Pub Date : 2012-04-03DOI: 10.1109/ISSCC.2012.6177034
Yusuke Tanaka, Yasufumi Hino, Y. Okada, Takahiro Takeda, Sho Ohashi, H. Yamagishi, K. Kawasaki, A. Hajimiri
Serial data links are often designed targeting a specific transmission medium. High-speed links using different predetermined transmission media have been demonstrated in the past [1-3]. This, however, restricts user's ability to use an integrated link interface with other transmission media once the chip is fabricated. For example, traditional transceivers for copper interconnects typically transmit baseband data, which is incompatible with a free-space wireless channel that is bandpass in nature and often uses RF carriers. A multi-modality transceiver block compatible with different transmission media is highly desirable as it offers great versatility by allowing the exact same interface circuitry to be used with different transmission media. Such a versatile interface can relax the board and system design requirements and enable the reuse of the same transceiver core with different media, reducing the time and cost overhead of re-designing and re-manufacturing.
{"title":"A versatile multi-modality serial link","authors":"Yusuke Tanaka, Yasufumi Hino, Y. Okada, Takahiro Takeda, Sho Ohashi, H. Yamagishi, K. Kawasaki, A. Hajimiri","doi":"10.1109/ISSCC.2012.6177034","DOIUrl":"https://doi.org/10.1109/ISSCC.2012.6177034","url":null,"abstract":"Serial data links are often designed targeting a specific transmission medium. High-speed links using different predetermined transmission media have been demonstrated in the past [1-3]. This, however, restricts user's ability to use an integrated link interface with other transmission media once the chip is fabricated. For example, traditional transceivers for copper interconnects typically transmit baseband data, which is incompatible with a free-space wireless channel that is bandpass in nature and often uses RF carriers. A multi-modality transceiver block compatible with different transmission media is highly desirable as it offers great versatility by allowing the exact same interface circuitry to be used with different transmission media. Such a versatile interface can relax the board and system design requirements and enable the reuse of the same transceiver core with different media, reducing the time and cost overhead of re-designing and re-manufacturing.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122272429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-04-03DOI: 10.1109/ISSCC.2012.6177046
Yasuhisa Tochigi, Katsuhiko Hanzawa, Yuri Kato, R. Kuroda, H. Mutoh, Ryuta Hirose, H. Tominaga, K. Takubo, Y. Kondo, S. Sugawa
This paper presents a 400H×256V pixel CMOS image sensor including 128 on-chip memory/pixel with 1Tpixel/s in burst operation without cooling and 780Mpixel/s in continuous operation. To improve the read-out speed from the chip, a noise-reduction circuit in pixel and relay buffers is introduced.
{"title":"A global-shutter CMOS image sensor with readout speed of 1Tpixel/s burst and 780Mpixel/s continuous","authors":"Yasuhisa Tochigi, Katsuhiko Hanzawa, Yuri Kato, R. Kuroda, H. Mutoh, Ryuta Hirose, H. Tominaga, K. Takubo, Y. Kondo, S. Sugawa","doi":"10.1109/ISSCC.2012.6177046","DOIUrl":"https://doi.org/10.1109/ISSCC.2012.6177046","url":null,"abstract":"This paper presents a 400H×256V pixel CMOS image sensor including 128 on-chip memory/pixel with 1Tpixel/s in burst operation without cooling and 780Mpixel/s in continuous operation. To improve the read-out speed from the chip, a noise-reduction circuit in pixel and relay buffers is introduced.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"107 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117282997","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-04-03DOI: 10.1109/ISSCC.2012.6177105
R. Pawlowski, Evgeni Krimer, Joseph Crop, J. Postman, N. M. Madani, M. Erez, P. Chiang
Near-threshold computing exhibits improved energy efficiency compared to nominal super-threshold operation [1, 2]. Two critical bottlenecks prevent mainstream adoption of low-VDD operation: degraded logic delay resulting in significantly lower throughput than at super-threshold, and excessive, unpredictable delay variation caused by increased sensitivity to process and dynamic variations.
{"title":"A 530mV 10-lane SIMD processor with variation resiliency in 45nm SOI","authors":"R. Pawlowski, Evgeni Krimer, Joseph Crop, J. Postman, N. M. Madani, M. Erez, P. Chiang","doi":"10.1109/ISSCC.2012.6177105","DOIUrl":"https://doi.org/10.1109/ISSCC.2012.6177105","url":null,"abstract":"Near-threshold computing exhibits improved energy efficiency compared to nominal super-threshold operation [1, 2]. Two critical bottlenecks prevent mainstream adoption of low-VDD operation: degraded logic delay resulting in significantly lower throughput than at super-threshold, and excessive, unpredictable delay variation caused by increased sensitivity to process and dynamic variations.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116981652","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-04-03DOI: 10.1109/ISSCC.2012.6176866
Y. Yano
Microelectronics has evolved to save power. In fact, semiconductor technology has been in the lead in the reduction of power consumption, by facilitating energy monitoring, and the controlling and managing of energy consumption. The key product in this advance has been a less-commonly-known semiconductor device called the microcontroller. That the MCU uses very little power was demonstrated for the first time by Renesas in 2006, by operating a low-power MCU from the electricity generated by 4 lemons! Subseqently, in 2011, we succeeded in operating our latest low-power MCU for 3 hours and 45 minutes using one lemon as a power source. Yet, in the future, MCUs must evolve further to save power, in widespread applications including the "energy harvesting" environment.
{"title":"Take the expressway to go greener","authors":"Y. Yano","doi":"10.1109/ISSCC.2012.6176866","DOIUrl":"https://doi.org/10.1109/ISSCC.2012.6176866","url":null,"abstract":"Microelectronics has evolved to save power. In fact, semiconductor technology has been in the lead in the reduction of power consumption, by facilitating energy monitoring, and the controlling and managing of energy consumption. The key product in this advance has been a less-commonly-known semiconductor device called the microcontroller. That the MCU uses very little power was demonstrated for the first time by Renesas in 2006, by operating a low-power MCU from the electricity generated by 4 lemons! Subseqently, in 2011, we succeeded in operating our latest low-power MCU for 3 hours and 45 minutes using one lemon as a power source. Yet, in the future, MCUs must evolve further to save power, in widespread applications including the \"energy harvesting\" environment.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115152163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-04-03DOI: 10.1109/ISSCC.2012.6176966
S. Hsu, A. Agarwal, M. Anders, S. Mathew, Himanshu Kaul, F. Sheikh, R. Krishnamurthy
Energy-efficient SIMD permutation operations are key for maximizing high-performance microprocessor vector datapath utilization in multimedia, graphics, and signal processing workloads [1-3]. A wide SIMD vector permutation engine is required to achieve high-throughput data rearrangement operations on large data sets, with scaled supply voltages to deliver high energy efficiency. An ultra-low-voltage reconfigurable 4-way to 32-way SIMD vector permutation engine consisting of a 32-entry × 256b 3-read/1-write ported register file with a 256b byte-wise any-to-any permute crossbar for 2-dimensional shuffle is fabricated in 22nm CMOS. The register file integrates a vertical shuffle across multiple entries into read/write operations, and includes clockless static reads with shared P/N dual-ended transmission gate (DETG) writes, improving register file VMIN by 250mV across PVT variations with a wide dynamic operating range of 280mV-1.1V. The permute crossbar implements an interleaved folded byte-wise multiplexer layout forming an any-to-any fully-connected tree to perform a horizontal shuffle with permute accumulate circuits, and includes vector flip-flops, stacked min-delay buffers, shared gates to average min-sized transistor variation, and ultra-low-voltage split-output (ULVS) level shifters improving logic VMIN by 150mV, while enabling peak energy efficiency of 585GOPS/W measured at 260mV, 50°C. The permutation engine occupies a dense layout of 0.048mm2 (Fig. 10.1.7) while achieving: (i) nominal register file performance of 1.8GHz, 106mW measured at 0.9V, 50°C; (ii) robust register file functionality measured down to 280mV (subthreshold) with peak energy efficiency of 154GOPS/W; (iii) scalable permute crossbar performance of 2.9GHz, 69mW measured at 1.1V, 50°C with deep sub-threshold operation at 240mV, 10MHz consuming 19μW; and (iv) a 64b 4×4 matrix transpose algorithm with 53% energy savings and 42% improved peak throughput of 263Gbps measured at 1.8GHz, 0.9V.
{"title":"A 280mV-to-1.1V 256b reconfigurable SIMD vector permutation engine with 2-dimensional shuffle in 22nm CMOS","authors":"S. Hsu, A. Agarwal, M. Anders, S. Mathew, Himanshu Kaul, F. Sheikh, R. Krishnamurthy","doi":"10.1109/ISSCC.2012.6176966","DOIUrl":"https://doi.org/10.1109/ISSCC.2012.6176966","url":null,"abstract":"Energy-efficient SIMD permutation operations are key for maximizing high-performance microprocessor vector datapath utilization in multimedia, graphics, and signal processing workloads [1-3]. A wide SIMD vector permutation engine is required to achieve high-throughput data rearrangement operations on large data sets, with scaled supply voltages to deliver high energy efficiency. An ultra-low-voltage reconfigurable 4-way to 32-way SIMD vector permutation engine consisting of a 32-entry × 256b 3-read/1-write ported register file with a 256b byte-wise any-to-any permute crossbar for 2-dimensional shuffle is fabricated in 22nm CMOS. The register file integrates a vertical shuffle across multiple entries into read/write operations, and includes clockless static reads with shared P/N dual-ended transmission gate (DETG) writes, improving register file VMIN by 250mV across PVT variations with a wide dynamic operating range of 280mV-1.1V. The permute crossbar implements an interleaved folded byte-wise multiplexer layout forming an any-to-any fully-connected tree to perform a horizontal shuffle with permute accumulate circuits, and includes vector flip-flops, stacked min-delay buffers, shared gates to average min-sized transistor variation, and ultra-low-voltage split-output (ULVS) level shifters improving logic VMIN by 150mV, while enabling peak energy efficiency of 585GOPS/W measured at 260mV, 50°C. The permutation engine occupies a dense layout of 0.048mm2 (Fig. 10.1.7) while achieving: (i) nominal register file performance of 1.8GHz, 106mW measured at 0.9V, 50°C; (ii) robust register file functionality measured down to 280mV (subthreshold) with peak energy efficiency of 154GOPS/W; (iii) scalable permute crossbar performance of 2.9GHz, 69mW measured at 1.1V, 50°C with deep sub-threshold operation at 240mV, 10MHz consuming 19μW; and (iv) a 64b 4×4 matrix transpose algorithm with 53% energy savings and 42% improved peak throughput of 263Gbps measured at 1.8GHz, 0.9V.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115382579","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-04-03DOI: 10.1109/ISSCC.2012.6177043
Dongmin Yoon, D. Sylvester, D. Blaauw
There is a growing interest in ultra-low-power wireless microsystems [1]. Synchronization between different nodes in a wireless sensor network plays an important role in the overall node energy budget due to the high power demand of wireless communication. One synchronization approach is to employ a realtime clock (RTC) on each node, with nodes awakening periodically to communicate and re-synchronize. With recent work on ultra-low-power microsystems demonstrating average power consumption of several nW [2], there is a need for ultra-low-power timers that can synchronize communication events and serve as frequency references for radios.
{"title":"A 5.58nW 32.768kHz DLL-assisted XO for real-time clocks in wireless sensing applications","authors":"Dongmin Yoon, D. Sylvester, D. Blaauw","doi":"10.1109/ISSCC.2012.6177043","DOIUrl":"https://doi.org/10.1109/ISSCC.2012.6177043","url":null,"abstract":"There is a growing interest in ultra-low-power wireless microsystems [1]. Synchronization between different nodes in a wireless sensor network plays an important role in the overall node energy budget due to the high power demand of wireless communication. One synchronization approach is to employ a realtime clock (RTC) on each node, with nodes awakening periodically to communicate and re-synchronize. With recent work on ultra-low-power microsystems demonstrating average power consumption of several nW [2], there is a need for ultra-low-power timers that can synchronize communication events and serve as frequency references for radios.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116123256","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-04-03DOI: 10.1109/ISSCC.2012.6177110
J. Hurwitz, J. Savoj
Sometimes a new technology or technique comes along that is just plain different to the incumbent solutions or conventional approaches. They can often take a while to make their mark, as the conventional state of the art keeps moving, or there is resistance to change because of the exotic nature of the solution being offered, or the crossover condition in the market for the technology to be justified has not yet been reached. This session looks at a number of ideas that are currently asking us to re-assess the way things are done. The five talks in this session cover the following topics: MEMS; thermal diffusivity sensor; VCO-based quantizer; continuous time DSP; and analog synthesis.
{"title":"Technologies that could change the world — You decide!","authors":"J. Hurwitz, J. Savoj","doi":"10.1109/ISSCC.2012.6177110","DOIUrl":"https://doi.org/10.1109/ISSCC.2012.6177110","url":null,"abstract":"Sometimes a new technology or technique comes along that is just plain different to the incumbent solutions or conventional approaches. They can often take a while to make their mark, as the conventional state of the art keeps moving, or there is resistance to change because of the exotic nature of the solution being offered, or the crossover condition in the market for the technology to be justified has not yet been reached. This session looks at a number of ideas that are currently asking us to re-assess the way things are done. The five talks in this session cover the following topics: MEMS; thermal diffusivity sensor; VCO-based quantizer; continuous time DSP; and analog synthesis.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116795057","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-04-03DOI: 10.1109/ISSCC.2012.6177020
Taehwan Roh, Sunjoo Hong, Hyunwoo Cho, H. Yoo
In this paper, we present a wearable mental health measurement system incorporating the nonlinear analysis of physiological rhythm including HRV and EEG signals together for high accuracy. The proposed system is implemented in a 31g headband that measures scalp signals and performs nonlinear-chaotic analysis to measure the stress levels. Using a 1.2V 40mAhr coin-battery (11.7χ5.35mm21.7g), the proposed system is able to operate for more than 7 days.
{"title":"A 259.6μW nonlinear HRV-EEG chaos processor with body channel communication interface for mental health monitoring","authors":"Taehwan Roh, Sunjoo Hong, Hyunwoo Cho, H. Yoo","doi":"10.1109/ISSCC.2012.6177020","DOIUrl":"https://doi.org/10.1109/ISSCC.2012.6177020","url":null,"abstract":"In this paper, we present a wearable mental health measurement system incorporating the nonlinear analysis of physiological rhythm including HRV and EEG signals together for high accuracy. The proposed system is implemented in a 31g headband that measures scalp signals and performs nonlinear-chaotic analysis to measure the stress levels. Using a 1.2V 40mAhr coin-battery (11.7χ5.35mm21.7g), the proposed system is able to operate for more than 7 days.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121760098","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-04-03DOI: 10.1109/ISSCC.2012.6176975
M. Rocznik, F. Henrici, Remigius Has
Pressure sensors used in automotive applications are subject to increasingly harsh environments such as acid containing gases in vehicle exhausts or exhaust gas recirculation. State-of-the-art gel protection for sensing elements and their electronics is reaching its limit. A circuit's exposed aluminum bond pads are especially vulnerable to corrosion and failure. In response to these issues, we report an approach to eliminate bond pads and bonds between the sensor and IC altogether.
{"title":"ASIC for a resonant wireless pressure-sensing system for harsh environments achieving ±2% error between −40 and 150°C using Q-based temperature compensation","authors":"M. Rocznik, F. Henrici, Remigius Has","doi":"10.1109/ISSCC.2012.6176975","DOIUrl":"https://doi.org/10.1109/ISSCC.2012.6176975","url":null,"abstract":"Pressure sensors used in automotive applications are subject to increasingly harsh environments such as acid containing gases in vehicle exhausts or exhaust gas recirculation. State-of-the-art gel protection for sensing elements and their electronics is reaching its limit. A circuit's exposed aluminum bond pads are especially vulnerable to corrosion and failure. In response to these issues, we report an approach to eliminate bond pads and bonds between the sensor and IC altogether.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123654042","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2012-04-03DOI: 10.1109/ISSCC.2012.6177035
C. Menolfi, J. Hertle, T. Toifl, T. Morf, Daniele Gardellini, M. Braendli, P. Buchmann, M. Kossel
Upcoming standards such as OIF CEI-25LR and CEI-28SR demand transmitter circuits above 20Gb/s [1]-[3] with stringent jitter requirements. The SST driver topology, which has been previously demonstrated at lower data rates [4], is an attractive solution as it enables multiple termination options and low power consumption. In addition, its single-ended topology facilitates an architecture in which the delay mismatch between true and complementary output can be adjusted, as is desirable for data transmission over long cables. In this contribution, the architecture and design of the key components of a half-rate 28Gb/s SST TX are presented.
{"title":"A 28Gb/s source-series terminated TX in 32nm CMOS SOI","authors":"C. Menolfi, J. Hertle, T. Toifl, T. Morf, Daniele Gardellini, M. Braendli, P. Buchmann, M. Kossel","doi":"10.1109/ISSCC.2012.6177035","DOIUrl":"https://doi.org/10.1109/ISSCC.2012.6177035","url":null,"abstract":"Upcoming standards such as OIF CEI-25LR and CEI-28SR demand transmitter circuits above 20Gb/s [1]-[3] with stringent jitter requirements. The SST driver topology, which has been previously demonstrated at lower data rates [4], is an attractive solution as it enables multiple termination options and low power consumption. In addition, its single-ended topology facilitates an architecture in which the delay mismatch between true and complementary output can be adjusted, as is desirable for data transmission over long cables. In this contribution, the architecture and design of the key components of a half-rate 28Gb/s SST TX are presented.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124771083","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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