Pub Date : 2024-05-15DOI: 10.1016/j.mne.2024.100260
Georgios P. Papageorgiou , Nikolaos Boukos , Maria Androulidaki , Dimitrios Christofilos , Vassilis Psycharis , Maria Katsikini , Fani Pinakidou , Eleni C. Paloura , Christoforos Krontiras , Eleni Makarona
Zinc oxide (ZnO) has emerged as one of the most promising candidates for mass-producing cost-efficient optoelectronic devices. This is primarily because it can be synthesized in high-quality nanostructures on a wide range of substrates through relatively simple chemical methods. However, producing p-type ZnO, regardless of the chosen method, remains an open and controversial issue. In this work, Li-doped ZnO nanostructures of varying Li-cocnentration were produced via a two-step hydrothermal growth synthesis and an in-depth analysis based on with Field Emission Scanning Electron Microscopy (FE-SEM), X-ray diffraction (XRD), Raman Spectroscopy, Extended X-Ray Absorption Fine Structure (EXAFS) Spectroscopy, and temperature-dependent Photoluminescence (PL) was carried out in an effort to gain insights into the Li-incorporation mechanisms. The findings indicated a strong interplay between the native defects responsible for the inherent n-type character of the material and Li incorporation. It is suggested that this interplay hinders the successful conversion of the Li-doped nanorods into p-type nanostructures and that when employing the hydrothermal approach it is essential to identify the precise conditions necessary for genuine Li incorporation as a Zn substitutional.
氧化锌(ZnO)已成为大规模生产具有成本效益的光电设备的最有前途的候选材料之一。这主要是因为它可以通过相对简单的化学方法在各种基底上合成高质量的纳米结构。然而,无论选择哪种方法,生产 p 型氧化锌仍然是一个开放和有争议的问题。在这项工作中,通过两步水热生长合成法制备了不同锂掺杂浓度的氧化锌纳米结构,并利用场发射扫描电子显微镜(FE-SEM)、X 射线衍射(XRD)、拉曼光谱、扩展 X 射线吸收精细结构(EXAFS)光谱和温度依赖性光致发光(PL)进行了深入分析,以深入了解锂掺杂机制。研究结果表明,造成材料固有 n 型特性的原生缺陷与锂掺杂之间存在着强烈的相互作用。研究表明,这种相互作用阻碍了掺锂纳米棒向 p 型纳米结构的成功转化,因此在采用水热法时,必须确定将锂作为 Zn 替代物进行真正掺入所需的精确条件。
{"title":"Investigation of hydrothermally-produced ZnO nanorods and the mechanisms of Li incorporation as a possible dopant","authors":"Georgios P. Papageorgiou , Nikolaos Boukos , Maria Androulidaki , Dimitrios Christofilos , Vassilis Psycharis , Maria Katsikini , Fani Pinakidou , Eleni C. Paloura , Christoforos Krontiras , Eleni Makarona","doi":"10.1016/j.mne.2024.100260","DOIUrl":"https://doi.org/10.1016/j.mne.2024.100260","url":null,"abstract":"<div><p>Zinc oxide (ZnO) has emerged as one of the most promising candidates for mass-producing cost-efficient optoelectronic devices. This is primarily because it can be synthesized in high-quality nanostructures on a wide range of substrates through relatively simple chemical methods. However, producing p-type ZnO, regardless of the chosen method, remains an open and controversial issue. In this work, Li-doped ZnO nanostructures of varying Li-cocnentration were produced via a two-step hydrothermal growth synthesis and an in-depth analysis based on with Field Emission Scanning Electron Microscopy (FE-SEM), X-ray diffraction (XRD), Raman Spectroscopy, Extended X-Ray Absorption Fine Structure (EXAFS) Spectroscopy, and temperature-dependent Photoluminescence (PL) was carried out in an effort to gain insights into the Li-incorporation mechanisms. The findings indicated a strong interplay between the native defects responsible for the inherent n-type character of the material and Li incorporation. It is suggested that this interplay hinders the successful conversion of the Li-doped nanorods into p-type nanostructures and that when employing the hydrothermal approach it is essential to identify the precise conditions necessary for genuine Li incorporation as a Zn substitutional.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"23 ","pages":"Article 100260"},"PeriodicalIF":0.0,"publicationDate":"2024-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590007224000236/pdfft?md5=9550786a76dde3a2bafc733a00d2da47&pid=1-s2.0-S2590007224000236-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141067393","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-13DOI: 10.1016/j.mne.2024.100258
Aleksandr Zozulia , Jeroen Bolk , Rene van Veldhoven , Gleb Nazarikov , Vadim Pogoretskiy , Samir Rihani , Graham Berry , Kevin Williams , Yuqing Jiao
We present a novel fabrication approach to an integrated nanophotonic platform, based on a III-V membrane bonded to a Si substrate with benzocyclobutene (BCB). The process incorporates a hybrid lithography strategy combining deep-UV and electron-beam lithography on the same wafer. We report for the first time the usage of deep-UV scanner lithography for the fabrication of the active-passive tapers and sub-micron waveguides on the same wafer, which enables better critical dimension control, uniformity, and reproducibility. The platform uses an active-passive butt-joint interface and includes components such as distributed feedback (DFB) and distributed Bragg reflector (DBR) lasers, electro-optical (EO) and electro-absorption (EA) modulators, and sub-micron ultra-confined passive waveguides, all monolithically integrated into a single membrane layer. The active devices have a heat sink achieved by ultra-thin BCB bonding. Lasers demonstrate up to 26 mW of optical power in the waveguide and a direct modulation bandwidth of up to 21 GHz. The modulators show static extinction up to 28.8 dB.
{"title":"Nanophotonic integrated active-passive InP membrane devices and circuits fabricated using ArF scanner lithography","authors":"Aleksandr Zozulia , Jeroen Bolk , Rene van Veldhoven , Gleb Nazarikov , Vadim Pogoretskiy , Samir Rihani , Graham Berry , Kevin Williams , Yuqing Jiao","doi":"10.1016/j.mne.2024.100258","DOIUrl":"https://doi.org/10.1016/j.mne.2024.100258","url":null,"abstract":"<div><p>We present a novel fabrication approach to an integrated nanophotonic platform, based on a III-V membrane bonded to a Si substrate with benzocyclobutene (BCB). The process incorporates a hybrid lithography strategy combining deep-UV and electron-beam lithography on the same wafer. We report for the first time the usage of deep-UV scanner lithography for the fabrication of the active-passive tapers and sub-micron waveguides on the same wafer, which enables better critical dimension control, uniformity, and reproducibility. The platform uses an active-passive butt-joint interface and includes components such as distributed feedback (DFB) and distributed Bragg reflector (DBR) lasers, electro-optical (EO) and electro-absorption (EA) modulators, and sub-micron ultra-confined passive waveguides, all monolithically integrated into a single membrane layer. The active devices have a heat sink achieved by ultra-thin BCB bonding. Lasers demonstrate up to 26 mW of optical power in the waveguide and a direct modulation bandwidth of up to 21 GHz. The modulators show static extinction up to 28.8 dB.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"23 ","pages":"Article 100258"},"PeriodicalIF":0.0,"publicationDate":"2024-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590007224000212/pdfft?md5=d5fd93e8bf263fb4464f4415b20d46ae&pid=1-s2.0-S2590007224000212-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140951304","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-11DOI: 10.1016/j.mne.2024.100259
Ryohei Hori , Kazuya Fujita , Chun Yi Chen , Tomoyuki Kurioka , Jhen-Yang Wu , Tso-Fu Mark Chang , Katsuyuki Machida , Hiroyuki Ito , Yoshihiro Miyake , Masato Sone
Gold is a promising material for movable components in MEMS devices by the high mass density, which allows reduction of the Brownian noise. Mechanical properties of metallic materials are known to be affected by the sample size effect. When bending test is utilized, the sample geometry effect is another factor. In this study, effects of the shape of the cross-section, or the cross-sectional geometry effect, are evaluated using micro-cantilevers with a trapezoidal cross-section. The yield stresses are ranged from 112 MPa to 185 MPa in micro-cantilevers composed of single crystalline gold, and the yield stresses varied from 372 MPa to 489 MPa in polycrystalline gold micro-cantilevers. The yield stress is found to be higher in the micro-cantilever having a smaller ratio of the top width over the bottom width, which demonstrates the cross-sectional geometry effect. Also, the cross-sectional geometry effect is more significant in the polycrystalline micro-cantilevers.
{"title":"Cross-sectional geometry effect on bending strength of gold micro-cantilever with trapezoidal cross-section","authors":"Ryohei Hori , Kazuya Fujita , Chun Yi Chen , Tomoyuki Kurioka , Jhen-Yang Wu , Tso-Fu Mark Chang , Katsuyuki Machida , Hiroyuki Ito , Yoshihiro Miyake , Masato Sone","doi":"10.1016/j.mne.2024.100259","DOIUrl":"https://doi.org/10.1016/j.mne.2024.100259","url":null,"abstract":"<div><p>Gold is a promising material for movable components in MEMS devices by the high mass density, which allows reduction of the Brownian noise. Mechanical properties of metallic materials are known to be affected by the sample size effect. When bending test is utilized, the sample geometry effect is another factor. In this study, effects of the shape of the cross-section, or the cross-sectional geometry effect, are evaluated using micro-cantilevers with a trapezoidal cross-section. The yield stresses are ranged from 112 MPa to 185 MPa in micro-cantilevers composed of single crystalline gold, and the yield stresses varied from 372 MPa to 489 MPa in polycrystalline gold micro-cantilevers. The yield stress is found to be higher in the micro-cantilever having a smaller ratio of the top width over the bottom width, which demonstrates the cross-sectional geometry effect. Also, the cross-sectional geometry effect is more significant in the polycrystalline micro-cantilevers.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"23 ","pages":"Article 100259"},"PeriodicalIF":0.0,"publicationDate":"2024-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590007224000224/pdfft?md5=c975d3baea9813e31a1d20e50884ceb8&pid=1-s2.0-S2590007224000224-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140951303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-05-08DOI: 10.1016/j.mne.2024.100257
Nicolai Støvring , Babak Rezaei , Arto Heiskanen , Jenny Emnéus , Stephan Sylvest Keller
Maskless UV photolithography is increasingly used, especially in research environments where low turn-around time for new designs improves productivity. Here, we fabricate pyrolytic carbon interdigitated microelectrodes with small interelectrode gaps, good adhesion to the carrier substrate, high surface area and excellent electrochemical properties using maskless UV photolithography with two negative epoxy-based photoresists, namely the commonly used SU-8 and the recently developed mr-DWL. The minimum realizable trench width in 15 μm thick photoresist films is 2.4 ± 0.15 μm for mr-DWL 5 and 3.1 ± 0.10 μm for SU-8 2035. After pyrolysis, the two resulting pyrolytic carbon materials show similar electrochemical properties. However, shrinkage during pyrolysis is significantly lower for mr-DWL compared to SU-8, which is beneficial for the fabrication of interdigitated microelectrodes. Furthermore, delamination of the electrodes during processing and operation is prevented due to the introduction of poly silicon adhesion structures. This work provides valuable insights into maskless UV lithography as well as into the pyrolytic carbon process to increase the yield, performance and productivity for fabrication of microelectrodes.
{"title":"Fabrication of pyrolytic carbon interdigitated microelectrodes by maskless UV photolithography with epoxy-based photoresists SU-8 and mr-DWL","authors":"Nicolai Støvring , Babak Rezaei , Arto Heiskanen , Jenny Emnéus , Stephan Sylvest Keller","doi":"10.1016/j.mne.2024.100257","DOIUrl":"10.1016/j.mne.2024.100257","url":null,"abstract":"<div><p>Maskless UV photolithography is increasingly used, especially in research environments where low turn-around time for new designs improves productivity. Here, we fabricate pyrolytic carbon interdigitated microelectrodes with small interelectrode gaps, good adhesion to the carrier substrate, high surface area and excellent electrochemical properties using maskless UV photolithography with two negative epoxy-based photoresists, namely the commonly used SU-8 and the recently developed mr-DWL. The minimum realizable trench width in 15 μm thick photoresist films is 2.4 ± 0.15 μm for mr-DWL 5 and 3.1 ± 0.10 μm for SU-8 2035. After pyrolysis, the two resulting pyrolytic carbon materials show similar electrochemical properties. However, shrinkage during pyrolysis is significantly lower for mr-DWL compared to SU-8, which is beneficial for the fabrication of interdigitated microelectrodes. Furthermore, delamination of the electrodes during processing and operation is prevented due to the introduction of poly silicon adhesion structures. This work provides valuable insights into maskless UV lithography as well as into the pyrolytic carbon process to increase the yield, performance and productivity for fabrication of microelectrodes.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"23 ","pages":"Article 100257"},"PeriodicalIF":0.0,"publicationDate":"2024-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590007224000200/pdfft?md5=60673ebe8420e6820b9903f3d1fe7dce&pid=1-s2.0-S2590007224000200-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141049018","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Water is a vital component for all living organisms, yet persistent water scarcity remains a global challenge. One potential solution lies in replicating the atmospheric water collection mechanism observed in the Stenocara beetle, characterized by a dorsal surface featuring alternating hydrophilic and hydrophobic regions. In this study, we have designed and examined two distinct biphilic patterned surface configurations, integrating various technologies, to mimic the beetle's water collection strategy. Our investigation evaluates the efficiency of these surfaces in both capturing water from fog and condensing water from dew. For fog collection two parameters were the most impactful: the roughness and the wettability contrast between hydrophilic and hydrophobic zones. In contrast, dew condensation was influenced by additional parameters notably the patterns' size and density that directly affect the water contact angle. It is worth noting, however, that the optimal surface for fog collection may not necessarily coincide with the most effective surface for dew condensation. Furthermore, our research includes a comparative analysis between the theoretically predicted volume of water droplet departure and the empirically observed results.
{"title":"Controlled wettability of biphilic patterned surfaces for enhanced atmospheric water harvesting","authors":"Joyce Estephan, Marie Panabière, Camille Petit-Etienne, Sebastien Labau, Léo Bon, Jean-Hervé Tortai, Cécile Gourgon","doi":"10.1016/j.mne.2024.100255","DOIUrl":"https://doi.org/10.1016/j.mne.2024.100255","url":null,"abstract":"<div><p>Water is a vital component for all living organisms, yet persistent water scarcity remains a global challenge. One potential solution lies in replicating the atmospheric water collection mechanism observed in the Stenocara beetle, characterized by a dorsal surface featuring alternating hydrophilic and hydrophobic regions. In this study, we have designed and examined two distinct biphilic patterned surface configurations, integrating various technologies, to mimic the beetle's water collection strategy. Our investigation evaluates the efficiency of these surfaces in both capturing water from fog and condensing water from dew. For fog collection two parameters were the most impactful: the roughness and the wettability contrast between hydrophilic and hydrophobic zones. In contrast, dew condensation was influenced by additional parameters notably the patterns' size and density that directly affect the water contact angle. It is worth noting, however, that the optimal surface for fog collection may not necessarily coincide with the most effective surface for dew condensation. Furthermore, our research includes a comparative analysis between the theoretically predicted volume of water droplet departure and the empirically observed results.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"23 ","pages":"Article 100255"},"PeriodicalIF":0.0,"publicationDate":"2024-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590007224000182/pdfft?md5=ceffce399788bdc2ff24b6d2f8ce8bee&pid=1-s2.0-S2590007224000182-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140844409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-04-28DOI: 10.1016/j.mne.2024.100256
Nico Rademacher , Eros Reato , Lukas Völkel , Annika Grundmann , Michael Heuken , Holger Kalisch , Andrei Vescan , Alwin Daus , Max C. Lemme
This study investigates the interactions between chemical vapor-deposited graphene and metal-organic chemical vapor-deposited molybdenum disulfide (MoS2) in heterostructures assembled via wet transfer. We use Raman spectroscopy to quantitatively determine close coupling between graphene and MoS2 based on the peak separations in graphene. Although annealing seems to be necessary after transfer to establish a close coupling, its parameters do not have a significant impact on the quality of coupling (for 100 °C < T < 400 °C and 5 min < t < 120 min). Furthermore, the method is robust against variations in graphene thickness because bilayers can be distinguished by comparing the full width at half maximum of the graphene 2D peak. We expand our study to mm2-scale areas of graphene-MoS2 heterostructures finding that films assembled via wet-transfer technique exhibit considerable variability in terms of coupling strength. Evaluating such interactions in heterostructures on large areas is important for future practical applications in heterostructure devices.
本研究探讨了化学气相沉积石墨烯和金属有机化学气相沉积二硫化钼(MoS2)在通过湿转移组装的异质结构中的相互作用。我们利用拉曼光谱,根据石墨烯的峰值分离来定量确定石墨烯和 MoS2 之间的紧密耦合。虽然在转移后似乎需要退火才能建立紧密耦合,但退火参数对耦合质量的影响并不大(100 °C < T < 400 °C 和 5 分钟 < t < 120 分钟)。此外,该方法对石墨烯厚度的变化也很稳健,因为通过比较石墨烯二维峰的半最大全宽,就可以区分双层石墨烯。我们将研究扩展到毫米级的石墨烯-MoS2 异质结构区域,发现通过湿转移技术组装的薄膜在耦合强度方面表现出相当大的差异。评估大面积异质结构中的这种相互作用对于未来异质结构器件的实际应用非常重要。
{"title":"CVD graphene-MoS2 Van der Waals heterostructures on the millimeter-scale","authors":"Nico Rademacher , Eros Reato , Lukas Völkel , Annika Grundmann , Michael Heuken , Holger Kalisch , Andrei Vescan , Alwin Daus , Max C. Lemme","doi":"10.1016/j.mne.2024.100256","DOIUrl":"https://doi.org/10.1016/j.mne.2024.100256","url":null,"abstract":"<div><p>This study investigates the interactions between chemical vapor-deposited graphene and metal-organic chemical vapor-deposited molybdenum disulfide (MoS<sub>2</sub>) in heterostructures assembled via wet transfer. We use Raman spectroscopy to quantitatively determine close coupling between graphene and MoS<sub>2</sub> based on the peak separations in graphene. Although annealing seems to be necessary after transfer to establish a close coupling, its parameters do not have a significant impact on the quality of coupling (for 100 °C < <em>T</em> < 400 °C and 5 min < <em>t</em> < 120 min). Furthermore, the method is robust against variations in graphene thickness because bilayers can be distinguished by comparing the full width at half maximum of the graphene 2D peak. We expand our study to mm<sup>2</sup>-scale areas of graphene-MoS<sub>2</sub> heterostructures finding that films assembled via wet-transfer technique exhibit considerable variability in terms of coupling strength. Evaluating such interactions in heterostructures on large areas is important for future practical applications in heterostructure devices.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"23 ","pages":"Article 100256"},"PeriodicalIF":0.0,"publicationDate":"2024-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590007224000194/pdfft?md5=342c3ffee3f2291ee9ca619303288e95&pid=1-s2.0-S2590007224000194-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140824232","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this study, the strain rate dependence in yield strengths of electrodeposited gold micro-pillars is evaluated for the design of movable components in MEMS devices. The micro-pillars are fabricated from electrodeposited gold by focused ion beam system. The strain rate dependence is quantified by the strain rate sensitivity, and the strain rate sensitivity is calculated from the yield strength obtained from compression tests of the gold micro-pillars having different sizes at different strain rates. An increase in the yield strength following a reduction in the pillar size is observed, which is the sample size effect. Also, weakening of the yield strength is observed following a decrease in the strain rate, which is the strain rate dependence, and the strain rate sensitivity of the gold micro-pillars is found be at roughly 0.03.
{"title":"Effects of the strain rate in compression of electrodeposited gold micro-pillars toward the design of MEMS components","authors":"Shota Kanno , Taro Omura , Jhen-Yang Wu , Tomoyuki Kurioka , Chun-Yi Chen , Parthojit Chakraborty , Katsuyuki Machida , Hiroyuki Ito , Yoshihiro Miyake , Masato Sone , Tso-Fu Mark Chang","doi":"10.1016/j.mne.2024.100254","DOIUrl":"https://doi.org/10.1016/j.mne.2024.100254","url":null,"abstract":"<div><p>In this study, the strain rate dependence in yield strengths of electrodeposited gold micro-pillars is evaluated for the design of movable components in MEMS devices. The micro-pillars are fabricated from electrodeposited gold by focused ion beam system. The strain rate dependence is quantified by the strain rate sensitivity, and the strain rate sensitivity is calculated from the yield strength obtained from compression tests of the gold micro-pillars having different sizes at different strain rates. An increase in the yield strength following a reduction in the pillar size is observed, which is the sample size effect. Also, weakening of the yield strength is observed following a decrease in the strain rate, which is the strain rate dependence, and the strain rate sensitivity of the gold micro-pillars is found be at roughly 0.03.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"23 ","pages":"Article 100254"},"PeriodicalIF":0.0,"publicationDate":"2024-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590007224000170/pdfft?md5=2e1d5e856d9a5174587acc53b7d0f432&pid=1-s2.0-S2590007224000170-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140645225","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-04-20DOI: 10.1016/j.mne.2024.100252
Maolei Zhou, Yadi Zhen, Andreas Dietzel
Flexible sensor arrays with multilevel circuits typically require complex production cycles leading to high costs and reliability issues. For establishing flexible arrays of strain sensors in Wheatstone bridge configurations structures on different levels within flexible films have to be connected by robust μ-via technology. Usually, dry etching is used to establish via-holes and direct current (DC) electrodeposition is used to fill them with copper. However, dry etching can lead to damages in the underlying electrode or incomplete removal of polymeric material, as inhomogeneities of polymeric foil thicknesses cannot completely be eliminated. This affects the quality of the plating and the reliability of the μ-via connections. It is aggravated by the fact that DC electroplated copper is often weakened by various defects, such as small voids. This article describes a reliable and less complex fabrication process for a Wheatstone bridge sandwich structure consisting of five polymer interlayers separating four metal layers. The femtosecond-laser μ-via drilling proved to be fast, material selective and therefore tolerant to inhomogeneities of polymeric foil thicknesses. Moreover, pulsed current (PC) electrodeposition significantly improved the quality of the copper filling. No voids were found using electron microscopy. Finally, the respiration monitoring sensors produced using this method were subjected to repetitive cycles of bending and relaxation. At a frequency of five cycles per second, reproducible cycles of signal changes were obtained, indicating the usefulness for detecting respiratory cycles of premature infants.
{"title":"Wheatstone bridge sensor arrays in foil by robust μ-via technology combining femtosecond-laser drilling and pulsed electrodeposition","authors":"Maolei Zhou, Yadi Zhen, Andreas Dietzel","doi":"10.1016/j.mne.2024.100252","DOIUrl":"https://doi.org/10.1016/j.mne.2024.100252","url":null,"abstract":"<div><p>Flexible sensor arrays with multilevel circuits typically require complex production cycles leading to high costs and reliability issues. For establishing flexible arrays of strain sensors in Wheatstone bridge configurations structures on different levels within flexible films have to be connected by robust μ-via technology. Usually, dry etching is used to establish via-holes and direct current (DC) electrodeposition is used to fill them with copper. However, dry etching can lead to damages in the underlying electrode or incomplete removal of polymeric material, as inhomogeneities of polymeric foil thicknesses cannot completely be eliminated. This affects the quality of the plating and the reliability of the μ-via connections. It is aggravated by the fact that DC electroplated copper is often weakened by various defects, such as small voids. This article describes a reliable and less complex fabrication process for a Wheatstone bridge sandwich structure consisting of five polymer interlayers separating four metal layers. The femtosecond-laser μ-via drilling proved to be fast, material selective and therefore tolerant to inhomogeneities of polymeric foil thicknesses. Moreover, pulsed current (PC) electrodeposition significantly improved the quality of the copper filling. No voids were found using electron microscopy. Finally, the respiration monitoring sensors produced using this method were subjected to repetitive cycles of bending and relaxation. At a frequency of five cycles per second, reproducible cycles of signal changes were obtained, indicating the usefulness for detecting respiratory cycles of premature infants.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"23 ","pages":"Article 100252"},"PeriodicalIF":0.0,"publicationDate":"2024-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590007224000157/pdfft?md5=36f574491110d65f5414a3f6e29f78e9&pid=1-s2.0-S2590007224000157-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140638400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-04-15DOI: 10.1016/j.mne.2024.100253
Meryiem Derraz , Chouaib Ennawaoui , Hicham Mastouri , Youssef El Hmamssy , Nourredine Abouricha , Abdelkader Rjafallah , El Mehdi Laadissi , Abdelowahed Hajjaji
In the contemporary quest for sustainable energy, the potential of piezoelectric energy harvesters to convert mechanical vibrations into electrical energy has become increasingly important. This study focuses on piezoelectric composites, in particular a BaTiO3/PLA (Barium Titanate/ Polylactic Acid) system with different volume percentages of BaTiO3 ceramic particles (20%, 40% and 60%), with the aim of optimizing energy conversion efficiency. A mathematical model is introduced, encompassing material attributes, mechanical loading frequencies and electrical energy outputs. The central role of mathematical modeling in predicting harvested energy is highlighted, offering insights beyond experimental limitations. The model, which is functionally dependent on the properties of the ceramic and polymer, enables the systematic exploration of various compositions and the identification of optimal material ratios. Experimental validation of the model for different strains (0.4%, 0.8% and 1%) and compositions of BaTiO3/PLA reaffirms its reliability. Notably, the highest power harvest observed is around 4.5 μW under a strain of 1% with a BaTiO3 composition of 60%. With these specific numerical values, this approach merges materials science and energy technology, propelling the advancement of efficient piezoelectric materials for renewable energy applications.
{"title":"Mathematical modeling for predicting electrical energy harvested using piezoelectric composite materials for smart system applications","authors":"Meryiem Derraz , Chouaib Ennawaoui , Hicham Mastouri , Youssef El Hmamssy , Nourredine Abouricha , Abdelkader Rjafallah , El Mehdi Laadissi , Abdelowahed Hajjaji","doi":"10.1016/j.mne.2024.100253","DOIUrl":"https://doi.org/10.1016/j.mne.2024.100253","url":null,"abstract":"<div><p>In the contemporary quest for sustainable energy, the potential of piezoelectric energy harvesters to convert mechanical vibrations into electrical energy has become increasingly important. This study focuses on piezoelectric composites, in particular a BaTiO<sub>3</sub>/PLA (Barium Titanate/ Polylactic Acid) system with different volume percentages of BaTiO<sub>3</sub> ceramic particles (20%, 40% and 60%), with the aim of optimizing energy conversion efficiency. A mathematical model is introduced, encompassing material attributes, mechanical loading frequencies and electrical energy outputs. The central role of mathematical modeling in predicting harvested energy is highlighted, offering insights beyond experimental limitations. The model, which is functionally dependent on the properties of the ceramic and polymer, enables the systematic exploration of various compositions and the identification of optimal material ratios. Experimental validation of the model for different strains (0.4%, 0.8% and 1%) and compositions of BaTiO<sub>3</sub>/PLA reaffirms its reliability. Notably, the highest power harvest observed is around 4.5 μW under a strain of 1% with a BaTiO<sub>3</sub> composition of 60%. With these specific numerical values, this approach merges materials science and energy technology, propelling the advancement of efficient piezoelectric materials for renewable energy applications.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"23 ","pages":"Article 100253"},"PeriodicalIF":0.0,"publicationDate":"2024-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590007224000169/pdfft?md5=260daf411a495666f7d851fc90385f87&pid=1-s2.0-S2590007224000169-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140555202","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In recent years, resistive memories have emerged as a pivotal advancement in the realm of electronics, offering numerous advantages in terms of energy efficiency, scalability, and non-volatility [1]. Characterized by their unique resistive switching behavior, these memories are well-suited for a variety of applications, ranging from high-density data storage to neuromorphic computing [2]. Their potential is further enhanced by their compatibility with advanced semiconductor processes, enabling seamless integration into modern electronic circuits [3]. A particularly promising avenue for resistive memory lies in its integration at the Back-End-of-Line (BEOL) stage of semiconductor manufacturing [4]. BEOL integration involves processes that occur after the fabrication of the transistors, primarily focusing on creating interconnections that electrically link these transistors. Integrating resistive memories at this stage can lead to compact, efficient, and high-performance architectures, pivotal for in-memory computing applications where data storage and processing are co-located [5]. This paper studies three ways to integrate TiOx-based resistive memory into passive crossbar array structures, using chemical mechanical polishing (CMP) processes, focusing on identifying the optimal integration techniques.
{"title":"Damascene versus subtractive line CMP process for resistive memory crossbars BEOL integration","authors":"Raphaël Dawant , Matthieu Gaudreau , Marc-Antoine Roy , Pierre-Antoine Mouny , Matthieu Valdenaire , Pierre Gliech , Javier Arias Zapata , Malek Zegaoui , Fabien Alibart , Dominique Drouin , Serge Ecoffey","doi":"10.1016/j.mne.2024.100251","DOIUrl":"https://doi.org/10.1016/j.mne.2024.100251","url":null,"abstract":"<div><p>In recent years, resistive memories have emerged as a pivotal advancement in the realm of electronics, offering numerous advantages in terms of energy efficiency, scalability, and non-volatility [1]. Characterized by their unique resistive switching behavior, these memories are well-suited for a variety of applications, ranging from high-density data storage to neuromorphic computing [2]. Their potential is further enhanced by their compatibility with advanced semiconductor processes, enabling seamless integration into modern electronic circuits [3]. A particularly promising avenue for resistive memory lies in its integration at the Back-End-of-Line (BEOL) stage of semiconductor manufacturing [4]. BEOL integration involves processes that occur after the fabrication of the transistors, primarily focusing on creating interconnections that electrically link these transistors. Integrating resistive memories at this stage can lead to compact, efficient, and high-performance architectures, pivotal for in-memory computing applications where data storage and processing are co-located [5]. This paper studies three ways to integrate TiO<sub><em>x</em></sub>-based resistive memory into passive crossbar array structures, using chemical mechanical polishing (CMP) processes, focusing on identifying the optimal integration techniques.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"23 ","pages":"Article 100251"},"PeriodicalIF":0.0,"publicationDate":"2024-04-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590007224000145/pdfft?md5=636ca20e86a04bf9828411b55d748881&pid=1-s2.0-S2590007224000145-main.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140558500","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}