Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887574
O. Krammer
In this paper, a new method for calculating the amount of solder paste required for Pin-in-paste technology is presented and compared to a widely used explicit expression from literature. This work is the continuation of the paper presented in SIITME2013. The optimal shape of the solder profile for Through-hole components is calculated with Surface Evolver; and the necessary volume is determined based on the profile calculation. The boundary conditions of the Surface Evolver calculations are the following: the solder wets until the edge of the solder pads and the contact angle is equal to the wetting angle. In the experiment, the volume is determined for different through-hole diameters and for various widths of solder pads (annular rings). Contrary to the previous paper (in which only circular lead was investigated), the calculations were extended including components with rectangular cross-sectional leads. The determined volumes were then compared to volumes calculated based on the literature expression; and correction factors were defined for both circular and rectangular leads.
{"title":"Correcting factor of solder paste volume calculation for Pin-in-paste technology","authors":"O. Krammer","doi":"10.1109/ISSE.2014.6887574","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887574","url":null,"abstract":"In this paper, a new method for calculating the amount of solder paste required for Pin-in-paste technology is presented and compared to a widely used explicit expression from literature. This work is the continuation of the paper presented in SIITME2013. The optimal shape of the solder profile for Through-hole components is calculated with Surface Evolver; and the necessary volume is determined based on the profile calculation. The boundary conditions of the Surface Evolver calculations are the following: the solder wets until the edge of the solder pads and the contact angle is equal to the wetting angle. In the experiment, the volume is determined for different through-hole diameters and for various widths of solder pads (annular rings). Contrary to the previous paper (in which only circular lead was investigated), the calculations were extended including components with rectangular cross-sectional leads. The determined volumes were then compared to volumes calculated based on the literature expression; and correction factors were defined for both circular and rectangular leads.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125955260","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887625
A. Knápek, F. Mika, J. Prásek, Petra Majzlíková
Characterization method for active layers for microelectrodes of electrochemical and gas sensors using scanning electron microscopy (SEM) is presented. In order to achieve maximum sensitivity and selectivity of the sensor, it is necessary to obtain precise knowledge of electrode's surface. Characterization was made using FEI Magellan SEM equipped with TLD secondary electron (SE) and CBS back-scattered electron (BSE) detectors, Energy-dispersive X-ray spectroscopy (EDS) and beam deceleration system. SEM at lower energies offers several advantages, among them the most important are: increase of material contrast, high ratio SE, BSE signal and noise, smaller interaction volume and elimination of charging effects.
{"title":"SEM characterization of carbon nanotubes based active layers of chemical sensors","authors":"A. Knápek, F. Mika, J. Prásek, Petra Majzlíková","doi":"10.1109/ISSE.2014.6887625","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887625","url":null,"abstract":"Characterization method for active layers for microelectrodes of electrochemical and gas sensors using scanning electron microscopy (SEM) is presented. In order to achieve maximum sensitivity and selectivity of the sensor, it is necessary to obtain precise knowledge of electrode's surface. Characterization was made using FEI Magellan SEM equipped with TLD secondary electron (SE) and CBS back-scattered electron (BSE) detectors, Energy-dispersive X-ray spectroscopy (EDS) and beam deceleration system. SEM at lower energies offers several advantages, among them the most important are: increase of material contrast, high ratio SE, BSE signal and noise, smaller interaction volume and elimination of charging effects.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131264191","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887596
A. Géczy, M. Fejős, L. Tersztyanszky, A. Kemler, A. Szabó
The paper presents an emerging problem in the field of electronics manufacturing, where the miniature SMD components and the large size of the panelized Printed Circuit Boards (PCBs) cause soldering failures indirectly during reflow soldering. During our investigation, the issue of PCB shrinkage was inspected, which causes linear offset problems along the lateral dimensions of the board during the stencil printing of the second PCB side. The offset in the print causes bridging failures and tombstones on specific fine-pitch SMD components (such as 0402 resistor ladders and 0603 chip-size resistors). To investigate the behavior of the PCB material, Differential Scanning Calorimetry (DSC) and Dynamic Mechanical Analysis (DMA) measurements were applied on the materials. With the DSC method it is possible to approximate the glass transition temperature parameter of the PCB material itself. A new PCB edge length measurement method was also developed to achieve deeper understanding on the shrinkage effect. The method is evaluated with lab-class measurement devices. With the edge length measurements, it is possible to approximate an overall shrinkage value for the given PCB, enabling efficient compensation and failure reduction.
{"title":"Investigating Printed Circuit Board shrinkage during reflow soldering","authors":"A. Géczy, M. Fejős, L. Tersztyanszky, A. Kemler, A. Szabó","doi":"10.1109/ISSE.2014.6887596","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887596","url":null,"abstract":"The paper presents an emerging problem in the field of electronics manufacturing, where the miniature SMD components and the large size of the panelized Printed Circuit Boards (PCBs) cause soldering failures indirectly during reflow soldering. During our investigation, the issue of PCB shrinkage was inspected, which causes linear offset problems along the lateral dimensions of the board during the stencil printing of the second PCB side. The offset in the print causes bridging failures and tombstones on specific fine-pitch SMD components (such as 0402 resistor ladders and 0603 chip-size resistors). To investigate the behavior of the PCB material, Differential Scanning Calorimetry (DSC) and Dynamic Mechanical Analysis (DMA) measurements were applied on the materials. With the DSC method it is possible to approximate the glass transition temperature parameter of the PCB material itself. A new PCB edge length measurement method was also developed to achieve deeper understanding on the shrinkage effect. The method is evaluated with lab-class measurement devices. With the edge length measurements, it is possible to approximate an overall shrinkage value for the given PCB, enabling efficient compensation and failure reduction.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116379095","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887559
S. Stoyanov, A. Dabek, C. Bailey
Ball Grid Array (BGA) packages are increasingly adopted in high reliability electronics equipment. The main reliability concern is that lead-free (Pb-free) packaged BGAs bring the risks of failures due to tin whiskers growth phenomena associated with tin or tin-rich alloys. Replacing Pb-free solder balls of BGA components with tin-lead solder alloy materials is the most effective risk mitigation strategy. Post-manufacturing processes that can be used to remove (deballing) and then deposit back (reballing) BGA solder balls have been recently developed and increasingly put in practice. This paper reports on the assessment of the thermal responses of BGAs subjected to hot nitrogen (N2) deballing and details the respective conclusions about the risk of thermally induced damage.
{"title":"Hot nitrogen deballing of Ball Grid Arrays","authors":"S. Stoyanov, A. Dabek, C. Bailey","doi":"10.1109/ISSE.2014.6887559","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887559","url":null,"abstract":"Ball Grid Array (BGA) packages are increasingly adopted in high reliability electronics equipment. The main reliability concern is that lead-free (Pb-free) packaged BGAs bring the risks of failures due to tin whiskers growth phenomena associated with tin or tin-rich alloys. Replacing Pb-free solder balls of BGA components with tin-lead solder alloy materials is the most effective risk mitigation strategy. Post-manufacturing processes that can be used to remove (deballing) and then deposit back (reballing) BGA solder balls have been recently developed and increasingly put in practice. This paper reports on the assessment of the thermal responses of BGAs subjected to hot nitrogen (N2) deballing and details the respective conclusions about the risk of thermally induced damage.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127068216","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887580
P. Gierth, Michael Zieschank, L. Rebenklau
The long time stability of solder joints on Ag-based thick film pastes has been studied. Therefore shear strength, electrical resistance, temperature coefficient of resistance (TCR), optical inspections of solder surface and cross section analyses have been performed. Samples of 1206 and 0805 SMD-components mounted with SnAgCu, SnPbAg, SnBi and SnCu on Ag/Pd or Ag/Pt conductors were prepared. To detect the influence of intermetallic phase growth, high temperature storage according JESD22-A103C at 150°C (125°C for SnBi-solder) up to 500 h has been applied. Shear fatigue life of the interconnection joints was studied with temperature cycling according JESD22-A104D between +125°C/-40°C for up to 1000 cycles. Differences in shear fatigue and electrical characteristics will be evaluated and discussed.
{"title":"Evaluation of long time stability of solder joints on Ag thick film conductors on Al2O3","authors":"P. Gierth, Michael Zieschank, L. Rebenklau","doi":"10.1109/ISSE.2014.6887580","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887580","url":null,"abstract":"The long time stability of solder joints on Ag-based thick film pastes has been studied. Therefore shear strength, electrical resistance, temperature coefficient of resistance (TCR), optical inspections of solder surface and cross section analyses have been performed. Samples of 1206 and 0805 SMD-components mounted with SnAgCu, SnPbAg, SnBi and SnCu on Ag/Pd or Ag/Pt conductors were prepared. To detect the influence of intermetallic phase growth, high temperature storage according JESD22-A103C at 150°C (125°C for SnBi-solder) up to 500 h has been applied. Shear fatigue life of the interconnection joints was studied with temperature cycling according JESD22-A104D between +125°C/-40°C for up to 1000 cycles. Differences in shear fatigue and electrical characteristics will be evaluated and discussed.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114066600","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887648
Jan Macioszczyk, P. Słobodzian, L. Golonka
The paper describes the study of possibility to improve the bandwidth of the LTCC (Low Temperature Cofired Ceramics) antennas. It is well-known that bandwidth broadening of microstrip antennas can be achieved by substrate structurizing. In our paper we describe the influence of an air cavity beneath a radiating patch or strip on the LTCC antenna performance. Results of computer simulations using HFSS™ software are shown. Then, manufacturing process is described. Results of measurement of network parameters and radiaton patterns of the antenna model are presented. Finally, a comparison between measured parameters and computer simulations is discussed.
{"title":"Improvement of the frequency bandwidth of LTCC meander antenna","authors":"Jan Macioszczyk, P. Słobodzian, L. Golonka","doi":"10.1109/ISSE.2014.6887648","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887648","url":null,"abstract":"The paper describes the study of possibility to improve the bandwidth of the LTCC (Low Temperature Cofired Ceramics) antennas. It is well-known that bandwidth broadening of microstrip antennas can be achieved by substrate structurizing. In our paper we describe the influence of an air cavity beneath a radiating patch or strip on the LTCC antenna performance. Results of computer simulations using HFSS™ software are shown. Then, manufacturing process is described. Results of measurement of network parameters and radiaton patterns of the antenna model are presented. Finally, a comparison between measured parameters and computer simulations is discussed.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123819912","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887634
R. Soukup, A. Hamácek, Lukas Mracek, J. Řeboun
This paper presents a research focused on embroidered temperature and humidity sensor elements for smart textile applications in health and medical care. Smart textile products face desirable textile properties for health care use include durability, “launderability” (washing resistance), flexibility and non-toxicity and the comfort aspect of clothing is also very important. For these reasons, the presented research was concentrated on the development of sensor elements based on specially prepared conductive yarns which are integrated into textile fabric with the familiar textile technique - embroidery and connected to control unit through snap fasteners. All the sensor element manufacturing steps are fully compatible with textile processing techniques. The preliminary investigation into the design, manufacturing and testing of the textile based temperature and humidity sensor elements are described in the paper.
{"title":"Textile based temperature and humidity sensor elements for healthcare applications","authors":"R. Soukup, A. Hamácek, Lukas Mracek, J. Řeboun","doi":"10.1109/ISSE.2014.6887634","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887634","url":null,"abstract":"This paper presents a research focused on embroidered temperature and humidity sensor elements for smart textile applications in health and medical care. Smart textile products face desirable textile properties for health care use include durability, “launderability” (washing resistance), flexibility and non-toxicity and the comfort aspect of clothing is also very important. For these reasons, the presented research was concentrated on the development of sensor elements based on specially prepared conductive yarns which are integrated into textile fabric with the familiar textile technique - embroidery and connected to control unit through snap fasteners. All the sensor element manufacturing steps are fully compatible with textile processing techniques. The preliminary investigation into the design, manufacturing and testing of the textile based temperature and humidity sensor elements are described in the paper.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131139110","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887628
I. Uvarova, R. Rudenko, E. A. Voitsihovska, I. Yaskovets, B. Danilchenko
In presented study we investigate the influence of electron irradiation, with energy of incident electrons 1 MeV, on the electrical resistance of single-walled carbon nanotube bundles. Irradiation was performed at liquid helium temperature for the first time. To determine radiation-induced damages accumulation and its further thermal recovering, the samples resistance was in situ measured in wide temperature range (5-300 K). The results reveal radiation damage annealing at temperature ~ 200 K that we associate with formation of inter-tube links in the bundles.
{"title":"Accumulation and recovery of radiation-induced damages in single-walled carbon nanotube bundles","authors":"I. Uvarova, R. Rudenko, E. A. Voitsihovska, I. Yaskovets, B. Danilchenko","doi":"10.1109/ISSE.2014.6887628","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887628","url":null,"abstract":"In presented study we investigate the influence of electron irradiation, with energy of incident electrons 1 MeV, on the electrical resistance of single-walled carbon nanotube bundles. Irradiation was performed at liquid helium temperature for the first time. To determine radiation-induced damages accumulation and its further thermal recovering, the samples resistance was in situ measured in wide temperature range (5-300 K). The results reveal radiation damage annealing at temperature ~ 200 K that we associate with formation of inter-tube links in the bundles.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128142197","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887585
Martin Molhanec
This contribution introduces a new way to productivity and quality improvement - Extreme Manufacturing (XM). The Author examines the origins and significance of this new approach which is based on well-known idea of Agility - a concept originated in the area of software development. But the Author employs this concept for increasing an efficiency and flexibility of product design - namely in the field of electronics manufacturing, for example component and PCB manufacturing, soldering, etc. The idea of Extreme Manufacturing is demonstrated by the proposal of Extreme Agile Product Design (XAPD), primarily intended as a tool for rapid design of electronic products. This work builds on the achievements resulting from the previous works of the Author regarding Agility in the area of electrical manufacturing. Here is explained how the basic principles of Extreme Manufacturing may be employed in the field of product design. Further, we clarify how the employment of this approach may increase a quality of the whole design process as well as the quality of final product. Finally, it will be presented some recommendations on how to successfully apply Extreme Manufacturing approach in practice.
{"title":"Extreme manufacturing — Agility to greater productivity and quality","authors":"Martin Molhanec","doi":"10.1109/ISSE.2014.6887585","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887585","url":null,"abstract":"This contribution introduces a new way to productivity and quality improvement - Extreme Manufacturing (XM). The Author examines the origins and significance of this new approach which is based on well-known idea of Agility - a concept originated in the area of software development. But the Author employs this concept for increasing an efficiency and flexibility of product design - namely in the field of electronics manufacturing, for example component and PCB manufacturing, soldering, etc. The idea of Extreme Manufacturing is demonstrated by the proposal of Extreme Agile Product Design (XAPD), primarily intended as a tool for rapid design of electronic products. This work builds on the achievements resulting from the previous works of the Author regarding Agility in the area of electrical manufacturing. Here is explained how the basic principles of Extreme Manufacturing may be employed in the field of product design. Further, we clarify how the employment of this approach may increase a quality of the whole design process as well as the quality of final product. Finally, it will be presented some recommendations on how to successfully apply Extreme Manufacturing approach in practice.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133212451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887578
L. Lorenz, S. Sohr, R. Rieske, K. Nieweglowski, T. Zerna, K. Wolter
For sensor systems and data communication, electro optical integration technologies are an auspicious alternative to conventional electronic system integration. To make the photonic integration more attractive compared to electronic integration technologies, packaging concepts are required which are suitable for mass production using standard processes of the electronics packaging. In this paper, a photonic transceiver integration technology is proposed. To take advantage of the development environments and processes commonly used in electronics packaging, a planar assembly strategy is preferred. That is why the concept uses glass substrates with planar lightwave circuits (PLC) and passive fiber chip coupling. By the use of flip-chip VCSELs and photodiodes, standard pick-and-place assembly becomes possible. Hence, a wafer-level manufacturing in high quantities is feasible. Additionally, the development processes for the photonic integration are of special interest in this paper. Until now, there is no development environment available to model or simulate entire optical devices in one workflow. Every sub part of the model requires a single tool instead. By using 3D-CAD, this work proposes to merge several sub-models into a single tool and achieves largely a simplified development of planar optical devices.
{"title":"Development of a wafer-level integration technology for photonic transceivers based on planar lightwave circuits","authors":"L. Lorenz, S. Sohr, R. Rieske, K. Nieweglowski, T. Zerna, K. Wolter","doi":"10.1109/ISSE.2014.6887578","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887578","url":null,"abstract":"For sensor systems and data communication, electro optical integration technologies are an auspicious alternative to conventional electronic system integration. To make the photonic integration more attractive compared to electronic integration technologies, packaging concepts are required which are suitable for mass production using standard processes of the electronics packaging. In this paper, a photonic transceiver integration technology is proposed. To take advantage of the development environments and processes commonly used in electronics packaging, a planar assembly strategy is preferred. That is why the concept uses glass substrates with planar lightwave circuits (PLC) and passive fiber chip coupling. By the use of flip-chip VCSELs and photodiodes, standard pick-and-place assembly becomes possible. Hence, a wafer-level manufacturing in high quantities is feasible. Additionally, the development processes for the photonic integration are of special interest in this paper. Until now, there is no development environment available to model or simulate entire optical devices in one workflow. Every sub part of the model requires a single tool instead. By using 3D-CAD, this work proposes to merge several sub-models into a single tool and achieves largely a simplified development of planar optical devices.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133278137","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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