Pub Date : 2009-11-10DOI: 10.1109/ISOT.2009.5326090
Sang-Hyuck Lee, Kyoung-Su Park, N. Park, Young-Pil Park
Image of mobile camera is easily blurred during the exposure time by hand motion. To reduce hand motion blur of image, optical image stabilization technologies are widely used. They need additional mechanism and fine alignment of optical components and make the size of system bulky. In the mobile devices, however, using minimum number of optical and mechanical component is important. In this paper, we propose noble image restoration algorithm using upscaled image and recalculated deconvolution filter from the point spread function of optical system not to use any additional mechanical or optical components. Upscaled and restored image represents higher image resolution than the reference image which is not upscaled.
{"title":"Enhancing blurred image by hand-motion of compact imaging system using wavefront coding and property of point spread function","authors":"Sang-Hyuck Lee, Kyoung-Su Park, N. Park, Young-Pil Park","doi":"10.1109/ISOT.2009.5326090","DOIUrl":"https://doi.org/10.1109/ISOT.2009.5326090","url":null,"abstract":"Image of mobile camera is easily blurred during the exposure time by hand motion. To reduce hand motion blur of image, optical image stabilization technologies are widely used. They need additional mechanism and fine alignment of optical components and make the size of system bulky. In the mobile devices, however, using minimum number of optical and mechanical component is important. In this paper, we propose noble image restoration algorithm using upscaled image and recalculated deconvolution filter from the point spread function of optical system not to use any additional mechanical or optical components. Upscaled and restored image represents higher image resolution than the reference image which is not upscaled.","PeriodicalId":366216,"journal":{"name":"2009 International Symposium on Optomechatronic Technologies","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127766143","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-10DOI: 10.1109/ISOT.2009.5326138
V. Polyzoev, E. Enikov, Brian C. Heinze, Jeong‐Yeol Yoon
This paper presents a novel concept for integrating a magnetic microparticle sandwich assay onto a microcantilever beam, towards rapid and sensitive detection of E. Coli. The gold coated surface of the microcantilever beam and the surface of superparamagnetic microparticles are functionalized with anti-E. coli IgG so that they bind only in presence of and via the E. coli. An external magnetic field produced by an electromagnet is used to enhance the microcantilever deflection, and an optical lever method is used to sensitively detect it.
{"title":"Magnetic particle enhanced microcantilever biosensor for rapid and Sensitive E. Coli detection","authors":"V. Polyzoev, E. Enikov, Brian C. Heinze, Jeong‐Yeol Yoon","doi":"10.1109/ISOT.2009.5326138","DOIUrl":"https://doi.org/10.1109/ISOT.2009.5326138","url":null,"abstract":"This paper presents a novel concept for integrating a magnetic microparticle sandwich assay onto a microcantilever beam, towards rapid and sensitive detection of E. Coli. The gold coated surface of the microcantilever beam and the surface of superparamagnetic microparticles are functionalized with anti-E. coli IgG so that they bind only in presence of and via the E. coli. An external magnetic field produced by an electromagnet is used to enhance the microcantilever deflection, and an optical lever method is used to sensitively detect it.","PeriodicalId":366216,"journal":{"name":"2009 International Symposium on Optomechatronic Technologies","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128773770","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The dual stage manipulator is composed of the voice coil motor (VCM) and piezoelectric ceramics transducer (PZT), which can produce the high precise displacement and express a well dynamic performance. However, inaccurate modeling of the dual stage exacerbates the positioning accuracy. This paper presents an approach to model the dual stage system using bond graph theory, and then derives the state space equations through the bond graph straightforwardly, which can be used in compute simulations.
{"title":"Modeling and simulation for dual stage system using bond graph theory","authors":"Weijun Wang, Dongik Shin, Changsoo Han, Hyeonseok Choi","doi":"10.1109/ISOT.2009.5326087","DOIUrl":"https://doi.org/10.1109/ISOT.2009.5326087","url":null,"abstract":"The dual stage manipulator is composed of the voice coil motor (VCM) and piezoelectric ceramics transducer (PZT), which can produce the high precise displacement and express a well dynamic performance. However, inaccurate modeling of the dual stage exacerbates the positioning accuracy. This paper presents an approach to model the dual stage system using bond graph theory, and then derives the state space equations through the bond graph straightforwardly, which can be used in compute simulations.","PeriodicalId":366216,"journal":{"name":"2009 International Symposium on Optomechatronic Technologies","volume":"117 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116340316","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-10DOI: 10.1109/ISOT.2009.5326039
Chun-Sam Song, Joon Hyun Kim, Jong-Hyeong Kim, S. Cho, J. Kim
As the technology of semi-conductor chip progresses to pursue high density and high speed, flip-chip technology recently has played a successful role to overcome technological limit of the existent gold wire bonding technology made a connection with outside terminal. Flip-chip is systemically different to the existent chip that transfers electrical signal by connecting wires to the chip externally. Because the interior connecting part of flip-chip is hidden into an invisible region between a die and a PCB, it is indispensable for preparing cut or sliced chips to observe inner joint parts. Therefore, this work embodied nondestructive inspection system that can examine the bonding part of flip-chip without damage of chip using an X-ray system. Using an attenuation characteristic of X-ray (the intensity after transmitting an X-ray), it could do monitoring the shape of solder bumps without damaging the chip. The suggested inspection method can effectively extract the edge of solder bumps from an X-ray image by using the exponential approximation for the intensity of transmitting an X-ray and detect inside bad bonding parts utilizing information about shape. The embodied inspection system is applied to evaluate actual bonded flip-chip.
{"title":"Detection of shape error through solder bump edge extraction of flip-chip by using exponential approximation function","authors":"Chun-Sam Song, Joon Hyun Kim, Jong-Hyeong Kim, S. Cho, J. Kim","doi":"10.1109/ISOT.2009.5326039","DOIUrl":"https://doi.org/10.1109/ISOT.2009.5326039","url":null,"abstract":"As the technology of semi-conductor chip progresses to pursue high density and high speed, flip-chip technology recently has played a successful role to overcome technological limit of the existent gold wire bonding technology made a connection with outside terminal. Flip-chip is systemically different to the existent chip that transfers electrical signal by connecting wires to the chip externally. Because the interior connecting part of flip-chip is hidden into an invisible region between a die and a PCB, it is indispensable for preparing cut or sliced chips to observe inner joint parts. Therefore, this work embodied nondestructive inspection system that can examine the bonding part of flip-chip without damage of chip using an X-ray system. Using an attenuation characteristic of X-ray (the intensity after transmitting an X-ray), it could do monitoring the shape of solder bumps without damaging the chip. The suggested inspection method can effectively extract the edge of solder bumps from an X-ray image by using the exponential approximation for the intensity of transmitting an X-ray and detect inside bad bonding parts utilizing information about shape. The embodied inspection system is applied to evaluate actual bonded flip-chip.","PeriodicalId":366216,"journal":{"name":"2009 International Symposium on Optomechatronic Technologies","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117311394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-10DOI: 10.1109/ISOT.2009.5326051
X. Tao, Hyungsuck Cho, K. Koh
Insufficient vision information using a conventional vision system with fixed optical parameters cannot meet the requirement for observation of micro parts with complex shapes in microassembly and micromanipulation. Small field of view, occlusion and low depth resolution are important issues. This paper presents a view planning method to increase the visibility for observation of micro objects using a variable view imaging system. The system integrates a telecentric scanner and a double wedge prisms system which can supply a flexible view with adjustable view angle and position. The best view angle is calculated by maximize the resolution of the interest surface under acceptable occlusion level. The view position is steered by visual feedback method which can keep the target inside of field of view. Simulations and experiment results shows the feasibility of the proposed approach.
{"title":"View planning to increase the visibility for observing micro objects using a variable view imaging system","authors":"X. Tao, Hyungsuck Cho, K. Koh","doi":"10.1109/ISOT.2009.5326051","DOIUrl":"https://doi.org/10.1109/ISOT.2009.5326051","url":null,"abstract":"Insufficient vision information using a conventional vision system with fixed optical parameters cannot meet the requirement for observation of micro parts with complex shapes in microassembly and micromanipulation. Small field of view, occlusion and low depth resolution are important issues. This paper presents a view planning method to increase the visibility for observation of micro objects using a variable view imaging system. The system integrates a telecentric scanner and a double wedge prisms system which can supply a flexible view with adjustable view angle and position. The best view angle is calculated by maximize the resolution of the interest surface under acceptable occlusion level. The view position is steered by visual feedback method which can keep the target inside of field of view. Simulations and experiment results shows the feasibility of the proposed approach.","PeriodicalId":366216,"journal":{"name":"2009 International Symposium on Optomechatronic Technologies","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115701782","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-10DOI: 10.1109/ISOT.2009.5326089
M. Kawamura, H. Goto, Susumu Sato
Optical phase retardation distributions and transient properties of a liquid crystal (LC) lens with multiple divided circularly hole-patterned electrodes and external electrode are experimentally measured and numerically analyzed for an LC molecular orientation in a consideration of time domain by using a three-dimensional (3D) finite-difference method. The dynamical behaviors of the reorientation in LC directors and of the phase retardation in the LC lens with positive and negative lens properties are compared.
{"title":"Transient properties of a liquid crystal lens with multiple divided circularly hole-patterned electrodes","authors":"M. Kawamura, H. Goto, Susumu Sato","doi":"10.1109/ISOT.2009.5326089","DOIUrl":"https://doi.org/10.1109/ISOT.2009.5326089","url":null,"abstract":"Optical phase retardation distributions and transient properties of a liquid crystal (LC) lens with multiple divided circularly hole-patterned electrodes and external electrode are experimentally measured and numerically analyzed for an LC molecular orientation in a consideration of time domain by using a three-dimensional (3D) finite-difference method. The dynamical behaviors of the reorientation in LC directors and of the phase retardation in the LC lens with positive and negative lens properties are compared.","PeriodicalId":366216,"journal":{"name":"2009 International Symposium on Optomechatronic Technologies","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126746910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-10DOI: 10.1109/ISOT.2009.5326088
M. Y. Kim, K. Koh
With strong needs of continued miniaturization and high density integration of semiconductor packages, the wafer level package technology leads the semiconductor package trend. For high reliability of the devices, wafer bumps and substrate bumps used for their connection junctions need to be in-line inspected in terms of top-height distribution, coplanarity, and volume uniformity. In this paper, a horizontal scanning interferometric system is proposed for bump shape inspection in three dimensions with large field of view and fast inspection speed based on optomechatronic system design concept. For wafer bumps made of solder and gold under transparent film layer, the specially-designed information extraction algorithms from multiple-peak interferogram acquired with variations of the horizontal position of the reference signal generator are suggested, which are composed of top surface profile and under-layer surface profile detection algorithms. A series of experiments is performed, and the effectiveness of the proposed inspection system is verified experimentally based on acquired test results in detail.
{"title":"Horizontal scanning interferometric system for wafer bump inspection of semiconductor packaging process","authors":"M. Y. Kim, K. Koh","doi":"10.1109/ISOT.2009.5326088","DOIUrl":"https://doi.org/10.1109/ISOT.2009.5326088","url":null,"abstract":"With strong needs of continued miniaturization and high density integration of semiconductor packages, the wafer level package technology leads the semiconductor package trend. For high reliability of the devices, wafer bumps and substrate bumps used for their connection junctions need to be in-line inspected in terms of top-height distribution, coplanarity, and volume uniformity. In this paper, a horizontal scanning interferometric system is proposed for bump shape inspection in three dimensions with large field of view and fast inspection speed based on optomechatronic system design concept. For wafer bumps made of solder and gold under transparent film layer, the specially-designed information extraction algorithms from multiple-peak interferogram acquired with variations of the horizontal position of the reference signal generator are suggested, which are composed of top surface profile and under-layer surface profile detection algorithms. A series of experiments is performed, and the effectiveness of the proposed inspection system is verified experimentally based on acquired test results in detail.","PeriodicalId":366216,"journal":{"name":"2009 International Symposium on Optomechatronic Technologies","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124342153","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-10DOI: 10.1109/ISOT.2009.5326093
July A. Galeano Zea, P. Sandoz, L. Robert
A vision system is used for measuring in-plane target position, displacement and orientation. An encrypted pseudo-periodic pattern fixed on the target forms a phase reference. Absolute position is determined with subpixel accuracy by phase computations from any local view of a small zone of the pattern. Method principle is presented and performances are characterized. The capability to resolve position on depth ranges larger than the lens depth of focus is demonstrated. The method is applied to position referencing of live cell culture boxes and could be used as visual control sensor in other applications.
{"title":"Position encryption of extended surfaces for subpixel localization of small-sized fields of observation","authors":"July A. Galeano Zea, P. Sandoz, L. Robert","doi":"10.1109/ISOT.2009.5326093","DOIUrl":"https://doi.org/10.1109/ISOT.2009.5326093","url":null,"abstract":"A vision system is used for measuring in-plane target position, displacement and orientation. An encrypted pseudo-periodic pattern fixed on the target forms a phase reference. Absolute position is determined with subpixel accuracy by phase computations from any local view of a small zone of the pattern. Method principle is presented and performances are characterized. The capability to resolve position on depth ranges larger than the lens depth of focus is demonstrated. The method is applied to position referencing of live cell culture boxes and could be used as visual control sensor in other applications.","PeriodicalId":366216,"journal":{"name":"2009 International Symposium on Optomechatronic Technologies","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122582911","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-10DOI: 10.1109/ISOT.2009.5326103
S. Yoshida, N. Yoshida, Yasuhiro Ohuchi, M. Yamamoto
Infrared (IR) sensors are used for various purposes, such as human body detection. This study concerns the development of downsized, low-cost lenses for IR sensors, and it is argued that computer generated holograms (CGH) are applicable to a lens. Lenses with CGH are inexpensive and lightweight since they can be mass-produced by using stampers, similar to compact discs. This study shows that lenses with CGH can detect IR with excellent angular resolution with a viewing angle of up to ±60°.
{"title":"Lightweight and low cost lens for infrared sensors using a computer generated hologram","authors":"S. Yoshida, N. Yoshida, Yasuhiro Ohuchi, M. Yamamoto","doi":"10.1109/ISOT.2009.5326103","DOIUrl":"https://doi.org/10.1109/ISOT.2009.5326103","url":null,"abstract":"Infrared (IR) sensors are used for various purposes, such as human body detection. This study concerns the development of downsized, low-cost lenses for IR sensors, and it is argued that computer generated holograms (CGH) are applicable to a lens. Lenses with CGH are inexpensive and lightweight since they can be mass-produced by using stampers, similar to compact discs. This study shows that lenses with CGH can detect IR with excellent angular resolution with a viewing angle of up to ±60°.","PeriodicalId":366216,"journal":{"name":"2009 International Symposium on Optomechatronic Technologies","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130388083","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-11-10DOI: 10.1109/ISOT.2009.5326075
Hyunki Lee, Hyungsuck Cho, Jonghyun Kim
Nowadays, a number of 3D shape measurement methods have been developed such as stereo vision, laser structured light, and Phase Measuring Profilometry (PMP). They have many problems such as correspondence problem, 2π-ambiguity and occlusion problem. Among them, occlusion problem is common problem for 3D shape measurement and well known as difficult to solve. To solve this problem, we suggest a new sensing system based on optical scanning system and movable mirror system, which can change the viewing angle without changing of field-of-view (FOV), and can do the FOV with maintaining the viewing angle. The performance of our system is checked by simulation and a series of real experiments.
{"title":"Active imaging system with variable viewing direction and position for 3D shape measurement in occluded region","authors":"Hyunki Lee, Hyungsuck Cho, Jonghyun Kim","doi":"10.1109/ISOT.2009.5326075","DOIUrl":"https://doi.org/10.1109/ISOT.2009.5326075","url":null,"abstract":"Nowadays, a number of 3D shape measurement methods have been developed such as stereo vision, laser structured light, and Phase Measuring Profilometry (PMP). They have many problems such as correspondence problem, 2π-ambiguity and occlusion problem. Among them, occlusion problem is common problem for 3D shape measurement and well known as difficult to solve. To solve this problem, we suggest a new sensing system based on optical scanning system and movable mirror system, which can change the viewing angle without changing of field-of-view (FOV), and can do the FOV with maintaining the viewing angle. The performance of our system is checked by simulation and a series of real experiments.","PeriodicalId":366216,"journal":{"name":"2009 International Symposium on Optomechatronic Technologies","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131009217","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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