Pub Date : 2017-12-01DOI: 10.1109/ICCS1.2017.8326000
Keval Kamdar, A. Acharya, Poonam Kadam
Since, the scale of the integration keeps on growing more and more signal processing applications need to be implemented on the Very Large Scale Integrated chip. These applications demand great computational capacity along with a considerable amount of energy. The objective of this paper is to provide promising low power solution for multiplier design for Very Large Scale Integration. The focus is on the reduction of power dissipation which is showing an ever-increasing growth with the scaling down of the techniques. The paper primarily throws light on low power multiplier design using Radix-4 modified booth's algorithm using Split Charge Recovery Logic. In standard Complementary Metal Oxide Semiconductor Circuits, bits are discarded after every transformation in the output level. As a result of which, the energy becomes heat, which in turn increases overhead needed to get rid of heat causing battery life problem. Modified booth's algorithm using Split Charge Recovery Logic circuit offers an efficient way to get out of this problem. A low power Multiplier is designed using modified booth's algorithm using Split Charge Recovery Logic. In the future, various different circuits can be implemented using adiabatic low power design.
{"title":"Low power multiplier design using adiabatic SCRL logic","authors":"Keval Kamdar, A. Acharya, Poonam Kadam","doi":"10.1109/ICCS1.2017.8326000","DOIUrl":"https://doi.org/10.1109/ICCS1.2017.8326000","url":null,"abstract":"Since, the scale of the integration keeps on growing more and more signal processing applications need to be implemented on the Very Large Scale Integrated chip. These applications demand great computational capacity along with a considerable amount of energy. The objective of this paper is to provide promising low power solution for multiplier design for Very Large Scale Integration. The focus is on the reduction of power dissipation which is showing an ever-increasing growth with the scaling down of the techniques. The paper primarily throws light on low power multiplier design using Radix-4 modified booth's algorithm using Split Charge Recovery Logic. In standard Complementary Metal Oxide Semiconductor Circuits, bits are discarded after every transformation in the output level. As a result of which, the energy becomes heat, which in turn increases overhead needed to get rid of heat causing battery life problem. Modified booth's algorithm using Split Charge Recovery Logic circuit offers an efficient way to get out of this problem. A low power Multiplier is designed using modified booth's algorithm using Split Charge Recovery Logic. In the future, various different circuits can be implemented using adiabatic low power design.","PeriodicalId":367360,"journal":{"name":"2017 IEEE International Conference on Circuits and Systems (ICCS)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133516023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/ICCS1.2017.8326002
Mobi Mathew, Jami Hossain
Electrical Energy has become one of the basic need of an individual in this era. There are many conventional and non-conventional methods of generating electricity. Electricity generation using Photovoltaic system is considered as one of the clean method of energy generation. Even though the PV power plants have a high initial cost, they have a longer lifespan of 25 years. There are different types of PV technologies in the market today like crystalline solar cells and thin film solar cells etc. In this paper, an attempt is done to evaluate and compare the performance of a 25 MW grid-connected solar PV power plant at Chandigarh of India with different PV technologies viz. crystalline silicon and thin film technologies. A simulation based study is adopted in this analysis. PVsyst simulation software is used for the simulation of the system. Energy production of the system with 2 types of modules of each technology obtained for various years of operation spanning entire lifetime of the solar PV plant. This analysis will reflect how best the solar P V plant will perform with two types of crystalline PV modules and two types of thin film P V modules.
{"title":"Analysis of a grid connected solar photovoltaic system with different PV technologies","authors":"Mobi Mathew, Jami Hossain","doi":"10.1109/ICCS1.2017.8326002","DOIUrl":"https://doi.org/10.1109/ICCS1.2017.8326002","url":null,"abstract":"Electrical Energy has become one of the basic need of an individual in this era. There are many conventional and non-conventional methods of generating electricity. Electricity generation using Photovoltaic system is considered as one of the clean method of energy generation. Even though the PV power plants have a high initial cost, they have a longer lifespan of 25 years. There are different types of PV technologies in the market today like crystalline solar cells and thin film solar cells etc. In this paper, an attempt is done to evaluate and compare the performance of a 25 MW grid-connected solar PV power plant at Chandigarh of India with different PV technologies viz. crystalline silicon and thin film technologies. A simulation based study is adopted in this analysis. PVsyst simulation software is used for the simulation of the system. Energy production of the system with 2 types of modules of each technology obtained for various years of operation spanning entire lifetime of the solar PV plant. This analysis will reflect how best the solar P V plant will perform with two types of crystalline PV modules and two types of thin film P V modules.","PeriodicalId":367360,"journal":{"name":"2017 IEEE International Conference on Circuits and Systems (ICCS)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114892829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/ICCS1.2017.8325974
R. Roselinkiruba, T. Sharmila
Cryptography and steganography play a vital role in making communication secret. Cryptography refers to the technology that encrypts data into unreadable format. Using steganography, the encrypted data are hidden inside a medium. In this paper, the impact that causes vulnerabilities after hiding each and every possible location of the pixel is analyzed experimentally. Bit planes of cover and stego images are analyzed by computing the difference in the corresponding 8-bit planes, so that one can clearly see the distortion of hidden information.
{"title":"Performance analysis in secured image encryption and data hiding using LSB algorithm","authors":"R. Roselinkiruba, T. Sharmila","doi":"10.1109/ICCS1.2017.8325974","DOIUrl":"https://doi.org/10.1109/ICCS1.2017.8325974","url":null,"abstract":"Cryptography and steganography play a vital role in making communication secret. Cryptography refers to the technology that encrypts data into unreadable format. Using steganography, the encrypted data are hidden inside a medium. In this paper, the impact that causes vulnerabilities after hiding each and every possible location of the pixel is analyzed experimentally. Bit planes of cover and stego images are analyzed by computing the difference in the corresponding 8-bit planes, so that one can clearly see the distortion of hidden information.","PeriodicalId":367360,"journal":{"name":"2017 IEEE International Conference on Circuits and Systems (ICCS)","volume":"65 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133002391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/ICCS1.2017.8325991
K. Beulah Sujan, T. Shanmuganantham
Micro Electro-Mechanical Systems consists both electrical and mechanical functions and this devices undergo micro fabrication when this micro fabricated devices are used in Bio-medical field then it is called Bio-MEMS. In this paper, MEMS sensor with multiple cantilever beams is designed which detects multiple diseases at the same time. The cantilever beam surface is coated with antibodies, which recognize the foreign agents in body. An antigen is added to the beams as a result there is increase in mass due to which beam deflects. Intellisuite software is used for finding the static mode where as frequency analysis can be done by using matlab. Detecting the disease through Cantilever sensing gives faster results compared with traditional method like ELISA and PCR.
{"title":"Bio-MEMS cantilever sensor design and analysis for detecting multiple diseases","authors":"K. Beulah Sujan, T. Shanmuganantham","doi":"10.1109/ICCS1.2017.8325991","DOIUrl":"https://doi.org/10.1109/ICCS1.2017.8325991","url":null,"abstract":"Micro Electro-Mechanical Systems consists both electrical and mechanical functions and this devices undergo micro fabrication when this micro fabricated devices are used in Bio-medical field then it is called Bio-MEMS. In this paper, MEMS sensor with multiple cantilever beams is designed which detects multiple diseases at the same time. The cantilever beam surface is coated with antibodies, which recognize the foreign agents in body. An antigen is added to the beams as a result there is increase in mass due to which beam deflects. Intellisuite software is used for finding the static mode where as frequency analysis can be done by using matlab. Detecting the disease through Cantilever sensing gives faster results compared with traditional method like ELISA and PCR.","PeriodicalId":367360,"journal":{"name":"2017 IEEE International Conference on Circuits and Systems (ICCS)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130234755","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/ICCS1.2017.8325986
S. K. Das, T. Shanuganatham
A triple Starfish shaped Microstrip patch antenna with microstrip line feed for IoT application is introduced in this work. The antenna is active over the frequency bands of 0.62GHz-0.96GHz, 2.34GHz-2.46GHz, 3.13GHz-3.31GHz, 4.73GHz-5.03GHz, 5.68GHz-5.92GHz. The Sn = −10 dB impedance bandwidth is 340MHz (0.62GHz-0.96GHz), 120MHz (2.34GHz-2.46GHz), 180MHz (3.13GHz-3.31GHz), 300MHz (4.73GHz-5.03GHz), 240MHz (5.68GHz-5.92GHz) in different bands. The FR4 material of dielectric constant 4.4 and loss tangent 0.02 is chosen as the substrate of the antenna. The antenna operates in the frequency ranges of Bluetooth, WiFi, and WiMAX and enables the IoT applications. As well as it can works in the range of GSM 900 band for cellular applications.
{"title":"Design of triple starfish shaped microstrip patch antenna for IoT applications","authors":"S. K. Das, T. Shanuganatham","doi":"10.1109/ICCS1.2017.8325986","DOIUrl":"https://doi.org/10.1109/ICCS1.2017.8325986","url":null,"abstract":"A triple Starfish shaped Microstrip patch antenna with microstrip line feed for IoT application is introduced in this work. The antenna is active over the frequency bands of 0.62GHz-0.96GHz, 2.34GHz-2.46GHz, 3.13GHz-3.31GHz, 4.73GHz-5.03GHz, 5.68GHz-5.92GHz. The Sn = −10 dB impedance bandwidth is 340MHz (0.62GHz-0.96GHz), 120MHz (2.34GHz-2.46GHz), 180MHz (3.13GHz-3.31GHz), 300MHz (4.73GHz-5.03GHz), 240MHz (5.68GHz-5.92GHz) in different bands. The FR4 material of dielectric constant 4.4 and loss tangent 0.02 is chosen as the substrate of the antenna. The antenna operates in the frequency ranges of Bluetooth, WiFi, and WiMAX and enables the IoT applications. As well as it can works in the range of GSM 900 band for cellular applications.","PeriodicalId":367360,"journal":{"name":"2017 IEEE International Conference on Circuits and Systems (ICCS)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130445793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/ICCS1.2017.8326029
K. Sreeram
Power electronics is the technology of converting electric power from one form to another using switching of electronic (semiconductor) devices. Matrix converter is a versatile converter for AC-AC, AC-DC, DC-AC and DC-DC conversions in which the frequency, amplitude and number of phases of the output voltage can be varied. It can be used in industries and labs as it provides unity power factor, without a DC link apart from providing regeneration capability. Matrix converter provides all conversions with minimum harmonics and sub-harmonics, bidirectional energy flow capability and minimal energy storage requirements. This paper focuses on single phase matrix converter for all conversion modes and MATLAB simulation model and hardware results are given to validate the novelty of the circuit.
{"title":"Universal matrix converter for AC and DC power conversions","authors":"K. Sreeram","doi":"10.1109/ICCS1.2017.8326029","DOIUrl":"https://doi.org/10.1109/ICCS1.2017.8326029","url":null,"abstract":"Power electronics is the technology of converting electric power from one form to another using switching of electronic (semiconductor) devices. Matrix converter is a versatile converter for AC-AC, AC-DC, DC-AC and DC-DC conversions in which the frequency, amplitude and number of phases of the output voltage can be varied. It can be used in industries and labs as it provides unity power factor, without a DC link apart from providing regeneration capability. Matrix converter provides all conversions with minimum harmonics and sub-harmonics, bidirectional energy flow capability and minimal energy storage requirements. This paper focuses on single phase matrix converter for all conversion modes and MATLAB simulation model and hardware results are given to validate the novelty of the circuit.","PeriodicalId":367360,"journal":{"name":"2017 IEEE International Conference on Circuits and Systems (ICCS)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131324217","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/ICCS1.2017.8325989
D. Vaithiyanathan, M. B. Raj, S. Pushpa, R. Seetharaman
The need for high performance system has pushed the limits of Moore's law to extend for future decades. This caused the evolution of compact transistors and produced the ultra scale thin film transistor called FinFET. Although the fully depleted SOI transistor (FD-SOI seems to be promising factor, FinFET replaced it for its resistance to short channel effects. The technological advancement further seeks a low power design and urges the core material to operate at its extreme low threshold point. This paper records various short channel effects such as SS, DIBL, threshold voltage of FinFET and NCFET stacked SRAM device in terms of delay, leakage power and signal to noise margin(SNM).
{"title":"Performance analysis of FinFET and negative capacitance FET over 6T SRAM","authors":"D. Vaithiyanathan, M. B. Raj, S. Pushpa, R. Seetharaman","doi":"10.1109/ICCS1.2017.8325989","DOIUrl":"https://doi.org/10.1109/ICCS1.2017.8325989","url":null,"abstract":"The need for high performance system has pushed the limits of Moore's law to extend for future decades. This caused the evolution of compact transistors and produced the ultra scale thin film transistor called FinFET. Although the fully depleted SOI transistor (FD-SOI seems to be promising factor, FinFET replaced it for its resistance to short channel effects. The technological advancement further seeks a low power design and urges the core material to operate at its extreme low threshold point. This paper records various short channel effects such as SS, DIBL, threshold voltage of FinFET and NCFET stacked SRAM device in terms of delay, leakage power and signal to noise margin(SNM).","PeriodicalId":367360,"journal":{"name":"2017 IEEE International Conference on Circuits and Systems (ICCS)","volume":"22 6S 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115948417","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/ICCS1.2017.8326037
Aditi Singh
Electromagnetic Pollution has been increased due to the widespread use of wireless technology such as heart machines used for medical purpose, high power radars used in military applications, mobile phones, automotive applications and PCBs of electronic systems. Analog ICs are more sensitive to EMI as compared to Digital ICs so Electromagnetic Compatiblity problem between appliances which coexists in the same environment is a severe problem. In this paper analysis has been done and techniques have been developed to reduce EMI effects on a current mirror.
{"title":"EMI harderend current mirror","authors":"Aditi Singh","doi":"10.1109/ICCS1.2017.8326037","DOIUrl":"https://doi.org/10.1109/ICCS1.2017.8326037","url":null,"abstract":"Electromagnetic Pollution has been increased due to the widespread use of wireless technology such as heart machines used for medical purpose, high power radars used in military applications, mobile phones, automotive applications and PCBs of electronic systems. Analog ICs are more sensitive to EMI as compared to Digital ICs so Electromagnetic Compatiblity problem between appliances which coexists in the same environment is a severe problem. In this paper analysis has been done and techniques have been developed to reduce EMI effects on a current mirror.","PeriodicalId":367360,"journal":{"name":"2017 IEEE International Conference on Circuits and Systems (ICCS)","volume":"795 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133447087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/ICCS1.2017.8326020
A. Sreedevi, T. Rao
Massive growth of connected devices, network traffic and wide range of application requirements have paved way for Device-to-device (D2D) network communication. This paper offers a D2D network model at 28 and 60 GHz, and methods to calculate the received-signal-strength (RSS) and signal-to-interference-plus-noise-ratio (SINR). The propagation analysis of two scenarios, Line of Sight (LOS) and Non-Line of Sight (NLOS) communication is modelled, and analyzed using network sum rate. A generalized joint optimization problem which maximizes the whole rate of the D2D network using an association vector algorithm is also presented. Simulation results show network performance and its dependency over distance and frequency using Device Association Vector Algorithm (DAVA).
{"title":"D2D communications performance analysis for LOS and NLOS scenarios with DAV algorithm","authors":"A. Sreedevi, T. Rao","doi":"10.1109/ICCS1.2017.8326020","DOIUrl":"https://doi.org/10.1109/ICCS1.2017.8326020","url":null,"abstract":"Massive growth of connected devices, network traffic and wide range of application requirements have paved way for Device-to-device (D2D) network communication. This paper offers a D2D network model at 28 and 60 GHz, and methods to calculate the received-signal-strength (RSS) and signal-to-interference-plus-noise-ratio (SINR). The propagation analysis of two scenarios, Line of Sight (LOS) and Non-Line of Sight (NLOS) communication is modelled, and analyzed using network sum rate. A generalized joint optimization problem which maximizes the whole rate of the D2D network using an association vector algorithm is also presented. Simulation results show network performance and its dependency over distance and frequency using Device Association Vector Algorithm (DAVA).","PeriodicalId":367360,"journal":{"name":"2017 IEEE International Conference on Circuits and Systems (ICCS)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121885256","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-12-01DOI: 10.1109/ICCS1.2017.8325987
N. Kalaiyazhagan, T. Shanmuganantham
A new modern MEMS sensor is designed for humidity and temperature measurement for agriculture field. The simulated results and micro-machined proposed cantilever structure based two sided micro cantilever sensors for agriculture applications are presented in this paper. The temperature and humidity sensor is consisting of sensing materials such as Cu and polysilicon is used, which is designed on the MEMS cantilever. The simulation is done by Intellisuite software. Since the FEM based displacement, stress and strain analysis is obtained. When temperature is applied to the sensor, the material is expanded, due to the coefficient of thermal expansion. In humidity sensor, the pressure increases that causes the cantilever leading to change in the displacement. This work may be potentially useful for sensor design engineers, for agriculture applications.
{"title":"Performance analysis of MEMS cantilever sensor for agriculture applications","authors":"N. Kalaiyazhagan, T. Shanmuganantham","doi":"10.1109/ICCS1.2017.8325987","DOIUrl":"https://doi.org/10.1109/ICCS1.2017.8325987","url":null,"abstract":"A new modern MEMS sensor is designed for humidity and temperature measurement for agriculture field. The simulated results and micro-machined proposed cantilever structure based two sided micro cantilever sensors for agriculture applications are presented in this paper. The temperature and humidity sensor is consisting of sensing materials such as Cu and polysilicon is used, which is designed on the MEMS cantilever. The simulation is done by Intellisuite software. Since the FEM based displacement, stress and strain analysis is obtained. When temperature is applied to the sensor, the material is expanded, due to the coefficient of thermal expansion. In humidity sensor, the pressure increases that causes the cantilever leading to change in the displacement. This work may be potentially useful for sensor design engineers, for agriculture applications.","PeriodicalId":367360,"journal":{"name":"2017 IEEE International Conference on Circuits and Systems (ICCS)","volume":"2021 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125705128","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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