2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724584
R. Dudek, M. Hildebrandt, S. Rzepka, R. Döring, L. Scheiter, Bastian Tröger, Mengjia Zhang, R. Ortmann
The development of automotive electronics towards autonomous driving applications generates various challenges, in particular also on the reliable functionality of components originally designed for consumer products. In addition to use with higher environmental loadings, e.g. higher temperatures, the microsystems must also stay reliable in other mounting situations. For analysis of these effects a methodology has been developed combining FEA and high precision optical measuring techniques for determination of in-plane and out-of-plane (warpage) deformations. A systematic study on mounting effects, i.e. on 3rd level reliability is reported New test setups were constructed to investigate effects of mounting. The “ 3rd level ” component loadings are either from screwing on aluminum plates or from four-point bending loading stages. For both test setups, a mismatch loading from the aluminum-baseplate is superimposed on the component-board mismatch loading. Sensor systems in QFN packages were chosen from the spectrum of characteristic CE packages. Both in-plane and warpage effects are studied from 1st to 3rd level by the combined method Simulation assumptions are discussed From the results it is shown that intrinsic deformations and warpages need to be considered directly in AE system design and indirectly when evaluating stress risks, e.g. for solder fatigue.
{"title":"A Combined Methodology to Include System Effects in Board-Level Stress Simulations","authors":"R. Dudek, M. Hildebrandt, S. Rzepka, R. Döring, L. Scheiter, Bastian Tröger, Mengjia Zhang, R. Ortmann","doi":"10.1109/EUROSIME.2019.8724584","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724584","url":null,"abstract":"The development of automotive electronics towards autonomous driving applications generates various challenges, in particular also on the reliable functionality of components originally designed for consumer products. In addition to use with higher environmental loadings, e.g. higher temperatures, the microsystems must also stay reliable in other mounting situations. For analysis of these effects a methodology has been developed combining FEA and high precision optical measuring techniques for determination of in-plane and out-of-plane (warpage) deformations. A systematic study on mounting effects, i.e. on 3rd level reliability is reported New test setups were constructed to investigate effects of mounting. The “ 3rd level ” component loadings are either from screwing on aluminum plates or from four-point bending loading stages. For both test setups, a mismatch loading from the aluminum-baseplate is superimposed on the component-board mismatch loading. Sensor systems in QFN packages were chosen from the spectrum of characteristic CE packages. Both in-plane and warpage effects are studied from 1st to 3rd level by the combined method Simulation assumptions are discussed From the results it is shown that intrinsic deformations and warpages need to be considered directly in AE system design and indirectly when evaluating stress risks, e.g. for solder fatigue.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"29 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130769762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724512
M. Kuczynska, Y. Maniar, N. Schafet, U. Becker, S. Weihe
In the first part of this paper difference between simulated SN-Curves under shearing and tensile cyclic load are presented and compared with measurement performed by A. Desphante and A. Dasgupta [1–2]. The two load modes are simulated until a specified force reduction. The material model used in this work is based on visco-plasticity extended with a damage formulation, enabling cyclic softening of the structure. Additionally, multiaxiality of governing stress state is intrinsically included, with aim to account for different damage evolutions under shear and tensile load cases. The calculated damage paths are investigated and compared with cross-sections. Finally, numerically determined lifetimes under different shear and tensile load levels are represented by means of SN-Woehler curves, showing a satisfying agreement with experimental findings. Second part of the paper extends the investigation scope to lifetime prediction of a chip resistor soldered on PCB under temperature cycling. The component is simulated under different temperature profiles, until a specific lifetime reduction is observed. Also in this case, lifetime is compared with measured data.
{"title":"Numerical Prediction of Failure in SnAgCu solder under shear and tensile-dominant cyclic loading","authors":"M. Kuczynska, Y. Maniar, N. Schafet, U. Becker, S. Weihe","doi":"10.1109/EUROSIME.2019.8724512","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724512","url":null,"abstract":"In the first part of this paper difference between simulated SN-Curves under shearing and tensile cyclic load are presented and compared with measurement performed by A. Desphante and A. Dasgupta [1–2]. The two load modes are simulated until a specified force reduction. The material model used in this work is based on visco-plasticity extended with a damage formulation, enabling cyclic softening of the structure. Additionally, multiaxiality of governing stress state is intrinsically included, with aim to account for different damage evolutions under shear and tensile load cases. The calculated damage paths are investigated and compared with cross-sections. Finally, numerically determined lifetimes under different shear and tensile load levels are represented by means of SN-Woehler curves, showing a satisfying agreement with experimental findings. Second part of the paper extends the investigation scope to lifetime prediction of a chip resistor soldered on PCB under temperature cycling. The component is simulated under different temperature profiles, until a specific lifetime reduction is observed. Also in this case, lifetime is compared with measured data.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"126 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128206060","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724583
Georg Sirok, E. Kraker, J. Magnien, E. Kozeschnik, D. Kieslinger, W. Ecker
This paper introduces a numerical approach dealing with self-healing of solder materials, with detailed discussion of the damage and healing behavior of solder joints through creep deformation. The description of damage- and subsequent healing processes was done within the continuum damage mechanics (CDM) framework, assuming the formation of voids in the material due to creep deformation. The presented model considers a potential healing effect by void closure due to viscous flow of the solder-material and capillary forces. It is assumed that partial melting of a two-phase solder material facilitates this effect. The proposed healing model introduces a concept to describe void closing effects under consideration of phase transformation by using exemplary Sn-Bi alloys.
{"title":"Numerical study on local effects of composition and geometry in self-healing solders","authors":"Georg Sirok, E. Kraker, J. Magnien, E. Kozeschnik, D. Kieslinger, W. Ecker","doi":"10.1109/EUROSIME.2019.8724583","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724583","url":null,"abstract":"This paper introduces a numerical approach dealing with self-healing of solder materials, with detailed discussion of the damage and healing behavior of solder joints through creep deformation. The description of damage- and subsequent healing processes was done within the continuum damage mechanics (CDM) framework, assuming the formation of voids in the material due to creep deformation. The presented model considers a potential healing effect by void closure due to viscous flow of the solder-material and capillary forces. It is assumed that partial melting of a two-phase solder material facilitates this effect. The proposed healing model introduces a concept to describe void closing effects under consideration of phase transformation by using exemplary Sn-Bi alloys.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128215464","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724529
K. Meier, D. Leslie, Tamara Storz, A. Dasgupta, K. Bock
The results on a unique double-cantilever test specimen that has been designed specifically for combined temperature/vibration testing are reported in this study. This specimen consists of two symmetric sets of 4 identical cantilever beams. In prior studies with this double-cantilever test specimen, all the solder joints were stressed to the same level. Thus, a test on one specimen resulted in a single data point on the fatigue curve. In the present study a modification of the double-cantilever test setup is presented which results in a different resonant frequency for each of the two cantilever sets. The asymmetric response produces two different cyclic strain levels in the solder joints on each of the two cantilever sets. Furthermore, a test setup adaption for simultaneous excitation of two test specimens allows four different stress levels in each vibration test. This allows significant time-savings in fatigue testing, compared to sequential testing of four different specimens. Vibration durability results under isothermal conditions are presented, and the potential ability for future experiments with superimposed temperature cycling on vibration is discussed.
{"title":"Harmonic Vibration Durability Tests on Lead-Free Solder Joints at Different Isothermal Conditions","authors":"K. Meier, D. Leslie, Tamara Storz, A. Dasgupta, K. Bock","doi":"10.1109/EUROSIME.2019.8724529","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724529","url":null,"abstract":"The results on a unique double-cantilever test specimen that has been designed specifically for combined temperature/vibration testing are reported in this study. This specimen consists of two symmetric sets of 4 identical cantilever beams. In prior studies with this double-cantilever test specimen, all the solder joints were stressed to the same level. Thus, a test on one specimen resulted in a single data point on the fatigue curve. In the present study a modification of the double-cantilever test setup is presented which results in a different resonant frequency for each of the two cantilever sets. The asymmetric response produces two different cyclic strain levels in the solder joints on each of the two cantilever sets. Furthermore, a test setup adaption for simultaneous excitation of two test specimens allows four different stress levels in each vibration test. This allows significant time-savings in fatigue testing, compared to sequential testing of four different specimens. Vibration durability results under isothermal conditions are presented, and the potential ability for future experiments with superimposed temperature cycling on vibration is discussed.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122211831","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724559
U. Zschenderlein, M. Klingler, J. Arnold, M. Baum, M. Weissbach, M. Schaal, B. Wunderle
The increased attention for sintered silver as die attach attracts also interest in its reliability assessment. Since the porous joint material shows rate-dependent behaviour at elevated temperature, its visco-plastic behaviour needs to be quantified. Though tensile tests are frequently used for that task is still a challenge to manufacture homogeneous specimens large enough to be safely handled and tensile tested. In this paper the we have presented a comprehensive technology for manufacturing sintered silver specimen for micro bending test. The sample length is about 10 mm but can still be tested with nanoindenter equipment. These specimens were bent at 25 °C at different strain rates. The corresponding stress-strain curves were obtained with transformation functions computed by a FE model. Tensile specimens of sintered silver were manufactured and tensile tested at 25, 100 and 175 °C for investigation of rate dependency and relaxation behaviour. For 25 °C no rate dependency was observed. At 100 °C and 175 °C significant reduction of tensile strength and increase of tensile strain was observed at smaller strain rates. The creep was caused by thermal activation of inner surface diffusion.
{"title":"Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications","authors":"U. Zschenderlein, M. Klingler, J. Arnold, M. Baum, M. Weissbach, M. Schaal, B. Wunderle","doi":"10.1109/EUROSIME.2019.8724559","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724559","url":null,"abstract":"The increased attention for sintered silver as die attach attracts also interest in its reliability assessment. Since the porous joint material shows rate-dependent behaviour at elevated temperature, its visco-plastic behaviour needs to be quantified. Though tensile tests are frequently used for that task is still a challenge to manufacture homogeneous specimens large enough to be safely handled and tensile tested. In this paper the we have presented a comprehensive technology for manufacturing sintered silver specimen for micro bending test. The sample length is about 10 mm but can still be tested with nanoindenter equipment. These specimens were bent at 25 °C at different strain rates. The corresponding stress-strain curves were obtained with transformation functions computed by a FE model. Tensile specimens of sintered silver were manufactured and tensile tested at 25, 100 and 175 °C for investigation of rate dependency and relaxation behaviour. For 25 °C no rate dependency was observed. At 100 °C and 175 °C significant reduction of tensile strength and increase of tensile strain was observed at smaller strain rates. The creep was caused by thermal activation of inner surface diffusion.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"85 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124992950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724573
R. Metasch, M. Roellig, P. Knoch, C. Weinmann, K. Meier
This paper presents a methodology to investigate and correlate the influence of porosity of silver sintered interconnects, e.g. used in power electronics, with their thermo-mechanical deformation behaviour. The proposed methodology includes the development of a shear specimen coming with a single cylindrical shaped silver-sintered joint enabling high resolution deformation measurements, strain rate controlled shear tests and according finite element analysis.The methodology also includes the development and optimization of a customized mechanical test system which is optimized for the measuring of deformations in the sub-micro meter range at high forces up to 500 N ([1], [2]). Furthermore, a multi-level image processing approach was developed to determine the porosity distribution of cross-section images of silver sintered joints.
{"title":"Methodology for Correlation of Porosity and Mechanical Properties of Silver Sintered Joints in Electronics","authors":"R. Metasch, M. Roellig, P. Knoch, C. Weinmann, K. Meier","doi":"10.1109/EUROSIME.2019.8724573","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724573","url":null,"abstract":"This paper presents a methodology to investigate and correlate the influence of porosity of silver sintered interconnects, e.g. used in power electronics, with their thermo-mechanical deformation behaviour. The proposed methodology includes the development of a shear specimen coming with a single cylindrical shaped silver-sintered joint enabling high resolution deformation measurements, strain rate controlled shear tests and according finite element analysis.The methodology also includes the development and optimization of a customized mechanical test system which is optimized for the measuring of deformations in the sub-micro meter range at high forces up to 500 N ([1], [2]). Furthermore, a multi-level image processing approach was developed to determine the porosity distribution of cross-section images of silver sintered joints.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121500227","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724585
Wolfgang Hölzl, R. Behlert, M. Gehring, G. Schrag
We present a study on a micromechanical bending actuator, which is intended for creating fluid flow by a fish-like, undulatory motion. This motion pattern describes an ascending wave traveling along the actuator and is capable to shed vortices into the surrounding fluid, forming a vortex wake. A segmented electrode at the top of the bending actuator enables the undulatory excitation. It turns out, that undulation creates slightly higher mass flow than resonant oscillations in the structure’s first eigenmode. At the same time, undulation needs less energy for generating equal mass flow, and, hence, is more efficient compared to resonant motion.
{"title":"Enhanced Fluid Flow by Wavelike Excitation of a Micromechanical Bending Actuator","authors":"Wolfgang Hölzl, R. Behlert, M. Gehring, G. Schrag","doi":"10.1109/EUROSIME.2019.8724585","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724585","url":null,"abstract":"We present a study on a micromechanical bending actuator, which is intended for creating fluid flow by a fish-like, undulatory motion. This motion pattern describes an ascending wave traveling along the actuator and is capable to shed vortices into the surrounding fluid, forming a vortex wake. A segmented electrode at the top of the bending actuator enables the undulatory excitation. It turns out, that undulation creates slightly higher mass flow than resonant oscillations in the structure’s first eigenmode. At the same time, undulation needs less energy for generating equal mass flow, and, hence, is more efficient compared to resonant motion.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133887987","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724592
Zhongchao Sun, Zili Wang, C. Qian, Yi Ren, Qiang Feng, Dezhen Yang, Bo Sun
To better understand the mechanical behaviour of a sintered nano-silver joint, it is quite necessary to develop a characterization method to quantitatively describe the stochastically distributed voids existing in it. In this paper, by virtue of a Cartesian coordinate system, the stochastically distributed voids in the sintered nano-silver joint are characterized with three parameters, which are the distance “l”, radius “r” and location angle “$alpha$”. And then by fitting these extracted parameters into certain distributions, for instance Normal distribution for “l” and “r”, and Uniform distribution for “$alpha$”, the distribution feature of the voids can be quantitively characterized. It is also found that the accuracy of these distribution parameters is highly dependent on the number of voids in the nano-silver joint. The proposed method is successfully to account for the pressure effect on void distribution in sintered nano-silver joints.
{"title":"Characterization of Stochastically Distributed Voids in Sintered Nano-Silver Joints","authors":"Zhongchao Sun, Zili Wang, C. Qian, Yi Ren, Qiang Feng, Dezhen Yang, Bo Sun","doi":"10.1109/EUROSIME.2019.8724592","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724592","url":null,"abstract":"To better understand the mechanical behaviour of a sintered nano-silver joint, it is quite necessary to develop a characterization method to quantitatively describe the stochastically distributed voids existing in it. In this paper, by virtue of a Cartesian coordinate system, the stochastically distributed voids in the sintered nano-silver joint are characterized with three parameters, which are the distance “l”, radius “r” and location angle “$alpha$”. And then by fitting these extracted parameters into certain distributions, for instance Normal distribution for “l” and “r”, and Uniform distribution for “$alpha$”, the distribution feature of the voids can be quantitively characterized. It is also found that the accuracy of these distribution parameters is highly dependent on the number of voids in the nano-silver joint. The proposed method is successfully to account for the pressure effect on void distribution in sintered nano-silver joints.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133172479","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724568
G. Narendran, N. Gnanasekaran, D. A. Perumal
The heat spreader integrated microchannel heat sink is employed in thermal management of transient hotspot problem in multicore processors for high density electronic cooling application. The heat transfer characteristics of heat spreader integrated microchannel were comprehensively analyzed experimentally and numerically, and their effectiveness and thermal enhancement factor was compared with the regular microchannel. By using deionized water and Graphene oxide (GO) nanofluid as working fluid, investigations were conducted for Reynolds number ranging from 100–300. Multiple hotspot cores were modelled in the microchannel with four different heat fluxes to study the temperature responses in the heat spreader under transient thermal loads. Additionally, studies were conducted to address the thermal stress developed in the packaging of heat spreader integrated microchannel in multiple hotspot conditions. The result shows that the thermal effectiveness of GO-0.12% increased 65% as compared with pure fluid.
{"title":"Migration of flow inducted hotspot with heat spreader integrated microchannel subjected to asymmetric heat flux: A Multiphysics approach.","authors":"G. Narendran, N. Gnanasekaran, D. A. Perumal","doi":"10.1109/EUROSIME.2019.8724568","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724568","url":null,"abstract":"The heat spreader integrated microchannel heat sink is employed in thermal management of transient hotspot problem in multicore processors for high density electronic cooling application. The heat transfer characteristics of heat spreader integrated microchannel were comprehensively analyzed experimentally and numerically, and their effectiveness and thermal enhancement factor was compared with the regular microchannel. By using deionized water and Graphene oxide (GO) nanofluid as working fluid, investigations were conducted for Reynolds number ranging from 100–300. Multiple hotspot cores were modelled in the microchannel with four different heat fluxes to study the temperature responses in the heat spreader under transient thermal loads. Additionally, studies were conducted to address the thermal stress developed in the packaging of heat spreader integrated microchannel in multiple hotspot conditions. The result shows that the thermal effectiveness of GO-0.12% increased 65% as compared with pure fluid.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131230903","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-01DOI: 10.1109/EUROSIME.2019.8724520
J. Nazdrowicz, A. Napieralski
In the paper authors present heterogeneous environment for modeling and simulations created with use Coventor MEMS+ and Matlab/SIMULINK software. The big advantage of this solution is possibility to merge with Cadence software what gives in effect big solution for modeling, simulation and design MEMS structure with ROIC (Read Out Integrated Circuit) for further fabrication. Authors present capabilities of implementation and some results obtained from simulations performed in this environment. There were performed for simple model of MEMS vibratory gyroscope with specific box beam springs on those inertial mass is suspended.
{"title":"Modelling, Simulations and Performance Analysis of MEMS vibrating Gyroscope in Coventor MEMS+ Environment","authors":"J. Nazdrowicz, A. Napieralski","doi":"10.1109/EUROSIME.2019.8724520","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724520","url":null,"abstract":"In the paper authors present heterogeneous environment for modeling and simulations created with use Coventor MEMS+ and Matlab/SIMULINK software. The big advantage of this solution is possibility to merge with Cadence software what gives in effect big solution for modeling, simulation and design MEMS structure with ROIC (Read Out Integrated Circuit) for further fabrication. Authors present capabilities of implementation and some results obtained from simulations performed in this environment. There were performed for simple model of MEMS vibratory gyroscope with specific box beam springs on those inertial mass is suspended.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"99 12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128011545","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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