Pub Date : 2007-09-01DOI: 10.1109/THERMINIC.2007.4451775
P. Borthen, G. Wachutka
We demonstrate the capabilities of a high temperature measurement set-up recently developed at our institute. It is dedicated to the characterization of semiconductor devices and test structures in the temperature range from room temperature up to 500degC and higher. A detailed description of the experimental equipment is given. Its practical use is demonstrated by measuring temperature-dependent characteristics of silicon VDMOSFET and IGBT devices as well as SiC-diodes. For the silicon devices, numerical simulations based on recently developed high temperature physical models were also performed in order to gain a deeper understanding of the measured data, together with a revalidation of the model parameters.
{"title":"A modular high temperature measurement set-up for semiconductor device characterization","authors":"P. Borthen, G. Wachutka","doi":"10.1109/THERMINIC.2007.4451775","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451775","url":null,"abstract":"We demonstrate the capabilities of a high temperature measurement set-up recently developed at our institute. It is dedicated to the characterization of semiconductor devices and test structures in the temperature range from room temperature up to 500degC and higher. A detailed description of the experimental equipment is given. Its practical use is demonstrated by measuring temperature-dependent characteristics of silicon VDMOSFET and IGBT devices as well as SiC-diodes. For the silicon devices, numerical simulations based on recently developed high temperature physical models were also performed in order to gain a deeper understanding of the measured data, together with a revalidation of the model parameters.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131031835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-09-01DOI: 10.1109/THERMINIC.2007.4451779
A. Koevoets, H. Eggink, J. Van der Sanden, J. Dekkers, T. Ruijl
The time dependent thermal behaviour of precision systems and processes in relation to positioning accuracy is an important aspect and often claims a large part of the available position budged. This problem can be dealt with using real-time error-compensation method that combines measured temperatures with knowledge of thermo-elastic properties of the precision system. The thermally induced time varying deformations are calculated real-time by the error compensation model based on measured temperatures. The gained performance depends on the uncertainty of the thermo-mechanical model, the configuration of the temperature sensors and uncertainties in the temperature measurements. In the paper a method is introduced that enables optimization of the sensor configuration and accompanying compensation model based on the modal reduction technique. This method can be used in cases where only little pre-knowledge of heat-loads are available and enables a more optimal sensor placement, thus improving the performance of the error-compensation method.
{"title":"Optimal sensor configuring techniques for the compensation of thermo-elastic deformations in high-precision systems","authors":"A. Koevoets, H. Eggink, J. Van der Sanden, J. Dekkers, T. Ruijl","doi":"10.1109/THERMINIC.2007.4451779","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451779","url":null,"abstract":"The time dependent thermal behaviour of precision systems and processes in relation to positioning accuracy is an important aspect and often claims a large part of the available position budged. This problem can be dealt with using real-time error-compensation method that combines measured temperatures with knowledge of thermo-elastic properties of the precision system. The thermally induced time varying deformations are calculated real-time by the error compensation model based on measured temperatures. The gained performance depends on the uncertainty of the thermo-mechanical model, the configuration of the temperature sensors and uncertainties in the temperature measurements. In the paper a method is introduced that enables optimization of the sensor configuration and accompanying compensation model based on the modal reduction technique. This method can be used in cases where only little pre-knowledge of heat-loads are available and enables a more optimal sensor placement, thus improving the performance of the error-compensation method.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115745436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-09-01DOI: 10.1109/THERMINIC.2007.4451748
H. Park
Heat generation from electronics increases with the advent of high-density integrated circuit technology. To come up with the heat generation, microscale cooling has been thought as a promising technology. Prediction of heat transfer rate is crucial in design of microscale cooling device but is not clearly understood yet. This work proposes a new correlation between heat transfer rate and Brinkman number which is nondimensional number of viscosity, flow velocity and temperature. Our experimental results showed a good empirical equation that Nu/(Re0.62 Pr0.33) is inversely proportional to the Brinkman number in laminar flow regime. It is expected that the equation proposed by this work can be useful to design microchannel cooling device.
{"title":"Dependency of heat transfer rate on the Brinkman number in microchannels","authors":"H. Park","doi":"10.1109/THERMINIC.2007.4451748","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451748","url":null,"abstract":"Heat generation from electronics increases with the advent of high-density integrated circuit technology. To come up with the heat generation, microscale cooling has been thought as a promising technology. Prediction of heat transfer rate is crucial in design of microscale cooling device but is not clearly understood yet. This work proposes a new correlation between heat transfer rate and Brinkman number which is nondimensional number of viscosity, flow velocity and temperature. Our experimental results showed a good empirical equation that Nu/(Re0.62 Pr0.33) is inversely proportional to the Brinkman number in laminar flow regime. It is expected that the equation proposed by this work can be useful to design microchannel cooling device.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117089753","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-09-01DOI: 10.1109/THERMINIC.2007.4451743
J. Czernohorsky, B. Maj, M. Viering, L. Wright, G. Balanon
Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).
{"title":"Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package","authors":"J. Czernohorsky, B. Maj, M. Viering, L. Wright, G. Balanon","doi":"10.1109/THERMINIC.2007.4451743","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451743","url":null,"abstract":"Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127057791","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-09-01DOI: 10.1109/THERMINIC.2007.4451744
Dan-Liang Yang, Y. Chan
Electromigration and thermomigration behaviors of eutectic tin-lead solder joints were studied above 100 degC with the currents ranging from 1.6 A to 2.0 A. The local temperature of the chip was deducted according to temperature coefficient of resistance. Also, this temperature was inspected by a thermal infrared mapping technique. It is suggested that the heat accumulation within first-level solder interconnections was highly related to the current density. During the electromigration process, Pb migration was apparently visible because of its faster diffusivity. Meanwhile, voids were initiated at the entry location of the electron flow due to the current crowding effect. Numerical simulation also predicted a local current density of above 105 A/cm2 within the solder joint In the thermomigration process, the transport of Pb was detected owing to the thermal gradient across the solder joint. Voids also occurred at the contact window due to accelerated atomic diffusion. In addition, the effect of electromigration and thermomigration on the mechanical behavior of the solder joint was examined through shearing tests.
研究了锡铅共晶焊点在100℃以上、1.6 ~ 2.0 A电流条件下的电迁移和热迁移行为。根据电阻温度系数减去芯片的局部温度。此外，还通过热红外测绘技术检测了该温度。结果表明，一级焊点内部的热积累与电流密度密切相关。在电迁移过程中，由于Pb具有较快的扩散速率，其迁移明显。同时，由于电流拥挤效应，在电子流的入口位置产生了空洞。数值模拟还预测了焊点内的局部电流密度在105 a /cm2以上。在热迁移过程中，由于焊点上的热梯度，检测到Pb的迁移。由于原子扩散加速，在接触窗口处也出现了空洞。此外，通过剪切试验考察了电迁移和热迁移对焊点力学性能的影响。
{"title":"The characteristics of electromigration and thermomigration in flip chip solder joints","authors":"Dan-Liang Yang, Y. Chan","doi":"10.1109/THERMINIC.2007.4451744","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451744","url":null,"abstract":"Electromigration and thermomigration behaviors of eutectic tin-lead solder joints were studied above 100 degC with the currents ranging from 1.6 A to 2.0 A. The local temperature of the chip was deducted according to temperature coefficient of resistance. Also, this temperature was inspected by a thermal infrared mapping technique. It is suggested that the heat accumulation within first-level solder interconnections was highly related to the current density. During the electromigration process, Pb migration was apparently visible because of its faster diffusivity. Meanwhile, voids were initiated at the entry location of the electron flow due to the current crowding effect. Numerical simulation also predicted a local current density of above 105 A/cm2 within the solder joint In the thermomigration process, the transport of Pb was detected owing to the thermal gradient across the solder joint. Voids also occurred at the contact window due to accelerated atomic diffusion. In addition, the effect of electromigration and thermomigration on the mechanical behavior of the solder joint was examined through shearing tests.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131095390","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-09-01DOI: 10.1109/THERMINIC.2007.4451773
V. Székely, S. Torok, E. Kollár
A flat mounting unit with electronically variable thermal resistance has been presented in the last year. The design was based on a Peltier cell and the appropriate control electronics and software. The device is devoted especially to the thermal characterization of packages, e.g. in dual cold plate arrangements. Although this design meets the requirements of the static measurement we are intended to improve its parameters as the settling time and dynamic thermal impedance and the range of realized thermal resistance. The new design applies the heat flux sensor developed by our team as well, making easier the control of the device. This development allows even the realization of negative thermal resistances.
{"title":"Improvements of the variable thermal resistance","authors":"V. Székely, S. Torok, E. Kollár","doi":"10.1109/THERMINIC.2007.4451773","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451773","url":null,"abstract":"A flat mounting unit with electronically variable thermal resistance has been presented in the last year. The design was based on a Peltier cell and the appropriate control electronics and software. The device is devoted especially to the thermal characterization of packages, e.g. in dual cold plate arrangements. Although this design meets the requirements of the static measurement we are intended to improve its parameters as the settling time and dynamic thermal impedance and the range of realized thermal resistance. The new design applies the heat flux sensor developed by our team as well, making easier the control of the device. This development allows even the realization of negative thermal resistances.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115855309","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-09-01DOI: 10.1109/THERMINIC.2007.4451737
M. Janicki, J. Banaszczyk, G. Mey, Marek Kaminski, Bjorn Vermeersch, Andrzej Napieralski
This paper presents thermal analyses of a power amplifier placed in a wind tunnel. All the investigations are based on the transient temperature measurements performed during the circuit cooling process. The measured cooling curves were used to compute the cumulative and differential structure functions for the circuit with a heat sink. These functions helped to determine the optimal values of circuit model parameters necessary for numerical thermal simulations. The experiments demonstrated the influence of the wind speed on the value of the heat transfer coefficient and consequently on the temperature of the entire structure.
{"title":"Application of structure functions for the investigation of forced air cooling","authors":"M. Janicki, J. Banaszczyk, G. Mey, Marek Kaminski, Bjorn Vermeersch, Andrzej Napieralski","doi":"10.1109/THERMINIC.2007.4451737","DOIUrl":"https://doi.org/10.1109/THERMINIC.2007.4451737","url":null,"abstract":"This paper presents thermal analyses of a power amplifier placed in a wind tunnel. All the investigations are based on the transient temperature measurements performed during the circuit cooling process. The measured cooling curves were used to compute the cumulative and differential structure functions for the circuit with a heat sink. These functions helped to determine the optimal values of circuit model parameters necessary for numerical thermal simulations. The experiments demonstrated the influence of the wind speed on the value of the heat transfer coefficient and consequently on the temperature of the entire structure.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115039317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
An acoustic field is used to increase the critical heat flux (CHF) of a flat-boiling-heat-transfer surface. The increase is a result of the acoustic effects on the vapor bubbles. Experiments are performed to explore the effects of an acoustic field on vapor bubbles in the vicinity of a rigid-heated wall. Work includes the construction of a novel heater used to produce a single vapor bubble of a prescribed size and at a prescribed location on a flat-boiling surface for better study of an individual vapor bubble's reaction to the acoustic field. Work also includes application of the results from the single-bubble heater to a calibrated-copper heater used for quantifying the improvements in CHF.
{"title":"Acoustically enhanced boiling heat transfer","authors":"Z. W. Douglas, M. Smith, A. Glezer","doi":"10.1063/1.4721669","DOIUrl":"https://doi.org/10.1063/1.4721669","url":null,"abstract":"An acoustic field is used to increase the critical heat flux (CHF) of a flat-boiling-heat-transfer surface. The increase is a result of the acoustic effects on the vapor bubbles. Experiments are performed to explore the effects of an acoustic field on vapor bubbles in the vicinity of a rigid-heated wall. Work includes the construction of a novel heater used to produce a single vapor bubble of a prescribed size and at a prescribed location on a flat-boiling surface for better study of an individual vapor bubble's reaction to the acoustic field. Work also includes application of the results from the single-bubble heater to a calibrated-copper heater used for quantifying the improvements in CHF.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2007-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114629134","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：