Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887644
O. Kainz, S. Kardoš, S. Slosarcik, Michal Jurcisin, P. Cabúk
The contribution describes practical implementation of virtual processing approach in education of electrotechnology, aimed to printed circuit boards (PCB) and thick-film circuits fabrication as a part of the virtual electrotechnology factory building. Appropriate tools are described for particular components development. The current knowledge in the field of web publishing and animation technology was used during development. The study texts supported by animations and video materials of technological procedures are the opus locatum at virtual factory development.
{"title":"Virtual factory for PCB and thick-film circuits fabrication","authors":"O. Kainz, S. Kardoš, S. Slosarcik, Michal Jurcisin, P. Cabúk","doi":"10.1109/ISSE.2014.6887644","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887644","url":null,"abstract":"The contribution describes practical implementation of virtual processing approach in education of electrotechnology, aimed to printed circuit boards (PCB) and thick-film circuits fabrication as a part of the virtual electrotechnology factory building. Appropriate tools are described for particular components development. The current knowledge in the field of web publishing and animation technology was used during development. The study texts supported by animations and video materials of technological procedures are the opus locatum at virtual factory development.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132572985","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887591
M. Placek, K. Dušek, J. Urbánek
The transition from a highly widespread lead solders to lead-free solder alloy types meant many changes in the electrical industry. This transition has brought many technological phenomena that deserve our attention and they have to be still addressed in order to improve the quality and reliability of manufacturing printed circuit boards. One of them is the presence of small crystalline formations on the surfaces of tin and some tin alloys which are called whiskers. This article focuses on the influence of the used electrical materials and their surface treatments on the growth of tin whiskers. For our experiment were selected two lead-free solders with a high percentage representation of tin, by which are Sn95,5Ag3,8Cu0,7 (SAC 387) and Sn99Cu1. Solders were plated in a thick layer on the three types of metal substrates with various surface finishes. For this experiment was chosen copper, brass and phosphor bronze. The created samples were exposed to static mechanical stresses of compressive force under the action of permanent constant temperature at 50 degrees of Celsius.
{"title":"Whiskers growth on thick tin layers and various types of surfaces","authors":"M. Placek, K. Dušek, J. Urbánek","doi":"10.1109/ISSE.2014.6887591","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887591","url":null,"abstract":"The transition from a highly widespread lead solders to lead-free solder alloy types meant many changes in the electrical industry. This transition has brought many technological phenomena that deserve our attention and they have to be still addressed in order to improve the quality and reliability of manufacturing printed circuit boards. One of them is the presence of small crystalline formations on the surfaces of tin and some tin alloys which are called whiskers. This article focuses on the influence of the used electrical materials and their surface treatments on the growth of tin whiskers. For our experiment were selected two lead-free solders with a high percentage representation of tin, by which are Sn95,5Ag3,8Cu0,7 (SAC 387) and Sn99Cu1. Solders were plated in a thick layer on the three types of metal substrates with various surface finishes. For this experiment was chosen copper, brass and phosphor bronze. The created samples were exposed to static mechanical stresses of compressive force under the action of permanent constant temperature at 50 degrees of Celsius.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130805412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887639
N. Dodev, N. Nenov, E. Dimitrov, Venelin Pavlov
The paper presented is dedicated to developing an electronic measurement system of test stand for evaluating the working condition of springs used in flexi-coil suspensions of railway rolling stock. The intended purpose of the system is to identify the characteristics of the spring being tested. The system identifies the vertical and horizontal load and displacement of the mounting domes of the springs, all measured by means of sensors [1]. After the measurement steps have been completed, the system outputs the identified characteristics for vertical and horizontal loading and gives a conclusion about the condition of the spring.
{"title":"Electronic measurement system of flexi-coil suspension springs test stand","authors":"N. Dodev, N. Nenov, E. Dimitrov, Venelin Pavlov","doi":"10.1109/ISSE.2014.6887639","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887639","url":null,"abstract":"The paper presented is dedicated to developing an electronic measurement system of test stand for evaluating the working condition of springs used in flexi-coil suspensions of railway rolling stock. The intended purpose of the system is to identify the characteristics of the spring being tested. The system identifies the vertical and horizontal load and displacement of the mounting domes of the springs, all measured by means of sensors [1]. After the measurement steps have been completed, the system outputs the identified characteristics for vertical and horizontal loading and gives a conclusion about the condition of the spring.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123855652","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887586
R. Jano, A. Fodor
The paper examines the feasibility of using vapour phase or infrared reflow soldering technologies for multi-layer ceramic chip (MLCC) and disk ceramic capacitors by employing the pin-in-paste technology. During practical experiments recommendations are made for optimizing the thermal profiles used when soldering there types of components in order to minimize the drift in the capacitance and ESR values of these types of capacitors.
{"title":"Soldering profile optimization for through-hole and surface mounted ceramic capacitors","authors":"R. Jano, A. Fodor","doi":"10.1109/ISSE.2014.6887586","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887586","url":null,"abstract":"The paper examines the feasibility of using vapour phase or infrared reflow soldering technologies for multi-layer ceramic chip (MLCC) and disk ceramic capacitors by employing the pin-in-paste technology. During practical experiments recommendations are made for optimizing the thermal profiles used when soldering there types of components in order to minimize the drift in the capacitance and ESR values of these types of capacitors.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116559068","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887558
Peter Lukacs, A. Pietrikova, L. Livovsky
In this paper we describe the most commonly used methods for analysis the mechanical properties of 3 types LTCC substrates (DuPont 951, DuPont 9K7, MuRata) based on three- and four-point bending as well as Dynamic Mechanical Analysis (DMA). The results of analysis show that the four-point bend test indicates a distribution of stress in the substrate with more accuracy and points to the tendency of the fracture-toughness state in the material. The three-point bend test achieves higher flexural strength of tested substrates. The re-firing process applied to the LTCC type 951 increases the flexural strength by 10 %. Extension of the duration of the firing process from 4 h to 26.5 h causes increasing the flexural strength by 100 %. This work proves that the Murata has the best homogeneity and the LTCC type 9K7 has the greatest predisposition to brittle fracture at a distance of lower supports of 32 mm. The sintering process' conditions of the ceramics have the significant influence to the shrinkage of the all tested ceramics' types. DMA analyses of the ceramics within the elasticity range confirm the described behavior of fracture-toughness state realized by classic test methods.
{"title":"Analysis of mechanical properties of LTCC substrates","authors":"Peter Lukacs, A. Pietrikova, L. Livovsky","doi":"10.1109/ISSE.2014.6887558","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887558","url":null,"abstract":"In this paper we describe the most commonly used methods for analysis the mechanical properties of 3 types LTCC substrates (DuPont 951, DuPont 9K7, MuRata) based on three- and four-point bending as well as Dynamic Mechanical Analysis (DMA). The results of analysis show that the four-point bend test indicates a distribution of stress in the substrate with more accuracy and points to the tendency of the fracture-toughness state in the material. The three-point bend test achieves higher flexural strength of tested substrates. The re-firing process applied to the LTCC type 951 increases the flexural strength by 10 %. Extension of the duration of the firing process from 4 h to 26.5 h causes increasing the flexural strength by 100 %. This work proves that the Murata has the best homogeneity and the LTCC type 9K7 has the greatest predisposition to brittle fracture at a distance of lower supports of 32 mm. The sintering process' conditions of the ceramics have the significant influence to the shrinkage of the all tested ceramics' types. DMA analyses of the ceramics within the elasticity range confirm the described behavior of fracture-toughness state realized by classic test methods.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"155 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123447728","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887599
I. Plotog, M. Vlădescu
It is an actual trend for electronic equipment to be used into growing range of working temperatures and at high level of the mechanical stress. As example, for the domains exempted by RoHS 2 EU Directive (it became law from January 2013) like aerospace, the standard maximum working temperature is 398.15K (125°C). The results of the comparative investigations regarding electrical and mechanical properties of the Lead/Lead-free solder joints function of working temperature and soldering thermal profile are presented in the paper. The experiments were designed based on previous work [1,2] having as starting point the “Homologous Temperature” concept [1,3,4], in order to respond to constrains imposed by the qualification processes of lead-free solder alloys for usage into exempted domains according to the RoHS 2 EU Directive [5,6].
{"title":"Working temperatures influence over the solder joints properties","authors":"I. Plotog, M. Vlădescu","doi":"10.1109/ISSE.2014.6887599","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887599","url":null,"abstract":"It is an actual trend for electronic equipment to be used into growing range of working temperatures and at high level of the mechanical stress. As example, for the domains exempted by RoHS 2 EU Directive (it became law from January 2013) like aerospace, the standard maximum working temperature is 398.15K (125°C). The results of the comparative investigations regarding electrical and mechanical properties of the Lead/Lead-free solder joints function of working temperature and soldering thermal profile are presented in the paper. The experiments were designed based on previous work [1,2] having as starting point the “Homologous Temperature” concept [1,3,4], in order to respond to constrains imposed by the qualification processes of lead-free solder alloys for usage into exempted domains according to the RoHS 2 EU Directive [5,6].","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124724216","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887576
Katharina Schulz, D. Ernst, S. Menzel, T. Gemming, J. Eckert, K. Wolter
The ever-growing need for reliable sensors and microsystems that can withstand strong temperature changes as well as impacts presents new challenges for the packaging industry. Research in this field thus focuses equally on the development of high temperature stable material systems and customized packaging technologies. Wire bonding is one of the preferred techniques, but high hardness of refractory materials negatively affects the plastic deformation process, which is the main condition for achieving sufficient adhesion between the layer and wire. In the present work, the thermosonic bonding (TS bonding) is examined and customized with a platinum wire (25 μm diameter) on platinum-coated silicon substrates (Pt thickness 300 nm). With the help of design of experiments (DoE) and the subsequent analysis of variance, suitable bonding settings have been evaluated. The outcome of the analysis of variance indicates that the platinum wire bonding is possible even at room temperature, however, the basic underlying quality criteria is not satisfied in this work. It is found that the TS bonding at a bonding temperature of 200°C is suitable for achieving an electrical contact to a thin platinum film.
{"title":"Thermosonic platinum wire bonding on platinum","authors":"Katharina Schulz, D. Ernst, S. Menzel, T. Gemming, J. Eckert, K. Wolter","doi":"10.1109/ISSE.2014.6887576","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887576","url":null,"abstract":"The ever-growing need for reliable sensors and microsystems that can withstand strong temperature changes as well as impacts presents new challenges for the packaging industry. Research in this field thus focuses equally on the development of high temperature stable material systems and customized packaging technologies. Wire bonding is one of the preferred techniques, but high hardness of refractory materials negatively affects the plastic deformation process, which is the main condition for achieving sufficient adhesion between the layer and wire. In the present work, the thermosonic bonding (TS bonding) is examined and customized with a platinum wire (25 μm diameter) on platinum-coated silicon substrates (Pt thickness 300 nm). With the help of design of experiments (DoE) and the subsequent analysis of variance, suitable bonding settings have been evaluated. The outcome of the analysis of variance indicates that the platinum wire bonding is possible even at room temperature, however, the basic underlying quality criteria is not satisfied in this work. It is found that the TS bonding at a bonding temperature of 200°C is suitable for achieving an electrical contact to a thin platinum film.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124833098","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887626
T. Falat, P. Matkowski, Z. Żaluk, J. Felba, A. Moscicki
Thermal Interface Materials are used in microelectronic packaging for reducing so called thermal resistance between heat source and heat sink. They are commonly used, often in form of thermally conductive adhesives, as an attaching materials for fixing silicon chips in the integrated circuits. Therefore, beside the thermal properties, a good mechanical strength of TIMs is required. Within this paper the shear strength of few different sintered nanoAg-based pastes used as TIM is examined.
{"title":"Mechanical strength of joints based on nano-Ag sintering phenomena","authors":"T. Falat, P. Matkowski, Z. Żaluk, J. Felba, A. Moscicki","doi":"10.1109/ISSE.2014.6887626","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887626","url":null,"abstract":"Thermal Interface Materials are used in microelectronic packaging for reducing so called thermal resistance between heat source and heat sink. They are commonly used, often in form of thermally conductive adhesives, as an attaching materials for fixing silicon chips in the integrated circuits. Therefore, beside the thermal properties, a good mechanical strength of TIMs is required. Within this paper the shear strength of few different sintered nanoAg-based pastes used as TIM is examined.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125067977","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887562
A. Fodor, R. Jano, D. Pitica
The presented work investigates the manual soldering process and how the thermal phenomena can affect different ICs, depending on their form. The study was developed mainly for surface-mount devices because the assembling technique involves direct contact with the soldering iron. Simulations were carried out using SolidWorks Flow Simulation tool, following that practical experiment using a thermal camera to be done in order to understand exactly the process of manual soldering.
{"title":"Thermal influences on IC packages during manual soldering process","authors":"A. Fodor, R. Jano, D. Pitica","doi":"10.1109/ISSE.2014.6887562","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887562","url":null,"abstract":"The presented work investigates the manual soldering process and how the thermal phenomena can affect different ICs, depending on their form. The study was developed mainly for surface-mount devices because the assembling technique involves direct contact with the soldering iron. Simulations were carried out using SolidWorks Flow Simulation tool, following that practical experiment using a thermal camera to be done in order to understand exactly the process of manual soldering.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124604909","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887566
C. Ionescu, D. Bonfert, M. Branzei
Printed Electronics is today an emerging technology with potential for many applications, having as target the low cost market. Although many applications are operating with low level of currents and voltages and hence thermal issues don't arise, there are some applications that imply thermal stressing of these substrates, for instance gas sensors. This paper presents an essay for establishing a measurement procedure for thermophysical properties of thin polymer foils, more precisely the thermal conductivity in steady state thermal regime [1]. For comparison, thermal conductivity of substrates with known thermal conductivity is measured supplemental, using a laboratory thermal conductivity meter.
{"title":"Investigation on thermal properties of substrates for printed electronics","authors":"C. Ionescu, D. Bonfert, M. Branzei","doi":"10.1109/ISSE.2014.6887566","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887566","url":null,"abstract":"Printed Electronics is today an emerging technology with potential for many applications, having as target the low cost market. Although many applications are operating with low level of currents and voltages and hence thermal issues don't arise, there are some applications that imply thermal stressing of these substrates, for instance gas sensors. This paper presents an essay for establishing a measurement procedure for thermophysical properties of thin polymer foils, more precisely the thermal conductivity in steady state thermal regime [1]. For comparison, thermal conductivity of substrates with known thermal conductivity is measured supplemental, using a laboratory thermal conductivity meter.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127003990","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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