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Proceedings of the 2003 International Symposium on Low Power Electronics and Design, 2003. ISLPED '03.最新文献

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Statistical estimation of leakage current considering inter- and intra-die process variation 考虑模具间和模具内工艺变化的泄漏电流统计估计
Rajeev R. Rao, A. Srivastava, D. Blaauw, D. Sylvester
We develop a method to estimate the variation of leakage current due to both intra-die and inter-die gate length process variability. We derive an analytical expression to estimate the probability density function (PDF) of the leakage current for stacked devices found in CMOS gates. These distributions of individual gate leakage currents are then combined to obtain the mean and variance of the leakage current for an entire circuit. We also present an approach to account for both the inter- and intra-die gate length variations to ensure that the circuit leakage PDF correctly models both types of variation. The proposed methods were implemented and tested on a number of benchmark circuits. Comparison to Monte-Carlo simulation validates the accuracy of the proposed method and demonstrates the efficiency of the proposed analysis method. Comparison with traditional deterministic leakage current analysis demonstrates the need for statistical methods for leakage current analysis.
我们开发了一种方法来估计由于模内和模间栅极长度过程变化而引起的泄漏电流的变化。我们导出了一个解析表达式来估计CMOS栅极中堆叠器件泄漏电流的概率密度函数(PDF)。然后将各个栅极泄漏电流的这些分布组合起来,得到整个电路泄漏电流的平均值和方差。我们还提出了一种方法来解释模间和模内门长度的变化,以确保电路泄漏PDF正确地模拟这两种类型的变化。所提出的方法在多个基准电路上进行了实现和测试。通过与蒙特卡罗仿真的比较,验证了所提分析方法的准确性,并证明了所提分析方法的有效性。与传统的确定性泄漏电流分析方法的比较表明,泄漏电流分析需要统计方法。
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引用次数: 127
UDSM (ultra-deep sub-micron)-aware post-layout power optimization for ultra low-power CMOS VLSI 超低功耗CMOS VLSI的UDSM(超深亚微米)感知布局后功率优化
Kyu-won Choi, A. Chatterjee
In this paper, we propose an efficient approach to minimize total power (switching, short-circuit, and leakage power) without performance loss for ultra-low power CMOS circuits in nanometer technologies. We present a framework for combining supply/threshold voltage scaling, gate sizing, and interconnect scaling techniques for power optimization and propose an efficient heuristic algorithm which ensures that the total slack budget is maximal and the total power is minimal in the presence of back end (post-layout-based) UDSM effects. We have tested the proposed algorithms on a set of benchmark circuits and some building blocks of a synthesizable ARM core. The experimental results show that our polynomial-time solvable strategy delivers over an order of magnitude savings in total power without compromising performance.
在本文中,我们提出了一种有效的方法来最小化纳米技术中超低功耗CMOS电路的总功率(开关,短路和泄漏功率)而不损失性能。我们提出了一个将电源/阈值电压缩放、栅极缩放和互连缩放技术相结合的框架,用于功率优化,并提出了一种有效的启发式算法,该算法确保在存在后端(基于布局后)UDSM效应的情况下,总空闲预算最大,总功率最小。我们已经在一组基准电路和一些可合成ARM核心的构建块上测试了所提出的算法。实验结果表明,我们的多项式时间可解策略在不影响性能的情况下节省了超过一个数量级的总功率。
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引用次数: 5
Reducing instruction fetch energy with backwards branch control information and buffering 利用反向支路控制信息和缓冲减少指令提取能量
J. Rivers, S. Asaad, J. Wellman, J. Moreno
Many emerging applications, e.g. in the embedded and DSP space, are often characterized by their loopy nature where a substantial part of the execution time is spent within a few program phases. Loop buffering techniques have been proposed for capturing and processing these loops in small buffers to reduce the processor's instruction fetch energy. However, these schemes are limited to straight-line or innermost loops and fail to adequately handle complex loops. In this paper, we propose a dynamic loop buffering mechanism that uses backwards branch control information to identify, capture and process complex loop structures. The DLB controller has been fully implemented in VHDL, synthesized and timed with the IBM Booledozer and Einstimer Synthesis tools, and analyzed for power with the Sequence PowerTheater tool. Our experiments show that the DLB approach, on average, results in a factor of 3 reduction in energy consumption compared to a traditional instruction memory design at an area overhead of about 9%.
许多新兴的应用程序,例如在嵌入式和DSP领域,通常以其循环特性为特征,其中大部分执行时间都花在几个程序阶段中。为了减少处理器的指令获取能量,已经提出了在小缓冲区中捕获和处理这些循环的循环缓冲技术。然而,这些方案仅限于直线或最内层循环,不能充分处理复杂的循环。在本文中,我们提出了一种动态循环缓冲机制,该机制使用向后分支控制信息来识别,捕获和处理复杂的循环结构。采用VHDL语言对DLB控制器进行了全面实现,利用IBM Booledozer和einmer合成工具进行了合成和定时,并利用Sequence PowerTheater工具进行了功率分析。我们的实验表明,平均而言,与传统的指令存储器设计相比,DLB方法的能耗降低了3倍,而面积开销约为9%。
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引用次数: 4
A power-aware SWDR cell for reducing cache write power 一种功率感知的SWDR单元,用于降低缓存写功率
Yen-Jen Chang, Chia-Lin Yang, F. Lai
Low power caches have become a critical component of both hand-held devices and high-performance processors. Based on the observation that an overwhelming majority of the data written to the cache are '0', in this paper we propose a power-aware SRAM cell with one single-bitline write port and one differential-bitlines read port, called SWDR cell, to minimize the cache power consumption in writing '0'. The SWDR cell uses a circuit-level technique, which is software independent and orthogonal to other low power techniques at architecture-level. Compared to the conventional SRAM cell, the experimental results show that without compromise of both performance and stability, the SWDR cell can result in 73%-92% reduction in average cache write power dissipated in bitlines.
低功耗缓存已经成为手持设备和高性能处理器的关键组件。基于对写入缓存的绝大多数数据为“0”的观察,在本文中,我们提出了一个具有一个单位线写入端口和一个差分位线读取端口的功率感知SRAM单元,称为SWDR单元,以最大限度地减少写入“0”时的缓存功耗。SWDR单元采用电路级技术,该技术与软件无关,并且在架构级上与其他低功耗技术正交。实验结果表明,与传统的SRAM单元相比,在不影响性能和稳定性的情况下,SWDR单元可以使平均缓存写功耗(以位线为单位)降低73% ~ 92%。
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引用次数: 4
A forward body-biased-low-leakage SRAM cache: device and architecture considerations 前向体偏低泄漏SRAM缓存:器件和架构考虑
C.H. Kim, Jae-Joon Kim, S. Mukhopadhyay, K. Roy
This paper presents a forward body-biasing (FBB) scheme for active leakage power reduction in cache memories. We utilize super high V/sub T/ (threshold voltage) devices to suppress the leakage power in unselected portions of a cache while fast operation is achieved by dynamically forward body-biasing the selected SRAM cells. In order to generate a super high V/sub T/ device, the 2D halo doping profile was optimized by considering different nanometer regime leakage mechanisms. The transition latency and energy overhead associated with FBB could be minimized by (i) waking up the SRAM cells ahead of the access and (ii) exploiting the cache access pattern. The combined device-circuit-architecture level techniques offer 64% total leakage reduction and 7.3% improvement in bitline delay compared to a previous state-of-the-art low-leakage SRAM technique.
提出了一种前向体偏置(FBB)方案,用于降低高速缓存存储器的有源泄漏功率。我们利用超高V/sub /(阈值电压)器件来抑制缓存中未选择部分的泄漏功率,同时通过动态前向体偏置所选SRAM单元实现快速操作。为了生成超高V/sub T/器件,考虑了不同的纳米区泄漏机制,对二维晕掺杂谱进行了优化。与FBB相关的转换延迟和能量开销可以通过(i)在访问之前唤醒SRAM单元和(ii)利用缓存访问模式来最小化。与之前最先进的低泄漏SRAM技术相比,结合器件电路架构级技术可减少64%的总泄漏,并将位线延迟提高7.3%。
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引用次数: 13
A novel high frequency, high-efficiency, differential class-E power amplifier in 0.18 /spl mu/m CMOS 一种新颖的高频、高效率、差分e类功率放大器,采用0.18 /spl mu/m CMOS
P. Heydari, Ying Zhang
This paper presents the design of a high efficiency, low THD, 5.7 GHz fully differential power amplifier for wireless communications in a standard 0.18 /spl mu/m CMOS technology. The power amplifier employs a fully differential class-E topology to achieve high power efficiency by exploiting its soft-switching property. In order to achieve high operating frequency, an injection-locked oscillator is utilized, which makes the output voltage of the power amplifier tuned at the input signal frequency. A complementary CMOS cross-coupled pair topology is employed to realize the LC-tank oscillator because it has lower phase-noise, thereby giving lower THD than the single NMOS cross-coupled pair topology. The proposed power amplifier can deliver 25 dBm output power to a 50 /spl Omega/ load at 5.7 GHz with 42.6% power-added efficiency (PAE) from a 1.8 V supply voltage.
本文设计了一种高效、低THD、5.7 GHz的无线通信全差分功率放大器,采用标准的0.18 /spl mu/m CMOS工艺。该功率放大器采用全差分e类拓扑结构,利用其软开关特性实现高功率效率。为了实现高工作频率,利用注入锁定振荡器使功率放大器的输出电压在输入信号频率上调谐。采用互补CMOS交叉耦合对拓扑结构实现LC-tank振荡器,因为它具有较低的相位噪声,从而比单NMOS交叉耦合对拓扑结构提供更低的THD。所提出的功率放大器可以在1.8 V电源电压下为5.7 GHz的50 /spl ω /负载提供25 dBm输出功率,功率附加效率(PAE)为42.6%。
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引用次数: 7
A new architecture for rail-to-rail input constant-g/sub m/ CMOS operational transconductance amplifiers 一种轨对轨输入恒g/sub / CMOS运算跨导放大器的新架构
M. M. Ahmadi, R. Lotfi, M. Sharif-Bakhtiar
A new architecture for constant-g/sub m/, rail-to-rail(R-R) input stages is presented that has less than 5% deviation in g/sub m/ over the entire range of the input common-mode voltage. Furthermore, a new structure for folded cascode amplifier based on the use of a floating current source is presented. Employing these techniques a low-power operational transconductance amplifier (OTA) with 100 MHz unity-gain bandwidth, 106 dB gain, 60/spl deg/ phase margin, 2.65 V swing, and 6.4 nV//spl radic/Hz input-referred noise with R-R input common-mode range is realized in a 0.8 /spl mu/m CMOS technology. This amplifier dissipates 10 mW from a 3V power supply.
提出了一种恒g/sub -m /、轨对轨(R-R)输入级的新架构,在整个输入共模电压范围内g/sub -m /的偏差小于5%。在此基础上,提出了一种基于浮动电流源的折叠级联放大器结构。利用这些技术,在0.8 /spl mu/m CMOS技术中实现了具有100 MHz单位增益带宽、106 dB增益、60/spl度/相位裕度、2.65 V摆幅和6.4 nV//spl径向/Hz输入参考噪声、R-R输入共模范围的低功率跨导运算放大器(OTA)。这个放大器从3V电源耗散10mw。
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引用次数: 0
A power-optimized widely-tunable 5-GHz monolithic VCO in a digital SOI CMOS technology. On high resistivity substrate 基于数字SOI CMOS技术的功率优化宽可调谐5 ghz单片压控振荡器。在高电阻率衬底上
Jonghae Kim, J. Plouchart, N. Zamdmer, M. Sherony, Yue Tan, Meeyoung Yoon, R. Trzcinski, Mosbah Talbi, J. Safran, A. Ray, L. Wagner
This paper describes the design and technology optimization of power-efficient monolithic VCOs with wide tuning range. Four 5-GHz LC-tank VCOs were fabricated in a 0.12-/spl mu/m SOI CMOS technology that was not enhanced for RF applications. High and regular resistivity substrates were used, as were single-layer and multiple-layer copper inductors. Using a new figure-of-merit (FOM/sub T/) that encompasses power dissipation, phase noise and tuning range, our best VCO has an FOM/sub T/ of -189 dBc/Hz. The measured frequency tuning range is 22 % and the phase noise is 126 dBc/Hz at 1 MHz offset for 4.5-GHz. Oscillation was achieved at 5.4-GHz at a minimum power consumption of 500 /spl mu/W.
本文介绍了一种低功耗、宽调谐范围的单片压控振荡器的设计和工艺优化。4个5 ghz LC-tank vco采用0.12-/spl mu/m SOI CMOS技术制造,该技术未针对RF应用进行增强。采用高电阻率和规则电阻率衬底,以及单层和多层铜电感器。使用包含功耗、相位噪声和调谐范围的新性能指标(FOM/sub T/),我们最好的VCO的FOM/sub T/为-189 dBc/Hz。测量频率调谐范围为22%,相位噪声为126 dBc/Hz,偏移量为1 MHz,频率为4.5 ghz。在5.4 ghz频率下实现振荡,最低功耗为500 /spl mu/W。
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引用次数: 1
Ambient intelligence - industrial research on a visionary concept 环境智能——对一个有远见的概念的工业研究
W. Weber
In this presentation, applications are discussed that describe achievements along the road towards 'ambient intelligence'. Appliances and devices disappear into the environment of the individual; instead services come into focus. Key to this development are systems solutions that lead to a significant improvement of the human-machine interface. Along this line, we present important technologies and key system components. They range from technologies for packaging and gathering of ambient energy, to system demonstrators such as low-cost electronic systems, ubiquitous sensor networks and electronics in smart textiles. The prime importance of the electric power supply and of low-power consumption, especially in the peripheral devices, is emphasized.
在本次演讲中,我们讨论了在“环境智能”道路上取得的成就。器具和设备消失在个人的环境中;相反,服务成为焦点。这一发展的关键是能够显著改善人机界面的系统解决方案。在此基础上,我们提出了重要的技术和关键的系统组件。它们的范围从包装和收集环境能量的技术,到低成本电子系统、无处不在的传感器网络和智能纺织品中的电子产品等系统演示。强调了电力供应和低功耗的首要重要性,特别是在外围设备中。
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引用次数: 50
Modeling and estimation of total leakage current in nano-scaled-CMOS devices considering the effect of parameter variation 考虑参数变化影响的纳米级cmos器件总泄漏电流建模与估计
S. Mukhopadhyay, K. Roy
In this paper we have developed analytical models to estimate the mean and the standard deviation in the gate, the subthreshold, the reverse biased source/drain junction band-to-band tunneling (BTBT) and the total leakage in scaled CMOS devices considering variation in process parameters like device geometry, doping profile, flat-band voltage and supply voltage. We have verified the model using Monte Carlo simulation using an NMOS device of 50 nm effective length and analyzed the results to enumerate the effect of different process parameters on the individual components and the total leakage.
在本文中,我们开发了分析模型来估计栅极,亚阈值,反向偏置源/漏极带到带隧道(BTBT)的平均值和标准差,以及考虑器件几何形状,掺杂轮廓,平带电压和电源电压等工艺参数变化的比例CMOS器件中的总泄漏。利用有效长度为50 nm的NMOS器件对模型进行了蒙特卡罗仿真验证,并对结果进行了分析,列举了不同工艺参数对各组分和总泄漏量的影响。
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引用次数: 28
期刊
Proceedings of the 2003 International Symposium on Low Power Electronics and Design, 2003. ISLPED '03.
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