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2021 IEEE 22nd Latin American Test Symposium (LATS)最新文献

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Thermal Neutron-induced SEUs on a COTS 28-nm SRAM-based FPGA under Different Incident Angles 不同入射角下基于COTS 28nm sram FPGA的热中子诱导seu
Pub Date : 2021-10-27 DOI: 10.1109/LATS53581.2021.9651879
J. Fabero, Golnaz Korkian, F. J. Franco, H. Mecha, M. Letiche, J. A. Clemente
This paper presents an experimental study of the SEU susceptibility against thermal neutron radiation of a 28-nm bulk Commercial-Off-The-Shelf (COTS) SRAM-based FPGA. Experimental results showing Single Event Upsets (SEUs) on configuration RAM (CRAM) cells, Flip-Flops (FFs), and Block RAMs (BRAMs) are provided and discussed. Shapes of multiple events (of various multiplicities) are also analyzed, as well as their dependency with the incident angle of the particle beam against the device's surface.
本文提出了一种基于28纳米商用现货(COTS) sram的FPGA的SEU对热中子辐射敏感性的实验研究。实验结果显示单事件干扰(seu)在配置RAM (CRAM)单元,触发器(FFs)和块RAM (BRAMs)上提供和讨论。还分析了多个事件(各种多重)的形状,以及它们与粒子束对设备表面入射角的依赖关系。
{"title":"Thermal Neutron-induced SEUs on a COTS 28-nm SRAM-based FPGA under Different Incident Angles","authors":"J. Fabero, Golnaz Korkian, F. J. Franco, H. Mecha, M. Letiche, J. A. Clemente","doi":"10.1109/LATS53581.2021.9651879","DOIUrl":"https://doi.org/10.1109/LATS53581.2021.9651879","url":null,"abstract":"This paper presents an experimental study of the SEU susceptibility against thermal neutron radiation of a 28-nm bulk Commercial-Off-The-Shelf (COTS) SRAM-based FPGA. Experimental results showing Single Event Upsets (SEUs) on configuration RAM (CRAM) cells, Flip-Flops (FFs), and Block RAMs (BRAMs) are provided and discussed. Shapes of multiple events (of various multiplicities) are also analyzed, as well as their dependency with the incident angle of the particle beam against the device's surface.","PeriodicalId":404536,"journal":{"name":"2021 IEEE 22nd Latin American Test Symposium (LATS)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121565618","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Resistive Open Defect Classification of Embedded Cells under Variations 变化条件下嵌入单元的电阻性开放缺陷分类
Pub Date : 2021-10-27 DOI: 10.1109/LATS53581.2021.9651857
Zahra Paria Najafi-Haghi, H. Wunderlich
Small Delay Faults (SDFs) due to defects and marginalities have to be distinguished from extra delays due to process variations, since they may form a reliability threat even if the resulting timing is in the specification. In this paper, it is shown that these faults can still be identified, even if the corresponding defect cell is deeply embedded into a combinational circuit and its behavioral features are affected by several masking impacts of the rest of the circuit. The results of a few delay tests at different voltages and frequencies serve as the input to machine learning procedures which can classify a circuit as marginal due to defects or just slow due to variations. Several machine learning techniques are investigated and compared with respect to accuracy, precision, and recall for different circuit sizes and defect scales. The classification strategies are powerful enough to sort out defect devices without a major impact on yield.
由于缺陷和边际性导致的小延迟故障(sdf)必须与由于工艺变化导致的额外延迟区分开来,因为即使结果时间在规范中,它们也可能形成可靠性威胁。本文表明,即使相应的缺陷单元深度嵌入到组合电路中,并且其行为特征受到电路其余部分的几个掩蔽影响,这些故障仍然可以被识别出来。在不同电压和频率下进行一些延迟测试的结果作为机器学习程序的输入,机器学习程序可以将电路分类为由于缺陷而边缘或由于变化而缓慢。研究了几种机器学习技术,并对不同电路尺寸和缺陷规模的准确性、精密度和召回率进行了比较。分类策略足够强大,可以在不影响产量的情况下对缺陷器件进行分类。
{"title":"Resistive Open Defect Classification of Embedded Cells under Variations","authors":"Zahra Paria Najafi-Haghi, H. Wunderlich","doi":"10.1109/LATS53581.2021.9651857","DOIUrl":"https://doi.org/10.1109/LATS53581.2021.9651857","url":null,"abstract":"Small Delay Faults (SDFs) due to defects and marginalities have to be distinguished from extra delays due to process variations, since they may form a reliability threat even if the resulting timing is in the specification. In this paper, it is shown that these faults can still be identified, even if the corresponding defect cell is deeply embedded into a combinational circuit and its behavioral features are affected by several masking impacts of the rest of the circuit. The results of a few delay tests at different voltages and frequencies serve as the input to machine learning procedures which can classify a circuit as marginal due to defects or just slow due to variations. Several machine learning techniques are investigated and compared with respect to accuracy, precision, and recall for different circuit sizes and defect scales. The classification strategies are powerful enough to sort out defect devices without a major impact on yield.","PeriodicalId":404536,"journal":{"name":"2021 IEEE 22nd Latin American Test Symposium (LATS)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125666807","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Nanosatellite On-Board Computer including a Many-Core Processor 包括多核处理器的纳米卫星机载计算机
Pub Date : 2021-10-27 DOI: 10.1109/LATS53581.2021.9651773
F. Pancher, Vanessa Vargas, P. Ramos, R. P. Bastos, David César Ardiles Saravia, R. Velazco
Software fault tolerance techniques can be applied to multi or many-core processors benefitting of the multiplicity of cores. The MPPA Coolidge many-core processor developed by KALRAY (Grenoble, France) was selected in the frame of OVNIPROM1 project as a target for the implementation of the N-Modular Redundancy and M-Partitions (NMR-MPar) fault tolerance technique developed at TIMA. This paper describes the implementation of this technique applied to the MPPA processor for its use as the heart of a nanosatellite On-Board Computer (OBC) to deal with errors produced by radiation effects.
软件容错技术可以应用于多核或多核处理器,这得益于内核的多样性。OVNIPROM1项目选择了KALRAY(法国格勒诺布尔)开发的MPPA Coolidge多核处理器作为实施TIMA开发的n -模块化冗余和m -分区(NMR-MPar)容错技术的目标。本文描述了该技术应用于MPPA处理器的实现,该处理器作为纳米卫星机载计算机(OBC)的核心,用于处理由辐射效应产生的误差。
{"title":"Nanosatellite On-Board Computer including a Many-Core Processor","authors":"F. Pancher, Vanessa Vargas, P. Ramos, R. P. Bastos, David César Ardiles Saravia, R. Velazco","doi":"10.1109/LATS53581.2021.9651773","DOIUrl":"https://doi.org/10.1109/LATS53581.2021.9651773","url":null,"abstract":"Software fault tolerance techniques can be applied to multi or many-core processors benefitting of the multiplicity of cores. The MPPA Coolidge many-core processor developed by KALRAY (Grenoble, France) was selected in the frame of OVNIPROM1 project as a target for the implementation of the N-Modular Redundancy and M-Partitions (NMR-MPar) fault tolerance technique developed at TIMA. This paper describes the implementation of this technique applied to the MPPA processor for its use as the heart of a nanosatellite On-Board Computer (OBC) to deal with errors produced by radiation effects.","PeriodicalId":404536,"journal":{"name":"2021 IEEE 22nd Latin American Test Symposium (LATS)","volume":"194 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115508441","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
TLP Generator Setup for Reliable Switching Characterization of Commercial GaN HEMTs 用于商用GaN hemt可靠开关特性的TLP发生器设置
Pub Date : 2021-10-27 DOI: 10.1109/LATS53581.2021.9651859
Carlos Bernal, M. Jiménèz, fabio. andrade
This paper proposes an automated setup to reliably characterize the soft switching behavior of commercial GaN HEMTs under pulsed measurements, based on the Transmission Line Pulse (TLP) generator principle. The proposed setup allows for high voltage - high current measurements while keeping the device under test within safe thermal conditions. Additionally, the setup follows the guidelines outlined on the JEDEC JEP173 standard, Dynamic ON-Resistance Test Method Guidelines for GaN HEMT based Power Conversion Devices, guaranteeing reliability and repeatability for a wide range of test conditions. This setup is suitable for characterizing several commercially available GaN HEMT structures such as enhancement and depletion mode devices in cascode or planar p-GaN gate structures. Results showed a non-monotonic behavior on the current collapse phenomenon, for tested planar p-GaN gate HEMT, as drain to source voltage increased. Also, the device ON resistance went significantly down as drain voltage approached to the rated limit.
本文提出了一种基于传输线脉冲(TLP)发生器原理的自动化装置,以可靠地表征商用GaN hemt在脉冲测量下的软开关行为。所提出的设置允许高电压-高电流测量,同时保持设备在安全的热条件下进行测试。此外,该设置遵循JEDEC JEP173标准(基于GaN HEMT的功率转换器件的动态导通电阻测试方法指南)中概述的指南,确保在广泛的测试条件下的可靠性和可重复性。该装置适用于表征几种市售GaN HEMT结构,如级联码中的增强和耗尽模式器件或平面p-GaN栅极结构。结果表明,在所测试的平面p-GaN栅极HEMT中,随着漏极对源极电压的增加,电流塌陷现象呈非单调行为。此外,当漏极电压接近额定极限时,器件的导通电阻显著下降。
{"title":"TLP Generator Setup for Reliable Switching Characterization of Commercial GaN HEMTs","authors":"Carlos Bernal, M. Jiménèz, fabio. andrade","doi":"10.1109/LATS53581.2021.9651859","DOIUrl":"https://doi.org/10.1109/LATS53581.2021.9651859","url":null,"abstract":"This paper proposes an automated setup to reliably characterize the soft switching behavior of commercial GaN HEMTs under pulsed measurements, based on the Transmission Line Pulse (TLP) generator principle. The proposed setup allows for high voltage - high current measurements while keeping the device under test within safe thermal conditions. Additionally, the setup follows the guidelines outlined on the JEDEC JEP173 standard, Dynamic ON-Resistance Test Method Guidelines for GaN HEMT based Power Conversion Devices, guaranteeing reliability and repeatability for a wide range of test conditions. This setup is suitable for characterizing several commercially available GaN HEMT structures such as enhancement and depletion mode devices in cascode or planar p-GaN gate structures. Results showed a non-monotonic behavior on the current collapse phenomenon, for tested planar p-GaN gate HEMT, as drain to source voltage increased. Also, the device ON resistance went significantly down as drain voltage approached to the rated limit.","PeriodicalId":404536,"journal":{"name":"2021 IEEE 22nd Latin American Test Symposium (LATS)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133306813","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Comparing different solutions for testing resistive defects in low-power SRAMs 比较低功耗ram中电阻性缺陷测试的不同解决方案
Pub Date : 2021-10-27 DOI: 10.1109/LATS53581.2021.9651760
Nunzio Mirabella, M. Grosso, G. Franchino, S. Rinaudo, I. Deretzis, A. Magna, M. Reorda
Low-power SRAM architectures are especially sensitive to many types of defects that may occur during manufacturing. Among these, resistive defects can appear. This paper analyzes some types of such defects that may impair the device functionalities in subtle ways, depending on the defect characteristics, and that may not be directly or easily detectable by traditional test methods, such as March algorithms. We analyze different methods to test such defects and discuss them in terms of complexity and test time.
低功耗SRAM架构对制造过程中可能出现的许多类型的缺陷特别敏感。其中,可出现电阻性缺陷。本文分析了一些类型的缺陷,这些缺陷可能会以微妙的方式损害设备的功能,这取决于缺陷的特征,并且可能无法直接或容易地被传统的测试方法(如March算法)检测到。我们分析了测试这些缺陷的不同方法,并从复杂性和测试时间的角度对它们进行了讨论。
{"title":"Comparing different solutions for testing resistive defects in low-power SRAMs","authors":"Nunzio Mirabella, M. Grosso, G. Franchino, S. Rinaudo, I. Deretzis, A. Magna, M. Reorda","doi":"10.1109/LATS53581.2021.9651760","DOIUrl":"https://doi.org/10.1109/LATS53581.2021.9651760","url":null,"abstract":"Low-power SRAM architectures are especially sensitive to many types of defects that may occur during manufacturing. Among these, resistive defects can appear. This paper analyzes some types of such defects that may impair the device functionalities in subtle ways, depending on the defect characteristics, and that may not be directly or easily detectable by traditional test methods, such as March algorithms. We analyze different methods to test such defects and discuss them in terms of complexity and test time.","PeriodicalId":404536,"journal":{"name":"2021 IEEE 22nd Latin American Test Symposium (LATS)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122293028","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A Tutorial on Design Obfuscation: from Transistors to Systems 设计混淆教程:从晶体管到系统
Pub Date : 2021-08-19 DOI: 10.1109/LATS53581.2021.9651741
S. Pagliarini
The recent advances in the area of design obfuscation are encouraging, but may present themselves as hard to read for a non-specialist audience. This tutorial uncovers these advances in a clear language, contrasting the approaches that can be implemented at layout level, in the netlist of a circuit, or even at chip level. This tutorial also highlights the available support, both from the tooling side and the logistics of fabricating an obfuscated integrated circuit.
设计混淆领域的最新进展令人鼓舞,但对于非专业观众来说,它们可能难以阅读。本教程以清晰的语言揭示了这些进步,对比了可以在布局级、电路网表甚至芯片级实现的方法。本教程还强调了从工具方面和制造模糊集成电路的后勤方面提供的支持。
{"title":"A Tutorial on Design Obfuscation: from Transistors to Systems","authors":"S. Pagliarini","doi":"10.1109/LATS53581.2021.9651741","DOIUrl":"https://doi.org/10.1109/LATS53581.2021.9651741","url":null,"abstract":"The recent advances in the area of design obfuscation are encouraging, but may present themselves as hard to read for a non-specialist audience. This tutorial uncovers these advances in a clear language, contrasting the approaches that can be implemented at layout level, in the netlist of a circuit, or even at chip level. This tutorial also highlights the available support, both from the tooling side and the logistics of fabricating an obfuscated integrated circuit.","PeriodicalId":404536,"journal":{"name":"2021 IEEE 22nd Latin American Test Symposium (LATS)","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121902748","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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2021 IEEE 22nd Latin American Test Symposium (LATS)
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