Pub Date : 1995-01-29DOI: 10.1109/MEMSYS.1995.472571
H. H. Langen, T. Masuzawa, M. Fujino
A new technology is presented in this paper for the selfaligned machining and assembly of 3D microparts and their tools using a WEDG unit and a mini work table consisting of a metal plate or a silicon and metal plate combination. Machining and assembly was carried out in a modular way on a single, newly developed prototype of low-cost and the following fabrication examples are given: micropipe-macrocylinder combination, a simple microrotor module which is inserted and guided into a silicon substrate and some mechanical parts of a skeleton of a possible 3D electromagnetic micromotor (permalloy stator fabricated through a silicon block into a permalloy substrate and a permalloy rotor disk with shaft). The following machining techniques were used: wire electrodischarge grinding (WEDG) [ 11, micro electrodischarge machining (micro-EDM), reverse micro-EDM (RMEDM) and micro ultrasonic machining (microUSM). Ultrasonic vibration was also applied for the self-aligned assembly of (micro)parts. The WEDG/micro-USM processing combination is a novel development, it features the self-aligned "throughwafer" machining. With a metal plate connected at the wafer's backside, self-aligned machining and assembly was carried out on the silicon substrate indirectly. Examples (electromagnetic micro motor, etc) are given of 3D MEMS that could be fabricated in the future when these techniques are successfully combined with MEMS fabrication techniques.
{"title":"Self-aligned machining and assembly of high aspect ratio microparts into silicon","authors":"H. H. Langen, T. Masuzawa, M. Fujino","doi":"10.1109/MEMSYS.1995.472571","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472571","url":null,"abstract":"A new technology is presented in this paper for the selfaligned machining and assembly of 3D microparts and their tools using a WEDG unit and a mini work table consisting of a metal plate or a silicon and metal plate combination. Machining and assembly was carried out in a modular way on a single, newly developed prototype of low-cost and the following fabrication examples are given: micropipe-macrocylinder combination, a simple microrotor module which is inserted and guided into a silicon substrate and some mechanical parts of a skeleton of a possible 3D electromagnetic micromotor (permalloy stator fabricated through a silicon block into a permalloy substrate and a permalloy rotor disk with shaft). The following machining techniques were used: wire electrodischarge grinding (WEDG) [ 11, micro electrodischarge machining (micro-EDM), reverse micro-EDM (RMEDM) and micro ultrasonic machining (microUSM). Ultrasonic vibration was also applied for the self-aligned assembly of (micro)parts. The WEDG/micro-USM processing combination is a novel development, it features the self-aligned \"throughwafer\" machining. With a metal plate connected at the wafer's backside, self-aligned machining and assembly was carried out on the silicon substrate indirectly. Examples (electromagnetic micro motor, etc) are given of 3D MEMS that could be fabricated in the future when these techniques are successfully combined with MEMS fabrication techniques.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124562584","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-01-29DOI: 10.1109/MEMSYS.1995.472594
J. Meyer, H. Beutel, E. Valderrama, E. Cabruja, P. Aebischer, G. Soldani, P. Dario
It has been shown previously that peripheral nerve axons are regenerating through microvias in silicon devices. A major challenge is the design of a biocompatible integrated neural connector allowing simultaneous, multi-site recordings or stimulation of axons in nerve bundles and to establish a reliable mechanical and electrical connection. This paper describes on-going research in the framework of an European project aimed to develop an implantable neural microsystem comprising various designs of perforated dices, multiple electrodes with on-chip integrated preprocessing circuitry, functional guidance channels for support and fixation of regenerating axons, and interconnection assemblies for bi-directional nervous signal transmission. Special emphasis is given on a light-weight design of the device and on the biocompatible integration and packaging of the chip. In this paper, we report about the microfabrication of the perforated dices, their incorporation into biocompatible guidance channels, and about in vitro and in vivo biocompatibility testing of materials applied.
{"title":"Perforated silicon dices with integrated nerve guidance channels for interfacing peripheral nerves","authors":"J. Meyer, H. Beutel, E. Valderrama, E. Cabruja, P. Aebischer, G. Soldani, P. Dario","doi":"10.1109/MEMSYS.1995.472594","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472594","url":null,"abstract":"It has been shown previously that peripheral nerve axons are regenerating through microvias in silicon devices. A major challenge is the design of a biocompatible integrated neural connector allowing simultaneous, multi-site recordings or stimulation of axons in nerve bundles and to establish a reliable mechanical and electrical connection. This paper describes on-going research in the framework of an European project aimed to develop an implantable neural microsystem comprising various designs of perforated dices, multiple electrodes with on-chip integrated preprocessing circuitry, functional guidance channels for support and fixation of regenerating axons, and interconnection assemblies for bi-directional nervous signal transmission. Special emphasis is given on a light-weight design of the device and on the biocompatible integration and packaging of the chip. In this paper, we report about the microfabrication of the perforated dices, their incorporation into biocompatible guidance channels, and about in vitro and in vivo biocompatibility testing of materials applied.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124828298","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-01-29DOI: 10.1109/MEMSYS.1995.472553
G. Vdovin, S. Middelhoek, L. Sarro
A novel micromachined deformable mir- ror display device (DMD) is proposed and character- ized. The principle of operation of DMD differs from that reported in (l). The DMD consists of a freely suspended silicon nitride/Al reflective flexible mem- brane, optical figure of which is controlled electro- statically by the array of integrated electrodes (2, 31. The local curvature of the membrane is proportional to the square of the voltage distribution on the ar- ray of electrodes. The light intensity in the near field of the collimated beam, reflected from the deformed membrane is modulated with the depth of modula- tion being approximately proportional to the mem- brane local curvature. The intensity distribution in the near field of the reflected beam follows approxi- mately the voltage distribution applied to the array of control electrodes. In contrast to (l) the device has 100% pixel fill factor. Contrast ratio of 3 : 1 and resolution of N 100 by 100 pixels with response time of N lms have been demonstrated experimentally.
{"title":"Deformable mirror display with continuous reflecting surface micromachined in silicon","authors":"G. Vdovin, S. Middelhoek, L. Sarro","doi":"10.1109/MEMSYS.1995.472553","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472553","url":null,"abstract":"A novel micromachined deformable mir- ror display device (DMD) is proposed and character- ized. The principle of operation of DMD differs from that reported in (l). The DMD consists of a freely suspended silicon nitride/Al reflective flexible mem- brane, optical figure of which is controlled electro- statically by the array of integrated electrodes (2, 31. The local curvature of the membrane is proportional to the square of the voltage distribution on the ar- ray of electrodes. The light intensity in the near field of the collimated beam, reflected from the deformed membrane is modulated with the depth of modula- tion being approximately proportional to the mem- brane local curvature. The intensity distribution in the near field of the reflected beam follows approxi- mately the voltage distribution applied to the array of control electrodes. In contrast to (l) the device has 100% pixel fill factor. Contrast ratio of 3 : 1 and resolution of N 100 by 100 pixels with response time of N lms have been demonstrated experimentally.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122317482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-01-29DOI: 10.1109/MEMSYS.1995.472575
E. Yamamoto, S. Hashimoto, M. Ito, I. Komazaki, K. Yanagisawa
There exists a growing demand for an ultra small tactile sensor used in future industrial and medical systems, such as a miniature robot for inspection and repair in an extremely small space and an endoscopelcatheter used in the minimum invasive, laparoscopic surgical system for diagnosis and treatment. An optical sensor has a high sensitivity and a large Electromagnetic Interference (EMI) tolerance, which is necessary and important in a practical use combined with any other electrical apparatus. However, a miniaturization and a product cost reduction of an optical sensor is very difficult because a conventional high sensitive optical sensor consists of a laser and many precisely assembled optical components such as a lens for a beam shaping, an optical isolator to prevent a lasing wavelength instability induced by an optical feedback, an optical beam splitter to construct an interferometric optical path. Recently, some optical pressure sensor using an optical fiber is developed[l],[2]. These sensor consists of a small sensing element and a rather large optical interferometer which is spatially separated from the sensing element. Although sensing tips of these fiber-optic sensors are rather small, they have a serious drawback that the change of fiber bending shape strongly affects on a sensor output to induce sensing error. A surface-emitting laser (SEL) has two advantages compared to a conventional edgeemitting laser for the sensing use. One is a lasing wavelength stability against an optical feedback. The other is a design flexibility for a divergence angle of radiation beam. Consequently, an optical sensor with SEL can realize a miniaturized sensor which does not needs any optical components such as lenses and an optical isolator. This paper describes a feasibility study for an optical tactile sensor using SEL as a light source. 2. Principle of Operation
对未来工业和医疗系统中使用的超小型触觉传感器的需求日益增长，例如在极小空间内进行检测和维修的微型机器人，以及用于诊断和治疗的微创腹腔镜手术系统中的内窥镜导管。光学传感器具有高灵敏度和较大的电磁干扰（EMI）容限，这在与任何其他电气设备的实际结合使用中都是必要和重要的。然而，要实现光学传感器的微型化并降低产品成本却非常困难，因为传统的高灵敏度光学传感器由激光器和许多精密装配的光学元件组成，如用于光束整形的透镜、用于防止光反馈引起的激光波长不稳定的光隔离器、用于构建干涉光路的光分束器等。最近，一些使用光纤的光学压力传感器被开发出来[l], [2]。这些传感器由一个小的传感元件和一个相当大的光学干涉仪组成，光学干涉仪与传感元件在空间上是分离的。虽然这些光纤传感器的传感头很小，但它们有一个严重的缺点，即光纤弯曲形状的变化会对传感器的输出产生强烈影响，从而导致传感误差。与用于传感的传统边缘发射激光器相比，表面发射激光器（SEL）有两个优点。其一是激光波长稳定，不会受到光反馈的影响。另一个优势是辐射光束发散角的设计灵活性。因此，带有 SEL 的光学传感器可以实现传感器的小型化，不需要透镜和光隔离器等任何光学元件。本文介绍了使用 SEL 作为光源的光学触觉传感器的可行性研究。2.工作原理
{"title":"Optical tactile sensor using surface-emitting laser","authors":"E. Yamamoto, S. Hashimoto, M. Ito, I. Komazaki, K. Yanagisawa","doi":"10.1109/MEMSYS.1995.472575","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472575","url":null,"abstract":"There exists a growing demand for an ultra small tactile sensor used in future industrial and medical systems, such as a miniature robot for inspection and repair in an extremely small space and an endoscopelcatheter used in the minimum invasive, laparoscopic surgical system for diagnosis and treatment. An optical sensor has a high sensitivity and a large Electromagnetic Interference (EMI) tolerance, which is necessary and important in a practical use combined with any other electrical apparatus. However, a miniaturization and a product cost reduction of an optical sensor is very difficult because a conventional high sensitive optical sensor consists of a laser and many precisely assembled optical components such as a lens for a beam shaping, an optical isolator to prevent a lasing wavelength instability induced by an optical feedback, an optical beam splitter to construct an interferometric optical path. Recently, some optical pressure sensor using an optical fiber is developed[l],[2]. These sensor consists of a small sensing element and a rather large optical interferometer which is spatially separated from the sensing element. Although sensing tips of these fiber-optic sensors are rather small, they have a serious drawback that the change of fiber bending shape strongly affects on a sensor output to induce sensing error. A surface-emitting laser (SEL) has two advantages compared to a conventional edgeemitting laser for the sensing use. One is a lasing wavelength stability against an optical feedback. The other is a design flexibility for a divergence angle of radiation beam. Consequently, an optical sensor with SEL can realize a miniaturized sensor which does not needs any optical components such as lenses and an optical isolator. This paper describes a feasibility study for an optical tactile sensor using SEL as a light source. 2. Principle of Operation","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131431834","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-01-29DOI: 10.1109/MEMSYS.1995.472557
R. Legtenberg, E. Berenschot, M. Elwenspoek, J. Fluitman
This paper presents the design and performance of an electrostatic actuator consisting of a laterally compliant cantilever beam and a fixed curved electrode, both suspended above a ground plane. A theoretical description of the static behavior of the cantilever as it is pulled into contact with the rigid fixed-electrode structure is given. Two models are presented: a simplified semi-analytical model based on energy methods, and fully three-dimensional (3-D) coupled electromechanical numerical simulations using CoSolve-EM. The two models are in qualitative agreement with each other, and predict stable actuator behavior when the beam deflection becomes constrained by the curved electrode geometry before electrostatic pull-in can occur. The pull-in behavior depends on the shape of the curved electrode. Test devices have been fabricated by polysilicon surface micromachining techniques. Experimental results confirm the basic theoretical results. Stable behavior with relatively large displacements and forces can be generated by these curved electrode actuators. Depending on the design, or as a result of geometrical imperfections, regions of unstable (pull-in) deflection behavior are also observed.
{"title":"Electrostatic curved electrode actuators","authors":"R. Legtenberg, E. Berenschot, M. Elwenspoek, J. Fluitman","doi":"10.1109/MEMSYS.1995.472557","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472557","url":null,"abstract":"This paper presents the design and performance of an electrostatic actuator consisting of a laterally compliant cantilever beam and a fixed curved electrode, both suspended above a ground plane. A theoretical description of the static behavior of the cantilever as it is pulled into contact with the rigid fixed-electrode structure is given. Two models are presented: a simplified semi-analytical model based on energy methods, and fully three-dimensional (3-D) coupled electromechanical numerical simulations using CoSolve-EM. The two models are in qualitative agreement with each other, and predict stable actuator behavior when the beam deflection becomes constrained by the curved electrode geometry before electrostatic pull-in can occur. The pull-in behavior depends on the shape of the curved electrode. Test devices have been fabricated by polysilicon surface micromachining techniques. Experimental results confirm the basic theoretical results. Stable behavior with relatively large displacements and forces can be generated by these curved electrode actuators. Depending on the design, or as a result of geometrical imperfections, regions of unstable (pull-in) deflection behavior are also observed.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134428803","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-01-29DOI: 10.1109/MEMSYS.1995.472569
Youngcheol Joo, Kiet Dieu, C. Kim
A novel method to fabricate microchannels to be used in microelectronics chip cooling has been developed. The channels are made by microelectroplating with thick photoresist as the sacrificial molds. By removing the photoresist mold before sealing is completed, the channel can be made with only one mask. The cross section of the channels presented in the paper are 5-10 pm wide and 8-10 pm high. This method solves the problem of removing the mold from inside the extremely long channels (e.g., length-to-width ratio as large as a thousand). Unlike other methods for fabrication of microchannels, this method can be integrated into existing IC processes and delivers a practical way to cool IC chips with microchannels.
{"title":"Fabrication of monolithic microchannels for IC chip cooling","authors":"Youngcheol Joo, Kiet Dieu, C. Kim","doi":"10.1109/MEMSYS.1995.472569","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472569","url":null,"abstract":"A novel method to fabricate microchannels to be used in microelectronics chip cooling has been developed. The channels are made by microelectroplating with thick photoresist as the sacrificial molds. By removing the photoresist mold before sealing is completed, the channel can be made with only one mask. The cross section of the channels presented in the paper are 5-10 pm wide and 8-10 pm high. This method solves the problem of removing the mold from inside the extremely long channels (e.g., length-to-width ratio as large as a thousand). Unlike other methods for fabrication of microchannels, this method can be integrated into existing IC processes and delivers a practical way to cool IC chips with microchannels.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"51 5","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114039874","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-01-29DOI: 10.1109/MEMSYS.1995.472586
J. Roeraade
Development of new and improved methods for chemical analysis is an issue of great importance. Analytical separation techniques such as chromatography and electrophoresis, combined with sensitive detectors have made it possible to characterize and quantify trace amounts of chemical compounds in complex matrices. Such techniques are indispensable in many areas, e.g. environmental chemistry, product control, in drug development etc.
{"title":"Chemical analysis in nanoscale needs, possibilities, techniques and outlooks","authors":"J. Roeraade","doi":"10.1109/MEMSYS.1995.472586","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472586","url":null,"abstract":"Development of new and improved methods for chemical analysis is an issue of great importance. Analytical separation techniques such as chromatography and electrophoresis, combined with sensitive detectors have made it possible to characterize and quantify trace amounts of chemical compounds in complex matrices. Such techniques are indispensable in many areas, e.g. environmental chemistry, product control, in drug development etc.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115741873","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-01-29DOI: 10.1109/MEMSYS.1995.472579
C. S. Taylor, Paul Cherkas, Hilary J. Hampton, J. Frantzen, B. Shah, W. Tiffany, L. Nanis, P. Booker, Amr Salahieh, R. Hansen
A three-dimensional printing process which we call “spatial forming” has been conceived and demonstrated as a method of manufacturing parts for cardiac catheter systems.’ This work extends the range. of particulate forming techniques into the niicrostructure area; brings to bear on the manufacture of three-dimensional structures the high production capabilities of offset lithography; and allows us to visualize a complete process for the volume production of objects and assemblies of a geometric complexity hitherto found only in nature. This process combines several technologies to generate solid metallic microstructures from fine powder. Cross section data from computer solid niodcls are used for patterning of a chrome mask which images a lithographic printing plate like those used in the publishing industry. A custom built offset printin9 press prints “negative” material (the space around the parts) on a ceramic substrate in multiple registered layers of ceramic pigmented organic ink averaging 0.5 pm thick; each layer is cured with L5’ light. Periodically an ink heavily loaded with finely powdered metal is knifed onto the substrate, filling the non-image voids with “positive” part material. This material is also UV cured, the surface planarized, and the entire printing process repeated in proper register until the desired thickness (e.g. -SO0 pm) is reached. The semi-finished parts are then debinderized to remove organic ink components, and sintered in controlled atmosphere futnaces in processe.s similar to those used in the metal injection molding industr).. The negative material crumbles away and the finished paits separate from the substrate.
{"title":"\"Spatial forming\"-a three dimensional printing process","authors":"C. S. Taylor, Paul Cherkas, Hilary J. Hampton, J. Frantzen, B. Shah, W. Tiffany, L. Nanis, P. Booker, Amr Salahieh, R. Hansen","doi":"10.1109/MEMSYS.1995.472579","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472579","url":null,"abstract":"A three-dimensional printing process which we call “spatial forming” has been conceived and demonstrated as a method of manufacturing parts for cardiac catheter systems.’ This work extends the range. of particulate forming techniques into the niicrostructure area; brings to bear on the manufacture of three-dimensional structures the high production capabilities of offset lithography; and allows us to visualize a complete process for the volume production of objects and assemblies of a geometric complexity hitherto found only in nature. This process combines several technologies to generate solid metallic microstructures from fine powder. Cross section data from computer solid niodcls are used for patterning of a chrome mask which images a lithographic printing plate like those used in the publishing industry. A custom built offset printin9 press prints “negative” material (the space around the parts) on a ceramic substrate in multiple registered layers of ceramic pigmented organic ink averaging 0.5 pm thick; each layer is cured with L5’ light. Periodically an ink heavily loaded with finely powdered metal is knifed onto the substrate, filling the non-image voids with “positive” part material. This material is also UV cured, the surface planarized, and the entire printing process repeated in proper register until the desired thickness (e.g. -SO0 pm) is reached. The semi-finished parts are then debinderized to remove organic ink components, and sintered in controlled atmosphere futnaces in processe.s similar to those used in the metal injection molding industr).. The negative material crumbles away and the finished paits separate from the substrate.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"255 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116169387","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1995-01-29DOI: 10.1109/MEMSYS.1995.472573
J. Elders, H. Jansen, M. Elwenspoek, W. Ehrfeld
The recent innovations in dry etching make it a promising technology for the fabrications of micromoulds. The high aspect ratios, directional freedom, low roughness, high etch rates and high selectivity with respect to the mask material allow a versatile fabrication process of micromoulds for subsequent electroplating and embossing, as is demonstrated with the DEEMO process. DEEMO is an English acronym and stands for Dry Etching, Electroplating and Moulding.
{"title":"DEEMO: a new technology for the fabrication of microstructures","authors":"J. Elders, H. Jansen, M. Elwenspoek, W. Ehrfeld","doi":"10.1109/MEMSYS.1995.472573","DOIUrl":"https://doi.org/10.1109/MEMSYS.1995.472573","url":null,"abstract":"The recent innovations in dry etching make it a promising technology for the fabrications of micromoulds. The high aspect ratios, directional freedom, low roughness, high etch rates and high selectivity with respect to the mask material allow a versatile fabrication process of micromoulds for subsequent electroplating and embossing, as is demonstrated with the DEEMO process. DEEMO is an English acronym and stands for Dry Etching, Electroplating and Moulding.","PeriodicalId":273283,"journal":{"name":"Proceedings IEEE Micro Electro Mechanical Systems. 1995","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115309622","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：