2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献
Pub Date : 2019-03-24DOI: 10.1109/EUROSIME.2019.8724510
Ilho Myeong, J. Jeon, Myounggon Kang, Hyungcheol Shin
In this paper, self-heating effect in newly introduced Vertical FET is investigated and discussed, and several architecture parameters such as channel width, number of channels affecting thermal reliability of VFET are studied through simulations. It is illustrated that VFET shows high lattice temperature and thermal resistance increase from changes in such architecture parameters. And lattice temperature imbalance between channels which causes performance and lifetime differences can be mitigated by adjusting the spacing between channels of multi-channel VFETs.
{"title":"Analysis of Self Heating Effect in Vertical-channel Field Effect Transistor","authors":"Ilho Myeong, J. Jeon, Myounggon Kang, Hyungcheol Shin","doi":"10.1109/EUROSIME.2019.8724510","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724510","url":null,"abstract":"In this paper, self-heating effect in newly introduced Vertical FET is investigated and discussed, and several architecture parameters such as channel width, number of channels affecting thermal reliability of VFET are studied through simulations. It is illustrated that VFET shows high lattice temperature and thermal resistance increase from changes in such architecture parameters. And lattice temperature imbalance between channels which causes performance and lifetime differences can be mitigated by adjusting the spacing between channels of multi-channel VFETs.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127729469","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-24DOI: 10.1109/EUROSIME.2019.8724533
E. Liu, F. Conti, R. Signorini, Enrico Brugnolotto, Sri Krishna Bhogaraju, G. Elger
In semiconductor devices manufacturing, various materials with different physico-chemical characteristics are connected and over hundreds of sequenced processing steps are necessary. In this regard, thermomechanical stress due to compressive and tensile strain is a serious aspect inside the device. Residual thermomechanical stress due to large difference in coefficients of thermal expansion between the materials generates reliability problems not only at the bonded interfaces but also for the lifetime of the active regions of the high power semiconductors. In this study, blue LEDs based on gallium nitride (GaN) bonded to a silicon carrier by a gold layer were soldered with eutectic gold-tin (AuSn) on a copper board or an aluminum insulated metal (AI-IMS). For both boards a reflow process in presence of formic acid vapor was used for soldering. The assemblies were studied using Raman spectroscopy. A finite element model was developed to simulate the thermomechanical stress present in the assemblies. Measured and simulated values were compared and evaluated at room temperature, at -50°C and at 180°C. The results suggest guidelines for the optimization of the assembling process of LED-based microelectronic devices.
{"title":"Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments","authors":"E. Liu, F. Conti, R. Signorini, Enrico Brugnolotto, Sri Krishna Bhogaraju, G. Elger","doi":"10.1109/EUROSIME.2019.8724533","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724533","url":null,"abstract":"In semiconductor devices manufacturing, various materials with different physico-chemical characteristics are connected and over hundreds of sequenced processing steps are necessary. In this regard, thermomechanical stress due to compressive and tensile strain is a serious aspect inside the device. Residual thermomechanical stress due to large difference in coefficients of thermal expansion between the materials generates reliability problems not only at the bonded interfaces but also for the lifetime of the active regions of the high power semiconductors. In this study, blue LEDs based on gallium nitride (GaN) bonded to a silicon carrier by a gold layer were soldered with eutectic gold-tin (AuSn) on a copper board or an aluminum insulated metal (AI-IMS). For both boards a reflow process in presence of formic acid vapor was used for soldering. The assemblies were studied using Raman spectroscopy. A finite element model was developed to simulate the thermomechanical stress present in the assemblies. Measured and simulated values were compared and evaluated at room temperature, at -50°C and at 180°C. The results suggest guidelines for the optimization of the assembling process of LED-based microelectronic devices.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121260665","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-24DOI: 10.1109/EUROSIME.2019.8724540
B. Wunderle, D. May, J. Heilmann, J. Arnold, J. Hirscheider, Y. Li, J. Bauer, R. Schacht, M. A. Ras
Thermal greases allow a low stress bond at low bond line thicknesses (BLT) at medium thermal conductivities and simple application, all of which make it an alternative to solders, thermal adhesives or pads. It is widely used in power and microprocessor applications, most of which involve large areas to be used for heat transfer. However, for years thermal overload failure of power modules and chips has been a pressing problem due to pump-out of thermal grease as a die or module thermal interface material (TIM): Most thermal greases are Bingham fluids and thus not solids, so they can be squeezed out from in between the gap, driven by thermo-mechanical action of the adjacent layers as e.g. DCB substrate or silicon chip with the heat sink. Today, thermal greases have to be qualified in lengthy stress tests in a product relevant environment which consumes substantial resources as often a system test is required. Therefore, a fast test is necessary which accelerates testing and thus allows a fast screening of commercial greases on one hand, and guidelines for material development on the other. For that purpose this paper addresses this topic in a combined simulative and experimental way, where at the same time a novel test procedure is proposed for accelerated grease pump-out testing (GPOT) in the framework of a completely new approach, combining loading with in-situ failure analytical techniques and decoupling thermal from mechanical loading. This allows for the first time a realistic loading of greases during accelerated testing with testing times below one hour. The method is demonstrated on various commercial and custom greases, varying their composition and structure, and benchmarked against industry standard thermal cycling tests. Further, two fundamental failure mechanisms have been identified being at work simultaneously, notably fluid transport (which constitutes actually a pump-in phenomenon) and air entrapment. We were able to identify key properties of the materials and loading variables, on which their intensity depends.
{"title":"Accelerated Pump Out Testing for Thermal Greases","authors":"B. Wunderle, D. May, J. Heilmann, J. Arnold, J. Hirscheider, Y. Li, J. Bauer, R. Schacht, M. A. Ras","doi":"10.1109/EUROSIME.2019.8724540","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724540","url":null,"abstract":"Thermal greases allow a low stress bond at low bond line thicknesses (BLT) at medium thermal conductivities and simple application, all of which make it an alternative to solders, thermal adhesives or pads. It is widely used in power and microprocessor applications, most of which involve large areas to be used for heat transfer. However, for years thermal overload failure of power modules and chips has been a pressing problem due to pump-out of thermal grease as a die or module thermal interface material (TIM): Most thermal greases are Bingham fluids and thus not solids, so they can be squeezed out from in between the gap, driven by thermo-mechanical action of the adjacent layers as e.g. DCB substrate or silicon chip with the heat sink. Today, thermal greases have to be qualified in lengthy stress tests in a product relevant environment which consumes substantial resources as often a system test is required. Therefore, a fast test is necessary which accelerates testing and thus allows a fast screening of commercial greases on one hand, and guidelines for material development on the other. For that purpose this paper addresses this topic in a combined simulative and experimental way, where at the same time a novel test procedure is proposed for accelerated grease pump-out testing (GPOT) in the framework of a completely new approach, combining loading with in-situ failure analytical techniques and decoupling thermal from mechanical loading. This allows for the first time a realistic loading of greases during accelerated testing with testing times below one hour. The method is demonstrated on various commercial and custom greases, varying their composition and structure, and benchmarked against industry standard thermal cycling tests. Further, two fundamental failure mechanisms have been identified being at work simultaneously, notably fluid transport (which constitutes actually a pump-in phenomenon) and air entrapment. We were able to identify key properties of the materials and loading variables, on which their intensity depends.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"319 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116230312","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724544
M. Feißt, Cong Li, J. Wilde
Thermo-mechanical deformation caused by the CTE-mismatch between device and substrate material is a severe problem for the mounting of sensor MEMS. FEM-simulations are helpful within the design process to minimize and predict errors of the output. Even when low-temperature interconnect methods like Transient-Liquid-Phase bonding are used simulations still might reduce costs in the development process. In this work, a material model for TLP-interconnects out of AgSn-alloys is presented. The elastic and plastic mechanical properties and CTE are determined for a temperature range between $25 ^ { circ } mathrm { C }$ and $200 ^{circ}mathrm {C}$. A combination of optical measurement for the strain, heating, and tensile testing was used for the experiments. Subsequently, the material data were used to analyze the thermo-mechanical behavior of a pressure sensor. On this example, the advantages of TLP-bonding were shown.
{"title":"Material Model and Simulation of Multilayer-AgSn-Foils for Transient-Liquid-Phase Bonding of Sensor Elements","authors":"M. Feißt, Cong Li, J. Wilde","doi":"10.1109/EUROSIME.2019.8724544","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724544","url":null,"abstract":"Thermo-mechanical deformation caused by the CTE-mismatch between device and substrate material is a severe problem for the mounting of sensor MEMS. FEM-simulations are helpful within the design process to minimize and predict errors of the output. Even when low-temperature interconnect methods like Transient-Liquid-Phase bonding are used simulations still might reduce costs in the development process. In this work, a material model for TLP-interconnects out of AgSn-alloys is presented. The elastic and plastic mechanical properties and CTE are determined for a temperature range between $25 ^ { circ } mathrm { C }$ and $200 ^{circ}mathrm {C}$. A combination of optical measurement for the strain, heating, and tensile testing was used for the experiments. Subsequently, the material data were used to analyze the thermo-mechanical behavior of a pressure sensor. On this example, the advantages of TLP-bonding were shown.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125000364","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724580
Péter Pálovics, M. Rencz
In this paper the movement and aggregation of the magnetic nanoparticles are investigated numerically in the presence of magnetic field in a micro-sized domain. The nanoparticles are located in a microfluidic device, in which continuous fluid flow is applied. The numerical model is created with the open source CFD software OpenFOAM, by extending one of its Eulerian-Lagrangian based solver. The simulations show that in the magnetic field the particles are aggregating to chains, which are oriented parallel to the magnetic field. The aggregation procedure is dominated by the magnetic interactions between the particles due to their magnetization.
{"title":"Numerical modelling of magnetic nanoparticle dynamics in microfluidic devices","authors":"Péter Pálovics, M. Rencz","doi":"10.1109/EUROSIME.2019.8724580","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724580","url":null,"abstract":"In this paper the movement and aggregation of the magnetic nanoparticles are investigated numerically in the presence of magnetic field in a micro-sized domain. The nanoparticles are located in a microfluidic device, in which continuous fluid flow is applied. The numerical model is created with the open source CFD software OpenFOAM, by extending one of its Eulerian-Lagrangian based solver. The simulations show that in the magnetic field the particles are aggregating to chains, which are oriented parallel to the magnetic field. The aggregation procedure is dominated by the magnetic interactions between the particles due to their magnetization.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122959015","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724508
Xiao-guang Lin, A. Dasgupta
Electronic packages are often exposed to complex life cycle environments, and in many cases, that involves exposure to multiaxial vibration. Previous studies have shown that under moderate or high amplitude multiaxial vibration, electronic systems can experience nonlinear response, especially for heavy components with high stand-off. This can produce cross-axis nonlinear interactions, resulting in amplification (or cancellation) of the nonlinear response, in comparison to the responses to uniaxial excitation along orthogonal axes. This nonlinear interaction has obvious implications on vibration durability of the assembly. The study performs a parametric combination of uniaxial and multiaxial vibration testing and modelling on structures that are mechanically equivalent to tall heavy electronic components, with varying loading parameters. Mechanical beams are designed as scaled surrogates to represent the dynamical behavior of Printed Circuit Boards (PCBs) with tall and heavy components on it. To investigate the nonlinear effects of multiaxial vibration excitation under different loading conditions, mechanical beams of different mass and length have been tested under different excitation profiles. The result shows that multiaxial vibration excitation can produce significant amounts of nonlinear cross-axis interactions, thus raising questions about the effectiveness of the traditional methodology of superposition of uniaxial vibration excitation for PWAs. The severity of nonlinear response depends not only on excitation parameters such as frequency ratios, phase relationships and amplitudes, but also on the component architecture. The resulting crossaxis interaction increases as the component becomes taller and heavier, which shows correlation between the size of the component and the nonlinearity of the vibrational response. The findings of this study will provide important guidance for developing protocols for multiaxial vibration testing instead of sequential uniaxial vibration testing.
{"title":"Effect of Nonlinear Interactions of Electronic Assemblies in Response to Multiaxial Vibration","authors":"Xiao-guang Lin, A. Dasgupta","doi":"10.1109/EUROSIME.2019.8724508","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724508","url":null,"abstract":"Electronic packages are often exposed to complex life cycle environments, and in many cases, that involves exposure to multiaxial vibration. Previous studies have shown that under moderate or high amplitude multiaxial vibration, electronic systems can experience nonlinear response, especially for heavy components with high stand-off. This can produce cross-axis nonlinear interactions, resulting in amplification (or cancellation) of the nonlinear response, in comparison to the responses to uniaxial excitation along orthogonal axes. This nonlinear interaction has obvious implications on vibration durability of the assembly. The study performs a parametric combination of uniaxial and multiaxial vibration testing and modelling on structures that are mechanically equivalent to tall heavy electronic components, with varying loading parameters. Mechanical beams are designed as scaled surrogates to represent the dynamical behavior of Printed Circuit Boards (PCBs) with tall and heavy components on it. To investigate the nonlinear effects of multiaxial vibration excitation under different loading conditions, mechanical beams of different mass and length have been tested under different excitation profiles. The result shows that multiaxial vibration excitation can produce significant amounts of nonlinear cross-axis interactions, thus raising questions about the effectiveness of the traditional methodology of superposition of uniaxial vibration excitation for PWAs. The severity of nonlinear response depends not only on excitation parameters such as frequency ratios, phase relationships and amplitudes, but also on the component architecture. The resulting crossaxis interaction increases as the component becomes taller and heavier, which shows correlation between the size of the component and the nonlinearity of the vibrational response. The findings of this study will provide important guidance for developing protocols for multiaxial vibration testing instead of sequential uniaxial vibration testing.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"402 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123964702","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724538
Z. Staliulionis, S. Mohanty, J. Hattel
Moisture is an important factor to reliability, functionality and durability of electronic devices. Nowadays, modelling tools have become an integral part of electronics design, because they are less expensive for searching the optimal design of moisture control. CFD and FEM are very time consuming due to their computational effort, therefore it is desirable to have a method such as well-known Resistor-Capacitor (RC) approach which is faster and has less spatial resolution. The paper concerns the development of an in-house code using the RC approach for simulating coupled heat and moisture transport inside electronic enclosure under non-isothermal conditions. Thereafter, the simulations results were compared with corresponding experiments in order to validate the developed code. Based on comparison with experiments, a new configuration RC model was developed for a more accurate humidity prediction. In general new RC model had the adsorption and desorption mechanisms included as a lumped capacitance for describing the surface of a wall on its both sides. Such modification improved the agreement with experiments.
{"title":"Resistor-Capacitor Approach for Modelling of Temperature and Humidity Response Inside Electronic Enclosures","authors":"Z. Staliulionis, S. Mohanty, J. Hattel","doi":"10.1109/EUROSIME.2019.8724538","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724538","url":null,"abstract":"Moisture is an important factor to reliability, functionality and durability of electronic devices. Nowadays, modelling tools have become an integral part of electronics design, because they are less expensive for searching the optimal design of moisture control. CFD and FEM are very time consuming due to their computational effort, therefore it is desirable to have a method such as well-known Resistor-Capacitor (RC) approach which is faster and has less spatial resolution. The paper concerns the development of an in-house code using the RC approach for simulating coupled heat and moisture transport inside electronic enclosure under non-isothermal conditions. Thereafter, the simulations results were compared with corresponding experiments in order to validate the developed code. Based on comparison with experiments, a new configuration RC model was developed for a more accurate humidity prediction. In general new RC model had the adsorption and desorption mechanisms included as a lumped capacitance for describing the surface of a wall on its both sides. Such modification improved the agreement with experiments.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114837670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724537
N. Unno, K. Yuki, R. Kibushi
Boiling heat transfer (BHT) is expected to be a cooling technology for next generation electronic devices because it can remove a large amount of heat from a heating surface using latent heat of vaporization. However, there are two big problems in BHT: critical heat flux (CHF) and vibration. When the heat flux exceeds CHF, film boiling occurs and it causes rapid increase of the temperature of the heating surface. At this time, electronic devices will be damaged or broken because of a high temperature. To perform BHT safely, therefore, a heat spreader is needed to decrease the heat flux less than CHF. To increase heat transfer coefficient (HTC), moreover, the heating surface should be contacted with a coolant directly while keeping high electrical insulation. On the other hand, boiling bubbles are generated and collapsed repeatedly in BHT, and it causes the vibration of the cooling system. Therefore, it is difficult to use a rigid adhesive for BHT cooling devices. Room-Temperature-Vulcanizing (RTV) silicones, which is elastomer, are typically used to connect the heating surface with vessels for BHT. However, the thermal conductivity of RTV silicone is usually low. In this study, the effect of the thermal conductivity of RTV silicone for BHT is investigated by thermal conductivity analysis.
{"title":"The effect of the thermal conductivity of room-temperature-vulcanizing silicone used for boiling heat transfer","authors":"N. Unno, K. Yuki, R. Kibushi","doi":"10.1109/EUROSIME.2019.8724537","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724537","url":null,"abstract":"Boiling heat transfer (BHT) is expected to be a cooling technology for next generation electronic devices because it can remove a large amount of heat from a heating surface using latent heat of vaporization. However, there are two big problems in BHT: critical heat flux (CHF) and vibration. When the heat flux exceeds CHF, film boiling occurs and it causes rapid increase of the temperature of the heating surface. At this time, electronic devices will be damaged or broken because of a high temperature. To perform BHT safely, therefore, a heat spreader is needed to decrease the heat flux less than CHF. To increase heat transfer coefficient (HTC), moreover, the heating surface should be contacted with a coolant directly while keeping high electrical insulation. On the other hand, boiling bubbles are generated and collapsed repeatedly in BHT, and it causes the vibration of the cooling system. Therefore, it is difficult to use a rigid adhesive for BHT cooling devices. Room-Temperature-Vulcanizing (RTV) silicones, which is elastomer, are typically used to connect the heating surface with vessels for BHT. However, the thermal conductivity of RTV silicone is usually low. In this study, the effect of the thermal conductivity of RTV silicone for BHT is investigated by thermal conductivity analysis.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126244238","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724581
K. Weide-Zaage, G. Payá-Vayá, Philemon Eichin
Particle radiation on ground and especially in space is unavoidable. This may lead to unwanted failures in electronic devices due to the continuously downscaling of microelectronic structures. Thinking of the expectation of more than 8000 new launched satellites in the next few years the need of radiation hardened components comes more and more in focus. Due to the high costs of radiation hardened (Rad-Hard) components, the aim is to find commercials of the shelf (COTS) which meets the need for this kind of harsh environment. Beside air and space applications, automotive components have to be Rad-Hard as well. Such components are specially designed and tested for the application in automotive. It is well known that test time in all cases is expensive and time consuming. Furthermore, simulations are more and more desired to decrease test times and allow a deeper look into the physical behavior of components and devices. The influences of materials (heavy metal), metallization layers and thickness of the die and radiation energy of neutrons and gamma radiation and their interactions will be discussed and simulation results concerning technological influences will be shown.
{"title":"Simulations in Terms of Radiation Effects on different BEOL Material Systems","authors":"K. Weide-Zaage, G. Payá-Vayá, Philemon Eichin","doi":"10.1109/EUROSIME.2019.8724581","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724581","url":null,"abstract":"Particle radiation on ground and especially in space is unavoidable. This may lead to unwanted failures in electronic devices due to the continuously downscaling of microelectronic structures. Thinking of the expectation of more than 8000 new launched satellites in the next few years the need of radiation hardened components comes more and more in focus. Due to the high costs of radiation hardened (Rad-Hard) components, the aim is to find commercials of the shelf (COTS) which meets the need for this kind of harsh environment. Beside air and space applications, automotive components have to be Rad-Hard as well. Such components are specially designed and tested for the application in automotive. It is well known that test time in all cases is expensive and time consuming. Furthermore, simulations are more and more desired to decrease test times and allow a deeper look into the physical behavior of components and devices. The influences of materials (heavy metal), metallization layers and thickness of the die and radiation energy of neutrons and gamma radiation and their interactions will be discussed and simulation results concerning technological influences will be shown.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128030875","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724554
F. Schindler-Saefkow, F. Rost, S. Rzepka
The paper reports the in-situ characterization of the creep behavior of flip chip solder balls during 4 point bending test by means of the IForce stress chip. The stress chip technology can measure mechanical stress at the surface of the silicon die. In flip chip configuration, the solder balls are only a few micrometer away from the n-and p-MOS current mirror cells of the stress chip. Hence, relaxation in the solder balls should directly cause measurable effects in these sensor cells. This is demonstrated by 4-point-bending of the flip chip stress chips. A simulation with and without creep material parameter proves the validity of the approach. A time-dependent analysis of the relaxation within the stress cell closest to the solder ball allows the deduction of the relaxation properties from the measurement.
{"title":"Measurements and Simulations of the Creep Strain in Flip Chip Solder Balls","authors":"F. Schindler-Saefkow, F. Rost, S. Rzepka","doi":"10.1109/EUROSIME.2019.8724554","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724554","url":null,"abstract":"The paper reports the in-situ characterization of the creep behavior of flip chip solder balls during 4 point bending test by means of the IForce stress chip. The stress chip technology can measure mechanical stress at the surface of the silicon die. In flip chip configuration, the solder balls are only a few micrometer away from the n-and p-MOS current mirror cells of the stress chip. Hence, relaxation in the solder balls should directly cause measurable effects in these sensor cells. This is demonstrated by 4-point-bending of the flip chip stress chips. A simulation with and without creep material parameter proves the validity of the approach. A time-dependent analysis of the relaxation within the stress cell closest to the solder ball allows the deduction of the relaxation properties from the measurement.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131946820","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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