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2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks最新文献

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An ultra wideband transmitter based on up conversion architecture 一种基于上变频结构的超宽带发射机
Chao Fang, Yuanjin Zheng, C. Law
This paper presents a novel architecture of an ultra wideband (UWB) transmitter circuit. The transmitter is designed for high data rate wireless communication. It employs up conversion concept. The up conversion concept is to multiply Gaussian monocycle pulse with 6.4 GHz sine wave to push the spectrum of Gaussian monocycle pulse into higher frequency band. As a result, the FCC spectral mask can be used efficiently. The transmitter presented contains 6.4 GHz VCO source, divide-by-32 high frequency prescaler, Gaussian monocycle pulse generator, Gilbert cell BPSK modulator, differential to single converter, RF mixer and driven amplifier. The circuits are designed in 0.18 um RFCMOS technology from IMF (Institute of Microelectronics). Simulation showed the correct operation of the circuit for supply voltages of 1.8 V and a power consumption of 195 mW. And the transmitted pulse covers frequency bandwidth from 3.1 GHz to 10.6 GHz. All the circuit simulations are done by HPADS.
提出了一种新型的超宽带(UWB)发射机电路结构。该发射机是为高数据速率无线通信而设计的。它采用向上转换的概念。上转换原理是将高斯单环脉冲与6.4 GHz正弦波相乘,将高斯单环脉冲的频谱推入更高的频段。因此,FCC频谱掩模可以被有效地利用。该发射机由6.4 GHz压控振荡器源、32分频高频预分频器、高斯单周期脉冲发生器、吉尔伯特单元BPSK调制器、差分到单变换器、射频混频器和驱动放大器组成。电路采用国际微电子研究所0.18 um RFCMOS技术设计。仿真结果表明,该电路在电源电压为1.8 V、功耗为195 mW时可以正常工作。传输的脉冲覆盖3.1 GHz到10.6 GHz的频率带宽。所有电路仿真均由HPADS完成。
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引用次数: 6
Low power UWB RF transceiver for wireless headset 用于无线耳机的低功率UWB射频收发器
Seong-Soo Lee, Sang‐Min Han, M. Son, A. Dmitriev, A. Panas
In this paper, the UWB RF transceiver architecture based on a direct chaotic communication system is introduced for wireless headset applications. The direct chaotic communication technology can realize excellent low data rate UWB communication. The low power RF transceiver with chaotic UWB signal of 3 GHz /spl sim/ 5 GHz is implemented for MP3 audio transmission. This simply configured system prototype performs non-coherent detection without up/down mixers. The system is expected E/sub b//N/sub 0/ of 18 dB for PER /spl les/ 10/sup -2/ at 32 bytes length of PSDU, and power consumption of 20 mW in case of 0.13 micron CMOS RFIC fabrication.
本文介绍了一种基于直接混沌通信系统的UWB射频收发器体系结构。直接混沌通信技术可以实现出色的低数据速率超宽带通信。实现了3ghz /spl sim/ 5ghz超宽带混沌信号低功率射频收发器,用于MP3音频传输。这个简单配置的系统原型在没有上下混频器的情况下执行非相干检测。在32字节的PSDU长度下,系统的E/sub / b/ N/sub / 0/为18 dB /spl / les/ 10/sup -2/,在0.13微米CMOS RFIC制造的情况下,功耗为20 mW。
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引用次数: 11
A novel low-voltage switched load CMOS active mixer 一种新型低压开关负载CMOS有源混频器
Shen Dan
A novel CMOS active mixer topology that can operate at low voltages (e.g. 1 v) is presented in this paper. By switching the load on or off other than switching the current, the switches require no voltage headroom. Because the switches are capacitively connected to the load, the switch can operate under full swing allowed by the supply voltage and contribute no thermal noise. The mixer is designed in 0.18 um CMOS technology, and the simulation results at 1 V supply voltage are satisfactory (gain=7 dB, IP3=7 dBm, NF-11 dB).
本文提出了一种新颖的CMOS有源混频器拓扑结构,可以在低电压(例如1 v)下工作。通过打开或关闭负载而不是切换电流,开关不需要电压余量。由于开关电容连接到负载,开关可以在电源电压允许的全摆幅下工作,并且不会产生热噪声。该混频器采用0.18 um CMOS技术设计,在1 V电源电压下仿真结果令人满意(增益=7 dB, IP3=7 dBm, NF-11 dB)。
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引用次数: 3
Issues in high-frequency noise characterization and modeling of MOSFETs mosfet高频噪声表征与建模问题
Chih-Hung Chen
This paper provides an overview on the major issues in the high-frequency noise characterization of deep submicron MOSFETs for RF IC applications. It includes the HF noise parameter measurements, test structure design, parameter de-embedding, noise source extraction, physics-based noise models and noise sources implementations.
本文概述了射频集成电路应用中深亚微米mosfet高频噪声特性的主要问题。包括高频噪声参数测量、测试结构设计、参数去嵌入、噪声源提取、基于物理的噪声模型和噪声源实现。
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引用次数: 1
Electromechanical resonator based bandpass sigma-delta modulator for wireless transceivers 基于机电谐振器的无线收发器带通σ - δ调制器
Y. Xu, R. Yu
Bandpass sigma-delta modulators commonly employ switch-capacitor (SC) or continuous-time (CT) loop filters. SC sigma-delta modulator can provide robust performance, but at low center frequencies. Its CT counterpart is able to operate at much high frequency, but its performance is often impaired by low-Q CT loop filters and the need of frequency tuning. In this paper, an alternative approach is introduced. Bandpass sigma-delta modulators employing electromechanical resonators as loop filter are described. As a proof-of-concept, a second- and fourth-order bandpass sigma-delta modulator are demonstrated in a 0.35-/spl mu/m CMOS process using off-chip SAW resonators with a resonant frequency of 47.3 MHz. The dynamic ranges, measured in a 200-kHz signal bandwidth when sampled at 189.2 MHz, are 57 dB and 69 dB for the second- and fourth-order modulator, respectively. The chips operate under a 3.3-V single supply with a power dissipation of 30 and 45 mW, respectively.
带通σ - δ调制器通常采用开关电容(SC)或连续时间(CT)环路滤波器。SC σ - δ调制器可以提供鲁棒性能,但在低中心频率。其对应的CT能够在高频率下工作,但其性能经常受到低q CT环路滤波器和频率调谐需求的影响。本文介绍了另一种方法。描述了采用机电谐振器作为环路滤波器的带通σ - δ调制器。作为概念验证,在0.35-/spl mu/m CMOS工艺中,使用片外SAW谐振器演示了二阶和四阶带通sigma-delta调制器,谐振频率为47.3 MHz。当采样频率为189.2 MHz时,在200 khz信号带宽下测量的动态范围为二阶和四阶调制器分别为57 dB和69 dB。芯片工作在3.3 v单电源下,功耗分别为30和45 mW。
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引用次数: 6
An integrated dual-band SiGe HBT low noise amplifier 一种集成双频SiGe HBT低噪声放大器
Chengyu Huang, Y. Hsin
A common-base cascade dual-band low noise amplifier (LNA) for 2.4 and 5.8 GHz is presented in this paper. The LNA design is based on SiGe HBT (TSMC 0.35 /spl mu/m BiCMOS) technology. At 2.4 GHz, the LNA performs a noise figure of 4.3 dB, associated gain of 11.1 dB, IIP3 of -4.4 dBm, and OIP3 of 5.3 dBm. At 5.8 GHz, the LNA performs a noise figure of 5.4 dB, associated gain of 5.11 dB, IIP3 of 3.7 dBm, and OIP3 of 7.3 dBm. The dc power consumption is 8.4 mW and the chip size is 0.86 /spl times/ 0.58 mm/sup 2/.
提出了一种2.4 GHz和5.8 GHz的共基级联双频低噪声放大器。LNA设计基于SiGe HBT (TSMC 0.35 /spl mu/m BiCMOS)技术。在2.4 GHz时,LNA的噪声系数为4.3 dB,相关增益为11.1 dB, IIP3为-4.4 dBm, OIP3为5.3 dBm。在5.8 GHz时,LNA的噪声系数为5.4 dB,相关增益为5.11 dB, IIP3为3.7 dBm, OIP3为7.3 dBm。直流功耗为8.4 mW,芯片尺寸为0.86 /spl倍/ 0.58 mm/sup 2/。
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引用次数: 0
Band-reconfigurable high-efficiency power amplifier using MEMS switches 采用MEMS开关的带可重构高效功率放大器
H. Okazaki, S. Narahashi, A. Fukuda, T. Miki
A band-reconfigurable power amplifier (PA) is presented that comprises band-switchable matching networks with RF microelectromechanical systems switches. The fabricated triple-band PA achieves the output power of 30 dBm and the power added efficiency of 60% in three different frequency bands, 900 MHz, 1500 MHz, and 2000 MHz. Because the proposed band-reconfigurable PA can be extended to a larger number of frequency bands, it will contribute to "band-free" operation for future mobile terminals.
提出了一种由带射频微机电系统开关的带可切换匹配网络组成的带可重构功率放大器。制作的三频段扩音器在900mhz、1500mhz和2000mhz三个不同频段的输出功率达到30dbm,功率增加效率达到60%。由于所提出的频段可重构PA可以扩展到更多的频段,它将有助于未来移动终端的“无带”操作。
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引用次数: 2
A single-ended laser driver with shunt coplanar waveguide for reduced crosstalk 用于减少串扰的分流共面波导单端激光驱动器
H. Zhao, L. Lei, M. Ba, W. Jemison, J.C.M. Hwang, G. Dang, J.J. Liu, W. Chang
This paper describes a driver circuit for two-dimensional VCSEL arrays. The driver circuit uses a novel low-impedance shunt coplanar waveguide to minimize interchannel crosstalk. To demonstrate our approach, a 10 Gb/s GaAs HBT driver circuit has been designed and fabricated. Both measured and simulated results show a 20 dB crosstalk improvement compared to similar designs using conventional microstrip and coplanar waveguides. To the best of our knowledge, the crosstalk is the lowest reported for a two-dimensional VCSEL array driver in the open literature.
本文介绍了一种二维VCSEL阵列的驱动电路。驱动电路采用新颖的低阻抗分流共面波导,最大限度地减少通道间串扰。为了证明我们的方法,设计并制作了一个10 Gb/s的GaAs HBT驱动电路。测量和模拟结果表明,与使用传统微带和共面波导的类似设计相比,串扰改善了20 dB。据我们所知,在公开文献中,二维VCSEL阵列驱动器的串扰是最低的。
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引用次数: 0
MEMS IC concept for advanced RF and millimeterwave communications MEMS IC概念用于先进的射频和毫米波通信
K. Grenier, D. Dubuc, N. Do, J. Busquere, F. Coccetti, A. Coustou, D. Dragomirescu, R. Plana
This paper aims to give an overview of the new architecture that will be embedded with the next generation of RF and millimeterwave modules that will have to feature new functionalities as flexibility and reconfigurability to match with all the standard that are or that will emerge, adaptability, testability to optimize the performances "on demand" in order to improve the autonomy, the reliability. The last issue deals with the miniaturisation that will be necessary to have a higher compactness for the modules and a reduced weight that is crucial for embedded applications.
本文旨在概述将嵌入下一代射频和毫米波模块的新架构,这些模块必须具有新的功能,如灵活性和可重构性,以匹配所有现有或即将出现的标准,适应性,可测试性,以“按需”优化性能,以提高自主性和可靠性。最后一个问题涉及到小型化,这将是为模块提供更高的紧凑性和减轻重量所必需的,这对嵌入式应用至关重要。
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引用次数: 0
Investigation into CPW to stripline vertical transitions for millimeter-wave applications in LTCC LTCC中毫米波应用的CPW -带状线垂直跃迁研究
Shou Lei, Y. Guo, L. Ong
A novel additional intermediate ground plane structure is proposed in this paper to improve the RF performance of the grounded coplanar waveguide (GCPW) to stripline vertical transition. The ground plane is placed in an inner layer to reduce the distance between the upper and lower grounds, making the approximate impedance of GCPW close to 50 /spl Omega/. Meanwhile, with another additional pad in the inner layer, the inductive effect of the transition can be compensated and improvement has been achieved from 55 GHz to 70 GHz. The presented design was simulated and validated by measurements.
为了提高接地共面波导向带状线垂直过渡的射频性能,提出了一种新型的附加中间接平面结构。为了减小上下地之间的距离,将接地面置于内层,使GCPW的近似阻抗接近50 /spl ω /。同时,在内层增加一个衬垫,可以补偿过渡的感应效应,实现从55 GHz到70 GHz的提升。所提出的设计经过了仿真和测量验证。
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引用次数: 4
期刊
2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks
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