The shock-induced multi-spall processes of nanocrystalline titanium alloys were simulated based on molecular dynamics method in this study to reveal the multi-spall damage mechanism caused by non-planar effect of shock wave induced by microscopic interface. The microscopic interface in nanocrystalline titanium alloys caused non-planar effect of shock wave propagation and hindered shock wave propagation. The shapes of non-planar shock wave in nanocrystalline dual-phase titanium alloys were affected by the distribution of second phase grain. Based on the relationship between the evolution law of tensile stress and the nucleation principle of multi-spall voids, it was found that the multi-spall voids nucleated at microscopic interface under tensile stress generated by the encounter between the secondary reflected wave and the reflected wave for the first time. The non-uniform distribution of tensile stress generated by the encounter between the non-uniform propagation reflected waves led to the non-uniform distribution of multi-spall voids at microscopic interface. The increase of dislocation density caused by second phase grain hindered the secondary void nucleation in nanocrystalline dual-phase titanium alloys, resulting in the difference in secondary void nucleation between nanocrystalline single-phase titanium alloy and nanocrystalline dual-phase titanium alloys. The damage rate () at the spall stage and strain rate () at the shock stage were positively correlated and followed the relationship: ( and were fitting parameters and related to the microstructure of material and shock conditions). The multi-voids still nucleated at microscopic interfaces and the intergranular spall occurred in nanocrystalline titanium alloys although the shock velocity increased.
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