricated using a new stereolithographic process","authors":"Y. Mizukami, D. Rajniak, M. Nishimura","doi":"10.1109/MEMSYS.2000.838612","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838612","url":null,"abstract":"We have fabricated an integrated micro-electrophoretic chip by implementing an acrylic microfluidic channel directly on top of a photosensor array using a new microfabrication process. The cross section of the microchannel is 100 /spl mu/m high/spl times/100 /spl mu/m wide, and the effective length is 4.5 cm. The photosensor consists of 147/spl times/147 pixels, each measuring 39 /spl mu/m/spl times/39 /spl mu/m. The integrated microchip is able to detect electrophoretic signals in real time along the whole microchannel as a two-dimensional image. The microfabrication process named \"stereolithography with double controlled surface (SD method)\" has been newly proposed in order to realize a highly transparent microchannel with a smooth surface without assembly processes such as bonding of two plates. The accuracy of fabrication is within 5% of the design values. We have also evaluated the performance of the fabricated microchip and confirmed its functionality. After a sample (Blue Dextran) was injected into the microchannel, significant values of absorbance were obtained from the photosensor along the whole microchannel. The absorbance was proportional to the concentration of Blue Dextran.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123959477","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-01-23DOI: 10.1109/MEMSYS.2000.838493
X. Ye, F. Tang, Haiqing Ding, Zhaoying Zhou
Vaporizing water micro-thrusters are fabricated and tested. A single micro-thruster we developed, fabricated by MEMS technologies, consists of a microresistor, a vaporizing chamber, a nozzle, a propellant inlet and a micro channel. The water propellant is fed into the thruster from a propellant tank by capillary force and pressure. The micro-thruster works in a pulse mode. During each period, an electric pulse is applied on the micro-resistor to heat the water in the chamber to vaporize it into high-pressure gas. A thrust is then produced as the gas exits through the nozzle. Test results show that for a single micro-thruster with pulse power of 48 W, the total impulse produced in a second is more than 0.2/spl times/10/sup -6/ N/spl middot/s.
{"title":"A vaporizing water micro-thruster","authors":"X. Ye, F. Tang, Haiqing Ding, Zhaoying Zhou","doi":"10.1109/MEMSYS.2000.838493","DOIUrl":"https://doi.org/10.1109/MEMSYS.2000.838493","url":null,"abstract":"Vaporizing water micro-thrusters are fabricated and tested. A single micro-thruster we developed, fabricated by MEMS technologies, consists of a microresistor, a vaporizing chamber, a nozzle, a propellant inlet and a micro channel. The water propellant is fed into the thruster from a propellant tank by capillary force and pressure. The micro-thruster works in a pulse mode. During each period, an electric pulse is applied on the micro-resistor to heat the water in the chamber to vaporize it into high-pressure gas. A thrust is then produced as the gas exits through the nozzle. Test results show that for a single micro-thruster with pulse power of 48 W, the total impulse produced in a second is more than 0.2/spl times/10/sup -6/ N/spl middot/s.","PeriodicalId":251857,"journal":{"name":"Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127144235","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：