Pub Date : 2025-09-01Epub Date: 2025-09-03DOI: 10.1016/j.mne.2025.100319
S. Schermer , J. Bieling , S. DeMoor , A. Zanzal , P. Reynolds , C. Helke , J. Bonitz , A. Voigt , D. Reuter
In this work a reticle based i-line projection grayscale stepper lithography is applied, the patterning results are analyzed and the lithographic process is optimized to obtain low surface roughness grayscale pattern. Here the low contrast resist ma-P 1211G, one type of the ma-P 1200G grayscale resist series, from micro resist technology and tailored grayscale reticles from benchmark technologies are used. The spin curve, contrast curve and layer homogeneity of the resist were measured. A low surface roughness of the generated grayscale structures is important, because the roughness will be transferred during subsequent etching steps as pattern transfer. The impact of the pixel size (within the reticle) on the resist roughness and structure fidelity after resist development was investigated. Therefore, to measure the roughness of exposed and developed structures by AFM, dedicated roughness pads were integrated into the reticle design. After evaluation of the resist roughness a DOE study for different annealing steps in order to smoothen the resist surface after development was conducted. The ideal annealing or smoothening temperature was determined to reduce the resist roughness and preserve/ retain the structure fidelity at the same time.
{"title":"Optimizing reticle based high throughput i-line grayscale projection lithography for 3D structures with low surface roughness","authors":"S. Schermer , J. Bieling , S. DeMoor , A. Zanzal , P. Reynolds , C. Helke , J. Bonitz , A. Voigt , D. Reuter","doi":"10.1016/j.mne.2025.100319","DOIUrl":"10.1016/j.mne.2025.100319","url":null,"abstract":"<div><div>In this work a reticle based i-line projection grayscale stepper lithography is applied, the patterning results are analyzed and the lithographic process is optimized to obtain low surface roughness grayscale pattern. Here the low contrast resist ma-P 1211G, one type of the ma-P 1200G grayscale resist series, from micro resist technology and tailored grayscale reticles from benchmark technologies are used. The spin curve, contrast curve and layer homogeneity of the resist were measured. A low surface roughness of the generated grayscale structures is important, because the roughness will be transferred during subsequent etching steps as pattern transfer. The impact of the pixel size (within the reticle) on the resist roughness and structure fidelity after resist development was investigated. Therefore, to measure the roughness of exposed and developed structures by AFM, dedicated roughness pads were integrated into the reticle design. After evaluation of the resist roughness a DOE study for different annealing steps in order to smoothen the resist surface after development was conducted. The ideal annealing or smoothening temperature was determined to reduce the resist roughness and preserve/ retain the structure fidelity at the same time.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"28 ","pages":"Article 100319"},"PeriodicalIF":3.1,"publicationDate":"2025-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145004270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-09-01Epub Date: 2025-08-06DOI: 10.1016/j.mne.2025.100312
Feng-Lin Tsao , Tzu-Yu Lin , Chen Shuai , Tzu-Chun Lo , Yu-Heng Hung , Chun-Hung Lin
As feature sizes in semiconductor manufacturing continue to shrink, accurate mask inspection and wafer-level prediction have become increasingly challenging. This paper presents a lithography-driven mask reconstruction framework that infers physically meaningful mask patterns from aerial images captured by mask reviewers. The proposed approach is grounded in an image formation model based on stacked pupil shift matrices and ensures physical interpretability and alignment with real lithography processes. The framework integrates a level-set-based inverse modeling approach with adaptive time-step optimization methods, including Barzilai–Borwein method and Golden Section Search, to ensure convergence efficiency and stability. To address the sensitivity of level-set methods to initialization, a deep learning-based model trained on lithography-aware data is introduced to generate accurate initial level-set functions. Additionally, an upsampling technique is employed to overcome pixel resolution limitations and to refine mask edge smoothness without increasing runtime. Experimental results demonstrate that the reconstructed masks generate aerial images that closely match those from mask reviewers. Compared with the sidelobe search, our AI-initialized method substantially improves reconstruction accuracy and convergence, especially in cases involving subresolution assist features. Furthermore, wafer-level evaluations exhibit strong alignment between simulated and actual CD variations, and matching slopes are consistently above 0.8. The proposed framework effectively bridges the gap between aerial image analysis and wafer behavior prediction, and offers a robust, scalable solution for advanced mask review and verification workflows.
{"title":"AI-initialized level-set inversion for lithographic mask reconstruction","authors":"Feng-Lin Tsao , Tzu-Yu Lin , Chen Shuai , Tzu-Chun Lo , Yu-Heng Hung , Chun-Hung Lin","doi":"10.1016/j.mne.2025.100312","DOIUrl":"10.1016/j.mne.2025.100312","url":null,"abstract":"<div><div>As feature sizes in semiconductor manufacturing continue to shrink, accurate mask inspection and wafer-level prediction have become increasingly challenging. This paper presents a lithography-driven mask reconstruction framework that infers physically meaningful mask patterns from aerial images captured by mask reviewers. The proposed approach is grounded in an image formation model based on stacked pupil shift matrices and ensures physical interpretability and alignment with real lithography processes. The framework integrates a level-set-based inverse modeling approach with adaptive time-step optimization methods, including Barzilai–Borwein method and Golden Section Search, to ensure convergence efficiency and stability. To address the sensitivity of level-set methods to initialization, a deep learning-based model trained on lithography-aware data is introduced to generate accurate initial level-set functions. Additionally, an upsampling technique is employed to overcome pixel resolution limitations and to refine mask edge smoothness without increasing runtime. Experimental results demonstrate that the reconstructed masks generate aerial images that closely match those from mask reviewers. Compared with the sidelobe search, our AI-initialized method substantially improves reconstruction accuracy and convergence, especially in cases involving subresolution assist features. Furthermore, wafer-level evaluations exhibit strong alignment between simulated and actual CD variations, and matching slopes are consistently above 0.8. The proposed framework effectively bridges the gap between aerial image analysis and wafer behavior prediction, and offers a robust, scalable solution for advanced mask review and verification workflows.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"28 ","pages":"Article 100312"},"PeriodicalIF":3.1,"publicationDate":"2025-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144810657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-09-01Epub Date: 2025-08-06DOI: 10.1016/j.mne.2025.100313
Jinyu Guo , Yifei Wang , Hao Quan , Shuoqiu Tian , Qiucheng Chen , Wentao Yuan , Qingxin Wu , Kangping Liu , Yifang Chen , Qiong He , Lei Zhou
Metasheets, composed of two identical metasurfaces closely aligned to each other within a mode-coupling distance on the two opposite sides of a SiNx membrane, are of unique functionalities for effective modulation of electromagnetic waves by nanoscale metallic structures. Although the physical image is readily clear, nanofabrication of such a two-sided devices with identical patterns still remains a big challenge because of the e-beam spreading caused by forward scattering in both resists and membranes. In this work, an innovative transmitted electron beam lithography (TEBL) was developed for metasheets. Three different resist stacks were tried and compared to eliminate the pattern deviation between them. A simulation study of TEBL was systematically carried out to figure out a reliable process window for replicating identical Au-gratings on the two opposite sides. The principle behind the success of replicating two identical metasurfaces on opposite sides is analyzed. The developed TEBL in this work extends the application of electron beam lithography to double-sided patterning for novel optical devices such as metasheets.
{"title":"Transmitted electron exposure in electron beam lithography for double-side patterning of bi-layer metasurfaces on a SiNx membrane","authors":"Jinyu Guo , Yifei Wang , Hao Quan , Shuoqiu Tian , Qiucheng Chen , Wentao Yuan , Qingxin Wu , Kangping Liu , Yifang Chen , Qiong He , Lei Zhou","doi":"10.1016/j.mne.2025.100313","DOIUrl":"10.1016/j.mne.2025.100313","url":null,"abstract":"<div><div>Metasheets, composed of two identical metasurfaces closely aligned to each other within a mode-coupling distance on the two opposite sides of a SiN<sub>x</sub> membrane, are of unique functionalities for effective modulation of electromagnetic waves by nanoscale metallic structures. Although the physical image is readily clear, nanofabrication of such a two-sided devices with identical patterns still remains a big challenge because of the e-beam spreading caused by forward scattering in both resists and membranes. In this work, an innovative transmitted electron beam lithography (TEBL) was developed for metasheets. Three different resist stacks were tried and compared to eliminate the pattern deviation between them. A simulation study of TEBL was systematically carried out to figure out a reliable process window for replicating identical Au-gratings on the two opposite sides. The principle behind the success of replicating two identical metasurfaces on opposite sides is analyzed. The developed TEBL in this work extends the application of electron beam lithography to double-sided patterning for novel optical devices such as metasheets.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"28 ","pages":"Article 100313"},"PeriodicalIF":3.1,"publicationDate":"2025-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144830654","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Weavable devices are innovative fabric-based electronics created by weaving yarns with various functions into a single cloth, enabling multifunctionality beyond traditional wearable devices. Electrically conductive yarns are essential for this integration, and in practical applications, yarns are prepared with varying twist numbers. This study investigates the metallization of nylon 6,6 yarns using a supercritical CO2-assisted NiP electroless plating method and examines the influence of twist numbers on metallization characteristics. The results show that increasing the twist number significantly decreases the electrical resistance of Ni-P/nylon 6,6 composite yarns, underscoring the critical role of yarn structure in electrical conductivity. Energy-dispersive X-ray spectroscopy (EDS) analysis indicates that higher twist numbers (0 T/m to 865 T/m) improve the distribution of Pd catalysts on scCO2-catalyzed nylon 6,6 yarns. Additionally, scanning electron microscope (SEM) observations and EDS analysis show that increasing the twist number leads to thicker and more uniform NiP coatings, thereby improving the electrical performance. Overall, this study demonstrates that optimizing twist number is key to improving the metallization quality and electrical properties of nylon 6,6 yarns for advanced weavable electronic applications.
{"title":"Ni-P metallization of nylon 6,6 yarns with varying twist numbers by supercritical CO2 catalyzation toward weavable devices","authors":"Kazuhiro Shibata , Tomoyuki Kurioka , Hikaru Kondo , Nao Yoshida , Wan-Ting Chiu , Chun-Yi Chen , Tso-Fu Mark Chang , Hiromichi Kurosu , Masato Sone","doi":"10.1016/j.mne.2025.100304","DOIUrl":"10.1016/j.mne.2025.100304","url":null,"abstract":"<div><div>Weavable devices are innovative fabric-based electronics created by weaving yarns with various functions into a single cloth, enabling multifunctionality beyond traditional wearable devices. Electrically conductive yarns are essential for this integration, and in practical applications, yarns are prepared with varying twist numbers. This study investigates the metallization of nylon 6,6 yarns using a supercritical CO<sub>2</sub>-assisted Ni<img>P electroless plating method and examines the influence of twist numbers on metallization characteristics. The results show that increasing the twist number significantly decreases the electrical resistance of Ni-P/nylon 6,6 composite yarns, underscoring the critical role of yarn structure in electrical conductivity. Energy-dispersive X-ray spectroscopy (EDS) analysis indicates that higher twist numbers (0 T/m to 865 T/m) improve the distribution of Pd catalysts on scCO<sub>2</sub>-catalyzed nylon 6,6 yarns. Additionally, scanning electron microscope (SEM) observations and EDS analysis show that increasing the twist number leads to thicker and more uniform Ni<img>P coatings, thereby improving the electrical performance. Overall, this study demonstrates that optimizing twist number is key to improving the metallization quality and electrical properties of nylon 6,6 yarns for advanced weavable electronic applications.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"28 ","pages":"Article 100304"},"PeriodicalIF":2.8,"publicationDate":"2025-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144322776","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-06-01Epub Date: 2025-06-02DOI: 10.1016/j.mne.2025.100301
S. Assie-Souleille, L. Seguier, D. Gauchard, I. Drobecq, B. Franc, L. Malaquin, J. Foncy
We present a novel and straightforward method using a standard stereolithography (SLA) 3D printer for high-resolution (20 μm x-y resolution), multi-material 2D hydrogel photo-patterning directly within a microfluidic chip. The process involves sequential injections of photosensitive hydrogel into a transparent microfluidic chip coupled with sequential direct laser writing by the printer through point-by-point photopolymerization. Our approach integrates a custom miniaturized syringe pump system into the SLA printer, thereby enabling fluid management and sequential injection of different photosensitive hydrogels directly into the microfluidic environment between each laser writing sequence. This technique enables the fabrication of intricate, multi-material hydrogel patterns (e.g., PEGDA and HAMA) with high spatial resolution over areas spanning several square millimeters. Future developments will focus on expanding the range of biomaterials and incorporating cell-laden hydrogels to facilitate the creation of biologically relevant microenvironments on chip.
This study opens new possibilities for high-resolution, multi-material hydrogel patterning in microfluidics and offers a valuable platform for advancing research in microsystems engineering.
{"title":"Stereolithography 3D printing method for multi-material hydrogel 2D photo-patterning in a microfluidic chip","authors":"S. Assie-Souleille, L. Seguier, D. Gauchard, I. Drobecq, B. Franc, L. Malaquin, J. Foncy","doi":"10.1016/j.mne.2025.100301","DOIUrl":"10.1016/j.mne.2025.100301","url":null,"abstract":"<div><div>We present a novel and straightforward method using a standard stereolithography (SLA) 3D printer for high-resolution (20 μm x-y resolution), multi-material 2D hydrogel photo-patterning directly within a microfluidic chip. The process involves sequential injections of photosensitive hydrogel into a transparent microfluidic chip coupled with sequential direct laser writing by the printer through point-by-point photopolymerization. Our approach integrates a custom miniaturized syringe pump system into the SLA printer, thereby enabling fluid management and sequential injection of different photosensitive hydrogels directly into the microfluidic environment between each laser writing sequence. This technique enables the fabrication of intricate, multi-material hydrogel patterns (e.g., PEGDA and HAMA) with high spatial resolution over areas spanning several square millimeters. Future developments will focus on expanding the range of biomaterials and incorporating cell-laden hydrogels to facilitate the creation of biologically relevant microenvironments on chip.</div><div>This study opens new possibilities for high-resolution, multi-material hydrogel patterning in microfluidics and offers a valuable platform for advancing research in microsystems engineering.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"27 ","pages":"Article 100301"},"PeriodicalIF":2.8,"publicationDate":"2025-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144204270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-06-01Epub Date: 2025-04-29DOI: 10.1016/j.mne.2025.100296
Tianhui Li , James A. Flint , Hailing Fu , Sotiris Korossis , Stephanos Theodossiades
Wireless power transfer provides a sustainable power source for active medical implants. Recent developments in biosensors, MEMS technologies and the advent of ubiquitous computing has opened up the potential for a millimeter-sized active medical implant for continuous health monitoring. Frequent wireless communication and data processing requires more energy than traditional active medical implants. Therefore, a continuous power source is needed. This study investigated the development of an ultrasonic power transfer (USPT) system for active medical implants. The system, comprised of a wearable and an implantable device, can transfer both power and data between the implant and the wearable. By implementing beamforming, it can adapt to misalignment between the transmitter and the receiver. In the experiments, the receiver outputs 0.16 mW after rectification, when transmitting through 0.5 cm of water. By measuring the time-of-flight (ToF) of a pulse transmitted from the receiver, implant position feedback is achieved. Data transfer is demonstrated at a rate of 1 kbit/s, across a 4 cm path in water, which is adequate for many biomedical applications.
{"title":"Ultrasonic power and data transfer for active medical implants using adaptive beamforming","authors":"Tianhui Li , James A. Flint , Hailing Fu , Sotiris Korossis , Stephanos Theodossiades","doi":"10.1016/j.mne.2025.100296","DOIUrl":"10.1016/j.mne.2025.100296","url":null,"abstract":"<div><div>Wireless power transfer provides a sustainable power source for active medical implants. Recent developments in biosensors, MEMS technologies and the advent of ubiquitous computing has opened up the potential for a millimeter-sized active medical implant for continuous health monitoring. Frequent wireless communication and data processing requires more energy than traditional active medical implants. Therefore, a continuous power source is needed. This study investigated the development of an ultrasonic power transfer (USPT) system for active medical implants. The system, comprised of a wearable and an implantable device, can transfer both power and data between the implant and the wearable. By implementing beamforming, it can adapt to misalignment between the transmitter and the receiver. In the experiments, the receiver outputs 0.16 mW after rectification, when transmitting through 0.5 cm of water. By measuring the time-of-flight (ToF) of a pulse transmitted from the receiver, implant position feedback is achieved. Data transfer is demonstrated at a rate of 1 kbit/s, across a 4 cm path in water, which is adequate for many biomedical applications.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"27 ","pages":"Article 100296"},"PeriodicalIF":2.8,"publicationDate":"2025-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143924689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-06-01Epub Date: 2025-05-08DOI: 10.1016/j.mne.2025.100298
Estelle Lu , Williams Flores Cisternas , Héloïse Uhl , Alexandre Chargueraud , Quentin Grimal , Guillaume Renaud , Jean-Gabriel Minonzio , Jacques Fattaccioli
Blood-mimicking fluids (BMFs) play a critical role in ultrasonic imaging and Doppler flow studies by replicating the physical and acoustic properties of blood. This study introduces a novel soybean oil-in-water emulsion as a BMF with particle size akin to red blood cells. Using a millifluidic device, we cross-validated flow profiles through both Doppler velocimetry and optical particle tracking, demonstrating compatibility with theoretical Poiseuille flow models. The millifluidic chip, fabricated via stereolithography, provided an optimized platform for dual optical and ultrasonic assessments. Results showed strong agreement between the two methods across a range of flow rates, affirming the suitability of the emulsion for velocimetry applications. Furthermore, the acoustic properties of soybean oil droplets support their potential as an echogenic and stable alternative to conventional BMFs.
{"title":"Assessing ultrasonic and optical flow velocimetry in a millifluidic device using oil-in-water emulsions as blood mimicking fluid","authors":"Estelle Lu , Williams Flores Cisternas , Héloïse Uhl , Alexandre Chargueraud , Quentin Grimal , Guillaume Renaud , Jean-Gabriel Minonzio , Jacques Fattaccioli","doi":"10.1016/j.mne.2025.100298","DOIUrl":"10.1016/j.mne.2025.100298","url":null,"abstract":"<div><div>Blood-mimicking fluids (BMFs) play a critical role in ultrasonic imaging and Doppler flow studies by replicating the physical and acoustic properties of blood. This study introduces a novel soybean oil-in-water emulsion as a BMF with particle size akin to red blood cells. Using a millifluidic device, we cross-validated flow profiles through both Doppler velocimetry and optical particle tracking, demonstrating compatibility with theoretical Poiseuille flow models. The millifluidic chip, fabricated via stereolithography, provided an optimized platform for dual optical and ultrasonic assessments. Results showed strong agreement between the two methods across a range of flow rates, affirming the suitability of the emulsion for velocimetry applications. Furthermore, the acoustic properties of soybean oil droplets support their potential as an echogenic and stable alternative to conventional BMFs.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"27 ","pages":"Article 100298"},"PeriodicalIF":2.8,"publicationDate":"2025-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143942364","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-06-01Epub Date: 2025-05-06DOI: 10.1016/j.mne.2025.100299
Farnaz Rezaei , Daniel O. Carlsson , Jimmy Hedin Dahlstrom , Jonas Lindh , Stefan Johansson
This study focuses on the fabrication and analysis of 3D-printed high-detail resolution cellulose acetate (CA) structures, particularly examining their specific surface area per volume . While electrospinning is a widely used technique for creating nanofiber membranes with high , which is advantageous for applications like chromatography, the performance could be further improved by precisely controlling fiber placement. To further develop membranes, this research explores the use of electroprinting with small distances between nozzle and collector, here named near-collector electroprinting, to create 3D structures. By optimizing printing parameters, in particular the reduction of the nozzle-to-collector distance, 3D structures with precise fiber placement within a few micrometers were fabricated. The specific surface area per volume was calculated for both 3D-printed and electrospun filters. Results showed that 3D-printed structures with a 5 μm pitch achieved a similar to electrospun filters.
Incorporating polyethyleneimine (PEI) in the CA ink enabled the 3D-printed structures to gain ion binding capacity which was further investigated. This ion-exchange ability which integrated into the printing step, eliminating the need for a separate post-modification process in bio-separation applications. By switching the substrate voltage from positive to negative, relative to the grounded nozzle, the printed fiber diameter decreased substantially for the CA ink with PEI. The for near-collector electroprinted fibers of this material could therefore potentially be higher than that of electrospun membranes, provided that an order of magnitude higher printing speed, than presently possible can be used. These findings suggest that near-collector electroprinted CA structures offer potential improvements in membrane design and performance, making them a promising alternative to traditional electrospun membranes for bio-separation applications.
{"title":"Near-collector electroprinting of cellulose acetate structures with large specific surface per volume","authors":"Farnaz Rezaei , Daniel O. Carlsson , Jimmy Hedin Dahlstrom , Jonas Lindh , Stefan Johansson","doi":"10.1016/j.mne.2025.100299","DOIUrl":"10.1016/j.mne.2025.100299","url":null,"abstract":"<div><div>This study focuses on the fabrication and analysis of 3D-printed high-detail resolution cellulose acetate (CA) structures, particularly examining their specific surface area per volume <span><math><mfenced><msub><mi>S</mi><mi>v</mi></msub></mfenced></math></span>. While electrospinning is a widely used technique for creating nanofiber membranes with high <span><math><msub><mi>S</mi><mi>v</mi></msub></math></span>, which is advantageous for applications like chromatography, the performance could be further improved by precisely controlling fiber placement. To further develop membranes, this research explores the use of electroprinting with small distances between nozzle and collector, here named near-collector electroprinting, to create 3D structures. By optimizing printing parameters, in particular the reduction of the nozzle-to-collector distance, 3D structures with precise fiber placement within a few micrometers were fabricated. The specific surface area per volume was calculated for both 3D-printed and electrospun filters. Results showed that 3D-printed structures with a 5 μm pitch achieved a <span><math><msub><mi>S</mi><mi>v</mi></msub></math></span> similar to electrospun filters.</div><div>Incorporating polyethyleneimine (PEI) in the CA ink enabled the 3D-printed structures to gain ion binding capacity which was further investigated. This ion-exchange ability which integrated into the printing step, eliminating the need for a separate post-modification process in bio-separation applications. By switching the substrate voltage from positive to negative, relative to the grounded nozzle, the printed fiber diameter decreased substantially for the CA ink with PEI. The <span><math><msub><mi>S</mi><mi>v</mi></msub></math></span> for near-collector electroprinted fibers of this material could therefore potentially be higher than that of electrospun membranes, provided that an order of magnitude higher printing speed, than presently possible can be used. These findings suggest that near-collector electroprinted CA structures offer potential improvements in membrane design and performance, making them a promising alternative to traditional electrospun membranes for bio-separation applications.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"27 ","pages":"Article 100299"},"PeriodicalIF":2.8,"publicationDate":"2025-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143936336","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
With the rapid advances of extreme ultraviolet (EUV) lithography toward ultra-high resolution, characterization technique of EUV resists by interference lithography (IL) for 14-nm node process needs urgent upgrading because of the considerable loss of light transmission by metallic grating masks. Diffraction phase gratings in dielectric silicon dioxide as masks are a promising solution, provided that 28 nm lines/spaces with high aspect ratio as well as large grating areas are obtained. This paper reports our recent success in replicating 28 nm half-pitch gratings with the aspect ratio of 13:1 and the area up to 200 × 200 μm2 by state-of-the-art electron beam lithography with regional proximity effect correction (PEC) in hydrogen silsesquioxane (HSQ) coated on a 100 nm silicon nitride membrane. To ensure well resolved lines/spaces in 350 nm thick HSQ, Monte Carlo algorithm is applied in the simulations of 3D absorbing electron energy density distributions, followed by calculations of equal energy contours of deposited energy based on the kinetic development model, which enables us to work out reliable dose windows. The process developed in this work should be feasibly extended to large area gratings in a future industrialization.
{"title":"Regional proximity effect correction for replicating 28 nm lines/spaces in HSQ as dielectric diffraction gratings with high aspect ratio","authors":"Qingxin Wu , Wentao Yuan , Qiucheng Chen , Hao Quan , Yifang Chen","doi":"10.1016/j.mne.2025.100295","DOIUrl":"10.1016/j.mne.2025.100295","url":null,"abstract":"<div><div>With the rapid advances of extreme ultraviolet (EUV) lithography toward ultra-high resolution, characterization technique of EUV resists by interference lithography (IL) for 14-nm node process needs urgent upgrading because of the considerable loss of light transmission by metallic grating masks. Diffraction phase gratings in dielectric silicon dioxide as masks are a promising solution, provided that 28 nm lines/spaces with high aspect ratio as well as large grating areas are obtained. This paper reports our recent success in replicating 28 nm half-pitch gratings with the aspect ratio of 13:1 and the area up to 200 × 200 μm<sup>2</sup> by state-of-the-art electron beam lithography with regional proximity effect correction (PEC) in hydrogen silsesquioxane (HSQ) coated on a 100 nm silicon nitride membrane. To ensure well resolved lines/spaces in 350 nm thick HSQ, Monte Carlo algorithm is applied in the simulations of 3D absorbing electron energy density distributions, followed by calculations of equal energy contours of deposited energy based on the kinetic development model, which enables us to work out reliable dose windows. The process developed in this work should be feasibly extended to large area gratings in a future industrialization.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"26 ","pages":"Article 100295"},"PeriodicalIF":2.8,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143739189","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The democratization of fabrication equipment has spurred recent interest in maskless grayscale lithography for both 2D and 3D microfabrication. However, the design of suitable template images remains a challenge. This work presents a simplified method for encoding 3D objects into grayscale image files optimized for grayscale lithography. Leveraging the widely used and open-source 3D modeling software Blender, we developed a robust approach to convert geometric heights into grayscale levels and generate image files through top-view rendering. Our method accurately reproduced the overall shape of simple structures like stairs and ramps compared to the original designs. We extended this approach to complex 3D sinusoidal surfaces, achieving similar results. Given the increasing accessibility and user-friendliness of digital rendering tools, this study offers a promising strategy for rapid prototyping of initial designs with minimal effort.
{"title":"Rapid prototyping of 3D microstructures: A simplified grayscale lithography encoding method using blender","authors":"Fabrício Frizera Borghi , Mohammed Bendimerad , Marie-Ly Chapon , Tatiana Petithory , Laurent Vonna , Laurent Pieuchot","doi":"10.1016/j.mne.2024.100294","DOIUrl":"10.1016/j.mne.2024.100294","url":null,"abstract":"<div><div>The democratization of fabrication equipment has spurred recent interest in maskless grayscale lithography for both 2D and 3D microfabrication. However, the design of suitable template images remains a challenge. This work presents a simplified method for encoding 3D objects into grayscale image files optimized for grayscale lithography. Leveraging the widely used and open-source 3D modeling software Blender, we developed a robust approach to convert geometric heights into grayscale levels and generate image files through top-view rendering. Our method accurately reproduced the overall shape of simple structures like stairs and ramps compared to the original designs. We extended this approach to complex 3D sinusoidal surfaces, achieving similar results. Given the increasing accessibility and user-friendliness of digital rendering tools, this study offers a promising strategy for rapid prototyping of initial designs with minimal effort.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"26 ","pages":"Article 100294"},"PeriodicalIF":2.8,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143148228","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}