R. Doyle, B. O'Flynn, W. Lawton, J. Barrett, J. Buckley
Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and nondestructive analysis techniques.
{"title":"Glob-top reliability characterisation: evaluation and analysis methods","authors":"R. Doyle, B. O'Flynn, W. Lawton, J. Barrett, J. Buckley","doi":"10.1109/PEP.1997.656487","DOIUrl":"https://doi.org/10.1109/PEP.1997.656487","url":null,"abstract":"Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and nondestructive analysis techniques.","PeriodicalId":340973,"journal":{"name":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134130151","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Shipley has been developing products to meet the demands of sequential build-up (SBU) technology for about five years. Shipley has worked closely with customers in evaluating these technologies, and are also involved in a US government initiative for low cost PWBs produced using a sequential manufacturing process. Our initial photodielectric, Multiposit(R) 9500, exhibited excellent plated metal adhesion, good imaging, aqueous developability, and outstanding material properties. As part of the ongoing effort, a new material, Multiposit(R) XP-96700, is under development. This new material exhibits the same material properties, including plated metal adhesion and good electrical properties, as Multiposit(R) 9500, but also exhibits improved processing, via shape, and photospeed. This new material is the centrepiece of a total process solution under development which uses the concept of a "factory within a factory" to allow the coating and imaging of this material in a clean environment within the normal PWB manufacturing shop floor. This paper presents preliminary information on a new photodielectric material, including data on via resolution and plating, plated metal adhesion, and physical and electrical properties of the cured material. We discuss and analyse some of the challenges facing SBU technology with regard to cost, reliability, planarization, PTH processing, and yield. Our goal is to explore the use and characterization of this new dielectric material using an integrated approach of imaging and metallization through to final board finish and testing.
{"title":"Using a new photoimageable dielectric for PWB sequential build-up technology","authors":"P. Knudsen","doi":"10.1109/PEP.1997.656470","DOIUrl":"https://doi.org/10.1109/PEP.1997.656470","url":null,"abstract":"Shipley has been developing products to meet the demands of sequential build-up (SBU) technology for about five years. Shipley has worked closely with customers in evaluating these technologies, and are also involved in a US government initiative for low cost PWBs produced using a sequential manufacturing process. Our initial photodielectric, Multiposit(R) 9500, exhibited excellent plated metal adhesion, good imaging, aqueous developability, and outstanding material properties. As part of the ongoing effort, a new material, Multiposit(R) XP-96700, is under development. This new material exhibits the same material properties, including plated metal adhesion and good electrical properties, as Multiposit(R) 9500, but also exhibits improved processing, via shape, and photospeed. This new material is the centrepiece of a total process solution under development which uses the concept of a \"factory within a factory\" to allow the coating and imaging of this material in a clean environment within the normal PWB manufacturing shop floor. This paper presents preliminary information on a new photodielectric material, including data on via resolution and plating, plated metal adhesion, and physical and electrical properties of the cured material. We discuss and analyse some of the challenges facing SBU technology with regard to cost, reliability, planarization, PTH processing, and yield. Our goal is to explore the use and characterization of this new dielectric material using an integrated approach of imaging and metallization through to final board finish and testing.","PeriodicalId":340973,"journal":{"name":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116070464","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Due to the rapid progress in materials science over the two last decades, many important results have been obtained for photonic materials and new photonic devices have been demonstrated. In this review, we briefly describe results which have been published over the last ten years and results which will influence the future. We concentrate our review on polymers and semiconductor materials. We have excluded optical properties which are based on only manipulations of nanostructures with two exceptions: porous silicon and quantum well infrared detectors. For polymers, we discuss electroluminescence, linear and nonlinear phenomena, photochromism, liquid crystal electro-optics and polymer optical waveguides. Polymers have many advantages, but also disadvantages which motivate us to cover other research directions for photonic materials, such as erbium doped materials, porous silicon, II-VI wide bandgap and nitride based semiconductor materials. We finish this review with a discussion on infrared technology to emphasis also the importance of packaging for photonic devices.
{"title":"Recent research and progress in photonic devices and materials","authors":"M. Willander, K. Skarp, Q.X. Zhao, Y. Fu, W. Lu","doi":"10.1109/PEP.1997.656466","DOIUrl":"https://doi.org/10.1109/PEP.1997.656466","url":null,"abstract":"Due to the rapid progress in materials science over the two last decades, many important results have been obtained for photonic materials and new photonic devices have been demonstrated. In this review, we briefly describe results which have been published over the last ten years and results which will influence the future. We concentrate our review on polymers and semiconductor materials. We have excluded optical properties which are based on only manipulations of nanostructures with two exceptions: porous silicon and quantum well infrared detectors. For polymers, we discuss electroluminescence, linear and nonlinear phenomena, photochromism, liquid crystal electro-optics and polymer optical waveguides. Polymers have many advantages, but also disadvantages which motivate us to cover other research directions for photonic materials, such as erbium doped materials, porous silicon, II-VI wide bandgap and nitride based semiconductor materials. We finish this review with a discussion on infrared technology to emphasis also the importance of packaging for photonic devices.","PeriodicalId":340973,"journal":{"name":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115041764","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
R. Sihlbom, M. Dernevik, Z. Lai, P. Starski, J. Liu
In this paper, we present results from measurement and simulation of epoxy-based anisotropically conductive adhesive joints (ACA). We studied two different types of connection: flip-chip bonded Si test chip and a transmission line gap bridged by Cu foil. Test chips were mounted on three substrates: rigid FR-4 PCB, flexible PCB and high frequency teflon-based duroid substrate. Equivalent electrical models are discussed based on physical considerations and parameters were fitted to measurement data in the HP MDS high-frequency CAD tool. A HP8510 network analyser was used to measure S-parameters on rigid FR-4 and flex boards in the 500 MHz-8 GHz frequency range for both flip-chips and bridges, and for duroid mounted flip-chips and bridges over 1-30 GHz. ACA microstructures were studied by cross-sectioning and SEM. LF results for 500 MHz-8 GHz indicated that ACA flip-chip joints and bridge joints on FR-4 or flex can be used. For HF applications (1-30 GHz), ACA flip-chip joints and bridge joints on duroid can be used. For flip-chip joints and bridge joints, ACA was as good as or better than the solder joint for FR-4 over 45 MHz-2 GHz and for duroid substrates over 1-30 GHz. The largest contribution to transmission loss is due to Si chip resistivity in the flip-chip assembly. HP momentum analysis showed that for duroid, Si-chip crosstalk also gave power losses, which is not the case for FR-4 or flex. HP momentum analysis of flip-chip on FR-4 and flex showed that FR-4 and flex substrate losses also should be considered. Different ACA particle sizes and materials made little difference to ACA joint electrical behaviour.
{"title":"Conductive adhesives for high-frequency applications","authors":"R. Sihlbom, M. Dernevik, Z. Lai, P. Starski, J. Liu","doi":"10.1109/PEP.1997.656482","DOIUrl":"https://doi.org/10.1109/PEP.1997.656482","url":null,"abstract":"In this paper, we present results from measurement and simulation of epoxy-based anisotropically conductive adhesive joints (ACA). We studied two different types of connection: flip-chip bonded Si test chip and a transmission line gap bridged by Cu foil. Test chips were mounted on three substrates: rigid FR-4 PCB, flexible PCB and high frequency teflon-based duroid substrate. Equivalent electrical models are discussed based on physical considerations and parameters were fitted to measurement data in the HP MDS high-frequency CAD tool. A HP8510 network analyser was used to measure S-parameters on rigid FR-4 and flex boards in the 500 MHz-8 GHz frequency range for both flip-chips and bridges, and for duroid mounted flip-chips and bridges over 1-30 GHz. ACA microstructures were studied by cross-sectioning and SEM. LF results for 500 MHz-8 GHz indicated that ACA flip-chip joints and bridge joints on FR-4 or flex can be used. For HF applications (1-30 GHz), ACA flip-chip joints and bridge joints on duroid can be used. For flip-chip joints and bridge joints, ACA was as good as or better than the solder joint for FR-4 over 45 MHz-2 GHz and for duroid substrates over 1-30 GHz. The largest contribution to transmission loss is due to Si chip resistivity in the flip-chip assembly. HP momentum analysis showed that for duroid, Si-chip crosstalk also gave power losses, which is not the case for FR-4 or flex. HP momentum analysis of flip-chip on FR-4 and flex showed that FR-4 and flex substrate losses also should be considered. Different ACA particle sizes and materials made little difference to ACA joint electrical behaviour.","PeriodicalId":340973,"journal":{"name":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129176530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The target of this study was to develop a semiconductor SMD low cost package suitable for an absolute pressure sensor. Key demands were an in-line concept for production (reel to reel) and an 'open package' due to micromechanically moveable structures at the sensor surface. A NiPd plated Cu leadframe was chosen, on to which a thermoplastic case was to be injection moulded. Several high temperature thermoplastic materials were investigated. Finally, a polymer was chosen for its good processability, dimensional stability, low impurities in the polymer (e.g. monomeric ingredients) and therefore a chemically clean surface. For die attach, a number of epoxy, silicone, and thermoplastic adhesives were checked. The evaluation was made with respect to good adhesion to the thermoplastic package and to low stress characteristics, due to the stress sensitive chip. The investigation then turned to an appropriate encapsulant for the composition. Eight different encapsulants were investigated until one specific silicone gel was found to be the most applicable. Key requirements were a low loss factor (tan /spl delta/), good creep behaviour and self-degassing behaviour. A two component material with fast curing characteristics was selected.
{"title":"Material investigation for pressure sensor package P-DSOF-8-1","authors":"T. Janczek","doi":"10.1109/PEP.1997.656493","DOIUrl":"https://doi.org/10.1109/PEP.1997.656493","url":null,"abstract":"The target of this study was to develop a semiconductor SMD low cost package suitable for an absolute pressure sensor. Key demands were an in-line concept for production (reel to reel) and an 'open package' due to micromechanically moveable structures at the sensor surface. A NiPd plated Cu leadframe was chosen, on to which a thermoplastic case was to be injection moulded. Several high temperature thermoplastic materials were investigated. Finally, a polymer was chosen for its good processability, dimensional stability, low impurities in the polymer (e.g. monomeric ingredients) and therefore a chemically clean surface. For die attach, a number of epoxy, silicone, and thermoplastic adhesives were checked. The evaluation was made with respect to good adhesion to the thermoplastic package and to low stress characteristics, due to the stress sensitive chip. The investigation then turned to an appropriate encapsulant for the composition. Eight different encapsulants were investigated until one specific silicone gel was found to be the most applicable. Key requirements were a low loss factor (tan /spl delta/), good creep behaviour and self-degassing behaviour. A two component material with fast curing characteristics was selected.","PeriodicalId":340973,"journal":{"name":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123342965","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Bidstrup-Allen, S.-T. Wang, L. Nguyen, F. Arbelaez
This study focuses on the development of next generation integrated CAD-based software tools to simulate reactive flow phenomena during plastic encapsulation of ICs. These tools are applicable to both existing production packages and future configurations, such as moulded MCMs, chip scale packages, ball grid arrays, and ultra-thin QFPs. Successful flow simulation for accurate encapsulation process modelling is strongly dependent on input data for cure kinetics and moulding compound rheology. Studies of rheokinetic relations for epoxy systems have investigated model systems rather than commercial materials, mainly because model systems have slower cure kinetics that are better understood than fast (<1 min) commercial resins. In this study, a commercial epoxy moulding compound, Sumikon EME 6300 HN, is explored. Our approach for conversion and rheological data collection on these systems involves initial models of epoxy compounds with reduced catalyst loading rather than standard formulations. As gelation time for these systems is much longer, kinetics and rheological data collection in the pre-gel region is simplified. A Kamal autocatalytic kinetic equation is used to model the change in conversion with reaction time during polymerization of epoxy systems. Differences are noted in the kinetics between systems reacted isothermally at a typical process temperature (/spl sim/170/spl deg/C) and those reacted with a slow (<15/spl deg/C/min) dynamic temperature ramp. Viscosity data for both isothermal and dynamic modes were collected. Use of the Castro-Macosko equation to model pre-gel region viscosity conversion data is presented.
{"title":"Rheokinetics models for epoxy molding compounds used in IC encapsulation","authors":"S. Bidstrup-Allen, S.-T. Wang, L. Nguyen, F. Arbelaez","doi":"10.1109/PEP.1997.656485","DOIUrl":"https://doi.org/10.1109/PEP.1997.656485","url":null,"abstract":"This study focuses on the development of next generation integrated CAD-based software tools to simulate reactive flow phenomena during plastic encapsulation of ICs. These tools are applicable to both existing production packages and future configurations, such as moulded MCMs, chip scale packages, ball grid arrays, and ultra-thin QFPs. Successful flow simulation for accurate encapsulation process modelling is strongly dependent on input data for cure kinetics and moulding compound rheology. Studies of rheokinetic relations for epoxy systems have investigated model systems rather than commercial materials, mainly because model systems have slower cure kinetics that are better understood than fast (<1 min) commercial resins. In this study, a commercial epoxy moulding compound, Sumikon EME 6300 HN, is explored. Our approach for conversion and rheological data collection on these systems involves initial models of epoxy compounds with reduced catalyst loading rather than standard formulations. As gelation time for these systems is much longer, kinetics and rheological data collection in the pre-gel region is simplified. A Kamal autocatalytic kinetic equation is used to model the change in conversion with reaction time during polymerization of epoxy systems. Differences are noted in the kinetics between systems reacted isothermally at a typical process temperature (/spl sim/170/spl deg/C) and those reacted with a slow (<15/spl deg/C/min) dynamic temperature ramp. Viscosity data for both isothermal and dynamic modes were collected. Use of the Castro-Macosko equation to model pre-gel region viscosity conversion data is presented.","PeriodicalId":340973,"journal":{"name":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116811163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Variations of volume resistivity of three electrically conductive adhesives (Ag-filled epoxy, Ag-filled cyanate ester, and Ni-filled epoxy) during 85/spl deg/C/85%RH aging were studied. Volume resistivity of the two Ag-filled ECAs decreased slightly at the beginning of aging and then remained stable. However, the volume resistivity of the Ni-filled epoxy increased substantially. Joint resistance variations of these conductive adhesives with different metals (Ag, Cu, and Sn) were also studied by using a specially designed test vehicle. The Ag-filled epoxy with Ag and Cu wires did not show appreciable joint resistance increase during 1000-hour 85/spl deg/C/85%RH aging. However, dramatic joint resistance increase with Sn wire was observed. The joint resistance of the Ag-filled cyanate ester ECA with all the metal wires increased, slightly with Ag and Cu wires and more dramatically with Sn wire. The Ni-filled epoxy showed significant joint resistance increase with both Ag and Cu wires. The electrical conductivity development of an ECA and the Ag flake used in this adhesive was studied. It was found that under heating, electrical conduction was achieved above certain temperatures. The Ag flake achieved electrical conduction at higher temperature than the ECA. The effect of curing temperature on ECA resistivity and shrinkage was investigated. Samples cured at higher temperatures exhibited higher shrinkage and lower resistivity.
{"title":"Fundamental study of electrically conductive adhesives (ECAs)","authors":"C. Wong, D. Lu, L. Meyers, S. Vona, Q. Tong","doi":"10.1109/PEP.1997.656477","DOIUrl":"https://doi.org/10.1109/PEP.1997.656477","url":null,"abstract":"Variations of volume resistivity of three electrically conductive adhesives (Ag-filled epoxy, Ag-filled cyanate ester, and Ni-filled epoxy) during 85/spl deg/C/85%RH aging were studied. Volume resistivity of the two Ag-filled ECAs decreased slightly at the beginning of aging and then remained stable. However, the volume resistivity of the Ni-filled epoxy increased substantially. Joint resistance variations of these conductive adhesives with different metals (Ag, Cu, and Sn) were also studied by using a specially designed test vehicle. The Ag-filled epoxy with Ag and Cu wires did not show appreciable joint resistance increase during 1000-hour 85/spl deg/C/85%RH aging. However, dramatic joint resistance increase with Sn wire was observed. The joint resistance of the Ag-filled cyanate ester ECA with all the metal wires increased, slightly with Ag and Cu wires and more dramatically with Sn wire. The Ni-filled epoxy showed significant joint resistance increase with both Ag and Cu wires. The electrical conductivity development of an ECA and the Ag flake used in this adhesive was studied. It was found that under heating, electrical conduction was achieved above certain temperatures. The Ag flake achieved electrical conduction at higher temperature than the ECA. The effect of curing temperature on ECA resistivity and shrinkage was investigated. Samples cured at higher temperatures exhibited higher shrinkage and lower resistivity.","PeriodicalId":340973,"journal":{"name":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116656825","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The industry is increasingly confronted with the necessity of solving the problems associated with the disposal of discarded goods. The impact that products have on the environment is becoming an important criterion in marketing products. On account of this, the technological process steps in production of electronic devices, their use and their disposal have to be environmentally acceptable. The paper intends to describe the feasibility of building an environmentally friendly device by use of polymer thick film technology (PTF) for printed components and tracks on silicone substrates. The use of PTF for tracks is eco-friendly because the patterning should take place in principle without endangering the environment through chemical treatment. The use of flexible inks on flexible silicone substrates without harmful flame retarding chemical substances makes the whole circuit board especially eco-friendly and allows the building of a space-saving 3D-package. Another measure is the elimination of mounted components such as resistors, coils and capacitors, because they consist of different parts and consequently of several materials. Printing of these components is possible and well-known from hybrid electronics. Printed devices do not need a conventional mounting process, and in polymer technology they consist of a resin which is filled with an active substance.
{"title":"Application of polymer-thick-film-technology (PTF) for environmentally friendly electronic devices","authors":"T. Fischer","doi":"10.1109/PEP.1997.656492","DOIUrl":"https://doi.org/10.1109/PEP.1997.656492","url":null,"abstract":"The industry is increasingly confronted with the necessity of solving the problems associated with the disposal of discarded goods. The impact that products have on the environment is becoming an important criterion in marketing products. On account of this, the technological process steps in production of electronic devices, their use and their disposal have to be environmentally acceptable. The paper intends to describe the feasibility of building an environmentally friendly device by use of polymer thick film technology (PTF) for printed components and tracks on silicone substrates. The use of PTF for tracks is eco-friendly because the patterning should take place in principle without endangering the environment through chemical treatment. The use of flexible inks on flexible silicone substrates without harmful flame retarding chemical substances makes the whole circuit board especially eco-friendly and allows the building of a space-saving 3D-package. Another measure is the elimination of mounted components such as resistors, coils and capacitors, because they consist of different parts and consequently of several materials. Printing of these components is possible and well-known from hybrid electronics. Printed devices do not need a conventional mounting process, and in polymer technology they consist of a resin which is filled with an active substance.","PeriodicalId":340973,"journal":{"name":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126301934","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
R. Sihlbom, M. Dernevik, M. Lindgren, P. Starski, Z. Lai, J. Liu
This paper gives results from HF measurements and simulation of sequential build-up boards (SBU). An HF test pattern was designed to investigate SBU HF properties. SBUs were supplied by four manufacturers. The test SBUs contained patterns for crosstalk, impedance matching, stray capacitance and wire bonding. The boards had a double-sided FR-4 core with two built-up layers on each side, but the HF test board was only on one side. Test patterns were located in layers five and six. Two line spacings between signal and victim tracks of 50 /spl mu/m and 100 /spl mu/m were considered. S-parameters were measured on a network analyser in the 45 MHz-10 GHz range. In time domain test, near-end and far-end responses were measured. Simulations used P-SPICE, HP MDS and a 2D finite difference program. Impedance measurements and simulations were performed in layers five and six with conductor widths for 50 /spl Omega/ and 55 /spl Omega/ characteristic impedances. Line widths ranged from 40-65 /spl mu/m in layer five and 150-200 /spl mu/m in layer six. Reference tracks were designed to estimate conductor and dielectric loss. In the wire-bonding test, two interconnect types were assessed: a solder joint and an isotropically conductive adhesive joint (ICA). A Si test chip was used for wire-bonding on the SBU-board. Crosstalk measurements and simulations agreed closely over 45 MHz-10 GHz. Small differences between the three dielectrics were obtained, and dielectric loss is a limiting factor in the HF range. For a test pattern length of 30 mm, the HF limit (-3 dB transmission loss), was 2-3 GHz in layer six and 3-4 GHz in layer five. Measured characteristic impedances ranged from 44-63 /spl Omega/.
{"title":"High frequency measurements and simulations on wire-bonded modules on the sequential build-up boards (SBU)","authors":"R. Sihlbom, M. Dernevik, M. Lindgren, P. Starski, Z. Lai, J. Liu","doi":"10.1109/PEP.1997.656483","DOIUrl":"https://doi.org/10.1109/PEP.1997.656483","url":null,"abstract":"This paper gives results from HF measurements and simulation of sequential build-up boards (SBU). An HF test pattern was designed to investigate SBU HF properties. SBUs were supplied by four manufacturers. The test SBUs contained patterns for crosstalk, impedance matching, stray capacitance and wire bonding. The boards had a double-sided FR-4 core with two built-up layers on each side, but the HF test board was only on one side. Test patterns were located in layers five and six. Two line spacings between signal and victim tracks of 50 /spl mu/m and 100 /spl mu/m were considered. S-parameters were measured on a network analyser in the 45 MHz-10 GHz range. In time domain test, near-end and far-end responses were measured. Simulations used P-SPICE, HP MDS and a 2D finite difference program. Impedance measurements and simulations were performed in layers five and six with conductor widths for 50 /spl Omega/ and 55 /spl Omega/ characteristic impedances. Line widths ranged from 40-65 /spl mu/m in layer five and 150-200 /spl mu/m in layer six. Reference tracks were designed to estimate conductor and dielectric loss. In the wire-bonding test, two interconnect types were assessed: a solder joint and an isotropically conductive adhesive joint (ICA). A Si test chip was used for wire-bonding on the SBU-board. Crosstalk measurements and simulations agreed closely over 45 MHz-10 GHz. Small differences between the three dielectrics were obtained, and dielectric loss is a limiting factor in the HF range. For a test pattern length of 30 mm, the HF limit (-3 dB transmission loss), was 2-3 GHz in layer six and 3-4 GHz in layer five. Measured characteristic impedances ranged from 44-63 /spl Omega/.","PeriodicalId":340973,"journal":{"name":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124883265","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The trend for miniaturisation in electronic equipment is continuing unabated. The increasing complexity of electronic memory components allows for new layout structures and design possibilities which constantly reinforce this trend. As IC capacity rises, new packaging technologies are also gaining steadily in importance, and flip-chip technology has established itself as a marketable and highly efficient technique. When flip-chip technology is used, there is always a need to fill the gap between die and substrate with a resin, also known as an underfill. Due to different coefficients of thermal expansion, stresses appear between bumps and die as well as between bumps and substrate. The underfill minimises or compensates these stresses. Additionally, it ensures the die's mechanical stability on the substrate. This paper presents three different underfiller systems which are cured by three different mechanisms. These completely new and partly unique underfilling materials have been developed on the basis of elastified, single component epoxy resins, and are suitable for a wide range of carrier substrates, offering obvious advantages compared with the systems available on the market at present. Greater attention is paid to those underfills which enable completely new underfilling techniques involving photoinduced pre-activation by light of a certain wavelength and intensity, even without subsequent heat curing. This technology opens up new ways of drastically cutting flip-chip process cost by economising on several process steps.
{"title":"Flip-chip underfilling with non-conductive photoinitiated adhesives - a new approach","authors":"M. Spiegel","doi":"10.1109/PEP.1997.656502","DOIUrl":"https://doi.org/10.1109/PEP.1997.656502","url":null,"abstract":"The trend for miniaturisation in electronic equipment is continuing unabated. The increasing complexity of electronic memory components allows for new layout structures and design possibilities which constantly reinforce this trend. As IC capacity rises, new packaging technologies are also gaining steadily in importance, and flip-chip technology has established itself as a marketable and highly efficient technique. When flip-chip technology is used, there is always a need to fill the gap between die and substrate with a resin, also known as an underfill. Due to different coefficients of thermal expansion, stresses appear between bumps and die as well as between bumps and substrate. The underfill minimises or compensates these stresses. Additionally, it ensures the die's mechanical stability on the substrate. This paper presents three different underfiller systems which are cured by three different mechanisms. These completely new and partly unique underfilling materials have been developed on the basis of elastified, single component epoxy resins, and are suitable for a wide range of carrier substrates, offering obvious advantages compared with the systems available on the market at present. Greater attention is paid to those underfills which enable completely new underfilling techniques involving photoinduced pre-activation by light of a certain wavelength and intensity, even without subsequent heat curing. This technology opens up new ways of drastically cutting flip-chip process cost by economising on several process steps.","PeriodicalId":340973,"journal":{"name":"Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129167476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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