2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724514
G. Massimino, A. Colombo, R. Ardito, F. Quaglia, F. Foncellino, A. Corigliano
This work is focused on the multi-physics modelling via the finite element method (FEM) of an air-coupled array of Piezoelectric Micromachined Ultrasonic Transducers (PMUTs) and its preliminary experimental validation in the time domain for the mechanical and acoustic behaviour.Two numerical models are used to simulate the complete performance of the system based on the response of the diaphragm.In the former, the electro-mechanical-acoustic (EMA) problem for the single PMUT is solved, exploiting the axial symmetry of the system, with the following features: the presence of the fabrication induced residual stresses, which determine a non-linear initial deformed configuration and a substantial linearized fundamental mode frequency shift of the piezo-plate; the multiple couplings between different physics, namely piezoelectric coupling in the active layer and acoustic-structural interaction for the waves propagation in the surrounding fluid. When the non-linearities are activated in the dynamic response, by the involved large displacements, the system shows an initial beating behaviour with small steady state amplitude increment as the voltage input increases.In the latter model, the full set of PMUTs belonging to the silicon die in a 4 × 4 array configuration is considered in which the vibrating plates are modelled as equivalent oscillating rigid plane circular pistons, with reduced imposed acceleration amplitude, on a rigid baffle represented by the remaining part of the surface die.The results of the numerical simulations are compared with the experimental ones in terms of the initial static pre-deflection and pressure at 15 cm from the centre of the diaphragm, on the vertical direction along its own acoustic axis, in the case of the TX test with a single actuated transducer for different voltage amplitudes.
{"title":"Air-Coupled Array of Pmuts at 100 kHz with PZT Active Layer: Multiphysics Model and Experiments","authors":"G. Massimino, A. Colombo, R. Ardito, F. Quaglia, F. Foncellino, A. Corigliano","doi":"10.1109/EUROSIME.2019.8724514","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724514","url":null,"abstract":"This work is focused on the multi-physics modelling via the finite element method (FEM) of an air-coupled array of Piezoelectric Micromachined Ultrasonic Transducers (PMUTs) and its preliminary experimental validation in the time domain for the mechanical and acoustic behaviour.Two numerical models are used to simulate the complete performance of the system based on the response of the diaphragm.In the former, the electro-mechanical-acoustic (EMA) problem for the single PMUT is solved, exploiting the axial symmetry of the system, with the following features: the presence of the fabrication induced residual stresses, which determine a non-linear initial deformed configuration and a substantial linearized fundamental mode frequency shift of the piezo-plate; the multiple couplings between different physics, namely piezoelectric coupling in the active layer and acoustic-structural interaction for the waves propagation in the surrounding fluid. When the non-linearities are activated in the dynamic response, by the involved large displacements, the system shows an initial beating behaviour with small steady state amplitude increment as the voltage input increases.In the latter model, the full set of PMUTs belonging to the silicon die in a 4 × 4 array configuration is considered in which the vibrating plates are modelled as equivalent oscillating rigid plane circular pistons, with reduced imposed acceleration amplitude, on a rigid baffle represented by the remaining part of the surface die.The results of the numerical simulations are compared with the experimental ones in terms of the initial static pre-deflection and pressure at 15 cm from the centre of the diaphragm, on the vertical direction along its own acoustic axis, in the case of the TX test with a single actuated transducer for different voltage amplitudes.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130212892","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724590
Ramiro S. Vargas C, V. Gonda
Thermal cycling causes deformations in electronic packaging structures, which may result in severe loads of solder connections. Prediction of stresses and strains in the solder connections is a critical step in design for the reliability of interconnected parts. Leaded soldering materials have been broadly used for electronic interconnects in the past due to their favorable electric, mechanical and thermal properties. Presently many different lead-free solder materials are applied as a suitable replacement for the hazardous eutectic SnPb solder. Lead-free solders are frequently Sn-based alloys with silver (Ag) and copper (Cu), resulting in a higher melting temperature. In an electronic package, the thermal-mechanical integrity of a soldered structure is of high importance for the reliability of the assembly. Hence, its mechanical properties and consequently mechanical behavior should be analyzed to probe the reliability of unleaded solders.In this work, a fundamental finite element model was created for an electronic assembly, on which cyclic thermal and mechanical load was applied. For the interconnecting solder, three types: Sn-3.5Ag, SAC305, and SAC387 were employed in the different models and the integrity of the package were evaluated.
{"title":"Comparison of the thermal-mechanical behavior of a soldered stack influenced by the choice of the solder","authors":"Ramiro S. Vargas C, V. Gonda","doi":"10.1109/EUROSIME.2019.8724590","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724590","url":null,"abstract":"Thermal cycling causes deformations in electronic packaging structures, which may result in severe loads of solder connections. Prediction of stresses and strains in the solder connections is a critical step in design for the reliability of interconnected parts. Leaded soldering materials have been broadly used for electronic interconnects in the past due to their favorable electric, mechanical and thermal properties. Presently many different lead-free solder materials are applied as a suitable replacement for the hazardous eutectic SnPb solder. Lead-free solders are frequently Sn-based alloys with silver (Ag) and copper (Cu), resulting in a higher melting temperature. In an electronic package, the thermal-mechanical integrity of a soldered structure is of high importance for the reliability of the assembly. Hence, its mechanical properties and consequently mechanical behavior should be analyzed to probe the reliability of unleaded solders.In this work, a fundamental finite element model was created for an electronic assembly, on which cyclic thermal and mechanical load was applied. For the interconnecting solder, three types: Sn-3.5Ag, SAC305, and SAC387 were employed in the different models and the integrity of the package were evaluated.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"174 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133695079","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724527
Christian Römelsberger, M. Hanke
This work is concerned with the efficient calculation of the Ohmic losses in fast switching devices based on half bridge circuits. The methodology is to treat the system in the frequency domain avoiding expensive transient solutions. Here there are two basic types of loss distributions, the losses of the sinusoidal load current and the losses of the commutation current. A circuit simulation is carried out to determine the spectral content of the losses in order to determine the weights with which the two contributions to the loss distribution need to be added up.
{"title":"New Method to Determine the Local Joule Heat Distribution in Fast Switching Devices","authors":"Christian Römelsberger, M. Hanke","doi":"10.1109/EUROSIME.2019.8724527","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724527","url":null,"abstract":"This work is concerned with the efficient calculation of the Ohmic losses in fast switching devices based on half bridge circuits. The methodology is to treat the system in the frequency domain avoiding expensive transient solutions. Here there are two basic types of loss distributions, the losses of the sinusoidal load current and the losses of the commutation current. A circuit simulation is carried out to determine the spectral content of the losses in order to determine the weights with which the two contributions to the loss distribution need to be added up.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127379875","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724551
R. Pufall, D. May, B. Wunderle, G. M. Reuther, N. Pflügler, Dominik Udiljak
Thermo-mechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) and temperature variations remain a major concern for the reliability of semiconductor components. Over the last decade a lot of effort was spent to find solutions to avoid delamination in packages by increasing adhesion. Cohesive zone element simulation allows predicting delamination behaviour and the location of critical areas which are prone to unstable crack propagation. During failure analyses, scanning acoustic microscopy (SAM) is often the method of choice for the detection of delaminated interfaces. Exposed pad packages demand a more sophisticated method to detect lead frame side wall cracks and delamination as well. To fulfil the requirements for future exposed pad packages for automotive applications, we introduce a simulation based approach for estimating how much adhesion is necessary to avoid delamination at critical locations. Partly released elastic energy stored at critical interfaces (limited delamination) can help to avoid unstable crack propagation and, thus, increase the robustness of these packages under cyclic loading. Helpful would be a method (preferable non-destructive) to verify the amount of delaminated side wall area (lead frame, die paddle, and moulding compound) to identify the critical delamination temperature for the exposed pad packages.
{"title":"Prediction of robustness of packages by cohesive zone finite element simulation and verification by non-destructive tests","authors":"R. Pufall, D. May, B. Wunderle, G. M. Reuther, N. Pflügler, Dominik Udiljak","doi":"10.1109/EUROSIME.2019.8724551","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724551","url":null,"abstract":"Thermo-mechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) and temperature variations remain a major concern for the reliability of semiconductor components. Over the last decade a lot of effort was spent to find solutions to avoid delamination in packages by increasing adhesion. Cohesive zone element simulation allows predicting delamination behaviour and the location of critical areas which are prone to unstable crack propagation. During failure analyses, scanning acoustic microscopy (SAM) is often the method of choice for the detection of delaminated interfaces. Exposed pad packages demand a more sophisticated method to detect lead frame side wall cracks and delamination as well. To fulfil the requirements for future exposed pad packages for automotive applications, we introduce a simulation based approach for estimating how much adhesion is necessary to avoid delamination at critical locations. Partly released elastic energy stored at critical interfaces (limited delamination) can help to avoid unstable crack propagation and, thus, increase the robustness of these packages under cyclic loading. Helpful would be a method (preferable non-destructive) to verify the amount of delaminated side wall area (lead frame, die paddle, and moulding compound) to identify the critical delamination temperature for the exposed pad packages.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130116814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724511
B. Vandevelde, R. Labie, R. Lauwaert, Daniel Werkhoven, D. Vanderstraeten, E. Blansaer, Jonas Lannoo, D. Pissoort
In this work, the solder joint reliability of QFN components is experimentally tested in thermal cycling and four-point bending cycling conditions, and this for three different solder materials: standard SAC305, low Ag SAC alloy and a new low melting temperature SnBi based alloy LMPA-Q. The outcome of the study is to evaluate if these new SnBi based solder material perform similar, worse or better than the more standard lead-free solders.
{"title":"Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q","authors":"B. Vandevelde, R. Labie, R. Lauwaert, Daniel Werkhoven, D. Vanderstraeten, E. Blansaer, Jonas Lannoo, D. Pissoort","doi":"10.1109/EUROSIME.2019.8724511","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724511","url":null,"abstract":"In this work, the solder joint reliability of QFN components is experimentally tested in thermal cycling and four-point bending cycling conditions, and this for three different solder materials: standard SAC305, low Ag SAC alloy and a new low melting temperature SnBi based alloy LMPA-Q. The outcome of the study is to evaluate if these new SnBi based solder material perform similar, worse or better than the more standard lead-free solders.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":" 45","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132095903","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724586
K. Jansen
Smart textiles are textiles with integrated sensors, data processing, communication and power units and can be regarded as a new application field for microelectronic devices. It largely benefits from a series of recent developments: sensors become smaller, more reliable and require less power and, on the other hand, energy harvesting techniques are continuously improving as well as energy storage devices as flexible batteries and super capacitors. Based on these rapid developments it is not unlikely to expect that in the near future we indeed will have textiles with an integrated battery less sensor network which will continuously monitor the health of patients, soldiers or you yourself.In this paper we show that before these e-textiles are as widely spread and accepted as our cell phones, a number of hurdles must be taken first.
{"title":"Smart textiles: how electronics merge into our clothing","authors":"K. Jansen","doi":"10.1109/EUROSIME.2019.8724586","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724586","url":null,"abstract":"Smart textiles are textiles with integrated sensors, data processing, communication and power units and can be regarded as a new application field for microelectronic devices. It largely benefits from a series of recent developments: sensors become smaller, more reliable and require less power and, on the other hand, energy harvesting techniques are continuously improving as well as energy storage devices as flexible batteries and super capacitors. Based on these rapid developments it is not unlikely to expect that in the near future we indeed will have textiles with an integrated battery less sensor network which will continuously monitor the health of patients, soldiers or you yourself.In this paper we show that before these e-textiles are as widely spread and accepted as our cell phones, a number of hurdles must be taken first.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114275248","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724589
J. Auersperg, E. Auerswald, D. Vogel, S. Rzepka
Progressive miniaturization and functional integration in the field of BEoL structures of modern CMOS components call for the use of new materials (porous or nanoparticles filled) in connection with completely new manufacturing technologies. Residual stresses generated in thin layers during several manufacturing processes can lead to delamination and cracking before and because of the stress under CPI (during lead-free reflow soldering and further chip handling, in particular). Challenges for the improvement of thermos-mechanical reliability exist from two sides: the higher thermo-mechanical loads as well as the partly lower damage and fracture resistance of those new materials and interfaces. Therefore, the question of the residual stresses and their influence on the risk of damage and fracture become an important factor. This fact also has an impact on the application of fracture mechanics analysis using simulative numerical methods as a reliable method for process and design optimization [1]. In this paper, the part of residual stresses of different layers for the formation and propagation of cracks in BEoL structures have been investigated by experiment (FIB based residual stress estimation) and simulation (XFEM delivering crack initiation and propagation).
{"title":"BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses","authors":"J. Auersperg, E. Auerswald, D. Vogel, S. Rzepka","doi":"10.1109/EUROSIME.2019.8724589","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724589","url":null,"abstract":"Progressive miniaturization and functional integration in the field of BEoL structures of modern CMOS components call for the use of new materials (porous or nanoparticles filled) in connection with completely new manufacturing technologies. Residual stresses generated in thin layers during several manufacturing processes can lead to delamination and cracking before and because of the stress under CPI (during lead-free reflow soldering and further chip handling, in particular). Challenges for the improvement of thermos-mechanical reliability exist from two sides: the higher thermo-mechanical loads as well as the partly lower damage and fracture resistance of those new materials and interfaces. Therefore, the question of the residual stresses and their influence on the risk of damage and fracture become an important factor. This fact also has an impact on the application of fracture mechanics analysis using simulative numerical methods as a reliable method for process and design optimization [1]. In this paper, the part of residual stresses of different layers for the formation and propagation of cracks in BEoL structures have been investigated by experiment (FIB based residual stress estimation) and simulation (XFEM delivering crack initiation and propagation).","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123647396","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724521
M. Packwood, Daohui Li, Xiang Li, P. Mumby-Croft
A simulation driven study is presented relating to the reliability of high power semiconductor module busbars under vibrational loading. Unexpected mechanical failure presented under qualification testing leading to an in depth study of the geometry through the simulation tool. The simulation tool provided an in depth analysis into the effects of multiple aspects of the vibration qualification test, as well as directly leading to the discovery of an unforeseen manufacturing defect. Further simulation based analysis of the newly discovered defect led to its removal from the manufacturing process and the cessation of busbar failure under vibration qualification.
{"title":"High Power Terminal Vibrational Analysis in Response to Experimental Qualification Results","authors":"M. Packwood, Daohui Li, Xiang Li, P. Mumby-Croft","doi":"10.1109/EUROSIME.2019.8724521","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724521","url":null,"abstract":"A simulation driven study is presented relating to the reliability of high power semiconductor module busbars under vibrational loading. Unexpected mechanical failure presented under qualification testing leading to an in depth study of the geometry through the simulation tool. The simulation tool provided an in depth analysis into the effects of multiple aspects of the vibration qualification test, as well as directly leading to the discovery of an unforeseen manufacturing defect. Further simulation based analysis of the newly discovered defect led to its removal from the manufacturing process and the cessation of busbar failure under vibration qualification.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121282272","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/eurosime.2019.8724576
Zhuangjian Liu
The flexible and wearable electronics system is an emerging technology for next-generation electronics. This type of electronics system can geometrically accommodate large mechanical deformations without imparting significant strains and stress in the materials from which it is constructed. Potential applications of this technology include flexible sensors, communicative packaging, transmitters and new photovoltaic and microfluidic devices, as well as areas of medicine and athletics for which flexible and conformable electronics are required. Computational Mechanics studies reveal many of the key underlying aspects of these systems and can establish important design criteria concerning device failure. For example, results are used to indicate the maximum strain or stress in a system, or the critical strain for buckling, etc. Furthermore, studies are made to optimize mechanics and materials for circuits that exhibit maximum stretchability.
{"title":"Computational Mechanics for Flexible and Wearable Electronics","authors":"Zhuangjian Liu","doi":"10.1109/eurosime.2019.8724576","DOIUrl":"https://doi.org/10.1109/eurosime.2019.8724576","url":null,"abstract":"The flexible and wearable electronics system is an emerging technology for next-generation electronics. This type of electronics system can geometrically accommodate large mechanical deformations without imparting significant strains and stress in the materials from which it is constructed. Potential applications of this technology include flexible sensors, communicative packaging, transmitters and new photovoltaic and microfluidic devices, as well as areas of medicine and athletics for which flexible and conformable electronics are required. Computational Mechanics studies reveal many of the key underlying aspects of these systems and can establish important design criteria concerning device failure. For example, results are used to indicate the maximum strain or stress in a system, or the critical strain for buckling, etc. Furthermore, studies are made to optimize mechanics and materials for circuits that exhibit maximum stretchability.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125971493","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724571
Zhou Jing, M. Ibrahim, Jiajie Fan, Xuejun Fan, Guoqi Zhang
The estimation of lifetime for highly reliable products including Ultraviolet Light-emitting Diodes (UV LEDs) has been challenging based on traditional lifetime tests that records time to failure. Recently constant stress and step stress degradation tests are used to gather degradation path data and modeling the degradation of performance characteristics has been applied. In this paper, a step stress accelerated degradation test (SSADT) designed to capture the degradation path and study the lifetime of UV LEDs. The radiation power degradation path was analyzed based on the IES TM-21 least square regression (LSR) and Wiener process approach. With its advantage of requiring smaller sample size and shorter test time, the SSADT provides a degradation path suitable for the proposed Wiener process modeling. The lifetime estimation for UV LEDs based on the proposed wiener process approach shows better prediction accuracy compared to the TM-21 LSR approach. By using this method, dynamic changes and degradation of the UV LEDs can be easily studied, and it can effectively estimate their remaining useful lifetimes.
{"title":"Lifetime Prediction of Ultraviolet Light-emitting Diodes with Accelerated Wiener Degradation Process","authors":"Zhou Jing, M. Ibrahim, Jiajie Fan, Xuejun Fan, Guoqi Zhang","doi":"10.1109/EUROSIME.2019.8724571","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724571","url":null,"abstract":"The estimation of lifetime for highly reliable products including Ultraviolet Light-emitting Diodes (UV LEDs) has been challenging based on traditional lifetime tests that records time to failure. Recently constant stress and step stress degradation tests are used to gather degradation path data and modeling the degradation of performance characteristics has been applied. In this paper, a step stress accelerated degradation test (SSADT) designed to capture the degradation path and study the lifetime of UV LEDs. The radiation power degradation path was analyzed based on the IES TM-21 least square regression (LSR) and Wiener process approach. With its advantage of requiring smaller sample size and shorter test time, the SSADT provides a degradation path suitable for the proposed Wiener process modeling. The lifetime estimation for UV LEDs based on the proposed wiener process approach shows better prediction accuracy compared to the TM-21 LSR approach. By using this method, dynamic changes and degradation of the UV LEDs can be easily studied, and it can effectively estimate their remaining useful lifetimes.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133717910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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