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Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96最新文献

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Electronic and vibrational properties of skutterudites 滑石的电子和振动特性
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553262
D. J. Singh, L. Nordstrom, W. Pickett, J. Feldman
Advances in theoretical understanding, numerical algorithms and computing technology have made practical the determination of electronic, vibrational and other properties from first principles, even for complex materials like advanced thermoelectrics. These approaches require a minimum of experimental input, typically only composition and crystal structure. As such they may be viewed as a new window on the materials, which in combination with experiment may lead to new insights and better understanding of the variation of properties with variables like composition. This may then lead to more efficient optimization of thermoelectric materials and help in searches for new materials. This paper illustrates how theory is being applied in the search for high ZT thermoelectrics, mostly through examples.
理论认识、数值算法和计算技术的进步,使得从第一性原理确定电子、振动和其他性质成为现实,甚至对于复杂的材料,如先进的热电材料也是如此。这些方法需要最少的实验输入,通常只需要成分和晶体结构。因此,它们可能被视为研究材料的新窗口,与实验相结合,可能会产生新的见解,更好地理解性质随组成等变量的变化。这可能会导致更有效地优化热电材料,并有助于寻找新材料。本文主要通过实例说明了理论是如何应用于寻找高ZT热电材料的。
{"title":"Electronic and vibrational properties of skutterudites","authors":"D. J. Singh, L. Nordstrom, W. Pickett, J. Feldman","doi":"10.1109/ICT.1996.553262","DOIUrl":"https://doi.org/10.1109/ICT.1996.553262","url":null,"abstract":"Advances in theoretical understanding, numerical algorithms and computing technology have made practical the determination of electronic, vibrational and other properties from first principles, even for complex materials like advanced thermoelectrics. These approaches require a minimum of experimental input, typically only composition and crystal structure. As such they may be viewed as a new window on the materials, which in combination with experiment may lead to new insights and better understanding of the variation of properties with variables like composition. This may then lead to more efficient optimization of thermoelectric materials and help in searches for new materials. This paper illustrates how theory is being applied in the search for high ZT thermoelectrics, mostly through examples.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127205643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electronic transport properties of highly conducting vapor-grown carbon fiber composites 高导电性气相生长碳纤维复合材料的电子输运特性
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553284
K. Stokes, T. Tritt, W. Fuller-Mora, A. Ehrlich, R. Jacobsen
We have measured the electrical resistivity and thermoelectric power of commercial vapor-grown carbon fibers and fiber composites from 4 K to 300 K. Post-growth heat treatment decreased the resistivity and moderately increased the magnitude of the thermopower. Thermoelectric measurements on fiber composites showed that the host material altered the resistivity but had little effect on the thermopower. Thermopower data suggest that the fibers in the composite material have a smaller degree of graphitization than isolated fibers.
我们测量了商用蒸汽生长碳纤维和纤维复合材料在4k至300k范围内的电阻率和热电功率。生长后热处理降低了电阻率,并适度提高了热功率的大小。对纤维复合材料的热电测量表明,基体材料改变了其电阻率,但对热功率影响不大。热电数据表明,复合材料中的纤维比单独的纤维具有更小的石墨化程度。
{"title":"Electronic transport properties of highly conducting vapor-grown carbon fiber composites","authors":"K. Stokes, T. Tritt, W. Fuller-Mora, A. Ehrlich, R. Jacobsen","doi":"10.1109/ICT.1996.553284","DOIUrl":"https://doi.org/10.1109/ICT.1996.553284","url":null,"abstract":"We have measured the electrical resistivity and thermoelectric power of commercial vapor-grown carbon fibers and fiber composites from 4 K to 300 K. Post-growth heat treatment decreased the resistivity and moderately increased the magnitude of the thermopower. Thermoelectric measurements on fiber composites showed that the host material altered the resistivity but had little effect on the thermopower. Thermopower data suggest that the fibers in the composite material have a smaller degree of graphitization than isolated fibers.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129046903","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Evaluation of metal-Bi2Te3 contacts by electron tunneling spectroscopy 电子隧穿光谱评价金属- bi2te3接触
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553515
J. Nagao, E. Hatta, K. Mukasa
Understanding the states of the metal electrode-semiconductor junctions is important for improving the performance of the thermoelectric devices. Tunneling spectroscopy has been applied to the evaluation of metal-semiconductor Schottky junctions. In this study, tunneling spectroscopy is applied to understanding the states of a metal/Bi/sub 2/Te/sub 3/ or a metal/Bi/sub 2/Se/sub 3/ junction. Bi/sub 2/Te/sub 3/ and Bi/sub 2/Se/sub 3/ single crystals were prepared by Bridgman method. The metal contacts were made on the cleavage surface of Bi/sub 2/Te/sub 3/ or Bi/sub 2/Se/sub 3/ by the thermal evaporation in the vacuum of 10/sup -3/ Pa. All tunnel conductance were measured at 4.2 K. Mg/, Al/ and Ag/Bi/sub 2/Te/sub 3/ junctions exhibit V-shaped tunnel conductance curves which indicate that these contacts ate the Schottky barrier. A Au/Bi/sub 2/Te/sub 3/ junction shows a flat conductance characteristic, so that we expect to be an ohmic contact formed in this junction. It becomes clear that the Schottky barrier is formed on the Mg/, Al/, or Ag/-Bi/sub 2/Te/sub 3/ junction. In the case of Au/ or Al/Bi/sub 2/Se/sub 3/ is also formed the Schottky barrier. Since Bi/sub 2/Te/sub 3/ and Bi/sub 2/Se/sub 3/, which are narrow energy gap semiconductors, form the Schottky barriers with those metals, the characterization of metal-semiconductor contacts is important to improve the performance of thermoelectric devices.
了解金属电极-半导体结的状态对提高热电器件的性能具有重要意义。隧道光谱已被应用于金属-半导体肖特基结的评价。在本研究中,隧道光谱应用于了解金属/Bi/sub 2/Te/sub 3/或金属/Bi/sub 2/Se/sub 3/结的状态。采用Bridgman法制备了Bi/sub 2/Te/sub 3/单晶和Bi/sub 2/Se/sub 3/单晶。采用10/sup -3/ Pa真空热蒸发的方法,在Bi/sub 2/Te/sub 3/或Bi/sub 2/Se/sub 3/的解理表面形成金属触点。在4.2 K下测量所有隧道电导。Mg/、Al/和Ag/Bi/sub 2/Te/sub 3/结呈现出v型隧道电导曲线,表明这些接点处于肖特基势垒中。Au/Bi/sub 2/Te/sub 3/结显示出平坦的电导特性,因此我们期望在该结中形成欧姆接触。结果表明,在Mg/、Al/或Ag/-Bi/sub 2/Te/sub 3/结上形成了肖特基势垒。在Au/或Al/Bi/sub 2/Se/sub 3/的情况下也形成肖特基势垒。由于Bi/sub 2/Te/sub 3/和Bi/sub 2/Se/sub 3/是窄能隙半导体,它们与这些金属形成肖特基势垒,因此金属-半导体接触特性的表征对提高热电器件的性能具有重要意义。
{"title":"Evaluation of metal-Bi2Te3 contacts by electron tunneling spectroscopy","authors":"J. Nagao, E. Hatta, K. Mukasa","doi":"10.1109/ICT.1996.553515","DOIUrl":"https://doi.org/10.1109/ICT.1996.553515","url":null,"abstract":"Understanding the states of the metal electrode-semiconductor junctions is important for improving the performance of the thermoelectric devices. Tunneling spectroscopy has been applied to the evaluation of metal-semiconductor Schottky junctions. In this study, tunneling spectroscopy is applied to understanding the states of a metal/Bi/sub 2/Te/sub 3/ or a metal/Bi/sub 2/Se/sub 3/ junction. Bi/sub 2/Te/sub 3/ and Bi/sub 2/Se/sub 3/ single crystals were prepared by Bridgman method. The metal contacts were made on the cleavage surface of Bi/sub 2/Te/sub 3/ or Bi/sub 2/Se/sub 3/ by the thermal evaporation in the vacuum of 10/sup -3/ Pa. All tunnel conductance were measured at 4.2 K. Mg/, Al/ and Ag/Bi/sub 2/Te/sub 3/ junctions exhibit V-shaped tunnel conductance curves which indicate that these contacts ate the Schottky barrier. A Au/Bi/sub 2/Te/sub 3/ junction shows a flat conductance characteristic, so that we expect to be an ohmic contact formed in this junction. It becomes clear that the Schottky barrier is formed on the Mg/, Al/, or Ag/-Bi/sub 2/Te/sub 3/ junction. In the case of Au/ or Al/Bi/sub 2/Se/sub 3/ is also formed the Schottky barrier. Since Bi/sub 2/Te/sub 3/ and Bi/sub 2/Se/sub 3/, which are narrow energy gap semiconductors, form the Schottky barriers with those metals, the characterization of metal-semiconductor contacts is important to improve the performance of thermoelectric devices.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123050514","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Texture influence on the forming of thermoelectric properties of pressed semiconductors 织构对压制半导体热电性能形成的影响
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553292
L. Anatychuk, S. V. Kosyachenko, S. V. Melnichuk
The dependence of thermoelectric properties on the texture layer thickness was investigated. The electric and thermal conductivities decrease is caused by decrease of texture layer thickness. Seebeck coefficient and figure of merit remain constant.
研究了热电性能与织构层厚度的关系。由于织构层厚度的减小,导致了导热系数和电导率的降低。塞贝克系数和优值保持不变。
{"title":"Texture influence on the forming of thermoelectric properties of pressed semiconductors","authors":"L. Anatychuk, S. V. Kosyachenko, S. V. Melnichuk","doi":"10.1109/ICT.1996.553292","DOIUrl":"https://doi.org/10.1109/ICT.1996.553292","url":null,"abstract":"The dependence of thermoelectric properties on the texture layer thickness was investigated. The electric and thermal conductivities decrease is caused by decrease of texture layer thickness. Seebeck coefficient and figure of merit remain constant.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122703303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
The design problems of thermoelectric heat pumps for transportation facilities 交通运输用热电热泵的设计问题
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553310
A. A. Aivazov, Y.I. Stern, K. Makhratchev, A.V. Morgal
The paper describes the problems of design and construction development of thermoelectric (TH) air chillers for different means of transport. The report contains the description of the temperature operating conditions of TH air chillers and the procedures of the TH air chiller testing. The results of the stand operation of the TH air chiller at various voltages are analyzed. The paper highlights TH module mathematical modeling by means of equations account for the variation of the main TH properties across the thermocouple with the temperature gradient. The modeling of TH module operation is based on the numerical solution of a second order nonlinear differential equation. The solution obtained is compared with the results from a crude method and from the stand testing.
介绍了针对不同运输工具的热电空冷机组的设计和施工开发问题。该报告包含TH空冷机温度运行条件的描述和TH空冷机测试程序。分析了TH型空冷机组在不同电压下的运行结果。本文重点介绍了热电偶上主要TH特性随温度梯度变化的数学建模方法。TH模块运行的建模是基于一个二阶非线性微分方程的数值解。将所得解与原始法和台架试验结果进行了比较。
{"title":"The design problems of thermoelectric heat pumps for transportation facilities","authors":"A. A. Aivazov, Y.I. Stern, K. Makhratchev, A.V. Morgal","doi":"10.1109/ICT.1996.553310","DOIUrl":"https://doi.org/10.1109/ICT.1996.553310","url":null,"abstract":"The paper describes the problems of design and construction development of thermoelectric (TH) air chillers for different means of transport. The report contains the description of the temperature operating conditions of TH air chillers and the procedures of the TH air chiller testing. The results of the stand operation of the TH air chiller at various voltages are analyzed. The paper highlights TH module mathematical modeling by means of equations account for the variation of the main TH properties across the thermocouple with the temperature gradient. The modeling of TH module operation is based on the numerical solution of a second order nonlinear differential equation. The solution obtained is compared with the results from a crude method and from the stand testing.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128469094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Physical principles of microminiaturization in thermoelectricity 热电微型化的物理原理
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553318
L. Anatychuk, O. Luste
Factors, which promote microminiaturization of cooling modules have been considered. Results of thermoelectric cooler investigations are presented taking into account all classical factors: electrical and heat resistance of a commutation, contact resistance, heat resistance of heat transfers, all kinds of thermoelectric effects, temperature dependencies of material properties, etc. The influence of all factors on cooling efficiency is analyzed. New factors, which can have influence on a module work, namely strong electric field, large temperature gradient, size effects, and diffusion processes are considered. The influence on microminiaturization and conditions for these factors actions are analyzed. A common analysis for microminiaturization limits and a prognosis of thermoelectric modules development is presented.
考虑了促进冷却模块微型化的因素。热电冷却器的研究结果考虑了所有经典因素:换相的电和热阻,接触电阻,传热的热阻,各种热电效应,材料性能的温度依赖性等。分析了各因素对冷却效率的影响。考虑了影响模块功的新因素,即强电场、大温度梯度、尺寸效应和扩散过程。分析了这些因素作用对微型化的影响及条件。对微小型化的限制进行了分析,并对热电模块的发展进行了预测。
{"title":"Physical principles of microminiaturization in thermoelectricity","authors":"L. Anatychuk, O. Luste","doi":"10.1109/ICT.1996.553318","DOIUrl":"https://doi.org/10.1109/ICT.1996.553318","url":null,"abstract":"Factors, which promote microminiaturization of cooling modules have been considered. Results of thermoelectric cooler investigations are presented taking into account all classical factors: electrical and heat resistance of a commutation, contact resistance, heat resistance of heat transfers, all kinds of thermoelectric effects, temperature dependencies of material properties, etc. The influence of all factors on cooling efficiency is analyzed. New factors, which can have influence on a module work, namely strong electric field, large temperature gradient, size effects, and diffusion processes are considered. The influence on microminiaturization and conditions for these factors actions are analyzed. A common analysis for microminiaturization limits and a prognosis of thermoelectric modules development is presented.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131406374","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Rational conditions and prospects for two-stage cooling modules use 两级冷却模块使用的合理条件与前景
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553321
L. Anatychuk, L. Vikhor, K. Misawa, N. Suzuki
The investigation results of rational fields of single- and two-stage thermoelectric cooling module use, in the context of their energetic efficiency and economical utility in refrigeration applications, are presented by the authors.
从单级和双级热电制冷模块在制冷应用中的能量效率和经济效用的角度出发,对其合理应用领域进行了调查。
{"title":"Rational conditions and prospects for two-stage cooling modules use","authors":"L. Anatychuk, L. Vikhor, K. Misawa, N. Suzuki","doi":"10.1109/ICT.1996.553321","DOIUrl":"https://doi.org/10.1109/ICT.1996.553321","url":null,"abstract":"The investigation results of rational fields of single- and two-stage thermoelectric cooling module use, in the context of their energetic efficiency and economical utility in refrigeration applications, are presented by the authors.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132984266","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Mechanically alloyed Mg2Si/sub 1-x/Snx solid solutions as thermoelectric materials 机械合金化Mg2Si/sub - 1-x/Snx固溶体作为热电材料
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553275
M. Riffel, J. Schilz
Mg/sub 2/Si/sub 1-x/Sn/sub x/ solid solutions with (0/spl les/x/spl les/0.4) were prepared by mechanical alloying and subsequent hot-pressing. It was found that the alloying process during milling develops in one of two different directions. The first one leads to the nominal composition with only a small amount of iron impurities resulting from wear of the milling media. In the second route-which only occurs in the presence of Sn-an abrasive phase is formed and the Fe content may increase up to 50 at%. The Fe is bound in FeSi and consequently, the solid solution has a lack of Si. The hot-pressing was performed at a temperature smaller than the peritectic temperature of the quasibinary Mg/sub 2/Si-Mg/sub 2/Sn system. A decomposition of the solid solutions occurs, which suggest changes on the miscibility gap in published phase diagrams. However, some transport measurements on the multiphase materials were performed, which revealed lower mobility values and lattice thermal conductivities compared to values published in the literature for single crystalline materials. The mobility of our materials was found to be independent from composition whereas the thermal conductivity decreases with increasing Sn content.
采用机械合金化和热压法制备了(0/spl les/x/spl les/0.4) Mg/sub 2/Si/sub 1-x/Sn/sub x/固溶体。发现铣削过程中合金化过程向两个不同方向之一发展。第一种方法导致标称组合物中只有少量的铁杂质,这些铁杂质是由铣削介质的磨损引起的。在第二种方法中,只发生在sn存在的情况下,形成磨料相,铁含量可以增加到50%。铁被束缚在FeSi中,因此,固溶体缺乏Si。热压温度小于准二元Mg/sub - 2/Si-Mg/sub - 2/Sn体系的包晶温度。固溶体发生分解,这表明在已发表的相图中混相间隙发生了变化。然而,对多相材料进行了一些输运测量,结果表明,与文献中发表的单晶材料相比,多相材料的迁移率值和晶格导热系数更低。我们发现材料的迁移率与成分无关,而热导率随着Sn含量的增加而降低。
{"title":"Mechanically alloyed Mg2Si/sub 1-x/Snx solid solutions as thermoelectric materials","authors":"M. Riffel, J. Schilz","doi":"10.1109/ICT.1996.553275","DOIUrl":"https://doi.org/10.1109/ICT.1996.553275","url":null,"abstract":"Mg/sub 2/Si/sub 1-x/Sn/sub x/ solid solutions with (0/spl les/x/spl les/0.4) were prepared by mechanical alloying and subsequent hot-pressing. It was found that the alloying process during milling develops in one of two different directions. The first one leads to the nominal composition with only a small amount of iron impurities resulting from wear of the milling media. In the second route-which only occurs in the presence of Sn-an abrasive phase is formed and the Fe content may increase up to 50 at%. The Fe is bound in FeSi and consequently, the solid solution has a lack of Si. The hot-pressing was performed at a temperature smaller than the peritectic temperature of the quasibinary Mg/sub 2/Si-Mg/sub 2/Sn system. A decomposition of the solid solutions occurs, which suggest changes on the miscibility gap in published phase diagrams. However, some transport measurements on the multiphase materials were performed, which revealed lower mobility values and lattice thermal conductivities compared to values published in the literature for single crystalline materials. The mobility of our materials was found to be independent from composition whereas the thermal conductivity decreases with increasing Sn content.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131090270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
A microstructural analysis of thin film TiNiSn tin薄膜的微观结构分析
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553533
D. Compton, A. Leitch, J. Neethling, V. V. Kozyrkov
This paper reports on a structural investigation of the ternary compound TiNiSn, prepared as a thin film by electron beam deposition of a sandwich structure comprising individual layers of Ti, Ni and Sn. The effect of annealing the compound at 800/spl deg/C for times up to 72 hours was investigated. X-ray diffraction revealed the formation of TiNi/sub 2/Sn after 6 hours of annealing. The excess of Ni in the deposited structure (confirmed by EDS) resulted in the first phase of TiNiSn not being present and a shift in the lattice parameter of second phase TiNi/sub 2/Sn.
本文报道了用电子束沉积由Ti、Ni和Sn组成的夹层结构制备三元化合物TiNiSn薄膜的结构研究。研究了在800/spl℃下退火72小时的效果。x射线衍射显示,退火6小时后形成了TiNi/sub 2/Sn。沉积结构中过量的Ni (EDS证实)导致TiNiSn的第一相不存在,而第二相TiNi/sub 2/Sn的晶格参数发生了移位。
{"title":"A microstructural analysis of thin film TiNiSn","authors":"D. Compton, A. Leitch, J. Neethling, V. V. Kozyrkov","doi":"10.1109/ICT.1996.553533","DOIUrl":"https://doi.org/10.1109/ICT.1996.553533","url":null,"abstract":"This paper reports on a structural investigation of the ternary compound TiNiSn, prepared as a thin film by electron beam deposition of a sandwich structure comprising individual layers of Ti, Ni and Sn. The effect of annealing the compound at 800/spl deg/C for times up to 72 hours was investigated. X-ray diffraction revealed the formation of TiNi/sub 2/Sn after 6 hours of annealing. The excess of Ni in the deposited structure (confirmed by EDS) resulted in the first phase of TiNiSn not being present and a shift in the lattice parameter of second phase TiNi/sub 2/Sn.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130644193","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Thermopower and electrical resistivity of undoped and co-doped /spl beta/-FeSi2 single crystals and /spl beta/-FeSi2+x thin films 未掺杂和共掺杂/spl β /-FeSi2单晶和/spl β /-FeSi2+x薄膜的热功率和电阻率
Pub Date : 1996-03-26 DOI: 10.1109/ICT.1996.553256
A. Heinrich, A. Burkov, C. Gladun, G. Behr, K. Herz, J. Schumann, H. Powalla
Thermopower and electrical resistivity have been investigated of /spl beta/-FeSi/sub 2/ single crystals and /spl beta/-FeSi/sub 2+x/ thin films in the temperature range from 40 K to 1200 K. The single crystals were grown by chemical transport reaction with source material of different purity and with a Si/Fe ratio between 1.5 and 2.5 to obtain crystals from the Fe-rich and Si-rich boundaries of the homogeneity range, respectively. The undoped and co-doped thin films have been prepared in the range -0.06
研究了/spl β /-FeSi/sub 2/单晶和/spl β /-FeSi/sub 2+x/薄膜在40 ~ 1200 K温度范围内的热功率和电阻率。采用不同纯度的原料,在Si/Fe比值为1.5 ~ 2.5的条件下,通过化学传递反应生长单晶,得到均匀性范围内富铁边界和富硅边界的单晶。用共蒸发法制备了在-0.06
{"title":"Thermopower and electrical resistivity of undoped and co-doped /spl beta/-FeSi2 single crystals and /spl beta/-FeSi2+x thin films","authors":"A. Heinrich, A. Burkov, C. Gladun, G. Behr, K. Herz, J. Schumann, H. Powalla","doi":"10.1109/ICT.1996.553256","DOIUrl":"https://doi.org/10.1109/ICT.1996.553256","url":null,"abstract":"Thermopower and electrical resistivity have been investigated of /spl beta/-FeSi/sub 2/ single crystals and /spl beta/-FeSi/sub 2+x/ thin films in the temperature range from 40 K to 1200 K. The single crystals were grown by chemical transport reaction with source material of different purity and with a Si/Fe ratio between 1.5 and 2.5 to obtain crystals from the Fe-rich and Si-rich boundaries of the homogeneity range, respectively. The undoped and co-doped thin films have been prepared in the range -0.06<x<0.25 by coevaporation. It is shown that the conductivity type of the single crystals changes from p-type to n-type with increasing purity of the starting material. Both thermopower and resistivity depend on the deviation from strict stoichiometry. The low temperature thermopower is mainly determined by phonon drag effect. The undoped films are of p-type. It is shown that the films are especially sensitive to doping at x/spl ap/0.13.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123898280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
期刊
Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96
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