Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887568
R. Kisiel, B. Platek, M. Myśliwiec
The paper deals with the thermal properties of Ag sintered layer used as interconnect material for SiC die assembly to DBC substrate. In our investigation an IR camera were used for measurement of thermal properties of Ag sintered layers. The changes of thermal conductivity were measured in temperature range from 69°C up to 221°C. The thermal conductivity of Ag sintered layers thickness 15 μm, made from micro particles, a flake shape, was in the range 7-10 W/mK and is stable in this temperature range.
{"title":"Thermal properties of Ag sintered layer used as interconnect material in microelectronics packaging","authors":"R. Kisiel, B. Platek, M. Myśliwiec","doi":"10.1109/ISSE.2014.6887568","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887568","url":null,"abstract":"The paper deals with the thermal properties of Ag sintered layer used as interconnect material for SiC die assembly to DBC substrate. In our investigation an IR camera were used for measurement of thermal properties of Ag sintered layers. The changes of thermal conductivity were measured in temperature range from 69°C up to 221°C. The thermal conductivity of Ag sintered layers thickness 15 μm, made from micro particles, a flake shape, was in the range 7-10 W/mK and is stable in this temperature range.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134549955","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887598
D. Filip, D. Petreus
In this paper an idea of wireless energy transfer using resonant inductors is presented. Comsol Multiphysics is used in order to simulate the energy transfer depending of the geometry of the resonant coil, parasitic components and position of the coils. Using different positions of the emitter coil and more than 1 resonant coil we can analyze the best case for transferring energy to the receptor.
{"title":"Wireless energy transfer using resonant induction","authors":"D. Filip, D. Petreus","doi":"10.1109/ISSE.2014.6887598","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887598","url":null,"abstract":"In this paper an idea of wireless energy transfer using resonant inductors is presented. Comsol Multiphysics is used in order to simulate the energy transfer depending of the geometry of the resonant coil, parasitic components and position of the coils. Using different positions of the emitter coil and more than 1 resonant coil we can analyze the best case for transferring energy to the receptor.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123980110","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887649
Y. Yakimenko, A. Zazerin, A. Orlov, O. Bogdan
Film bulk acoustic resonators (FBARs) are becoming increasingly requested as an element of high-performance bandpass filters for modern microwave communication systems due to its inherent advantages at high frequencies. Active filter design using FBAR allows realizing of a wider range of characteristics. The FBAR active filter design process is related with the optimization of multiple parameters including filter architecture, biasing of active elements, impedance matching and also the topology and structure of resonators. Obtaining of filter's frequency characteristics with high selectivity and smooth phase response is only possible using high-precision models of resonators. The purpose of this work is to propose a three-dimensional finite element model (FEM) of a FBAR for further integration into the computer-aided filter design system. The simulation results of the proposed solution are compared with a frequently used modified Butterworth-Van-Dyke (mBVD) model to designate the significance of changes in the output filter characteristics arising from the application of 3D piezoelectric resonator model.
{"title":"Film bulk acoustic resonator finite element model in active filter design","authors":"Y. Yakimenko, A. Zazerin, A. Orlov, O. Bogdan","doi":"10.1109/ISSE.2014.6887649","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887649","url":null,"abstract":"Film bulk acoustic resonators (FBARs) are becoming increasingly requested as an element of high-performance bandpass filters for modern microwave communication systems due to its inherent advantages at high frequencies. Active filter design using FBAR allows realizing of a wider range of characteristics. The FBAR active filter design process is related with the optimization of multiple parameters including filter architecture, biasing of active elements, impedance matching and also the topology and structure of resonators. Obtaining of filter's frequency characteristics with high selectivity and smooth phase response is only possible using high-precision models of resonators. The purpose of this work is to propose a three-dimensional finite element model (FEM) of a FBAR for further integration into the computer-aided filter design system. The simulation results of the proposed solution are compared with a frequently used modified Butterworth-Van-Dyke (mBVD) model to designate the significance of changes in the output filter characteristics arising from the application of 3D piezoelectric resonator model.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121277936","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887619
Aurelian Botau, D. Bonfert, C. Negrea
Due to the continuous trend of miniaturization and high density interconnect PCBs, chip resistors are getting smaller and smaller. The resistive layer dimensions have been reduced and its small thickness is dependant by the technological manufacturing process, therefore transient electrical events like Electrostatic Discharge Pulses (ESD) can change the initial properties of the resistive layer, which leads to a modification of the resistance value or damaging the layer, causing chip resistor failure. This paper presents an analysis for the thermal and electrical behavior of thick and thin film chip resistors, by applying DC- current and rectangular pulses of short width and high voltage and current amplitudes. These high power and short duration pulses give in situ information about the adiabatic behavior of the analyzed layer.
{"title":"Electrical and thermal behavior for DC and pulsed stress on chip resistors","authors":"Aurelian Botau, D. Bonfert, C. Negrea","doi":"10.1109/ISSE.2014.6887619","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887619","url":null,"abstract":"Due to the continuous trend of miniaturization and high density interconnect PCBs, chip resistors are getting smaller and smaller. The resistive layer dimensions have been reduced and its small thickness is dependant by the technological manufacturing process, therefore transient electrical events like Electrostatic Discharge Pulses (ESD) can change the initial properties of the resistive layer, which leads to a modification of the resistance value or damaging the layer, causing chip resistor failure. This paper presents an analysis for the thermal and electrical behavior of thick and thin film chip resistors, by applying DC- current and rectangular pulses of short width and high voltage and current amplitudes. These high power and short duration pulses give in situ information about the adiabatic behavior of the analyzed layer.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126111125","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887636
E. Iontchev, Radostin Kenov, R. Miletiev, I. Simeonov, Y. Isaev
The paper discusses the hardware implementation of the quad sensor structure and the possibility to improve the noise characteristics of the structure when simultaneously sampling is accomplished. The histograms of the linear and angular accelerations are given to proof the theory of the structure, published in our previous paper. This structure may be manufactured as a single MEMS inertial sensor with better noise parameters.
{"title":"Hardware implementation of quad microelectromechanical sensor structure for inertial systems","authors":"E. Iontchev, Radostin Kenov, R. Miletiev, I. Simeonov, Y. Isaev","doi":"10.1109/ISSE.2014.6887636","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887636","url":null,"abstract":"The paper discusses the hardware implementation of the quad sensor structure and the possibility to improve the noise characteristics of the structure when simultaneously sampling is accomplished. The histograms of the linear and angular accelerations are given to proof the theory of the structure, published in our previous paper. This structure may be manufactured as a single MEMS inertial sensor with better noise parameters.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127945489","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887643
R. Wuchrer, G. Lautenschläger, R. Metasch, M. Röllig, Thomas Fleischer, T. Härtling
We present a compact and robust interrogation device for the read out of fiber Bragg grating sensors. The core system consists of a dielectric thin film filter with a lateral spectral transmission gradient and a photo diode array. This allows a high resolution detection of the Bragg wavelength shift by means of a centroid measurement. We first show the functionality of the system with a temperature measurement on a fiber Bragg grating. We achieved a temperature resolution of 0.2 K and an accuracy of ± 2 K, which correspond to a spectral resolution of 1 pm and an accuracy of ± 11 pm. On the basis of these results, we developed a specially adapted high sensitivity electronics and a robust packaging for the applications on pipeline structures.
{"title":"Filter-based interrogation of fiber Bragg grating sensors","authors":"R. Wuchrer, G. Lautenschläger, R. Metasch, M. Röllig, Thomas Fleischer, T. Härtling","doi":"10.1109/ISSE.2014.6887643","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887643","url":null,"abstract":"We present a compact and robust interrogation device for the read out of fiber Bragg grating sensors. The core system consists of a dielectric thin film filter with a lateral spectral transmission gradient and a photo diode array. This allows a high resolution detection of the Bragg wavelength shift by means of a centroid measurement. We first show the functionality of the system with a temperature measurement on a fiber Bragg grating. We achieved a temperature resolution of 0.2 K and an accuracy of ± 2 K, which correspond to a spectral resolution of 1 pm and an accuracy of ± 11 pm. On the basis of these results, we developed a specially adapted high sensitivity electronics and a robust packaging for the applications on pipeline structures.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124567562","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887608
E. Gieva, R. Rusev, G. Angelov, R. Radonov, M. Hristov
A microelectronic circuit of block-elements functionally analogous to two hydrogen bonding networks is investigated in the present paper. The hydrogen bonding networks are extracted from Michaelis complex of β-lactamase protein. They are described by electrical circuits. The hydrogen bonds of the networks are presented by three- or four-terminal block-elements in the juxtaposed electrical circuits. The block-elements are coded in Matlab with polynomials and static and dynamic analyses are performed. The circuits' behavior appeared to be similar to current source or amplifier, and signal modulator.
{"title":"Microelectronic circuits analogous to hydrogen bonding networks in Michaelis complex of beta-lactamase protein","authors":"E. Gieva, R. Rusev, G. Angelov, R. Radonov, M. Hristov","doi":"10.1109/ISSE.2014.6887608","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887608","url":null,"abstract":"A microelectronic circuit of block-elements functionally analogous to two hydrogen bonding networks is investigated in the present paper. The hydrogen bonding networks are extracted from Michaelis complex of β-lactamase protein. They are described by electrical circuits. The hydrogen bonds of the networks are presented by three- or four-terminal block-elements in the juxtaposed electrical circuits. The block-elements are coded in Matlab with polynomials and static and dynamic analyses are performed. The circuits' behavior appeared to be similar to current source or amplifier, and signal modulator.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129079528","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887573
P. Mach, D. Bušek
The goal of this work was to find if there is some difference in thermomechanical properties of one- and two-component electrically conductive adhesives. All adhesive used in this study were of an epoxy type filled with silver flakes and all had isotropic electrical conductivity. The storage modulus, loss modulus and tan delta were studied using thermodynamic mechanical analysis carried out by a penetration probe. The samples were formed on glass substrates, the thermodynamic analysis was carried out by the force 0.3 ±0.2 N at 1Hz, the maximum temperature was 140 °C. It was found that there are no significant differences between the thermodynamic parameters of adhesives tested. It was also found that all adhesives were not optimally cured though curing was carried out in accordance with recommendation of a producer of adhesives.
{"title":"Study of thermomechanical properties of one- and two-component conductive adhesives","authors":"P. Mach, D. Bušek","doi":"10.1109/ISSE.2014.6887573","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887573","url":null,"abstract":"The goal of this work was to find if there is some difference in thermomechanical properties of one- and two-component electrically conductive adhesives. All adhesive used in this study were of an epoxy type filled with silver flakes and all had isotropic electrical conductivity. The storage modulus, loss modulus and tan delta were studied using thermodynamic mechanical analysis carried out by a penetration probe. The samples were formed on glass substrates, the thermodynamic analysis was carried out by the force 0.3 ±0.2 N at 1Hz, the maximum temperature was 140 °C. It was found that there are no significant differences between the thermodynamic parameters of adhesives tested. It was also found that all adhesives were not optimally cured though curing was carried out in accordance with recommendation of a producer of adhesives.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115971008","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887582
M. Hirman, K. Rendl, F. Steiner, V. Wirth
The paper describes the effect of the solder profile on the formation of an intermetallic layer in the solder composition of 57.6% Bi-42% Sn-0.4% Ag. Soldered joints were made by soldering of chip resistors of 1206 size with different soldering reflow profiles. Solder pads on the PCB are made of copper therefore they mainly make Cu6Sn5 IMC. This layer has an effect on the mechanical strength of the soldered joint. Samples are measured by using the shear strength test. The thickness of the IMC layer is measured by Confocal Laser Scanning Microscope. IMC layer thickness grows with greater delivered energy into the joint during soldering.
{"title":"Influence of reflow soldering profiles on creation of IMC at the interface of SnBi/Cu","authors":"M. Hirman, K. Rendl, F. Steiner, V. Wirth","doi":"10.1109/ISSE.2014.6887582","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887582","url":null,"abstract":"The paper describes the effect of the solder profile on the formation of an intermetallic layer in the solder composition of 57.6% Bi-42% Sn-0.4% Ag. Soldered joints were made by soldering of chip resistors of 1206 size with different soldering reflow profiles. Solder pads on the PCB are made of copper therefore they mainly make Cu6Sn5 IMC. This layer has an effect on the mechanical strength of the soldered joint. Samples are measured by using the shear strength test. The thickness of the IMC layer is measured by Confocal Laser Scanning Microscope. IMC layer thickness grows with greater delivered energy into the joint during soldering.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116719567","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887629
E. Coca, V. Cehan
Knowledge of the materials' properties of reflection of electromagnetic waves (EMW) is necessary for understanding and modeling propagation, especially inside buildings and in urban areas. This paper presents the results of experimental determinations of these properties for several materials (Aluminium, Melamine Faced Fiberboard, and Gypsum Drywall slabs) in a semi-anechoic chamber, at several frequencies, in the band from 2.00 to 3.00 GHz. The results show that aluminum is a good reflector, which was expected, but that melamine hardboard reflects EMW nearly as well as aluminum. The material used for drywall is less reflective at almost all frequencies. The results also show a fairly significant dependence of reflection properties on frequency, as reflected power decreases with frequency.
{"title":"Laboratory study of electromagnetic waves reflectivity of certain materials","authors":"E. Coca, V. Cehan","doi":"10.1109/ISSE.2014.6887629","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887629","url":null,"abstract":"Knowledge of the materials' properties of reflection of electromagnetic waves (EMW) is necessary for understanding and modeling propagation, especially inside buildings and in urban areas. This paper presents the results of experimental determinations of these properties for several materials (Aluminium, Melamine Faced Fiberboard, and Gypsum Drywall slabs) in a semi-anechoic chamber, at several frequencies, in the band from 2.00 to 3.00 GHz. The results show that aluminum is a good reflector, which was expected, but that melamine hardboard reflects EMW nearly as well as aluminum. The material used for drywall is less reflective at almost all frequencies. The results also show a fairly significant dependence of reflection properties on frequency, as reflected power decreases with frequency.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126703757","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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