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2020 IEEE 38th VLSI Test Symposium (VTS)最新文献

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Internal I/O Testing: Definition and a Solution 内部I/O测试:定义和解决方案
Pub Date : 2020-04-01 DOI: 10.1109/VTS48691.2020.9107567
S. Chakravarty, Fei Su, Indira A Gohad, Sudheer V Bandana, B. S. Adithya, W. M. Lim
Many semi-conductor manufacturing companies use 3D interconnect technology to flexibly combine smaller heterogeneous designs in a system-on-package. Internal I/O (IIO) are placed at two ends of the inter-die interconnect. Small dimension of IIOs prohibits tester probing. This, along with the very large number of inter-die interconnects poses a serious challenge to robustly test these interconnects. This is a hindrance to adopting 3D interconnect technologies. This paper discusses the difference between IIO testing and GPIO, HSIO testing. A novel IIO BIST solution, which removes a major obstacle for adopting 3D-interconnect technology, is presented.
许多半导体制造公司使用3D互连技术灵活地将较小的异构设计组合在系统级封装中。内部I/O (IIO)位于芯片互连的两端。IIOs的小尺寸妨碍测试器探测。这一点,加上大量的内部互连,对这些互连的可靠测试提出了严峻的挑战。这是采用3D互连技术的一个障碍。本文讨论了IIO测试与GPIO、HSIO测试的区别。提出了一种新颖的IIO - BIST解决方案,消除了采用3d互连技术的主要障碍。
{"title":"Internal I/O Testing: Definition and a Solution","authors":"S. Chakravarty, Fei Su, Indira A Gohad, Sudheer V Bandana, B. S. Adithya, W. M. Lim","doi":"10.1109/VTS48691.2020.9107567","DOIUrl":"https://doi.org/10.1109/VTS48691.2020.9107567","url":null,"abstract":"Many semi-conductor manufacturing companies use 3D interconnect technology to flexibly combine smaller heterogeneous designs in a system-on-package. Internal I/O (IIO) are placed at two ends of the inter-die interconnect. Small dimension of IIOs prohibits tester probing. This, along with the very large number of inter-die interconnects poses a serious challenge to robustly test these interconnects. This is a hindrance to adopting 3D interconnect technologies. This paper discusses the difference between IIO testing and GPIO, HSIO testing. A novel IIO BIST solution, which removes a major obstacle for adopting 3D-interconnect technology, is presented.","PeriodicalId":326132,"journal":{"name":"2020 IEEE 38th VLSI Test Symposium (VTS)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2020-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131913933","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
DFSSD: Deep Faults and Shallow State Duality, A Provably Strong Obfuscation Solution for Circuits with Restricted Access to Scan Chain DFSSD:深故障和浅状态对偶,扫描链受限访问电路的一种可证明的强混淆解
Pub Date : 2020-02-18 DOI: 10.1109/VTS48691.2020.9107629
Shervin Roshanisefat, Hadi Mardani Kamali, K. Z. Azar, Sai Manoj Pudukotai Dinakarrao, Naghmeh Karimi, H. Homayoun, Avesta Sasan
In this paper, we introduce DFSSD, a novel logic locking solution for sequential and FSM circuits with a restricted (locked) access to the scan chain. DFSSD combines two techniques for obfuscation: (1) Deep Faults, and (2) Shallow State Duality. Both techniques are specifically designed to resist against sequential SAT attacks based on bounded model checking. The shallow state duality prevents a sequential SAT attack from taking a shortcut for early termination without running an exhaustive unbounded model checker to assess if the attack could be terminated. The deep fault, on the other hand, provides a designer with a technique for building deep, yet key recoverable faults that could not be discovered by sequential SAT (and bounded model checker based) attacks in a reasonable time.
在本文中,我们介绍了DFSSD,一种新的逻辑锁定解决方案,用于顺序和FSM电路,具有对扫描链的限制(锁定)访问。DFSSD结合了两种混淆技术:(1)深断层,(2)浅状态对偶。这两种技术都是专门设计来抵抗基于有界模型检查的连续SAT攻击的。浅状态对偶性防止连续的SAT攻击在不运行详尽的无界模型检查器来评估攻击是否可以终止的情况下采取早期终止的捷径。另一方面,深层故障为设计人员提供了一种技术,用于构建深层但关键的可恢复故障,这些故障无法在合理的时间内被连续的SAT(和基于有界模型检查器的)攻击发现。
{"title":"DFSSD: Deep Faults and Shallow State Duality, A Provably Strong Obfuscation Solution for Circuits with Restricted Access to Scan Chain","authors":"Shervin Roshanisefat, Hadi Mardani Kamali, K. Z. Azar, Sai Manoj Pudukotai Dinakarrao, Naghmeh Karimi, H. Homayoun, Avesta Sasan","doi":"10.1109/VTS48691.2020.9107629","DOIUrl":"https://doi.org/10.1109/VTS48691.2020.9107629","url":null,"abstract":"In this paper, we introduce DFSSD, a novel logic locking solution for sequential and FSM circuits with a restricted (locked) access to the scan chain. DFSSD combines two techniques for obfuscation: (1) Deep Faults, and (2) Shallow State Duality. Both techniques are specifically designed to resist against sequential SAT attacks based on bounded model checking. The shallow state duality prevents a sequential SAT attack from taking a shortcut for early termination without running an exhaustive unbounded model checker to assess if the attack could be terminated. The deep fault, on the other hand, provides a designer with a technique for building deep, yet key recoverable faults that could not be discovered by sequential SAT (and bounded model checker based) attacks in a reasonable time.","PeriodicalId":326132,"journal":{"name":"2020 IEEE 38th VLSI Test Symposium (VTS)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2020-02-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130763720","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
期刊
2020 IEEE 38th VLSI Test Symposium (VTS)
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