Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887640
N. Blaz, A. Maric, S. Toškov, G. Miskovic, G. Radosavljevic, L. Zivanov
In this paper the possibility of detection presents of various liquids in distilled water by employing the interdigital capacitor was investigated. Quantity detection principle of known liquid in distilled water is based on immerging the interdigital capacitor in distilled water and observing changes of its capacity with quantity increment of known liquid. Experimental measurement were done with interdigital capacitor fabricated in LTCC technology immerged in distillated water with various quantity of known liquids. Good results were achieved. It was concluded that it is possible to detect changes of 0.1 ml of known liquid in 100 ml of distilled water.
{"title":"Capacitive sensor for quantity detection of known liquid present in distilled water","authors":"N. Blaz, A. Maric, S. Toškov, G. Miskovic, G. Radosavljevic, L. Zivanov","doi":"10.1109/ISSE.2014.6887640","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887640","url":null,"abstract":"In this paper the possibility of detection presents of various liquids in distilled water by employing the interdigital capacitor was investigated. Quantity detection principle of known liquid in distilled water is based on immerging the interdigital capacitor in distilled water and observing changes of its capacity with quantity increment of known liquid. Experimental measurement were done with interdigital capacitor fabricated in LTCC technology immerged in distillated water with various quantity of known liquids. Good results were achieved. It was concluded that it is possible to detect changes of 0.1 ml of known liquid in 100 ml of distilled water.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130466832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887638
O. Bogdan, A. Orlov, G. Pashkevich, V. Ulianova, Y. Yakimenko, A. Zazerin
Various modifications of the ZnO nanostructures based sensitive element for the two-port surface acoustic wave sensor (SAW) design were considered. The influence of morphometric parameters (diameter and length) of ZnO nanostructures on output SAW sensor characteristics was investigated by finite element simulation method. Obtained versatile flexible multiparameter model allowed the evaluation of performance parameters. The optimal parameters for nanostructure-enhanced SAW sensor design could be estimated by the proposed approach.
{"title":"Optimal parameters determination for nanostructure-enhanced surface acoustic waves sensor","authors":"O. Bogdan, A. Orlov, G. Pashkevich, V. Ulianova, Y. Yakimenko, A. Zazerin","doi":"10.1109/ISSE.2014.6887638","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887638","url":null,"abstract":"Various modifications of the ZnO nanostructures based sensitive element for the two-port surface acoustic wave sensor (SAW) design were considered. The influence of morphometric parameters (diameter and length) of ZnO nanostructures on output SAW sensor characteristics was investigated by finite element simulation method. Obtained versatile flexible multiparameter model allowed the evaluation of performance parameters. The optimal parameters for nanostructure-enhanced SAW sensor design could be estimated by the proposed approach.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123322235","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887624
G. Wróblewski, M. Słoma, D. Janczak, A. Mlozniak, M. Jakubowska
Packages and labels are necessary for every product on the market and are present among us for many years. Packages have to include every year more and more information, gain new functionalities and characterize with attractive design what can be achieved thankfully to printed electronics. Printed electronic structures made on labels (called smart labels) that were afterwards stick on packages can be found in literature, however there is still a lack in technologies and materials allowing direct printing of electronics on packages during packaging operations. This work presents a low cost method of producing electroluminescent displays directly on products packages without vacuum, cleanroom or other rigorous production conditions. Elaborated spray coating technology is suitable for mass production and can be easily implemented in production lines. Set of materials based on diverse functional fillers in polymer resins was developed to obtain desired coating functionalities. Conductive layers were done using carbon nano-tubes (CNT), graphene nano-platelets (GNP) and nano-silver (nAg). For dielectric layers we used barium titanate (BaTiO3) nano-powders and as luminophores copper doped zinc sulfide (ZnS:Cu). Presented structures were done on various types of packages - aluminum cans, cardboard boxes and polypropylene bottles.
{"title":"Electroluminescent structures with nanomaterials for direct printing of interactive packages and labels","authors":"G. Wróblewski, M. Słoma, D. Janczak, A. Mlozniak, M. Jakubowska","doi":"10.1109/ISSE.2014.6887624","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887624","url":null,"abstract":"Packages and labels are necessary for every product on the market and are present among us for many years. Packages have to include every year more and more information, gain new functionalities and characterize with attractive design what can be achieved thankfully to printed electronics. Printed electronic structures made on labels (called smart labels) that were afterwards stick on packages can be found in literature, however there is still a lack in technologies and materials allowing direct printing of electronics on packages during packaging operations. This work presents a low cost method of producing electroluminescent displays directly on products packages without vacuum, cleanroom or other rigorous production conditions. Elaborated spray coating technology is suitable for mass production and can be easily implemented in production lines. Set of materials based on diverse functional fillers in polymer resins was developed to obtain desired coating functionalities. Conductive layers were done using carbon nano-tubes (CNT), graphene nano-platelets (GNP) and nano-silver (nAg). For dielectric layers we used barium titanate (BaTiO3) nano-powders and as luminophores copper doped zinc sulfide (ZnS:Cu). Presented structures were done on various types of packages - aluminum cans, cardboard boxes and polypropylene bottles.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115402337","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887617
I. Costea, C. Dumitrescu, N. Dumitru, B. Soare
The present paper presents the technological solution dedicated to the implementation of the K-complex detection algorithm, from the EEG medical signals, with the help of the TMS320C6211B signal processor, produced by Texas Instruments. This application is based on the host-target system architecture, where the target is the DSK (Digital Starter Kit), which performs realtime processing and is transmitted from the software host on the processing computer. The host software is written in G, Labview programming language, and has the objective of achieving an automated detector for the K complex, derived from the sleep electroencephalogram. The K complex detection automatization must establish a verification criterion and a prediction criterion.
{"title":"Biomedical signals analysis techniques using the signal processor TMS320C6211B","authors":"I. Costea, C. Dumitrescu, N. Dumitru, B. Soare","doi":"10.1109/ISSE.2014.6887617","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887617","url":null,"abstract":"The present paper presents the technological solution dedicated to the implementation of the K-complex detection algorithm, from the EEG medical signals, with the help of the TMS320C6211B signal processor, produced by Texas Instruments. This application is based on the host-target system architecture, where the target is the DSK (Digital Starter Kit), which performs realtime processing and is transmitted from the software host on the processing computer. The host software is written in G, Labview programming language, and has the objective of achieving an automated detector for the K complex, derived from the sleep electroencephalogram. The K complex detection automatization must establish a verification criterion and a prediction criterion.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126529079","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887637
M. Kisić, N. Blaz, A. Maric, G. Radosavljevic, L. Zivanov, M. Damnjanović
The objective of this research is to study various coil designs and to propose the pattern that can improve the performance of the pressure sensor. Wireless pressure sensor, based on polyimide foil, is designed, fabricated and tested. The proposed sensor is realised in heterogonous integration process and consists of PCB (Printed Circuit Board) coil, spacer and polyimide membrane with attached LTCC (Low Temperature Co-fired Ceramic) ferrite. Pressure variations are wirelessly detected in system antenna-sensor resonant frequency, by a phase-dip technique. The distance between the coil and the ferrite varies with an applied external pressure and consequently membrane deflection, so the inductance of the coil increases and the resonant frequency of the system decreases. The effect of coil designs with different number of turns is examined and sensor performances are compared. Experimental measurements are determined and confirmed by analytical calculations and simulated results.
{"title":"Influence of coil design on sensing performance of pressure sensor with polyimide membrane","authors":"M. Kisić, N. Blaz, A. Maric, G. Radosavljevic, L. Zivanov, M. Damnjanović","doi":"10.1109/ISSE.2014.6887637","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887637","url":null,"abstract":"The objective of this research is to study various coil designs and to propose the pattern that can improve the performance of the pressure sensor. Wireless pressure sensor, based on polyimide foil, is designed, fabricated and tested. The proposed sensor is realised in heterogonous integration process and consists of PCB (Printed Circuit Board) coil, spacer and polyimide membrane with attached LTCC (Low Temperature Co-fired Ceramic) ferrite. Pressure variations are wirelessly detected in system antenna-sensor resonant frequency, by a phase-dip technique. The distance between the coil and the ferrite varies with an applied external pressure and consequently membrane deflection, so the inductance of the coil increases and the resonant frequency of the system decreases. The effect of coil designs with different number of turns is examined and sensor performances are compared. Experimental measurements are determined and confirmed by analytical calculations and simulated results.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122642512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887555
S. Toškov, Nenad Krcic, G. Radosavljevic
Integrated cavities, screen-printed passive components and channels are common parts of 3D micro-fluidic devices fabricated in low temperature co-fired ceramics (LTCC) technology. However, realization of defect-free structures without cracks, sagging of cavities or channels is challenging and strongly influenced by quality of lamination and firing processing conditions. Lamination technique based on incorporation of polymethylmethycrylate (PMMA) sacrificial volume material (SVM) for implementation of large cavities inside LTCC module is presented in this paper. Optimized firing conditions for proper burnout of SVM have been described. Influence of lamination and firing processing conditions are demonstrated in fabrication of 3-dimensional micro-fluidic device. Tested structure contains screen printed interdigital capacitor (IDC) positioned inside large cavity with dimensions 0.23 +/- 0.01 × 5.6 × 11.2 [mm3] for thickness, width and length, respectively. Obtained results show advantages of PMMA incorporation in fabrication of defect-free structures in LTCC technology.
{"title":"LTCC lamination process using PMMA fugitive material","authors":"S. Toškov, Nenad Krcic, G. Radosavljevic","doi":"10.1109/ISSE.2014.6887555","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887555","url":null,"abstract":"Integrated cavities, screen-printed passive components and channels are common parts of 3D micro-fluidic devices fabricated in low temperature co-fired ceramics (LTCC) technology. However, realization of defect-free structures without cracks, sagging of cavities or channels is challenging and strongly influenced by quality of lamination and firing processing conditions. Lamination technique based on incorporation of polymethylmethycrylate (PMMA) sacrificial volume material (SVM) for implementation of large cavities inside LTCC module is presented in this paper. Optimized firing conditions for proper burnout of SVM have been described. Influence of lamination and firing processing conditions are demonstrated in fabrication of 3-dimensional micro-fluidic device. Tested structure contains screen printed interdigital capacitor (IDC) positioned inside large cavity with dimensions 0.23 +/- 0.01 × 5.6 × 11.2 [mm3] for thickness, width and length, respectively. Obtained results show advantages of PMMA incorporation in fabrication of defect-free structures in LTCC technology.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130305263","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887606
A. Andonova, I. Zhivkov, Y. Georgiev, G. Angelov, J. Honová, M. Weiter
This paper presents the results from research on the application of Infrared Thermography (IRT) for sub-surface defect evaluation in organic solar cells (OSC). The research was carried out with the three types of test samples: OSC without defects, with unknown and with known types of defects and evaluated localized defects. Passive as well as active thermography for the sub-surface defect detection of selected test OSC modules is applied. An identification of sub-surface defects, connected with the inhomogeneity of the active film thickness, dislocation of the masks during the sample preparation, leakage currents between neighbor electrodes, and structural defects was carried out. The results show a successful application of IRT for fault detection and localization during fabrication process and during the diagnostic control of such modules.
{"title":"Thermographic control of organic solar cells","authors":"A. Andonova, I. Zhivkov, Y. Georgiev, G. Angelov, J. Honová, M. Weiter","doi":"10.1109/ISSE.2014.6887606","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887606","url":null,"abstract":"This paper presents the results from research on the application of Infrared Thermography (IRT) for sub-surface defect evaluation in organic solar cells (OSC). The research was carried out with the three types of test samples: OSC without defects, with unknown and with known types of defects and evaluated localized defects. Passive as well as active thermography for the sub-surface defect detection of selected test OSC modules is applied. An identification of sub-surface defects, connected with the inhomogeneity of the active film thickness, dislocation of the masks during the sample preparation, leakage currents between neighbor electrodes, and structural defects was carried out. The results show a successful application of IRT for fault detection and localization during fabrication process and during the diagnostic control of such modules.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124545773","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887612
J. Šimota, J. Tupa
This paper deals with the application of SPC methodology to service processes. SPC methodology is an important tool in industry because it helps find variability in processes. Any variability is undesirable because it causes deviation from the target value. Service processes are different in the specific ways and SPC methodology is suitable tool for measuring, controlling and eliminating of variation. It is demonstrated and verified on the case study.
{"title":"Implementation of SPC methodology to service processes","authors":"J. Šimota, J. Tupa","doi":"10.1109/ISSE.2014.6887612","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887612","url":null,"abstract":"This paper deals with the application of SPC methodology to service processes. SPC methodology is an important tool in industry because it helps find variability in processes. Any variability is undesirable because it causes deviation from the target value. Service processes are different in the specific ways and SPC methodology is suitable tool for measuring, controlling and eliminating of variation. It is demonstrated and verified on the case study.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121981608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887603
M. Branzei, B. Mihailescu, I. Pencea
The new RoHS 2 Directive [1] touch up the research work for replacement the lead soldering materials with lead-free types, without compromising functionality and reliability. At least two of the three solder joints functionalities, mechanical and thermal one, are determined by the microstructure morphology and stability. As consequence, any material must accomplish dedicated procedures for qualification to be used for these domains of applications characterized by a large range of working temperatures and high mechanical stress level. According to "Homologous temperature" (TH) concept, the working temperature for a solder alloy could be expressed as a fraction of its melting temperature measured in Kelvin degrees and must not be over 0.5 value [2]. Shear tests performed at different temperatures are correlated with the microstructure morphology and stability investigates by X-ray Diffraction Analysis.
{"title":"Lead/lead-free solder alloys shear tests correlations with structure at different temperatures","authors":"M. Branzei, B. Mihailescu, I. Pencea","doi":"10.1109/ISSE.2014.6887603","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887603","url":null,"abstract":"The new RoHS 2 Directive [1] touch up the research work for replacement the lead soldering materials with lead-free types, without compromising functionality and reliability. At least two of the three solder joints functionalities, mechanical and thermal one, are determined by the microstructure morphology and stability. As consequence, any material must accomplish dedicated procedures for qualification to be used for these domains of applications characterized by a large range of working temperatures and high mechanical stress level. According to \"Homologous temperature\" (TH) concept, the working temperature for a solder alloy could be expressed as a fraction of its melting temperature measured in Kelvin degrees and must not be over 0.5 value [2]. Shear tests performed at different temperatures are correlated with the microstructure morphology and stability investigates by X-ray Diffraction Analysis.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126725835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887631
D. Vuza, M. Vlădescu
During the development of an electronic module using a complex programmable logic device (CPLD) and a micro-controller, we noticed an abnormal behavior of the CPLD manifested as an unexpected reset of a counter. We identified a synchronous perturbation and an asynchronous perturbation as being responsible for the disturbance, both of them being related to the change in the state of a large number of data lines. We devised and tested methods for eliminating both perturbations, the application of which helped in achieving the intended behavior of the device.
{"title":"Solving an EMC/EMI problem occurred inside a complex programmable logic device","authors":"D. Vuza, M. Vlădescu","doi":"10.1109/ISSE.2014.6887631","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887631","url":null,"abstract":"During the development of an electronic module using a complex programmable logic device (CPLD) and a micro-controller, we noticed an abnormal behavior of the CPLD manifested as an unexpected reset of a counter. We identified a synchronous perturbation and an asynchronous perturbation as being responsible for the disturbance, both of them being related to the change in the state of a large number of data lines. We devised and tested methods for eliminating both perturbations, the application of which helped in achieving the intended behavior of the device.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127188391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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