Simulating heat conduction has been studied using approaches including peridynamics. However, accurately capturing heat transfer across discontinuities such as cracks and material interfaces remains a major challenge. This study presents a computational framework for heat transfer that utilizes a peridynamic differential operator approach to offer a unified modeling approach for both continuous and discontinuous media. The classical heat conduction equation is computed by using peridynamic differential operators, enabling natural treatment of discontinuities. A bond-wise function is defined by the interaction state between nodes, enabling a consistent representation of heat transfer for both intact and broken bonds. For broken bonds, thermal contact conductance is incorporated into the bond-wise function to capture heat transfer across partial discontinuities. The framework is verified through numerical analyses of a two-panel contact problem and a three-dimensional L-shaped bimaterial panel. The results demonstrate accurate prediction of interfacial phenomena, including temperature drops and localized heat flux concentration. The analyses further show that the bond-wise function successfully captures the influence of the thermal contact conductance on both the degree of heat transfer across crack interfaces and the resulting alteration of singularity characteristics. Overall, the framework provides a general and computationally efficient tool for simulating heat conduction in heterogeneous systems with partial discontinuities and establishes a basis for fully coupled thermomechanical analyses.
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