Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887589
K. Dušek, M. Placek, D. Bušek, K. Dvorakova, A. Rudajevová
During the surface mount technological process the assembled PCB is exposed to heat when molten solder alloy wets the surfaces and creates future solder joints. The PCB with all components should ideally be exposed to the same temperature profile during the soldering process. The temperatures differ throughout the PCB due to different thermal capacities of used materials and components even though the temperature profile is stable. The aim of the study was to assess the solderability of the copper material with different thermal capacity and to consider the effect of different types of fluxes. The measurement was done by wetting balance method, where the wetting force is measured as a function of time during which the test specimen is immersed into, remains immersed and then it is pulled out from the solder bath. In our experiments we used copper wire of four different diameters (0.7 mm, 1 mm, 1.5 mm), three types of solders - one lead (Sn63Pb37) and two lead free (Sn99Cu1, Sn97Cu3) solders and three types of fluxes.
在表面贴装技术过程中，当熔化的焊料合金润湿表面并形成未来的焊点时，组装的PCB暴露在热量中。理想情况下，在焊接过程中，所有组件的PCB应暴露在相同的温度曲线下。尽管温度分布是稳定的，但由于所用材料和组件的热容不同，整个PCB的温度也不同。研究的目的是评估不同热容量的铜材料的可焊性，并考虑不同类型的助焊剂的影响。测量是通过润湿平衡法完成的，其中润湿力是作为时间的函数来测量的，在此期间，试样浸入，保持浸入，然后从焊锡浴中取出。在我们的实验中，我们使用了四种不同直径的铜线(0.7 mm, 1 mm, 1.5 mm)，三种焊料-一种铅(Sn63Pb37)和两种无铅(Sn99Cu1, Sn97Cu3)焊料和三种助焊剂。
{"title":"Study of influence of thermal capacity and flux activity on the solderability","authors":"K. Dušek, M. Placek, D. Bušek, K. Dvorakova, A. Rudajevová","doi":"10.1109/ISSE.2014.6887589","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887589","url":null,"abstract":"During the surface mount technological process the assembled PCB is exposed to heat when molten solder alloy wets the surfaces and creates future solder joints. The PCB with all components should ideally be exposed to the same temperature profile during the soldering process. The temperatures differ throughout the PCB due to different thermal capacities of used materials and components even though the temperature profile is stable. The aim of the study was to assess the solderability of the copper material with different thermal capacity and to consider the effect of different types of fluxes. The measurement was done by wetting balance method, where the wetting force is measured as a function of time during which the test specimen is immersed into, remains immersed and then it is pulled out from the solder bath. In our experiments we used copper wire of four different diameters (0.7 mm, 1 mm, 1.5 mm), three types of solders - one lead (Sn63Pb37) and two lead free (Sn99Cu1, Sn97Cu3) solders and three types of fluxes.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128779667","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887604
B. Medgyes, I. Hajdu, R. Berényi, L. Gál, M. Ruszinkó, G. Harsányi
Water drop (WD) test and a contact angle measurement method were used to investigate the electrochemical migration (ECM) behavior on different microelectronic substrates with silver conductor lines in all cases. Environment friendly substrates were also investigated in this study as possible candidates of the conventional ones. ECM is kind of short failure phenomenon, which can lead to series defect in case of operating microcircuits, when moisture appears on/in a conductor-dielectric-conductor system. The results show that the novel biodegradable substrate patterns can have a significant higher ECM risk comparing to the conventional ones. The main causes can be the different wetting behavior and the different conductor line accuracy of the technological processes.
{"title":"Electrochemical migration of silver on conventional and biodegradable substrates in microelectronics","authors":"B. Medgyes, I. Hajdu, R. Berényi, L. Gál, M. Ruszinkó, G. Harsányi","doi":"10.1109/ISSE.2014.6887604","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887604","url":null,"abstract":"Water drop (WD) test and a contact angle measurement method were used to investigate the electrochemical migration (ECM) behavior on different microelectronic substrates with silver conductor lines in all cases. Environment friendly substrates were also investigated in this study as possible candidates of the conventional ones. ECM is kind of short failure phenomenon, which can lead to series defect in case of operating microcircuits, when moisture appears on/in a conductor-dielectric-conductor system. The results show that the novel biodegradable substrate patterns can have a significant higher ECM risk comparing to the conventional ones. The main causes can be the different wetting behavior and the different conductor line accuracy of the technological processes.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126502031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887577
D. Ernst, M. Melzer, D. Makarov, F. Bahr, W. Hofmann, O. Schmidt, T. Zerna
We realized ultra-thin and flexible magnetic field sensors based on the Hall Effect in 2 μm thick Bismuth films prepared on commercial flexible double-layer polyimide PCB with a total thickness of 150 μm. These sensors could be potentially applied in active magnetic bearing (AMB) systems. Therefore, here we address reliability aspects of flexible Hall sensors with emphasis on the proper choice of adhesive to mount the sensor to a stator of the AMB. The thermal shock tests in the standard automotive temperature range of -40°C to 165°C as well as the vibration test of the sensor mounted to the stator has proven the sensor's stability.
{"title":"Packaging technologies for (Ultra-)thin sensor applications in active magnetic bearings","authors":"D. Ernst, M. Melzer, D. Makarov, F. Bahr, W. Hofmann, O. Schmidt, T. Zerna","doi":"10.1109/ISSE.2014.6887577","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887577","url":null,"abstract":"We realized ultra-thin and flexible magnetic field sensors based on the Hall Effect in 2 μm thick Bismuth films prepared on commercial flexible double-layer polyimide PCB with a total thickness of 150 μm. These sensors could be potentially applied in active magnetic bearing (AMB) systems. Therefore, here we address reliability aspects of flexible Hall sensors with emphasis on the proper choice of adhesive to mount the sensor to a stator of the AMB. The thermal shock tests in the standard automotive temperature range of -40°C to 165°C as well as the vibration test of the sensor mounted to the stator has proven the sensor's stability.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126537980","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887567
Michal Štekovič, J. Šandera
Thick film voltammetric systems for electrochemical analysis in-situ are characterized by small size, low cost and variability of a used materials [1]. A conventional alumina ceramics substrate allows a creation of only planar electrode system. Low Temperature Co-fired Ceramics (LTCC) enables to create three dimensional structure, while maintaining the similar advantageous properties of alumina ceramics, such as low surface roughness, chemical indifference, good thermal stability. This article is focused on design and fabrication of electrochemical sensor in LTCC technology. The sensor consists of two parts. A base of the sensor contains heater. The second part contains a three-electrode system for electrochemical analysis. The design of the electrodes enables to measure a small quantity of an analyte.
{"title":"Fabrication of electrochemical sensor in Low Temperature Co-fired Ceramics","authors":"Michal Štekovič, J. Šandera","doi":"10.1109/ISSE.2014.6887567","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887567","url":null,"abstract":"Thick film voltammetric systems for electrochemical analysis in-situ are characterized by small size, low cost and variability of a used materials [1]. A conventional alumina ceramics substrate allows a creation of only planar electrode system. Low Temperature Co-fired Ceramics (LTCC) enables to create three dimensional structure, while maintaining the similar advantageous properties of alumina ceramics, such as low surface roughness, chemical indifference, good thermal stability. This article is focused on design and fabrication of electrochemical sensor in LTCC technology. The sensor consists of two parts. A base of the sensor contains heater. The second part contains a three-electrode system for electrochemical analysis. The design of the electrodes enables to measure a small quantity of an analyte.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116862894","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887610
B. Psota, A. Otáhal, I. Szendiuch
This paper deals with the usage of the computer simulation for the mechanical testing of the PCB's to obtain optimal configuration for mechanical reliability. The main target is to determine factors that are the most important role for this kind of analysis. For this purpose sensitive analysis were made and following critical data were defined. The critical step is to determinate correct material data as well as properties of the board including its attachment.
{"title":"Mechanical testing of PCB using computer simulations","authors":"B. Psota, A. Otáhal, I. Szendiuch","doi":"10.1109/ISSE.2014.6887610","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887610","url":null,"abstract":"This paper deals with the usage of the computer simulation for the mechanical testing of the PCB's to obtain optimal configuration for mechanical reliability. The main target is to determine factors that are the most important role for this kind of analysis. For this purpose sensitive analysis were made and following critical data were defined. The critical step is to determinate correct material data as well as properties of the board including its attachment.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114928569","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-01DOI: 10.1109/ISSE.2014.6887552
Michal Jurcisin, S. Slosarcik, S. Kardoš
Articles deals with technology of realization of LTCC-HTCC heterostructure based on different thermal conductivity of substrates as well as with fabrication process of inner channels on the interface of heterostructure. In the practical part the results of measurements on realized samples for the purpose of use in field of heat dissipation from electronic microstructures are presented.
{"title":"Heat dissipation based on LTCC-HTCC heterostructure","authors":"Michal Jurcisin, S. Slosarcik, S. Kardoš","doi":"10.1109/ISSE.2014.6887552","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887552","url":null,"abstract":"Articles deals with technology of realization of LTCC-HTCC heterostructure based on different thermal conductivity of substrates as well as with fabrication process of inner channels on the interface of heterostructure. In the practical part the results of measurements on realized samples for the purpose of use in field of heat dissipation from electronic microstructures are presented.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116821023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-01DOI: 10.1109/ISSE.2014.6887618
I. Costea, P. Tanasa, I. Barbu, I. Cojocaru, N. Dumitru
The surveillance of incidents that may occur in traffic presented in this paper show the recording of an accident on a highway or national road, therefore it uses the e-call system for reporting data. Therefore as time is of the essence the recorded data will be stored in a “cloud” system and all active officers on duty will be notified and will be able to respond. The data stored in the “cloud” will help on the matter of prevention of future accidents by creating a visual response by using a graphical rendition summarized into a chart.
{"title":"Automatic traffic monitoring system","authors":"I. Costea, P. Tanasa, I. Barbu, I. Cojocaru, N. Dumitru","doi":"10.1109/ISSE.2014.6887618","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887618","url":null,"abstract":"The surveillance of incidents that may occur in traffic presented in this paper show the recording of an accident on a highway or national road, therefore it uses the e-call system for reporting data. Therefore as time is of the essence the recorded data will be stored in a “cloud” system and all active officers on duty will be notified and will be able to respond. The data stored in the “cloud” will help on the matter of prevention of future accidents by creating a visual response by using a graphical rendition summarized into a chart.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115966587","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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